CN219590784U

CN219590784U - Water cooling structure of central processing unit

Info

Publication number: CN219590784U
Application number: CN202320590900.0U
Authority: CN
Inventors: 邸一鸣
Original assignee: Shanxi University
Current assignee: Shanxi University
Priority date: 2023-03-23
Filing date: 2023-03-23
Publication date: 2023-08-25
Anticipated expiration: 2033-03-23

Abstract

The utility model provides a water cooling structure of a central processing unit, which comprises a structure body, wherein the structure body comprises a radiating water tank, mounting mechanisms are symmetrically and fixedly arranged on two sides of the radiating water tank, a computer main board is fixedly arranged at the bottom of the radiating water tank through the mounting mechanisms, heat of the central processing unit led out by heat-conducting silicone grease is directly absorbed by the radiating water tank and directly transferred to cooling liquid, and meanwhile, heat of the radiating water tank and the cooling liquid can be emitted through radiating fins, so that the radiating efficiency of the structure is improved, and the water cooling structure is low in production cost; and can prevent through the limiting cover that heat conduction silicone grease from receiving the extrusion and outflow for central processing unit fully contacts with the heat dissipation water tank, and it is convenient to install and fix this water-cooling structure through fixed pipe, elastic plate, extrusion piece and screw rod, convenient operation.

Description

Water cooling structure of central processing unit

Technical Field

The utility model relates to the technical field of water cooling structures of central processing units, in particular to a water cooling structure of a central processing unit.

Background

The CPU is one of the main devices of the electronic computer and is a core accessory in the computer. The central processing unit in the computer usually adopts the mutual matching of the cooling fan and the cooling fins to dissipate heat, the cooling effect of the cooling fan and the cooling fins is limited, and the water-cooled cooling device can also be used for dissipating heat of the central processing unit.

The utility model discloses a Chinese patent with publication number of CN212010952U, which provides a heat dissipating device of a central processing unit of a computer, and comprises a main board, wherein a central processing unit body is arranged at the top of the main board, a heat conducting block is arranged above the main board, a heat conducting layer is arranged between the bottom of the heat conducting block and the top of the central processing unit body, a copper pipe is arranged in the heat conducting block, a heat dissipating fin is fixedly connected to the top of the heat conducting block, a heat dissipating frame is arranged on one side of the outer surface of the heat conducting block, a heat dissipating fan is arranged on the heat dissipating frame, a positioning block I is fixedly connected to the outer surface of the heat conducting block, a positioning block II is arranged at a position corresponding to the upper part of the main board, and a connecting bolt is fixedly connected to the bottom of the positioning block II; according to the technical scheme, heat generated during the working of the central processing unit can be quickly conducted onto the heat conducting block through the heat conducting layer, the butt joint with the water cooling equipment can be conveniently conducted through the copper pipe structure, so that cooling liquid can circulate in the copper pipe, a part of heat can be taken away, the heat on the heat conducting block is conducted onto the radiating fin to be dispersed, the heat conducting fan is matched with the heat conducting layer to drive airflow to flow through the radiating fin, the heat on the radiating fin is taken away, therefore the quick heat radiating work of the central processing unit can be realized, the heat radiating performance is stable, the use safety of the central processing unit can be effectively ensured, but the heat of the central processing unit needs to be transmitted to the cooling liquid through the heat conducting layer, the heat conducting block and the copper pipe through the copper pipe, the heat conducting block and the heat conducting layer, the heat conducting layer between the central processing unit and the heat radiating device is heat conducting silicone grease according to the fact that the heat conducting layer between the central processing unit and the heat radiating device is known to be colloid, the heat conducting silicone grease can be extruded when the heat conducting block is arranged at the top of the central processing unit, more silicone grease can be easily used to flow outwards, the heat is used, the silicone grease is less can be used, the heat between the central processing unit and the central processing unit is low in heat conducting efficiency and the heat conducting device is not used.

Therefore, the utility model provides a water cooling structure of a central processing unit.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model aims to provide a water cooling structure of a central processing unit, so as to solve the problems in the background art, and the heat of the central processing unit can be directly radiated through the heat-conducting silicone grease, the radiating water tank and the cooling liquid by limiting the heat-conducting silicone grease through the limiting cover, and the radiating fins can absorb part of the heat and radiate the heat, so that the radiating efficiency of the water cooling structure can be improved.

