CN219285684U

CN219285684U - Notebook heat dissipation module

Info

Publication number: CN219285684U
Application number: CN202320211596.4U
Authority: CN
Inventors: 唐华
Original assignee: Shenzhen Inet Technology Co ltd
Current assignee: Shenzhen Inet Technology Co ltd
Priority date: 2023-02-14
Filing date: 2023-02-14
Publication date: 2023-06-30
Anticipated expiration: 2033-02-14

Abstract

The utility model belongs to the technical field of heat radiation module equipment, and discloses a notebook heat radiation module which comprises a fan shell, heat radiation fins, grooves, notch grooves, a heat radiation plate and heat radiation pipes, wherein the heat radiation fins are fixedly arranged on one side of the outer wall of the fan shell, the number of the grooves is two, each groove is arranged at the top of the outer wall of the heat radiation fin, the notch grooves are arranged at the top of the outer wall of the fan shell, the inside of each notch groove is communicated with the inside of each groove, and the heat radiation pipes are fixedly arranged at the top of the outer wall of the heat radiation fin. This notebook heat dissipation module sets up the breach groove through seting up on the fan casing, seting up the recess on the fin, changing the structure of fan casing and fin, can practice thrift auxiliary material cost increase, can improve former device temperature effectively, improve user experience and feel, avoid the heat that the notebook produced to all dispel from D shell, lead to D shell temperature too high, influence user experience and feel, need additionally install the graphite flake and dispel the heat, increase cost.

Description

Notebook heat dissipation module

Technical Field

The utility model relates to the technical field of heat dissipation module equipment, in particular to a notebook heat dissipation module.

Background

The notebook computer, called "portable computer, palm computer or laptop computer" features small body, convenient for carrying, and is a small and portable personal computer.

The heat dissipation module, as the name implies, is a module unit applied to heat dissipation purposes of systems, devices, equipment and the like, is now specially referred to as a heat dissipation device of a notebook computer, and then expanded and referred to as a heat dissipation device of a desktop computer, a projector and the like using a heat pipe, and heat of components is generally led into a heat dissipation fin through a heat conducting bottom plate to perform heat dissipation operation.

The utility model discloses a high-efficient heat dissipation module of notebook computer is recorded to authority publication number "CN213876616U", including radiating fin, radiating fin surface fixedly connected with heat dissipation fan, and radiating fin one end welded connection has the heat pipe to heat pipe both sides fixedly connected with fixed plate, heat pipe internally mounted has telescopic machanism, and telescopic machanism including the flexible interior pole that cup joints with the inside activity of heat pipe, counterpoint bolt has been seted up to flexible interior pole one side equidistance, the inside threaded connection of heat pipe has first hand to twist the bolt. According to the utility model, the telescopic inner rod is pulled to drive the connecting plate to move in a telescopic way, the distance between the connecting plate and the radiating fins is adjusted, so that the heat conducting bottom plate is driven to adjust a proper position, the proper installation position of the heat conducting bottom plate can be found in the notebook computer, excessive space is prevented from being occupied, and the telescopic inner rod can be extruded and fixed by rotating the first hand-screwed bolt.

Above-mentioned patent is convenient for install and dismantle notebook heat dissipation module, be convenient for later stage overhauls or changes the components and parts, but above-mentioned patent is unfavorable for improving the heat dissipation of notebook D shell, and electronics consumer PC market strengthens the competition increasingly, needs with low costs, and good heat radiation structure of reliability, and the present market is more to utilize D shell trompil, and D shell pastes auxiliary material such as graphite flake, copper foil, and the cost is higher, and the heat that the notebook produced all looses from D shell, leads to D shell temperature too high easily, influences user experience and feels.

Disclosure of Invention

The utility model provides a notebook computer heat radiation module, which is characterized in that a notch groove is formed in a fan shell, and grooves are formed in a heat radiation fin, so that the structures of the fan shell and the heat radiation fin are changed, the cost of auxiliary materials is saved, the temperature of an original device can be effectively improved, the user experience is improved, the heat generated by a notebook computer is prevented from being radiated from a D shell, the temperature of the D shell is overhigh, the user experience is influenced, and a graphite sheet is additionally arranged to radiate heat, so that the cost is increased.

