CN115047960A - Auxiliary heat dissipation device for computer - Google Patents
Auxiliary heat dissipation device for computer Download PDFInfo
- Publication number
- CN115047960A CN115047960A CN202210686363.XA CN202210686363A CN115047960A CN 115047960 A CN115047960 A CN 115047960A CN 202210686363 A CN202210686363 A CN 202210686363A CN 115047960 A CN115047960 A CN 115047960A
- Authority
- CN
- China
- Prior art keywords
- cold
- heat dissipation
- fin
- computer
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses an auxiliary heat dissipation device for a computer, which relates to the technical field of computer heat dissipation and comprises a bottom box, a cold-row heat dissipation group and a semiconductor refrigeration group, wherein the cold-row heat dissipation group and the semiconductor refrigeration group are both arranged on one side of the bottom box, the cold-row heat dissipation group comprises a cold-row fan arranged on the bottom box, one side of the cold-row fan is provided with a cold row, the semiconductor refrigeration group comprises a heat dissipation fan arranged on the bottom box, one side of the heat dissipation fan is provided with a first heat dissipation fin, one side of the first heat dissipation fin is connected with a heat generation end of a semiconductor refrigeration fin, and the refrigeration end of the semiconductor refrigeration fin is connected with a second heat dissipation fin. The invention transmits the heat of the CPU to the circulating liquid through the water cooling head, the circulating liquid flows through the cold drain and radiates the replaced heat out of the bottom box through the cold drain fan, the circulating liquid flows through the second radiating fin and transmits the temperature of the refrigerating end of the semiconductor refrigerating sheet to the circulating liquid through the copper pipe, so that the temperature of the circulating liquid is reduced, and the temperature is discharged to the outer side of the bottom box through the radiating fan, thereby improving the radiating efficiency of the computer.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to an auxiliary heat dissipation device for a computer.
Background
The computer is commonly called a computer and consists of a hardware system and a software system, the existing computer usually adopts two heat dissipation modes of air cooling and liquid cooling, but the air cooling and the liquid cooling need to carry out heat replacement through a heat dissipation fan and a cold bar in the heat dissipation process, and therefore the heat dissipation effect and the heat dissipation efficiency are greatly reduced. Therefore, an auxiliary heat sink for a computer is needed to solve the above problems.
Disclosure of Invention
The invention aims to provide an auxiliary heat dissipation device for a computer, which is used for solving the defects in the prior art.
The utility model provides an auxiliary heat radiation device for computer, includes the under casing, cold row's heat dissipation group and semiconductor refrigeration group are all installed in one side of under casing, just cold row's heat dissipation group is including installing the cold row fan on the under casing, cold row is installed to one side of cold row fan, semiconductor refrigeration group is including installing the radiator fan in the under casing, radiator fan's one side is installed fin one, one side of fin one is connected with semiconductor refrigeration piece and is sent out hot end, the refrigeration end of semiconductor refrigeration piece is connected with fin two.
Preferably, the second heat radiating fin is provided with a mounting groove, an S-shaped copper pipe is mounted in the mounting groove, and one end of the copper pipe is connected to the cold row.
Preferably, a main board is installed in the bottom box, a water cooling head is connected to a CPU of the main board, and two ends of the water cooling head are respectively connected to the cold row and the copper pipe through hoses.
Preferably, exhaust fans are symmetrically installed on one side of the bottom box, and filter screens are installed on the cold exhaust fan, the heat dissipation fan and the exhaust fans.
Preferably, the contact surface of the semiconductor refrigeration piece and the first and second radiating fins increases heat conduction through silicone grease.
The invention has the advantages that: the heat of the CPU is transferred to the circulating liquid in the water cooling head through the water cooling head, the circulating liquid is driven to move through the water pump of the water cooling head, then the circulating liquid flows through the cold drain and the replaced heat is dissipated out of the bottom box through the cold drain fan, then the circulating liquid flows through the radiating fin II and transfers the temperature of the refrigerating end of the semiconductor refrigerating sheet to the circulating liquid through the copper pipe, so that the temperature of the circulating liquid is reduced, meanwhile, the radiating fin I conducts the temperature of the heating end of the semiconductor refrigerating sheet, the temperature is dissipated to the outer side of the bottom box through the radiating fan, and the heat dissipating efficiency of the computer is improved through the refrigerating effect of the semiconductor refrigerating sheet.
Drawings
Fig. 1 is a schematic structural view of the whole of the present invention.
FIG. 2 is a schematic view of the interior of the bottom case of the present invention.
Fig. 3 is an assembly view of the semiconductor refrigeration unit of the present invention.
Wherein: 1-a bottom box; 2-cold row heat dissipation group; 3-a semiconductor refrigeration group; 4-a cold exhaust fan; 5-cold discharging; 6-a heat dissipation fan; 7-a first heat sink; 8-semiconductor refrigerating sheet; 9-a second heat radiating fin; 10-mounting grooves; 11-copper tube; 12-a main board; 13-a water cooling head; 14-an exhaust fan; 15-a filter screen.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 3, an auxiliary heat dissipation device for a computer includes a bottom case 1, a cold row heat dissipation group 2 and a semiconductor refrigeration group 3, the cold row heat dissipation group 2 and the semiconductor refrigeration group 3 are both installed on one side of the bottom case 1, the cold row heat dissipation group 2 includes a cold row fan 4 installed on the bottom case 1, a cold row 5 is installed on one side of the cold row fan 4, the semiconductor refrigeration group 3 includes a heat dissipation fan 6 installed on the bottom case 1, a first heat dissipation fin 7 is installed on one side of the heat dissipation fan 6, one side of the first heat dissipation fin 7 is connected with a heat emitting end of a semiconductor refrigeration fin 8, and a refrigeration end of the semiconductor refrigeration fin 8 is connected with a second heat dissipation fin 9. The semiconductor refrigerating sheet 8 is electrically connected to a power supply of the main board 12.