In order to achieve the above object, the present utility model is realized by the following technical scheme: the utility model provides a central processing unit water cooling structure, includes the structure body, the structure body includes the heat radiation water tank, the bilateral symmetry fixed mounting of heat radiation water tank has the installation mechanism, the bottom of heat radiation water tank has the computer motherboard through installation mechanism fixed mounting, the top fixed mounting of computer motherboard has central processing unit, central processing unit sets up between computer motherboard and heat radiation water tank.

Further, the installation mechanism comprises a fixing plate, two ends of the radiating water tank are symmetrically and fixedly installed on the fixing plate, and a screw is installed in the fixing plate in a limiting and rotating mode.

Further, the bottom of the fixing plate is fixedly provided with a fixing pipe corresponding to the outer side of the screw rod, and two sides of the bottom of the fixing pipe are symmetrically and fixedly provided with elastic plates.

Further, the bottom fixed mounting of both sides the elastic plate has the extrusion piece, the screw has been seted up to the inside of extrusion piece, extrusion piece passes through screw movable mounting in the bottom of screw rod.

Further, the jack is arranged at the position of the computer main board corresponding to the installation mechanism, the bottom end of the fixing tube is inserted into the jack, and the top end of the screw rod is fixedly provided with a knob.

Further, the bottom of the heat radiation water tank is sleeved with a limiting cover, the limiting cover is arranged between the heat radiation water tank and the central processing unit, and heat conduction silicone grease is arranged in the limiting cover.

Further, radiating fins are fixedly mounted in the radiating water tank at equal intervals, and the top ends of the radiating fins are arranged on the outer side of the radiating water tank.

Further, a flow channel is arranged between one side of the bottom end of the radiating fin and the inner wall of the radiating water tank, the shape of the flow channel is S-shaped, and a water inlet pipe and a water outlet pipe are symmetrically and fixedly arranged at two ends of the same side of the radiating water tank.

The utility model has the beneficial effects that: according to the water cooling structure of the central processing unit, the heat of the central processing unit led out by the heat conduction silicone grease is directly absorbed by the heat dissipation water tank and is directly transmitted to the cooling liquid, and meanwhile, the heat of the heat dissipation water tank and the cooling liquid can be emitted by the heat dissipation fins, so that the heat dissipation efficiency of the structure is improved, and the production cost of the water cooling structure is low; can prevent through the limiting cover that heat conduction silicone grease from receiving the extrusion and outflow for central processing unit fully contacts with the heat dissipation water tank, and it is convenient to install and fix this water-cooling structure through fixed pipe, elastic plate, extrusion piece and screw rod, convenient operation.

Drawings

FIG. 1 is a block diagram of a CPU water cooling structure according to the present utility model;

FIG. 2 is a cross-sectional view of a CPU water cooling structure according to the present utility model;

FIG. 3 is a diagram showing a water tank structure of a CPU water cooling structure according to the present utility model;

in the figure: 1. a central processing unit; 2. a computer motherboard; 3. a limiting cover; 4. a heat radiation water tank; 5. a heat radiation fin; 6. a mounting mechanism; 7. a knob; 8. a fixing plate; 9. a fixed tube; 10. a screw; 11. an elastic plate; 12. extruding a block; 13. a water inlet pipe; 14. and a water outlet pipe.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

Referring to fig. 1 to 3, the present utility model provides a technical solution: the utility model provides a central processing unit water cooling structure, includes the structure body, the structure body includes radiating water tank 4, radiating water tank 4's bilateral symmetry fixed mounting has installation mechanism 6, the bottom of radiating water tank 4 is through installation mechanism 6 fixed mounting has computer motherboard 2, computer motherboard 2's top fixed mounting has central processing unit 1, central processing unit 1 sets up between computer motherboard 2 and radiating water tank 4, conveniently installs structure body fixed mounting on computer motherboard 2 through installation mechanism 6.

In this embodiment, the installation mechanism 6 includes fixed plate 8, fixed plate 8 symmetry fixed mounting has the both ends of cooling water tank 4, the inside spacing rotation of fixed plate 8 installs screw rod 10, the outside fixed mounting of the bottom of fixed plate 8 corresponds screw rod 10 has fixed pipe 9, the both sides symmetry fixed mounting of the bottom of fixed pipe 9 has elastic plate 11, both sides the bottom fixed mounting of elastic plate 11 has extrusion piece 12, the screw has been seted up to extrusion piece 12's inside, extrusion piece 12 passes through screw movable mounting in the bottom of screw rod 10, the jack has been seted up to the position department that corresponds installation mechanism 6 on the computer mainboard 2, the bottom of fixed pipe 9 is pegged graft in the inside of jack, the top fixed mounting of screw rod 10 has knob 7, drives screw rod 10 through knob 7 and rotates, and screw rod 10 is close to fixed pipe 9 and extrudees elastic plate 11 through the screw, and elastic plate 11 is protruding to both sides to fix installation mechanism 6 and computer mainboard 2 between.

