CN210119749U - Heat dissipation device and notebook computer - Google Patents
Heat dissipation device and notebook computer Download PDFInfo
- Publication number
- CN210119749U CN210119749U CN201920992489.3U CN201920992489U CN210119749U CN 210119749 U CN210119749 U CN 210119749U CN 201920992489 U CN201920992489 U CN 201920992489U CN 210119749 U CN210119749 U CN 210119749U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- substrate
- transfer block
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipation device and a notebook computer, wherein the heat dissipation device comprises a mainboard, a first heat conduction mechanism connected with the mainboard, an air cooling heat conduction mechanism connected with the first heat conduction mechanism, a second heat conduction mechanism connected with the air cooling heat conduction mechanism, and a heat dissipation part connected with the second heat conduction mechanism; the mainboard comprises a CPU; the first heat conducting mechanism comprises a substrate connected with the CPU; the air-cooled heat conduction mechanism comprises a first heat pipe connected with the substrate and a first radiating fin connected with the first heat pipe; the second heat conducting mechanism comprises a fixing plate and a second heat pipe connected with the fixing plate; the second heat pipe is used for connecting the substrate; the heat dissipation piece is connected with the fixing plate. The heat dissipation device dissipates the heat of the CPU through the first heat pipe and the first heat dissipation fin through the substrate, and dissipates the heat of the CPU through the second heat pipe and the heat dissipation fin, so that the rapid heat dissipation of the CPU is realized. The heat dissipation device has simple structure and good heat dissipation effect.
Description
Technical Field
The utility model relates to a computer cooling equipment technical field especially relates to a simple structure's heat abstractor and notebook computer.
Background
The performance upgrading of the notebook computer is mainly the upgrading of a CPU, after a new generation of high-performance CPU is replaced, the heating power consumption can be increased, and the noise of the notebook computer can be enhanced under the working state of high power consumption. Because the whole machine shell is a mould forming product, the change of the whole machine shell brings great workload to the design and the production, greatly influences the design and the production period and increases the cost of the notebook. The new heat dissipation scheme needs to meet the original noise index under the existing structural framework, so how to solve the problem of heat dissipation in the original structural framework of the whole machine shell is a difficult problem.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need to provide a heat dissipation device and a notebook computer with simple structure and good heat dissipation effect.
A heat dissipation device comprises a main board, a first heat conduction mechanism connected with the main board, an air cooling heat conduction mechanism connected with the first heat conduction mechanism, a second heat conduction mechanism connected with the air cooling heat conduction mechanism, and a heat dissipation piece connected with the second heat conduction mechanism; the main board comprises a CPU; the first heat conducting mechanism comprises a substrate connected with the CPU; the air-cooled heat conduction mechanism comprises a first heat pipe connected with the substrate and a first radiating fin connected with the first heat pipe; the second heat conducting mechanism comprises a fixing plate and a second heat pipe connected with the fixing plate; the second heat pipe is used for connecting the substrate; the heat dissipation piece is connected with the fixing plate.
The utility model discloses a heat abstractor dispels the heat with CPU's heat through first heat pipe and first fin through the base plate, and simultaneously, CPU's heat dispels the heat through second heat pipe and heat-dissipating piece, realizes CPU's quick heat dissipation. The heat dissipation device has simple structure and good heat dissipation effect.
In one embodiment, the first heat conducting mechanism further includes a first heat transfer block and a second heat transfer block respectively connected to the front and back surfaces of the substrate; the first heat transfer block is used for abutting against the CPU; the second heat transfer block is used for abutting against the first heat pipe.
In one embodiment, the second heat conducting mechanism further comprises a heat conducting block; the heat conducting block is connected with one side of the fixing plate, which is connected with the second heat pipe; the heat conducting block is used for being abutted to the substrate and the second heat pipe.
In one embodiment, the motherboard further comprises a bridge chip; the bridge chip is arranged on one side of the CPU.