In order to achieve the above purpose, the utility model is realized by the following technical scheme: a notebook heat dissipation module, comprising:

a fan housing;

the radiating fins are fixedly arranged on one side of the outer wall of the fan shell;

the grooves are arranged, and each groove is formed in the top of the outer wall of each radiating fin; and

the notch groove is formed in the top of the outer wall of the fan shell, and the inside of the notch groove is communicated with the inside of the groove.

Further, the heat dissipation device further comprises a heat dissipation plate and a heat dissipation tube, wherein the heat dissipation tube is fixedly arranged at the top of the outer wall of the heat dissipation fin, and the heat dissipation plate is fixedly arranged at the bottom of the outer wall of the heat dissipation tube, which is close to one side edge.

Further, a placement hole is formed in the top of the outer wall of the fan shell, and the cross section of the placement hole is circular.

Further, the outer wall of the fan shell is fixedly provided with two mounting blocks, and mounting holes are formed in the top of the outer wall of each mounting block.

Further, a plurality of fixing holes are formed in the top of the outer wall of the heat dissipation plate.

Further, the bottom of the inner wall of the fan shell is fixedly provided with a mounting seat.

The notebook computer heat dissipation module provided by the utility model has the following beneficial effects: this notebook heat dissipation module sets up the breach groove through seting up on the fan casing, seting up the recess on the fin, changing the structure of fan casing and fin, can practice thrift auxiliary material cost increase, can improve former device temperature effectively, improve user experience and feel, avoid the heat that the notebook produced to all dispel from D shell, lead to D shell temperature too high, influence user experience and feel, need additionally install the graphite flake and dispel the heat, increase cost.

Drawings

Fig. 1 is a perspective view of a first view angle of a notebook heat dissipation module provided by the present utility model;

fig. 2 is a second perspective view of the notebook heat dissipation module provided by the present utility model;

fig. 3 is an enlarged schematic view at a in fig. 2.

In the figure: 1. a fan housing; 2. a heat radiation fin; 3. a groove; 4. a notch groove; 5. a heat dissipation plate; 6. a heat radiating pipe; 7. placing the hole; 8. a mounting block; 9. a mounting hole; 10. a fixing hole; 11. and (5) a mounting seat.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present utility model are within the protection scope of the present utility model.

Referring to fig. 1-3, an embodiment of the present utility model provides a notebook computer heat dissipation module. The notebook computer heat radiation module comprises a fan shell 1, heat radiation fins 2, a groove 3 and a notch groove 4, wherein the heat radiation fins 2 are fixedly arranged on one side of the outer wall of the fan shell 1; two grooves 3 are arranged, and each groove 3 is arranged at the top of the outer wall of the heat radiation fin 2; the notch groove 4 is formed in the top of the outer wall of the fan shell 1, and the inside of the notch groove 4 is communicated with the inside of the groove 3.

In this embodiment: the fan housing 1 is equipped with the cavity, install radiator fan in the cavity, radiator fin 2 comprises a plurality of U-shaped piece, increase radiating effect, the inside of every U-shaped piece is linked together with the inside of fan housing 1, through the radiator fan in the fan housing 1, can direct the heat on the radiator fin 2 to the notebook outside fast, the vertical cross-section of recess 3 can be the trapezoid form, the radiating area can be increased in order to promote radiator fin 2's radiating efficiency, the quantity of recess 3 can set up according to the condition of in-service use, through notch groove 4 and recess 3, can change the radiating direction, improve D shell temperature, user experience is felt, the part cost has been saved, the heat that the notebook produced all is gone out from D shell, lead to D shell temperature to be too high, influence user experience felt, need additionally install the graphite piece and dispel the heat, increase cost, through changing the structure of fan housing 1 and radiator fin 2, can practice thrift the auxiliary material cost increase, can improve former device temperature effectively.

Specifically, the notebook computer heat dissipation module further comprises a heat dissipation plate 5 and a heat dissipation tube 6, wherein the heat dissipation tube 6 is fixedly arranged at the top of the outer wall of the heat dissipation fin 2, and the heat dissipation plate 5 is fixedly arranged at the bottom of the outer wall of the heat dissipation tube 6, which is close to one side edge.

In this embodiment: the heat dissipation plate 5 is arranged on the CPU, can dissipate heat of the CPU, two ends of the heat dissipation pipe 6 are respectively connected with the heat dissipation plate 5 and the heat dissipation fins 2, the heat dissipation pipe 6 can transfer heat on the heat dissipation plate 5 to the heat dissipation fins 2, and the notebook heat dissipation module can be formed through the fan shell 1, the heat dissipation fins 2, the heat dissipation plate 5 and the heat dissipation pipe 6 to dissipate heat of the inside of the notebook.

Specifically, the top of the outer wall of the fan housing 1 is provided with a placement hole 7, and the cross section of the placement hole 7 is circular.

In this embodiment: through the placement hole 7 for placement of the heat radiation fan.

Specifically, the outer wall of the fan housing 1 is fixedly provided with two mounting blocks 8, and the top of the outer wall of each mounting block 8 is provided with a mounting hole 9.

In this embodiment: the fan housing 1 can be installed and fixed inside the computer through the threaded connection between the installation holes 9 on the installation block 8 and the bolts.

Specifically, a plurality of fixing holes 10 are formed in the top of the outer wall of the heat dissipation plate 5.

In this embodiment: the heat dissipation plate 5 is mounted on the CPU through a plurality of fixing holes 10, and heat generated by the CPU can be transferred to the heat dissipation plate 5.

Specifically, the bottom of the inner wall of the fan housing 1 is fixedly provided with a mounting seat 11.

In this embodiment: the mounting seat 11 is used for mounting and placing the cooling fan, so that the cooling fan is arranged inside the fan housing 1.

When the notebook computer is used, the fan housing 1 is firstly mounted in the notebook computer through the bolts, the heat radiating plate 5 is mounted on the CPU through the plurality of fixing holes 10, when the notebook computer is in operation, heat generated by the CPU can be transferred to the heat radiating plate 5, the heat radiating tube 6 can transfer the heat on the heat radiating plate 5 to the heat radiating fins 2, the heat is dissipated from the D shell through the heat radiating fan in the fan housing 1, in the heat radiating process, part of the heat can be isolated from the notch groove 4 and the groove 3, the temperature of the D shell can be improved, the user experience sense is improved, the heat generated by the notebook computer is prevented from being dissipated from the D shell, the temperature of the D shell is overhigh, and the user experience sense is influenced.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a notebook heat dissipation module which characterized in that includes:

a fan housing (1) provided with a cavity;

the radiating fins (2) are fixedly arranged on one side of the outer wall of the fan shell (1);

the heat dissipation device comprises two grooves (3), wherein each groove (3) is formed in the top of the outer wall of each heat dissipation fin (2); and

the notch groove (4) is formed in the top of the outer wall of the fan shell (1), and the inside of the notch groove (4) is communicated with the inside of the groove (3).

2. The notebook heat dissipation module as defined in claim 1, wherein: the heat dissipation device is characterized by further comprising a heat dissipation plate (5) and a heat dissipation tube (6), wherein the heat dissipation tube (6) is fixedly arranged at the top of the outer wall of the heat dissipation fin (2), and the heat dissipation plate (5) is fixedly arranged at the bottom of the outer wall of the heat dissipation tube (6) close to one side edge.

3. The notebook heat dissipation module of claim 2, wherein: the top of the outer wall of the fan shell (1) is provided with a placement hole (7), and the cross section of the placement hole (7) is in a round shape.

4. A notebook heat sink module as claimed in claim 3, wherein: the outer wall of the fan housing (1) is fixedly provided with two mounting blocks (8), and mounting holes (9) are formed in the top of the outer wall of each mounting block (8).

5. The notebook heat dissipation module as defined in claim 4, wherein: a plurality of fixing holes (10) are formed in the top of the outer wall of the heat dissipation plate (5).

6. The notebook heat dissipation module as defined in claim 5, wherein: the bottom of the inner wall of the fan shell (1) is fixedly provided with a mounting seat (11).