CN104180351B - LED lamp with plate type radiator - Google Patents
LED lamp with plate type radiator Download PDFInfo
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- CN104180351B CN104180351B CN201410454091.6A CN201410454091A CN104180351B CN 104180351 B CN104180351 B CN 104180351B CN 201410454091 A CN201410454091 A CN 201410454091A CN 104180351 B CN104180351 B CN 104180351B
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 64
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 53
- 229910052782 aluminium Inorganic materials 0.000 claims description 53
- 239000004411 aluminium Substances 0.000 claims description 48
- 238000009434 installation Methods 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 239000011777 magnesium Substances 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 64
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 description 24
- 239000006185 dispersion Substances 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 238000009423 ventilation Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 4
- 241000276425 Xiphophorus maculatus Species 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED lamp with a plate type radiator. The LED lamp comprises the plate type radiator and multiple LED chips. Multiple installing positions and multiple heat dissipation pillars are arranged on the plate type radiator. Each installing position is correspondingly provided with one LED chip. The plate type radiator is a metal plate type radiator. According to the LED lamp with the plate type radiator, the LED chips are directly arranged on the plate type radiator, in this way, the structure is simple, the integrated structure is achieved, the heat dissipation effect is good, and the LED chips can meet the using requirements of a high-power LED lamp. In addition, compared with a traditional LED lamp of which an outer shell needs to be additionally provided with a heat dissipation device, the plate type radiator of the LED lamp with the plate type radiator can be directly used as the outer shell, heat conduction and heat dissipation effects are very good, the manufacturing difficulty is very low, and the cost is low.
Description
Technical field
The present invention relates to LED lamp radiator field, more particularly to a kind of LED lamp with panel radiator.
Background technology
Led (light emitting diode, light emitting diode), it can directly and efficiently convert electrical energy into visible
Light, and have the service life up to tens thousand of hours～100,000 hour, thus be widely used in landscape, safety, extraordinary and general
The fields such as logical illumination, market potential is beyond measure.
The basic structure of led is the p n knot of a quasiconductor, and when electric current flows through led element, the temperature of p n knot will
Rise, and the temperature in p n interface be referred to as led junction temperature, be typically due to the size that element chip is respectively provided with very little, therefore, also
The temperature of led chip is referred to as the junction temperature of led chip.
Adopt the LED lamp that led makes to be referred to as the most frequently used lighting the advantages of of fine quality, durable, energy-conservation.
However, the drawback that LED lamp itself exists is that LED lamp light efficiency is affected larger, relatively by the junction temperature of led
High junction temperature of chip will lead to light efficiency to occur being decreased obviously, and influence whether the service life of LED lamp.Because LED lamp is being sent out
Light time, the temperature of its own can constantly raise, in lasting illumination work, if the heat that LED lamp produces can not be sent out in time
Shed, it will cause the damage of LED lamp, the service life of impact LED lamp.Therefore, solve the heat dissipation problem of LED lamp for carrying
The performance rising LED lamp is most important.
For the problems referred to above, the heat energy that some LED lamps produce when typically led lighting is directly delivered to aluminium alloy or each
Plant metal shell to be radiated, or by heat conductive silica gel transferring heat energy, thus reducing the high temperature producing during led illumination, reduce led light
Decline, extend led illumination service life.
But, for the larger LED lamp of luminous power, due to the radiating effect of shell and leading of heat conductive silica gel
Thermal effect is poor can not to meet cooling requirements, therefore can not realize well reducing the high temperature producing during led illumination.If in addition increasing again
If heat abstractor is on shell, then can increase manufacture difficulty, and cost is also higher.
Content of the invention
Based on this it is necessary to provide a kind of good heat dissipation effect, the better simply LED lamp with panel radiator of structure.
A kind of LED lamp with panel radiator is it is characterised in that include: panel radiator and several led cores
Piece；
Several installation positions and several thermal columns are provided with described panel radiator；
Each described installation position is corresponding to install led chip described in；
Described panel radiator is metal plate type radiator.
In one of embodiment, described panel radiator includes aluminium base and thermal column, and described aluminium base has phase
To first side and second side, described installation position is located in described first side, and described thermal column is arranged at described the
On two side faces.
In one of embodiment, described thermal column is copper post.
In one of embodiment, described copper post is hollow tubular structure.
In one of embodiment, the side wall of described copper post offers several louvres.
In one of embodiment, the height of described copper post is 2 times to 5 times of the thickness of described aluminium base.
In one of embodiment, described thermal column is in that array is arranged.
In one of embodiment, described installation position is in that array is arranged.
In one of embodiment, the radius of described copper post is the 10% to 20% of the spacing of described installation position.
In one of embodiment, also include a scatter plate, described scatter plate is fixedly installed on the described of described aluminium base
In first side, and the light of described led chip emission passes through described scatter plate.
, by being set directly at led chip on panel radiator, structure is relatively for the above-mentioned LED lamp with panel radiator
Simple it is achieved that integral structure, radiating effect preferably, can meet powerful LED lamp and use.Additionally, it is relatively conventional
In traditional LED lamp, need to set up heat abstractor, the plate type radiator of the above-mentioned LED lamp with panel radiator in shell
Device can directly use as shell, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively low.