In one embodiment, the first heat conducting mechanism further includes a third heat transfer block and a fourth heat transfer block respectively connected to the front and back surfaces of the substrate; the third heat transfer block is used for abutting against the bridge chip; the fourth heat transfer block is used for abutting against the heat dissipation piece.
In one embodiment, the system further comprises a chassis; the case comprises a shell, a cover plate connected with the shell and a protection plate connected with the cover plate; the main board is arranged on the shell; the fixing plate is arranged on one side of the cover plate close to the main plate; the fixing plate is arranged on one side of the first heat pipe, which is far away from the first radiating fin; the heat dissipation member is installed between the cover plate and the protection plate.
In one embodiment, the device further comprises a fastening mechanism; the fastening mechanism comprises a first fastener and a second fastener; the first fastener is used for fixing the main board and the shell; the second fastener is used for fixing the main board and the substrate.
In one embodiment, the air-cooled heat conducting mechanism further comprises a fan; the fan is arranged at an end corner of the shell; an air inlet hole is formed in one side of the shell, and an air outlet hole is formed in one end of the shell; the air inlet hole and the air outlet hole are arranged corresponding to the fan; the cover plate is provided with heat dissipation holes corresponding to the fans.
In one embodiment, the first heat sink is disposed between the fan and the air outlet.
A notebook computer comprises the heat dissipation device.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation device according to an embodiment of the present invention;
fig. 2 is a schematic structural view of the main board, the first heat conducting mechanism, the housing and the first fastening member in the heat dissipation device shown in fig. 1;
FIG. 3 is a schematic view of the heat dissipating device shown in FIG. 1, except for the cover plate, the protection plate and the heat dissipating member;
FIG. 4 is a schematic structural view of a cover plate and a heat sink in the heat dissipation device shown in FIG. 1;
fig. 5 is an assembly structure diagram of the heat dissipation device shown in fig. 1.
Reference is made to the accompanying drawings in which:
a heat sink 100;
a motherboard 10, a CPU11, a bridge chip 12, a first heat conduction mechanism 20, a substrate 21, a first heat transfer block 22, a second heat transfer block 23, a third heat transfer block 24, a fourth heat transfer block 25;
the air cooling heat conduction mechanism 30, the first heat pipe 31, the first heat sink 32, the fan 33, the second heat conduction mechanism 40, the fixing plate 41, the second heat pipe 42, the heat conduction block 43, and the heat sink 50;
the air conditioner comprises a case 60, a shell 61, an air inlet hole 611, an air outlet hole 612, a cover plate 62, a protection plate 63, a fastening mechanism 70, a first fastening piece 71 and a second fastening piece 72.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully below. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 5, a heat dissipation apparatus 100 according to an embodiment of the present invention includes a main board 10, a first heat conduction mechanism 20 connected to the main board 10, an air-cooled heat conduction mechanism 30 connected to the first heat conduction mechanism 20, a second heat conduction mechanism 40 connected to the air-cooled heat conduction mechanism 30, and a heat dissipation member 50 connected to the second heat conduction mechanism 40; the main board 10 includes a CPU 11; the first heat conduction mechanism 20 includes a substrate 21 to which the CPU11 is connected; the air-cooled heat conducting mechanism 30 comprises a first heat pipe 31 connected with the substrate 21 and a first heat sink 32 connected with the first heat pipe 31; the second heat conducting mechanism 40 includes a fixing plate 41 and a second heat pipe 42 connected to the fixing plate 41; the second heat pipe 42 is used for connecting the substrate 21; the heat sink 50 is connected to the fixing plate 41. The heat dissipation device 100 dissipates the heat of the CPU11 through the first heat pipe 31 and the first heat sink 32 via the substrate 21, and dissipates the heat of the CPU11 through the second heat pipe 42 and the heat dissipation member 50, thereby achieving rapid heat dissipation of the CPU 11.
