CN213876625U - Novel computer mainboard radiator - Google Patents
Novel computer mainboard radiator Download PDFInfo
- Publication number
- CN213876625U CN213876625U CN202023112058.5U CN202023112058U CN213876625U CN 213876625 U CN213876625 U CN 213876625U CN 202023112058 U CN202023112058 U CN 202023112058U CN 213876625 U CN213876625 U CN 213876625U
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- Prior art keywords
- mounting
- heat
- heat pipe
- shell
- fixed
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- 238000009434 installation Methods 0.000 claims abstract description 37
- 238000001816 cooling Methods 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000005494 condensation Effects 0.000 claims description 19
- 238000009833 condensation Methods 0.000 claims description 19
- 239000000498 cooling water Substances 0.000 claims description 13
- 238000001704 evaporation Methods 0.000 claims description 11
- 230000008020 evaporation Effects 0.000 claims description 11
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 7
- 239000002826 coolant Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型属于电脑散热装置技术领域，公开了一种新型电脑主板散热器，包括热管、安装壳和循环水泵，所述安装壳上固定有支架，支架由三个端部重合的支撑杆组成，所述支架上固定有散热风扇，所述支架的顶部固定有基环，基环的外壁上阵列设置有散热片一，本实用新型通过在散热风扇的安装壳上安装热管，令热管的一端安装于安装壳的侧边缘上，并设置散热片二与热管接触，热管具备优良的导热能力，能够快速高效地将主板的热量传递至散热片二上，散热风扇可在散热片二处形成气流，有效将热量散去，在原有散热风扇的基础上增加的热管大大提高了散热器的散热性能，能适用于大功率的主板散热。
The utility model belongs to the technical field of computer cooling devices, and discloses a novel computer motherboard radiator, which comprises a heat pipe, a mounting shell and a circulating water pump. A bracket is fixed on the mounting shell, and the bracket is composed of three supporting rods with overlapping ends. A cooling fan is fixed on the bracket, a base ring is fixed on the top of the bracket, and a cooling fin is arranged in an array on the outer wall of the base ring. The utility model installs a heat pipe on the installation shell of the cooling fan, and makes one end of the heat pipe installed On the side edge of the mounting case, the second heat sink is set in contact with the heat pipe. The heat pipe has excellent thermal conductivity and can quickly and efficiently transfer the heat of the motherboard to the second heat sink. The cooling fan can form airflow at the second heat sink. The heat is effectively dissipated, and the heat pipe added on the basis of the original cooling fan greatly improves the heat dissipation performance of the radiator, and is suitable for heat dissipation of high-power motherboards.
Description
Technical Field
The utility model belongs to the technical field of the computer heat dissipation device, concretely relates to novel computer motherboard radiator.
Background
The motherboard is also called a motherboard, a system board, or a motherboard. It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card. When the computer works, heat generated by various elements on the mainboard is accumulated on the mainboard, so that the mainboard needs to be radiated to prolong the service life of the mainboard.
The radiator of the computer mainboard at present only adopts the cooperation of a fan and radiating fins to radiate heat, and can normally radiate heat for the computer mainboard with low power, however, for the computer mainboard with more elements, the radiator has low radiating speed and low efficiency, can not radiate the heat of the mainboard quickly and efficiently, leads to unstable operation of the mainboard elements, shortens the service life, even leads to the burning of the mainboard, and has low safety performance and low economic benefit.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel computer motherboard radiator to it is less to solve current computer motherboard radiator heat dissipation device, and the radiating rate is slow, problem that the radiating efficiency is low.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel computer mainboard radiator, includes heat pipe, installation shell and circulating water pump, be fixed with the support on the installation shell, the support comprises the bracing piece of three tip coincidence, and the contained angle of every two adjacent bracing pieces is 60, be fixed with radiator fan on the support, the top of support is fixed with the base ring, and the array is provided with fin one on the outer wall of base ring, and fin one is arc platelike, seted up the through-hole on the installation shell, and fin one inlays and locates on the through-hole inner wall, the symmetry is fixed with two sets of mounting brackets on the lateral wall of installation shell, and every mounting bracket of group comprises the installation pole of two symmetries, the one end of heat pipe is installed in two sets of mounting brackets, and is two sets of still install the base plate on the mounting bracket, the array is provided with fin two on the base plate, and the lateral wall and the heat pipe contact of base plate.
Preferably, the one end that the heat pipe is located two sets of mounting brackets is established to the condensation segment, and the other end is established to the evaporation zone, every group equal symmetry has seted up two mounting grooves on the lateral wall between two installation poles of mounting bracket, and the condensation segment can slide with the mounting groove cooperation of every group mounting bracket.