Brief description
Fig. 1 is the structural representation of the LED lamp of an embodiment of the present invention；
Fig. 2 is the structural representation of the LED lamp with flat radiator of an embodiment of the present invention；
Fig. 3 is the structural representation of the flat radiator shown in Fig. 2；
Fig. 4 is the structural representation at another visual angle of flat radiator shown in Fig. 3；
Fig. 5 is the structural representation at the another visual angle of flat radiator shown in Fig. 2；
Fig. 6 is the structural representation of the LED lamp with panel radiator of an embodiment of the present invention；
Fig. 7 is the structural representation of the aluminium base shown in Fig. 6；
Fig. 8 is the structural representation of the thermal column shown in Fig. 6；
Fig. 9 is the structural representation of the integral type LED lamp of an embodiment of the present invention；
Figure 10 is the structural representation of the scatter plate shown in Fig. 9.
Specific embodiment
Understandable for enabling the above objects, features and advantages of the present invention to become apparent from, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.Elaborate a lot of details in order to fully understand this in the following description
Bright.But the present invention can be much to implement different from alternate manner described here, and those skilled in the art can be not
Similar improvement is done, therefore the present invention is not limited by following public specific embodiment in the case of running counter to intension of the present invention.
Refer to Fig. 1, the LED lamp 10 with panel radiator includes radiator 70, several led chips 80 and dissipates
Penetrate plate 90.Several led chips 80 and scatter plate 90 are installed on radiator 70, by directly arranging led chip 80
On radiator 70, radiating effect preferably, can meet powerful LED lamp and use.Additionally, relatively conventional in traditional led
Light fixture, needs to set up heat abstractor in shell, the radiator 70 of above-mentioned LED lamp 10 can directly use as shell, and has
There are fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
It is specific embodiment part below.
Embodiment 1
Refer to Fig. 2, the LED lamp with panel radiator is the LED lamp 20 with flat radiator, and it includes
Flat radiator 400, several led chips (chip) 500 and scatter plate 600.Several led chips 500 and scattering
Plate 600 is respectively provided with flat radiator 400.By led chip 500 is directly arranged on flat radiator 400, radiating effect
Fruit preferably, can meet powerful LED lamp and use.Additionally, relatively conventional in traditional LED lamp, need to increase in shell
If heat abstractor, the flat radiator 400 of the LED lamp 20 of above-mentioned flat radiator can directly use as shell,
And there is fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
Refer to Fig. 3 to Fig. 5, it is the structural representation of three different directions of flat radiator 400 shown in Fig. 2
Figure.Flat radiator 400 include several heat-conducting substrates 410, two radiating fixing radiating fins 430 of wing plate 420, two,
Several main radiating fins 440 and several auxiliary radiating fins 450.Radiating wing plate 420, fixing radiating fin 430 and master
Radiating fin 440 is all fixedly installed on heat-conducting substrate 410, and auxiliary radiating fin 450 is arranged on radiating wing plate 420.And for example, lead
Hot substrate 410, the two radiating fixing radiating fins 430 of wing plate 420, two, several main radiating fins 440 and several are auxiliary
Radiating fin 450 is formed in one structure.Wherein, as shown in Figure 3, Figure 4, the flat design of heat-conducting substrate 410, for example, it is thick
Spend for 3 to 5 millimeters, as such, it is possible to effectively reduce the integral thickness of flat radiator 400, reach overall flat effect.
Several heat-conducting substrates 410 be spaced successively be fixedly installed on fixing radiating fin 430, main radiating fin 440 and
One side of radiating wing plate 420 that is to say, that the bearing of trend of several heat-conducting substrates 410 is parallel, fixing radiating fin 430,
The bearing of trend of main radiating fin 440 and radiating wing plate 420 is vertical with the bearing of trend of heat-conducting substrate 410, as such, it is possible to
Improve the hollow out degree of flat radiator 400, be easy to be internally formed more heat-dissipating spaces in flat radiator 400, from
And improve the cooling surface area of flat radiator 400, and then improve the radiating effect of flat radiator 400.
In order to increase the cooling surface area of flat radiator 400, meanwhile, beneficial to flow through both sides radiating wing plate 420 relatively
Cold air takes away the heat that heat-conducting substrate 410 passes to radiating wing plate 420, forms cross-ventilation heat transfer, such that it is able to further
Improve the radiating effect of flat radiator 400, for example, refer to Fig. 3, if a side of radiating wing plate 420 is fixedly installed on
On one end end of dry heat-conducting substrate 410, and the plane that the wing plate 420 that radiates is located with several heat-conducting substrates 410 forms folder
Angle, for example, the angle of described angle is 30 degree to 90 degree.It is appreciated that radiating wing plate 420 is away from the side of heat-conducting substrate 410
Extraneous air is stretched in the inclined direction in side, as such, it is possible to increase the cooling surface area of flat radiator 400, additionally, being additionally favorable for
The cooler air flowing through both sides radiating wing plate 420 takes away the heat that heat-conducting substrate 410 passes to radiating wing plate 420, forms air
Convection heat transfer' heat-transfer by convection, such that it is able to improve the radiating effect of flat radiator 400 further.And for example, radiating wing plate 420 is square plate
Shape structure, and for example, radiating wing plate 420 is arc platy structure.
In order to increase the cooling surface area of flat radiator 400 further, for example, refer to Fig. 4, several auxiliary radiatings
Fin 450 is spaced successively and is fixedly installed on radiating wing plate 420, and the bearing of trend of several auxiliary radiating fins 450 is identical, and
The bearing of trend of several auxiliary radiating fins 450 is vertical with the bearing of trend of heat-conducting substrate 410, as such, it is possible to increase further
Plus the cooling surface area of flat radiator 400, such that it is able to improve the radiating effect of flat radiator 400 further.
In order to preferably install flat radiator 400, for example, Fig. 5, a side of fixing radiating fin 430 are referred to
It is fixedly installed on the medium position of several heat-conducting substrates 410, another side edge bending setting of fixing radiating fin 430
Buckle installation portion 431, so, flat radiator 400 can be directly installed on outside support by buckle installation portion 431,
Such that it is able to preferably install flat radiator 400.For example, it is arranged on floor body of wall.
In order to increase the cooling surface area of flat radiator 400 further, for example, Fig. 5, main radiating fin are referred to
440 side is fixedly installed on two side positions of several heat-conducting substrates 410, the extension of several main radiating fins 440
Direction is identical, and the bearing of trend of several main radiating fins 440 is vertical with the bearing of trend of heat-conducting substrate 410, so,
The cooling surface area of flat radiator 400 can be increased further, such that it is able to improve flat radiator 400 further
Radiating effect.
In order to preferably install flat radiator 400, meanwhile, beneficial to the structure optimizing flat radiator 400, more preferably
Ground improves radiating effect, for example, refers to Fig. 5, two fixing radiating fins 430, several main radiating fins 440 and some
Individual auxiliary radiating fin 450 is fixedly installed after heat-conducting substrate 410 and forms sector structure, that is, the height of two fixing radiating fins 430,
The height of the height of main radiating fin 440 and auxiliary radiating fin 450 successively decreases successively, so, on the one hand can avoid main radiating
Fin 440 and auxiliary radiating fin 450 fix, to installing, the interference that radiating fin 430 produces, by which better fixing radiating fin
Piece 430 installs flat radiator 400, at the same time it can also play the effect of the structure optimizing flat radiator 400, more preferably
Ground improves heat dispersion.
For more progressive the heat dispersion improving described flat radiator, for example, described flat radiator is gold
Belong to flat radiator, and for example, described flat radiator is the flat radiator of alloy.
For example, the flat radiator of an embodiment includes each component of following mass percent:
0.4 part～0.5 part of silicon, 0.5 part～0.6 part of ferrum, 0.05 part～0.3 part of copper, 0.3 part～0.4 part of manganese, 2.1 parts of magnesium
～2.9 parts, 0.18 part～0.28 part of chromium, the aluminum of 5.1 parts～6.1 parts of zinc, 0.2 part～0.3 part of titanium and surplus.It is appreciated that
By using the zinc of above-mentioned mass percent and magnesium, the mgzn2 of strengthening effect is significant can be formed so that the heat of flat radiator
Treatment effect will be greatly improved far better than a zinc bianry alloy, tensile strength, and stress corrosion resistant and anti-stripping
The ability of corrosion of falling also can increase, and heat-conductive characteristic is also larger, i.e. the good heat dispersion performance of flat radiator.
Refer to Fig. 2, heat-conducting substrate 410 is away from two radiating fixing radiating fins 430 of wing plate 420, two, several masters
The one side of radiating fin 440 and several auxiliary radiating fins 450 arranges several installation positions 411, for installing led chip
500.
In order to preferably be arranged on led chip and protect led chip, for example, described installation position is hemispherical, described
Led chip is arranged on the side of described heat-conducting substrate, and the fixation of described led chip is placed in described installation position, so,
Led chip can be preferably arranged on and protect led chip.
In order to increase the radiating effect of heat-conducting substrate 410 further, for example, refer to Fig. 2, heat-conducting substrate 410 is arranged
Some through holes 412, through hole 412 can increase the cooling surface area of heat-conducting substrate 410, and heat-conducting substrate 410 is located at and is provided with
The relatively warm air of the side of led chip 500 can expand via through holes 412 inflow by own vol and be provided with two radiating wing plates
420th, the opposite side of two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450, this
Sample, by above-mentioned air's circulation, can increase the radiating effect of heat-conducting substrate 410 further.
In order to further increase the radiating effect of heat-conducting substrate 410, take away the heat of led chip 500 generation more quickly
Amount, for example, refers to Fig. 2, and through hole 412 is in that array is arranged, and installation position 411 is in that array is arranged.And for example, each installation position 411 sets
It is placed in the center of the rectangle that four through holes 412 surround.And for example, the aperture of through hole 412 be installation position 411 spacing 20% to
40%.And for example, the aperture of through hole 412 is less than the spacing of installation position 411.
Refer to Fig. 2, scatter plate 600 is fixedly installed on heat-conducting substrate 410, and led chip 500 is located at heat-conducting substrate
Between 410 and scatter plate 600, the light of led chip 500 transmitting exposes to outside through scatter plate 600.
The above-mentioned LED lamp 20 with panel radiator passes through for led chip 500 to be set directly at flat radiator
On 400, structure relatively simple it is achieved that integral structure, radiating effect preferably, can meet powerful LED lamp and use.This
Outward, relatively conventional in traditional LED lamp, need to set up heat abstractor, the above-mentioned LED lamp with panel radiator in shell
20 flat radiator 400 can directly use as shell, and has fabulous heat conduction and radiating effect, manufacture difficulty
Relatively low, cost is relatively low.
Embodiment 2
Refer to Fig. 6 and Fig. 7, there is the LED lamp 30 of panel radiator, it include panel radiator 700, several
Led chip 800 and scatter plate 900.Several led chips 800 and scatter plate 900 are respectively provided with panel radiator 700.Logical
Cross and led chip 800 is directly set on panel radiator 700, preferably, can meet powerful LED lamp makes radiating effect
With.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor, the LED lamp of above-mentioned panel radiator in shell
The panel radiator 700 of tool 30 can directly use as shell, and has fabulous heat conduction and radiating effect, manufacture difficulty
Relatively low, cost is relatively low.
Refer to Fig. 6, panel radiator 700 includes 710, two heat-dissipating fins 720 of an aluminium base, several fixing radiatings
Post 730, several main thermal columns 740 and several auxiliary thermal columns 750.Heat-dissipating fin 720, fixing thermal column 730 and master
Thermal column 740 is all fixedly installed on aluminium base 710, and auxiliary thermal column 750 is arranged on heat-dissipating fin 720.
Several fixing thermal columns 730 are arranged on aluminium base 710 in array, for example, several fixing 730 points of thermal columns
Cloth is arranged on aluminium base 710 in two rows, and often arrange in fixing thermal column 730 line be straight line.Several main thermal columns
740 are arranged on aluminium base 710 in array, and for example, several main thermal columns 740 are arranged on aluminium base 710 in some rows, and
The line of the main thermal column 740 in often arranging is straight line.Several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in array, example
If, several auxiliary thermal columns 750 are on some rows' setting heat-dissipating fins 720, and the line of the auxiliary thermal column 750 in often arranging is straight
Line.As such, it is possible to improve the hollow out degree of panel radiator 700, it is easy to be internally formed more radiatings in panel radiator 700
Space, thus improving the cooling surface area of panel radiator 700, and then improves the radiating effect of panel radiator 700.
In order to increase the cooling surface area of panel radiator 700, meanwhile, beneficial to flowing through the colder of both sides heat-dissipating fin 720
Air takes away the heat that aluminium base 710 passes to heat-dissipating fin 720, forms cross-ventilation heat transfer, such that it is able to improve further
The radiating effect of panel radiator 700, for example, refers to Fig. 6, a side of heat-dissipating fin 720 is fixedly installed on aluminium base 710
A side on, and the plane that heat-dissipating fin 720 is located with aluminium base 710 forms angle, and for example, the angle of described angle is 30
Spend to 90 degree.It is appreciated that heat-dissipating fin 720 stretches into extraneous air away from the inclined direction of a side of aluminium base 710, this
Sample, can increase the cooling surface area of panel radiator 700, additionally, being additionally favorable for flowing through the cooler air of both sides heat-dissipating fin 720
Take away the heat that aluminium base 710 passes to heat-dissipating fin 720, form cross-ventilation heat transfer, board-like such that it is able to improve further
The radiating effect of radiator 700.And for example, heat-dissipating fin 720 is square laminated structure, and and for example, heat-dissipating fin 720 is arc-shaped flaky
Structure.
In order to increase the cooling surface area of panel radiator 700 further, for example, refer to Fig. 6, several auxiliary thermal columns
750 successively interval be fixedly installed on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 are arranged on heat-dissipating fin in array
On 720, and for example, several auxiliary thermal columns 750 are on some rows setting heat-dissipating fins 720, and the auxiliary thermal column 750 in often arranging
Line is straight line.As such, it is possible to increase the cooling surface area of panel radiator 700 further, such that it is able to improve plate further
The radiating effect of formula radiator 700.
For preferably mounting plate type radiator 700, for example, refer to Fig. 6, several fixing thermal columns 730 are in array
It is arranged on aluminium base 710, for example, several fixing thermal column 730 distributions are arranged on aluminium base 710 in two rows, and often arrange
In fixing thermal column 730 line be straight line.And for example, one end of fixing thermal column 730 is fixedly installed on several aluminium bases
On 710 medium position, the other end end bending setting buckle installation portion 731 of fixing thermal column 730, so, plate type radiator
Device 700 can be directly installed on outside support by buckle installation portion 731, such that it is able to preferably mounting plate type radiator
700.For example, it is arranged on floor body of wall.
In order to increase the cooling surface area of panel radiator 700 further, for example, refer to Fig. 6, main thermal column 740
One end is fixedly installed on two side positions of several aluminium bases 710, and and for example, several main thermal columns 740 are arranged in array
On aluminium base 710, for example, several main thermal columns 740 are arranged on aluminium base 710 in some rows, and often arrange in main radiating
The line of post 740 is straight line, as such, it is possible to increase the cooling surface area of panel radiator 700 further, such that it is able to further
Improve the radiating effect of panel radiator 700.
For preferably mounting plate type radiator 700, beneficial to the structure optimizing panel radiator 700, preferably carry meanwhile
High radiating effect, for example, refers to Fig. 6, two fixing thermal columns 730, several main thermal columns 740 and several auxiliary radiatings
Post 750 forms bow-shaped structural after aluminium base 710 is fixedly installed, and so, on the one hand can avoid main thermal column 740 and auxiliary radiating
Post 750 fixes, to installing, the interference that thermal column 730 produces, by which better fixing thermal column 730 mounting plate type radiator 700,
At the same time it can also play the effect of the structure optimizing panel radiator 700, preferably improve heat dispersion.
In order to further improve the heat dispersion of described panel radiator, for example, described panel radiator is metal
Panel radiator, and for example, described panel radiator is alloy plate type radiator.
For example, the panel radiator of an embodiment includes each component of following mass percent:
0.7 part～0.5 part of silicon, 0.5 part～0.6 part of ferrum, 0.05 part～0.3 part of copper, 0.3 part～0.7 part of manganese, 2.1 parts of magnesium
～2.9 parts, 0.18 part～0.28 part of chromium, the aluminum of 5.1 parts～6.1 parts of zinc, 0.2 part～0.3 part of titanium and surplus.It is appreciated that
By using the zinc of above-mentioned mass percent and magnesium, the mgzn2 of strengthening effect is significant can be formed so that at the heat of panel radiator
Far better than a zinc bianry alloy, tensile strength will be greatly improved reason effect, and stress corrosion resistant and anti-strip
The ability of corrosion also can increase, and heat-conductive characteristic is also larger, i.e. the good heat dispersion performance of panel radiator.
And for example, described aluminium base is identical with described thermal column material or different setting, and and for example, described aluminium base is that aluminum closes
Gold base, described thermal column is copper post.And for example, described thermal column specifically include described fixing thermal column, described main thermal column with
And described auxiliary thermal column.
In order to further enhance the radiating effect of described thermal column, for example, described thermal column is copper post, and for example, described copper
Post is hollow tubular structure, and for example, refers to Fig. 8, the side wall of copper post 900a offers several louvres 910a.And for example,
The height of described copper post is 2 times to 5 times of the thickness of described aluminium base；The height of for example described copper post is the thickness of described aluminium base
3.2 times of degree.And for example, described thermal column is in that array is arranged.As such, it is possible to increase the radiating effect strengthening described thermal column further
Really.
Please refer to Fig. 6 and Fig. 7, aluminium base 710 away from two heat-dissipating fins 720, several fixing thermal columns 730,
The one side of several main thermal columns 740 and several auxiliary thermal columns 750 arranges several installation positions 711, for installing led
Chip 800.
In order to preferably install led chip and protect led chip, for example, described installation position is hemispherical, described led
Chip is arranged on the side of described aluminium base, and the fixation of described led chip is placed in described installation position, as such, it is possible to
Preferably it is arranged on led chip and protect led chip.
In order to increase the radiating effect of aluminium base 710 further, for example, refer to Fig. 7, aluminium base 710 is arranged some
Through hole 712, through hole 712 can increase the cooling surface area of aluminium base 710, and aluminium base 710 is located at and is provided with led chip
If the relatively warm air of 800 side can expand via through holes 712 inflow by own vol is provided with two heat-dissipating fins 720
The dry opposite side fixing thermal column 730, several main thermal columns 740 and several auxiliary thermal columns 750, so, by upper
State air's circulation, the radiating effect of aluminium base 710 can be increased further.
In order to further increase the radiating effect of aluminium base 710, take away the heat of led chip 800 generation more quickly,
For example, refer to Fig. 7, through hole 712 is in that array is arranged, installation position 711 is in that array is arranged.And for example, each installation position 711 is arranged at
The center of the rectangle that four through holes 712 surround.And for example, the aperture of through hole 712 is the 30% to 70% of the spacing of installation position 711.
And for example, the aperture of through hole 712 is less than the spacing of installation position 711.
Refer to Fig. 6, scatter plate 900 is fixedly installed on aluminium base 710, and led chip 800 be located at aluminium base 710 with
And between scatter plate 900, the light of led chip 800 transmitting exposes to outside through scatter plate 900.
For example, described panel radiator is provided with several installation positions and several thermal columns；Described plate type radiator
Device includes aluminium base and thermal column, and described aluminium base has relative first side and second side, described installation position position
In described first side, described thermal column is arranged in described second side.And for example, each described installation position corresponds to installation one
Described led chip；Described installation position is in that array is arranged.The radius of described copper post be the spacing of described installation position 10% to
20%.And for example, described scatter plate is fixedly installed in the described first side of described aluminium base, and described led chip emission
Light pass through described scatter plate.
The above-mentioned LED lamp 30 with panel radiator passes through for led chip 800 to be set directly at panel radiator 700
On, structure relatively simple it is achieved that integral structure, radiating effect preferably, can meet powerful LED lamp and use.Additionally,
Relatively conventional in traditional LED lamp, need to set up heat abstractor, the above-mentioned LED lamp 30 with panel radiator in shell
Panel radiator 700 can directly use as shell, and have fabulous heat conduction and radiating effect, manufacture difficulty is relatively
Low, cost is relatively low.
Embodiment 3
Refer to Fig. 9, have panel radiator LED lamp 50 include radiator 100, several led chips 200 and
Scatter plate 300.Several led chips 200 and scatter plate 300 are respectively provided with radiator 100.By will be direct for led chip 200
On setting radiator 100, radiating effect preferably, can meet powerful LED lamp and use.Additionally, relatively conventional in tradition
LED lamp, need to set up heat abstractor in shell, the radiator 100 of the LED lamp 20 of above-mentioned radiator can directly as
Shell uses, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively low
Refer to Fig. 9, radiator 100 includes 110, two radiating fixing radiating fins of wing plate 120, two of several substrates
130th, several main radiating fins 140 and several auxiliary radiating fins 150.Radiating wing plate 120, fixing radiating fin 130 with
And main radiating fin 140 is all fixedly installed on substrate 110, auxiliary radiating fin 150 is arranged on radiating wing plate 120.
Several substrates 110 are spaced successively and are fixedly installed on fixing radiating fin 130, main radiating fin 140 and radiating
One side of wing plate 120, that is to say, that the bearing of trend of several substrates 110 is parallel, fixes radiating fin 130, main radiating fin
The bearing of trend of piece 140 and radiating wing plate 120 is vertical with the bearing of trend of substrate 110, as such, it is possible to improve radiator
100 hollow out degree, is easy to be internally formed more heat-dissipating spaces in radiator 100, thus improving the radiating table of radiator 100
Area, and then improve the radiating effect of radiator 100.
In order to increase the cooling surface area of radiator 100, meanwhile, beneficial to the cooler air flowing through both sides radiating wing plate 120
Take away the heat that substrate 110 passes to radiating wing plate 120, form cross-ventilation heat transfer, such that it is able to improve radiator further
100 radiating effect, for example, refers to Fig. 9, a side of radiating wing plate 120 is fixedly installed on one end of several substrates 110
On end, and the plane that the wing plate 120 that radiates is located with several substrates 110 forms angle, and for example, the angle of described angle is 30
Spend to 90 degree.It is appreciated that radiating wing plate 120 stretches into extraneous air away from the inclined direction of a side of substrate 110, so,
The cooling surface area of radiator 100 can be increased, additionally, the cooler air being additionally favorable for flowing through both sides radiating wing plate 120 takes away base
Plate 110 passes to the heat of radiating wing plate 120, forms cross-ventilation heat transfer, such that it is able to improve dissipating of radiator 100 further
Thermal effect.And for example, radiating wing plate 120 is square platy structure, and and for example, radiating wing plate 120 is arc platy structure.
In order to increase the cooling surface area of radiator 100 further, for example, refer to Fig. 9, several auxiliary radiating fins
150 successively interval be fixedly installed on radiating wing plate 120 on, the bearing of trend of several auxiliary radiating fins 150 is identical and some
The bearing of trend of individual auxiliary radiating fin 150 is vertical with the bearing of trend of substrate 110, as such, it is possible to increase radiator further
100 cooling surface area, such that it is able to improve the radiating effect of radiator 100 further.
In order to preferably install radiator 100, for example, refer to Fig. 9, a side fixation of fixing radiating fin 130 sets
It is placed on the medium position of several substrates 110, another side edge bending setting buckle installation portion of fixing radiating fin 130
131, so, radiator 100 can be directly installed on outside support by buckle installation portion 131, such that it is able to preferably pacify
Dress radiator 100.For example, it is arranged on floor body of wall.
In order to increase the cooling surface area of radiator 100 further, for example, refer to Fig. 9, the one of main radiating fin 140
Side is fixedly installed on two side positions of several substrates 110, and the bearing of trend of several main radiating fins 140 is identical, and
And the bearing of trend of several main radiating fins 140 is vertical with the bearing of trend of substrate 110, as such, it is possible to increase further
The cooling surface area of radiator 100, such that it is able to improve the radiating effect of radiator 100 further.
In order to preferably install radiator 100, meanwhile, beneficial to the structure optimizing radiator 100, preferably improve radiating effect
Really, for example, refer to Fig. 9, two fixing radiating fins 130, several main radiating fins 140 and several auxiliary radiating fins
150 be fixedly installed after substrate 110 and form sector structure, i.e. the height of two fixing radiating fins 130, main radiating fin 140
Height and the height of auxiliary radiating fin 150 successively decrease successively, so, on the one hand can avoid main radiating fin 140 and auxiliary dissipate
Hot fin 150, to installing the interference that fixing radiating fin 130 produces, installs radiator by which better fixing radiating fin 130
100, at the same time it can also play the effect of the structure optimizing radiator 100, preferably improve heat dispersion.
For more progressive the heat dispersion improving described radiator, for example, described radiator is metal heat sink, and
If described radiator is alloy heat-sink device.And for example, described substrate is metal basal board, and and for example, described substrate is aluminium base, and for example,
Described radiating fin is copper sheet, and and for example, described substrate is identical with described radiating fin material or different setting.And for example, described scattered
Hot fin specifically includes described fixing radiating fin, described main radiating fin and described auxiliary radiating fin, and for example, described fixation
Radiating fin, described main radiating fin and described auxiliary radiating fin material is identical or different setting.And for example, some described radiatings
Several thermal vias are offered on radiating fin described in fin.And for example, radiating wire is set between several described thermal vias.
And for example, described radiating wire forms network structure.
For example, the radiator of an embodiment includes each component of following mass percent:
0.4 part～0.5 part of silicon, 0.5 part～0.6 part of ferrum, 0.05 part～0.3 part of copper, 0.3 part～0.4 part of manganese, 2.1 parts of magnesium
～2.9 parts, 0.18 part～0.28 part of chromium, the aluminum of 5.1 parts～6.1 parts of zinc, 0.2 part～0.3 part of titanium and surplus.It is appreciated that
By using the zinc of above-mentioned mass percent and magnesium, the mgzn2 of strengthening effect is significant can be formed so that the heat treatment effect of radiator
Far better than a zinc bianry alloy, tensile strength will be greatly improved fruit, and stress corrosion resistant and anti-strip corrosion
Ability also can increase, heat-conductive characteristic is also larger, i.e. the good heat dispersion performance of radiator.
Refer to Fig. 9, substrate 110 is away from two the radiating fixing radiating fins 130 of wing plate 120, two, several main radiatings
The one side of fin 140 and several auxiliary radiating fins 150 arranges several installation positions 111 and fixed bit 113.Installation position
111 are used for installing led chip 200, and for example, each described led chip is correspondingly arranged installation position described in.Fixed bit 113 is used for
Scatter plate 300 is installed.
In order to preferably be arranged on led chip and protect led chip, for example, described installation position is hemispherical, described
Led chip is arranged on the side of described substrate, and the fixation of described led chip is placed in described installation position, as such, it is possible to
Preferably it is arranged on led chip and protect led chip.
In order to increase the radiating effect of substrate 110 further, for example, refer to Fig. 9, substrate 110 arranges some through holes
112, through hole 112 can increase the cooling surface area of substrate 110, and substrate 110 is located at the side being provided with led chip 200
Relatively warm air via through holes 112 can be expanded by own vol and flow into the fixing radiating of two radiating wing plates 120, two be installed
The opposite side of fin 130, several main radiating fins 140 and several auxiliary radiating fins 150, so, by above-mentioned cold and hot
Air circulation circulates, and can increase the radiating effect of substrate 110 further.
In order to further increase the radiating effect of substrate 110, take away the heat of led chip 200 generation, example more quickly
As referred to Fig. 9, through hole 112 is in that array is arranged, installation position 111 is in that array is arranged.And for example, each installation position 111 is arranged at four
The center of the rectangle that individual through hole 112 surrounds.And for example, the aperture of through hole 112 is the 20% to 10% of the spacing of installation position 111.Again
As the aperture of through hole 112 is less than the spacing of installation position 111.
In order to further increase the radiating effect of substrate 110, for example, refer to Fig. 9, two adjacent substrates 110 it
Between form a radiating groove 115, radiating groove 115 be beneficial to cross-ventilation conduct heat, as such, it is possible to further increase substrate 110 dissipate
Thermal effect.
Please refer to Fig. 9 and Figure 10, scatter plate 300 is fixedly installed on substrate 110 by fixed bit 112, and led
Chip 200 is located between substrate 110 and scatter plate 300, and the light that led chip 200 is launched exposes to outer through scatter plate 300
Portion.For example, the both sides of scatter plate 300 are provided with strip bulge portion 310, and strip bulge portion 310 is fixedly installed on substrate 110,
And for example, strip bulge portion 310 offers several fixing holes 311, for installing fixing scatter plate 300 and substrate 110.
In order to preferably install fixing scatter plate, for example, described substrate has relative first side and second side,
Several installation positions and several fixed bits are provided with described first side, some described radiating fins are arranged at described
On two side faces, and for example, described fixed bit is screw, and described scatter plate is spirally connected and is fixedly installed on described each described fixed bit, and
As described fixed bit is cylinder, and described cylindrical height is 1 to 5 millimeter, and and for example, described cylinder is copper post, described copper
Post is bolted in and is fixed on described substrate, and and for example, described copper post is bolted in described scatter plate away from one end of described substrate, and
Described scatter plate is contacted with described substrates into intimate.
The above-mentioned LED lamp 50 with panel radiator passes through led chip 200 is set directly on radiator 100, knot
Structure relatively simple it is achieved that integral structure, radiating effect preferably, can meet powerful LED lamp and use.Additionally, relatively
Tradition in traditional LED lamp, needs to set up heat abstractor in shell, the dissipating of the above-mentioned LED lamp 50 with panel radiator
Hot device 100 can directly use as shell, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively
Low.
It should be noted that the other embodiment of the present invention also includes, the technical characteristic in the various embodiments described above is mutually tied
Close the formed, LED lamp with panel radiator that can implement, as such, it is possible to it is simpler to reach good heat dissipation effect, structure
Single and flat technique effect.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (7)
1. a kind of LED lamp with panel radiator is it is characterised in that include: panel radiator and several led cores
Piece；
Several installation positions and several thermal columns are provided with described panel radiator；
Described panel radiator includes an aluminium base, two heat-dissipating fins and thermal column, and a side of described heat-dissipating fin is solid
Surely it is arranged on a side of described aluminium base, and the plane that described heat-dissipating fin is located with described aluminium base forms angle, institute
The angle stating angle is 30 degree to 90 degree, and described aluminium base has relative first side and second side, described installation position
In described first side, described thermal column is arranged in described second side, and described thermal column is copper post, described thermal column
Including several fixing thermal columns, several main thermal columns and several auxiliary thermal columns, described fixing thermal column and described
Main thermal column is all fixedly installed on described aluminium base, and described auxiliary thermal column is arranged on described heat-dissipating fin, on described substrate
Some through holes are set, and described through hole is in that array is arranged；
Each described installation position is corresponding to install led chip described in；
Described panel radiator is metal plate type radiator；
Wherein, described panel radiator includes each component of following mass percent: 0.7 part～0.5 part of silicon, ferrum 0.5 part～0.6
Part, 0.05 part～0.3 part of copper, 0.3 part～0.7 part of manganese, 2.1 parts～2.9 parts of magnesium, 0.18 part～0.28 part of chromium, 5.1 parts of zinc～
The aluminum of 6.1 parts, 0.2 part～0.3 part of titanium and surplus.
2. the LED lamp with panel radiator according to claim 1 is it is characterised in that described copper post is hollow pipe
Shape structure.
3. the LED lamp with panel radiator according to claim 2 is it is characterised in that on the side wall of described copper post
Offer several louvres.
4. the LED lamp with panel radiator according to claim 3 is it is characterised in that the height of described copper post is
2 times of the thickness of described aluminium base are to 5 times.
5. the LED lamp with panel radiator according to claim 1 is it is characterised in that described installation position is in array
Setting.
6. the LED lamp with panel radiator according to claim 5 is it is characterised in that the radius of described copper post is
The 10% to 20% of the spacing of described installation position.
7. dissipated it is characterised in that also including one according to the arbitrary described LED lamp with panel radiator of claim 1 to 6
Penetrate plate, described scatter plate is fixedly installed in the described first side of described aluminium base, and the light of described led chip emission
Through described scatter plate.
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| CN201410454091.6A CN104180351B (en) | 2014-09-05 | 2014-09-05 | LED lamp with plate type radiator |
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|---|---|---|---|
| CN201410454091.6A CN104180351B (en) | 2014-09-05 | 2014-09-05 | LED lamp with plate type radiator |
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| CN104180351B true CN104180351B (en) | 2017-02-01 |
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| CN104676336A (en) * | 2015-01-30 | 2015-06-03 | 东莞市闻誉实业有限公司 | Led lamp |
| CN108488772A (en) * | 2018-05-25 | 2018-09-04 | 郑州森源新能源科技有限公司 | A kind of LED lamp radiator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260810A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | Novel light emitting diode (LED) radiator base material |
| CN202629987U (en) * | 2012-05-21 | 2012-12-26 | 宣炯华 | Radiator of light emitting diode (LED) lamp |
| CN103322536A (en) * | 2013-05-23 | 2013-09-25 | 邱洪涛 | Light-emitting diode (LED) aluminum pipe drilling efficient radiator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084726Y (en) * | 2007-05-24 | 2008-07-09 | 北京四方吉思电气有限公司 | Heat radiator |
| CN101881425A (en) * | 2010-06-08 | 2010-11-10 | 重庆四联光电科技有限公司 | Heat radiating device for high-power LED street lamp |
| KR20130027377A (en) * | 2011-09-07 | 2013-03-15 | 소닉스자펜 주식회사 | Led light with high heat radiating property |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260810A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | Novel light emitting diode (LED) radiator base material |
| CN202629987U (en) * | 2012-05-21 | 2012-12-26 | 宣炯华 | Radiator of light emitting diode (LED) lamp |
| CN103322536A (en) * | 2013-05-23 | 2013-09-25 | 邱洪涛 | Light-emitting diode (LED) aluminum pipe drilling efficient radiator |
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