As shown in fig. 1 and 2, in the present embodiment, the CPU11 is mounted on the motherboard 10; the motherboard 10 further includes a bridge chip 12; the bridge chip 12 is disposed on one side of the CPU 11. Optionally, the substrate 21 is made of a heat conductive material. In order to dissipate heat timely from the CPU11, the first heat conducting mechanism 20 further includes a first heat transfer block 22 and a second heat transfer block 23 respectively connected to the front and back sides of the substrate 21; the first heat transfer block 22 is used for abutting against the CPU 11; the second heat transfer block 23 is used to abut against the first heat pipe 31, so that the heat of the CPU11 is dissipated through the first heat transfer block 22, the substrate 21, the second heat transfer block 23 and the first heat pipe 31. In order to dissipate heat of the bridge chip 12 in time, the first heat conducting mechanism 20 further includes a third heat transfer block 24 and a fourth heat transfer block 25 respectively connected to the front and back surfaces of the substrate 21; the third heat transfer block 24 is used to abut against the bridge chip 12, and the heat of the bridge chip 12 is dissipated through the third heat transfer block 24, the substrate 21 and the fourth heat transfer block 25. Referring to fig. 3, the first heat pipe 31 is bent, and the number of the first heat pipes 31 is two; the first heat sink 32 is a fin, and the first heat pipe 31 and the first heat sink 32 are welded together. The air-cooled heat conducting mechanism 30 further comprises a fan 33; the fan 33 is disposed at one side of the first heat sink 32. In order to timely dissipate heat of the CPU11, a second heat conducting mechanism 40 is arranged on the CPU 11; optionally, the fixing plate 41 is an aluminum substrate; the second heat pipes 42 are straight, and two second heat pipes 42 are provided; further, the second heat pipe 42 is welded to the fixing plate 41. The second heat conduction mechanism 40 further includes a heat conduction block 43; the heat conduction block 43 is arranged at one side of the fixing plate 41 connected with the second heat pipe 42; the heat conduction block 43 is used to contact the substrate 21 and the second heat pipe 42. Optionally, the heat-conducting block 43 is a copper block; the heat conduction block 43 is welded to the fixing plate 41.
Referring to fig. 4 and 5, the heat dissipating member 50 abuts against the fourth heat transfer block 25, so that the heat of the bridge chip 12 is dissipated through the third heat transfer block 22, the substrate 21, the fourth heat transfer block 25 and the heat dissipating member 50; meanwhile, the heat sink 50 abuts against the fixing plate 41, so that the heat of the CPU11 is dissipated through the first heat transfer block 22, the substrate 21, the heat conduction block 43, the second heat pipe 42, the fixing plate 41 and the heat sink 50; optionally, the heat sink 50 is a fin. The heat dissipation device 100 further includes a chassis 60; the casing 60 includes a housing 61, a cover 62 connected to the housing 61, and a protection plate 63 connected to the cover 62. Optionally, a fixing column (not shown) is arranged on the housing 61; the main board 10 is mounted on a fixing post of the housing 61. The fan 33 is arranged at the end corner of the shell 61; the fixing plate 41 is installed on one side of the cover plate 62 close to the main board 10; the fixing plate 41 is installed on the side of the first heat pipe 31 away from the first heat sink 32; the heat sink 50 is installed between the cover plate 62 and the protection plate 63. Further, an air inlet hole 611 is formed in one side of the shell 61, and an air outlet hole 612 is formed in one end of the shell 61; the air inlet 311 and the air outlet 312 are arranged corresponding to the fan 33; the first heat pipe 31 extends from the second heat transfer block 23 to the air outlet 612; the first heat sink 32 is disposed between the fan 33 and the air outlet 612 for dissipating heat; the cover plate 62 has heat dissipation holes (not shown) corresponding to the fans 33; the protection plate 63 is a grid plate, which can not only naturally ventilate and dissipate heat, but also isolate the high temperature area on the heat dissipation member 50, thereby preventing the human-computer from being heated when in contact. In use, the fan 33 rotates to make the cold air flow from the air inlet hole 611 through the first heat sink 32 and flow out from the air outlet hole 612, so as to take away the heat of the first heat sink 32. In one embodiment, the heat dissipation device 100 further comprises a fastening mechanism 70; the fastening mechanism 70 includes a first fastening member 71 and a second fastening member 72; the first fastening member 71 is used for fixing the main board 10 and the housing 61; the second fastening member 72 is used to fix the main board 10 and the base board 21. Optionally, the first fastener 71 and the second fastener 72 are both hexagonal nut posts. Further, the first fastening member 71 fixes the main board 10 and the fixing post on the housing 61, and the second fastening member 72 fixes the substrate 21 and the first fastening member 71.