In this embodiment, the bottom of radiator 4 cup joints installs spacing cover 3, between radiator 4 and central processing unit 1 is installed to spacing cover 3, the inside of spacing cover 3 is provided with heat conduction silicone grease, the inside equidistance fixed mounting of radiator 4 has radiator fin 5, the top of radiator fin 5 sets up in the outside of radiator 4, be provided with the runner between the inner wall of bottom one side of radiator fin 5 and radiator 4, the shape of runner is "S" type, radiator 4 is with the both ends symmetry fixed mounting of one side have inlet tube 13 and outlet pipe 14, and radiator 4 is copper goods, can absorb the heat of heat dissipation silicone grease derivation and cool down it through the coolant liquid, improves radiator 4' S radiating efficiency through radiator fin 5 simultaneously.

When the water cooling structure of the central processing unit is used, the heat of the central processing unit 1 led out by the heat conduction silicone grease is directly absorbed by the heat radiation water tank 4 and is directly transferred to the cooling liquid, and meanwhile, the heat of the heat radiation water tank 4 and the cooling liquid can be emitted by the heat radiation fins 5, so that the heat radiation efficiency of the structure is improved; can prevent through limiting cover 3 that heat conduction silicone grease from receiving the extrusion and outflow for central processing unit 1 fully contacts with cooling water tank 4, conveniently installs and fixes this water-cooling structure through fixed pipe 9, elastic plate 11, extrusion piece 12 and screw rod 10, convenient operation.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The utility model provides a central processing unit water cooling structure, includes the structure body, a serial communication port, the structure body includes heat radiation water tank (4), the bilateral symmetry fixed mounting of heat radiation water tank (4) has installation mechanism (6), the bottom of heat radiation water tank (4) is through installation mechanism (6) fixed mounting has computer motherboard (2), the top fixed mounting of computer motherboard (2) has central processing unit (1), central processing unit (1) set up between computer motherboard (2) and heat radiation water tank (4).

2. The water cooling structure of a central processing unit according to claim 1, wherein: the mounting mechanism (6) comprises a fixing plate (8), two ends of the radiating water tank (4) are symmetrically and fixedly mounted on the fixing plate (8), and a screw (10) is mounted in the fixing plate (8) in a limiting rotation mode.

3. The water cooling structure of a central processing unit according to claim 2, wherein: the bottom of the fixed plate (8) is fixedly provided with a fixed pipe (9) corresponding to the outer side of the screw rod (10), and two sides of the bottom of the fixed pipe (9) are symmetrically and fixedly provided with elastic plates (11).

4. A water cooling structure for a central processing unit according to claim 3, wherein: the bottom of elastic plate (11) both sides fixed mounting has extrusion piece (12), the screw has been seted up to the inside of extrusion piece (12), extrusion piece (12) are through screw movable mounting in the bottom of screw rod (10).

5. The water cooling structure of a cpu according to claim 4, wherein: the computer is characterized in that a jack is formed in the computer main board (2) at a position corresponding to the mounting mechanism (6), the bottom end of the fixing tube (9) is inserted into the jack, and a knob (7) is fixedly mounted at the top end of the screw rod (10).

6. The water cooling structure of a central processing unit according to claim 1, wherein: the bottom of the radiating water tank (4) is sleeved with a limiting cover (3), the limiting cover (3) is arranged between the radiating water tank (4) and the central processing unit (1), and heat conduction silicone grease is arranged in the limiting cover (3).

7. The water cooling structure of a central processing unit according to claim 1, wherein: radiating fins (5) are fixedly mounted in the radiating water tank (4) at equal intervals, and the top ends of the radiating fins (5) are arranged on the outer side of the radiating water tank (4).

8. The water cooling structure of a cpu according to claim 7, wherein: a flow channel is arranged between one side of the bottom end of the radiating fin (5) and the inner wall of the radiating water tank (4), the shape of the flow channel is S-shaped, and a water inlet pipe (13) and a water outlet pipe (14) are symmetrically and fixedly arranged at two ends of the same side of the radiating water tank (4).