Preferably, two sets of still install condenser pipe between the mounting bracket, and condenser pipe and the condensation zone contact of heat pipe, it has the coolant liquid to add in the condenser pipe, and condenser pipe's both ends are connected to circulating water pump's the end of intaking and the end of play water respectively.
Preferably, still be fixed with the installation cassette of two symmetries on a lateral wall of installation shell, all seted up the arc wall on the lateral wall between two installation cassettes, and condenser tube's outer wall can cooperate with two arc walls, condenser tube installs on the mount pad through two installation cassettes, and the both ends of condenser tube pass two sets of mounting brackets respectively.
Preferably, the outer wall of the evaporation section is provided with a mounting seat, a heat conduction shell is fixed on one side wall of the mounting shell, and the heat conduction shell is in contact with the outer wall of the condensation section of the heat pipe.
Preferably, be provided with 3 installation feet on the lateral wall of installation shell, the symmetry is provided with 4 installation feet on the both sides wall of mount pad, the installation shell all installs on the computer mainboard through the cooperation of screw and installation foot with the mount pad.
Compared with the prior art, the utility model, following beneficial effect has:
(1) the utility model discloses an installation heat pipe on radiator fan's installation shell, make the one end of heat pipe install on the side reason of installation shell, and set up fin two and heat pipe contact, the heat pipe possesses good heat-conducting ability, can be fast high-efficiently with the heat transfer of mainboard to fin two on, radiator fan can be in two formation air currents of fin, effectively dispel the heat, the heat pipe that increases on original radiator fan's basis has improved the heat dispersion of radiator greatly, can be applicable to powerful mainboard heat dissipation, the component steady operation has been ensured, extension mainboard life.
(2) The utility model discloses a set up circulating water pump, and through installation cassette installation condenser tube in the mounting bracket, make condenser tube and the condensation zone lateral wall contact of heat pipe, at the inside coolant liquid that adds of condenser tube, and be connected to circulating water pump's water inlet and delivery port respectively with the both ends of condenser tube, make the coolant liquid circulation flow, thereby constantly take away the heat of heat pipe transmission to condensation zone, improve the radiating effect to the heat pipe greatly, the radiating performance of heat pipe heat transfer has been improved, further improve the radiating effect of radiator.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the cooling fan and the first cooling fin of the present invention;
FIG. 3 is a schematic view of the heat pipe and the mounting frame of the present invention;
in the figure: the heat pipe-1, the mounting shell-2, the circulating water pump-3, the mounting seat-4, the first cooling fin-5, the heat conduction shell-6, the mounting rack-7, the cooling water pipe-8, the second cooling fin-9, the evaporation section-10, the condensation section-11, the support-12, the cooling fan-13, the mounting clamping seat-14 and the mounting foot-15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: a novel computer mainboard radiator comprises a heat pipe 1, a mounting shell 2 and a circulating water pump 3, wherein a support 12 is fixed on the mounting shell 2, the support 12 is composed of three support rods with overlapped end parts, the included angle between every two adjacent support rods is 60 degrees, a radiating fan 13 is fixed on the support 12, when the mounting shell 2 is mounted on a computer mainboard, the radiating fan 13 is not contacted with the surface of the mainboard, the model of the radiating fan 13 adopts an ACFP-108K type fan, the top of the support 12 is fixed with a base ring, radiating fins 5 are arrayed on the outer wall of the base ring, the radiating fins 5 are in an arc plate shape, the contact area of the radiating fins 5 and airflow is increased, the radiating effect is improved, through holes are formed in the mounting shell 2, the radiating fins 5 are embedded on the inner wall of the through holes, two groups of mounting racks 7 are symmetrically fixed on one side wall of the mounting shell 2, and each group of mounting racks 7 is composed of two symmetrical mounting racks, one end of the heat pipe 1 is installed in the two groups of installation racks 7, the base plate is further installed on the two groups of installation racks 7, the second radiating fins 9 are arranged on the base plate in an array mode, the second radiating fins 9 are inclined, the side walls of the base plate are in contact with the heat pipe 1, the heat pipe 1 has excellent heat conducting capacity, heat of the main board can be rapidly and efficiently transferred to the second radiating fins 9, the first radiating fins 5 and the second radiating fins 9 are made of aluminum, and the heat radiating performance is good.
Further, the one end that heat pipe 1 is located two sets of mounting brackets 7 is established to condensation segment 11, and the other end is established to evaporation zone 10, and two mounting grooves have all been seted up to the symmetry on the lateral wall between two installation poles of every group mounting bracket 7, and condensation segment 11 can slide with the mounting groove cooperation of every group mounting bracket 7.
Furthermore, a cooling water pipe 8 is further installed between the two sets of mounting frames 7, the cooling water pipe 8 is in contact with the condensation section 11 of the heat pipe 1, cooling liquid is added into the cooling water pipe 8, two ends of the cooling water pipe 8 are respectively connected to the water inlet end and the water outlet end of the circulating water pump 3, the model of the circulating water pump 3 is selected from PLD-1201, and the PLD-1201 is used for driving the cooling liquid in the cooling water pipe 8 to continuously and circularly flow, so that most of heat of the condensation section 11 of the heat pipe 1 is effectively taken away, the heat dissipation effect of the heat pipe 1 is greatly improved, and the cooling fan 13 and the circulating water pump 3 are both electrically connected with a power supply outside the computer mainboard.
Specifically, still be fixed with the installation cassette 14 of two symmetries on the lateral wall of installation shell 2, all seted up the arc wall on the lateral wall between two installation cassettes 14, and condenser tube 8's outer wall can with two arc wall cooperations, condenser tube 8 installs on mount pad 4 through two installation cassettes 14, and condenser tube 8's both ends pass two sets of mounting brackets 7 respectively to steadily install condenser tube 8 on installation shell 2.
It is worth explaining that, the outer wall of the evaporation section 10 is provided with the mounting seat 4 for being mounted on a high-power element, so that the evaporation section 10 is in contact with the element, the high-power element is effectively cooled, the mounting shell 2 and the mounting seat 4 are made of copper, the heat conduction efficiency is high, a heat conduction shell 6 is fixed on one side wall of the mounting shell 2, the heat conduction shell 6 is in contact with the outer wall of the condensation section 11 of the heat pipe 1, and the heat conduction shell 6 is made of graphene, so that the heat conduction effect is good.
Furthermore, be provided with 3 installation feet 15 on the lateral wall of installation shell 2, the symmetry is provided with 4 installation feet 15 on the both sides wall of mount pad 4, and installation shell 2 all installs on the computer mainboard through screw and installation foot 15's cooperation with mount pad 4.
The utility model discloses a theory of operation and use flow: when the utility model is used, a worker firstly installs the radiator on a computer mainboard, a mounting seat 4 on an evaporation section 10 of a heat pipe 1 is installed on the mainboard through screws, the evaporation section 10 is in contact with a component which generates more heat, then a mounting shell 2 is installed on the mainboard through screws, a first cooling fin 5 faces outwards, a circulating water pump 3 and a cooling fan 13 are electrified through a power supply, when the component on the mainboard works, the evaporation section 10 of the heat pipe 1 quickly and efficiently transfers the heat of the component to a condensation section 11 and uniformly to a second cooling fin 9, the copper mounting shell 2 uniformly transfers the heat of the mainboard to the first cooling fin 5, the cooling fan 13 rotates, airflow is generated on the first cooling fin 5 and the second cooling fin 9, and therefore the heat is effectively dissipated;
through set up heat pipe 1 on radiator fan 13's basis, the heat dispersion of radiator has been improved greatly, can be applicable to the powerful mainboard heat dissipation, the component steady operation has been ensured, extension mainboard life, can also avoid the mainboard to burn out, improve security performance and economic benefits, and circulating water pump 3 drives the continuous circulation flow of coolant liquid in condenser pipe 8, thereby effectively take away the most heat of 1 condensation segment 11 of heat pipe, improve the radiating effect to heat pipe 1 greatly, the radiating performance of heat pipe 1 heat transfer has been improved, further improve the radiating effect of radiator.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023112058.5U CN213876625U (en) | 2020-12-22 | 2020-12-22 | Novel computer mainboard radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023112058.5U CN213876625U (en) | 2020-12-22 | 2020-12-22 | Novel computer mainboard radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213876625U true CN213876625U (en) | 2021-08-03 |
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ID=77069787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023112058.5U Expired - Fee Related CN213876625U (en) | 2020-12-22 | 2020-12-22 | Novel computer mainboard radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213876625U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113918399A (en) * | 2021-12-06 | 2022-01-11 | 深圳市微特精密科技股份有限公司 | Computer mainboard firmware function test device |
-
2020
- 2020-12-22 CN CN202023112058.5U patent/CN213876625U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113918399A (en) * | 2021-12-06 | 2022-01-11 | 深圳市微特精密科技股份有限公司 | Computer mainboard firmware function test device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210803 |