When the heat dissipation device 100 is used, the heat of the CPU11 is transferred to the substrate 21 through the first heat transfer block 22, the substrate 21 is transferred to the second heat transfer block 23, and then transferred to the first heat pipe 31 through the second heat transfer block 23, the first heat pipe 31 is transferred to the first heat dissipation fin 32, and finally, the heat is dissipated through the fan 33; meanwhile, the heat of the CPU11 is transferred to the heat conduction block 43 through the substrate 21, the heat conduction block 43 is transferred to the second heat pipe 42, the second heat pipe 42 is transferred to the fixing plate 41, and then is transferred to the heat sink 50 through the fixing plate 41, and the heat dissipation is realized by the natural convection of the heat sink 50. The heat of the bridge chip 12 is transferred to the substrate 21 through the third heat transfer block 24, the substrate 21 is transferred to the fourth heat transfer block 25, the fourth heat transfer block 25 is transferred to the heat dissipation member 50, and the heat dissipation is realized through the natural convection of the heat dissipation member 50; the heat dissipation problem of a new generation of high-performance and high-power-consumption CPU11 and the bridge chip 12 is solved in the existing chassis structure frame, and the noise index is not changed.
On the basis of the above embodiments, in an optional embodiment, the heat dissipation device 100 is applied to a notebook computer.
The utility model discloses a heat abstractor 100 dispels the heat with CPU 11's heat through first heat pipe 31 and first fin 32 through base plate 21, and simultaneously, CPU 11's heat dispels the heat through second heat pipe 42 and heat sink 50, realizes CPU 11's quick heat dissipation. The heat dissipation device 100 has a simple structure and a good heat dissipation effect.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A heat dissipation device is characterized by comprising a main board, a first heat conduction mechanism connected with the main board, an air cooling heat conduction mechanism connected with the first heat conduction mechanism, a second heat conduction mechanism connected with the air cooling heat conduction mechanism, and a heat dissipation piece connected with the second heat conduction mechanism; the main board comprises a CPU; the first heat conducting mechanism comprises a substrate connected with the CPU; the air-cooled heat conduction mechanism comprises a first heat pipe connected with the substrate and a first radiating fin connected with the first heat pipe; the second heat conducting mechanism comprises a fixing plate and a second heat pipe connected with the fixing plate; the second heat pipe is used for connecting the substrate; the heat dissipation piece is connected with the fixing plate.
2. The heat dissipation device of claim 1, wherein the first heat conducting mechanism further comprises a first heat transfer block and a second heat transfer block respectively connected to the front and back surfaces of the substrate; the first heat transfer block is used for abutting against the CPU; the second heat transfer block is used for abutting against the first heat pipe.
3. The heat dissipating device of claim 1, wherein said second heat conducting mechanism further comprises a heat conducting block; the heat conducting block is connected with one side of the fixing plate, which is connected with the second heat pipe; the heat conducting block is used for being abutted to the substrate and the second heat pipe.
4. The heat dissipation device of claim 1, wherein the motherboard further comprises a bridge chip; the bridge chip is arranged on one side of the CPU.
5. The heat dissipation device as claimed in claim 4, wherein the first heat conducting mechanism further comprises a third heat transfer block and a fourth heat transfer block respectively connected to the front and back surfaces of the substrate; the third heat transfer block is used for abutting against the bridge chip; the fourth heat transfer block is used for abutting against the heat dissipation piece.