In this embodiment, a mounting groove 10 is provided on the second heat sink 9, an S-shaped copper tube 11 is mounted in the mounting groove 10, and one end of the copper tube 11 is connected to the cold row 5.
In this embodiment, a main board 12 is installed in the bottom case 1, a water cooling head 13 is connected to a CPU of the main board 12, and two ends of the water cooling head 13 are respectively connected to the cold row 5 and the copper pipe 11 through hoses. The water cooling head 13 is electrically connected to a power supply of the main board 12 and drives a water pump in the water cooling head 13 to work.
In this embodiment, the exhaust fan 14 is symmetrically installed on one side of the bottom case 1, and the filter screen 15 is installed on each of the cold exhaust fan 4, the heat dissipation fan 6 and the exhaust fan 14.
In the embodiment, the contact surfaces of the semiconductor refrigeration sheet 8 and the first and second heat sinks 7 and 9 are increased in heat conduction through silicone grease.
The working principle of the invention is as follows: the device transmits the temperature of a CPU (Central processing Unit) to circulating liquid in a water cooling head 13 through the water cooling head 13, then the circulating liquid circularly flows through a water pump in the water cooling head 13, then the circulating liquid passes through a cold row 5, heat replacement is carried out through the cold row 5, then the temperature is discharged out of the outer side of a bottom box 1 through a cold row fan 4, then the circulating liquid flows through a second radiating fin 9, the temperature of a refrigerating end of a semiconductor refrigerating fin 8 is replaced into the circulating liquid through a copper pipe 11, meanwhile, the temperature of a heating end of the semiconductor refrigerating fin 8 is replaced through a first radiating fin 7 and then discharged out of the outer side of the bottom box 1 through a radiating fan 6, an exhaust fan 14 sucks air and the outside of the bottom box 1 is discharged through the cold row fan 4 and the radiating fan 6, and an air duct passage is formed to promote heat dissipation.
The invention transmits the heat of the CPU to the circulating liquid in the water cooling head 13 through the water cooling head 13, drives the circulating liquid to move through the water pump of the water cooling head 13, then the circulating liquid flows through the cold discharge 5 and radiates the replaced heat out of the bottom box 1 through the cold discharge fan 4, then the circulating liquid flows through the second radiating fin 9 and transmits the temperature of the refrigerating end of the semiconductor refrigerating fin 8 to the circulating liquid through the copper pipe 11, so that the temperature of the circulating liquid is reduced, meanwhile, the first radiating fin 7 transmits the temperature of the heating end of the semiconductor refrigerating fin 8, the temperature is discharged to the outer side of the bottom box 1 through the radiating fan 6, and the radiating efficiency of the computer is improved through the refrigerating effect of the semiconductor refrigerating fin 8.
It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.
Claims (5)
1. The utility model provides an auxiliary heat abstractor for computer which characterized in that: including under casing (1), cold heat dissipation group (2) and semiconductor refrigeration group (3) of arranging all install in one side of under casing (1), just cold heat dissipation group (2) of arranging is including installing cold exhaust fan (4) on under casing (1), cold row (5) are installed to one side of cold exhaust fan (4), semiconductor refrigeration group (3) is including installing in radiator fan (6) of under casing (1), fin (7) are installed to one side of radiator fan (6), one side of fin (7) is connected with semiconductor refrigeration piece (8) heat-emitting end, the refrigeration end of semiconductor refrigeration piece (8) is connected with fin two (9).
2. The auxiliary heat sink for computer as claimed in claim 1, wherein: and a mounting groove (10) is formed in the radiating fin of the second radiating fin (9), an S-shaped copper pipe (11) is mounted in the mounting groove (10), and one end of the copper pipe (11) is connected to the cold row (5).
3. The auxiliary heat sink for computer as claimed in claim 2, wherein: a main board (12) is installed in the bottom box (1), a water cooling head (13) is connected to a CPU of the main board (12), and two ends of the water cooling head (13) are respectively connected to the cold row (5) and the copper pipe (11) through hoses.
4. The auxiliary heat sink for computer as claimed in claim 1, wherein: exhaust fan (14) are installed to one side symmetry of under casing (1), all install filter screen (15) on cold exhaust fan (4), radiator fan (6) and exhaust fan (14).
5. The auxiliary heat sink for computer as claimed in claim 1, wherein: and the contact surfaces of the semiconductor refrigerating sheet (8) and the first radiating sheet (7) and the second radiating sheet (9) increase heat conduction through silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210686363.XA CN115047960A (en) | 2022-06-16 | 2022-06-16 | Auxiliary heat dissipation device for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210686363.XA CN115047960A (en) | 2022-06-16 | 2022-06-16 | Auxiliary heat dissipation device for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115047960A true CN115047960A (en) | 2022-09-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210686363.XA Pending CN115047960A (en) | 2022-06-16 | 2022-06-16 | Auxiliary heat dissipation device for computer |
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| Country | Link |
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| CN (1) | CN115047960A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
-
2022
- 2022-06-16 CN CN202210686363.XA patent/CN115047960A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
| CN115951769B (en) * | 2023-03-10 | 2023-05-09 | 山东合众智远信息技术有限公司 | Heat abstractor for computer CPU |
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