6. The heat dissipating device of claim 1, further comprising a chassis; the case comprises a shell, a cover plate connected with the shell and a protection plate connected with the cover plate; the main board is arranged on the shell; the fixing plate is arranged on one side of the cover plate close to the main plate; the fixing plate is arranged on one side of the first heat pipe, which is far away from the first radiating fin; the heat dissipation member is installed between the cover plate and the protection plate.
7. The heat dissipating device of claim 6, further comprising a fastening mechanism; the fastening mechanism comprises a first fastener and a second fastener; the first fastener is used for fixing the main board and the shell; the second fastener is used for fixing the main board and the substrate.
8. The heat dissipating device of claim 6, wherein said air-cooled heat conducting mechanism further comprises a fan; the fan is arranged at an end corner of the shell; an air inlet hole is formed in one side of the shell, and an air outlet hole is formed in one end of the shell; the air inlet hole and the air outlet hole are arranged corresponding to the fan; the cover plate is provided with heat dissipation holes corresponding to the fans.
9. The heat dissipating device of claim 8, wherein the first heat sink is disposed between the fan and the air outlet.
10. A notebook computer characterized by comprising the heat dissipating device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920992489.3U CN210119749U (en) | 2019-06-27 | 2019-06-27 | Heat dissipation device and notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920992489.3U CN210119749U (en) | 2019-06-27 | 2019-06-27 | Heat dissipation device and notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210119749U true CN210119749U (en) | 2020-02-28 |
Family
ID=69616328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920992489.3U Active CN210119749U (en) | 2019-06-27 | 2019-06-27 | Heat dissipation device and notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210119749U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970880A (en) * | 2020-09-16 | 2020-11-20 | 研祥智能科技股份有限公司 | Closed cabinet |
-
2019
- 2019-06-27 CN CN201920992489.3U patent/CN210119749U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970880A (en) * | 2020-09-16 | 2020-11-20 | 研祥智能科技股份有限公司 | Closed cabinet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101466240B (en) | Radiating device | |
| CN201601122U (en) | heat sink | |
| CN107943254B (en) | A portable computer device and its cooling module | |
| US20210212238A1 (en) | Server heat dissipation structure | |
| CN201336012Y (en) | Combined type heat-radiating shell and embedded computer | |
| CN210119749U (en) | Heat dissipation device and notebook computer | |
| CN102375514A (en) | Electronic device | |
| CN209433318U (en) | A kind of machine box for server and its composite type cooling system | |
| CN219936382U (en) | Novel heat dissipation module, mainboard and notebook computer | |
| CN102819300A (en) | Heat sink and electronic device structure | |
| CN105744799A (en) | Heat dissipation apparatus and heat dissipation system | |
| CN207067911U (en) | A module heat sink for heat dissipation of a control module | |
| CN117270661A (en) | A mini host partitioned heat dissipation structure with a display | |
| CN2665919Y (en) | expandable heat sink | |
| CN215833827U (en) | High-performance vision host computer of integrated IO mainboard | |
| CN103732038A (en) | Heat dissipation structure | |
| CN109002141B (en) | Computer mainframe heat dissipation equipment | |
| CN2852243Y (en) | Structure of computer heat radiator | |
| CN1681113A (en) | heat pipe radiator | |
| CN105324016A (en) | Case | |
| CN221595614U (en) | Fanless radiator | |
| CN201142047Y (en) | 1U chassis cooling device that is good for heat dissipation | |
| CN221962183U (en) | A U-shaped heat dissipation host structure | |
| CN212135374U (en) | Rack-mounted server cooling system | |
| CN221378579U (en) | Computer motherboard protection architecture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230727 Address after: 518057 1701, Yanxiang science and technology building, 31 Gaoxin middle Fourth Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Yanxiang Smart Technology Co.,Ltd. Address before: 518107 5th floor, No.1, Yanxiang Zhigu chuangxiangdi, No.11, Gaoxin Road, Guangming New District, Shenzhen City, Guangdong Province Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |