CN210605614U - Heat abstractor for computer machine case - Google Patents

Heat abstractor for computer machine case Download PDF

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Publication number
CN210605614U
CN210605614U CN201920988491.3U CN201920988491U CN210605614U CN 210605614 U CN210605614 U CN 210605614U CN 201920988491 U CN201920988491 U CN 201920988491U CN 210605614 U CN210605614 U CN 210605614U
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CN
China
Prior art keywords
liquid
cooling
heat
cooling head
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920988491.3U
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Chinese (zh)
Inventor
文承光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wen Chengguang
Original Assignee
Wen Chengguang
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Filing date
Publication date
Application filed by Wen Chengguang filed Critical Wen Chengguang
Priority to CN201920988491.3U priority Critical patent/CN210605614U/en
Application granted granted Critical
Publication of CN210605614U publication Critical patent/CN210605614U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a heat abstractor for computer machine case, heat abstractor sets up in computer machine incasement portion, heat abstractor includes the coolant liquid case that is used for saving the coolant liquid, the liquid cooling head that is used for cooling down computer machine case, impels pumping installations, heat exchanger, pipe, temperature sensor and the main control unit of coolant liquid incasement portion coolant liquid flow, through pipe connection between pumping installations, coolant liquid case, heat exchanger and the liquid cooling head, the main control unit with temperature sensor, pumping installations, heat exchanger respectively communication connection; the temperature sensor is provided with a plurality of probes which are respectively arranged near the liquid cooling head, the cooling liquid tank and the heat exchanger; the liquid cooling head comprises a liquid cooling head body, a heat conduction layer, a liquid inlet and a liquid outlet, wherein the liquid inlet is used for cooling liquid to flow in, and the liquid outlet is used for cooling liquid to flow out. The device has stronger radiating effect, can prevent that the dust from getting into, can not produce the characteristics of dewfall, noise is low.

Description

Heat abstractor for computer machine case
Technical Field
The utility model relates to a computer manufacturing field specifically is a heat abstractor for computer machine case.
Background
The CPU and other parts of the computer generate heat in the process of high-speed operation, the volume structure of the computer is increasingly miniaturized due to the high integration level of the current integrated circuit, the heat generated by the operation of the computer is concentrated, and the normal work of the CPU and other electronic parts can be influenced if the heat can not be dissipated timely.
In addition to reducing self-heating of the CPU and the electronic components, the computer needs a heat dissipation structure to dissipate heat of the CPU and the electronic components, and the existing heat dissipation methods of the computer mainly include air cooling, semiconductor cooling, water cooling and the like.
The air-cooled type heat radiation mode which is widely used at present adopts the heat radiation sheet with good heat conduction to be tightly attached to a CPU (central processing unit) and other electronic parts with large heat productivity, then a fan is fixed on the other side of the heat radiation sheet to transfer heat from the CPU and other parts to the heat radiation sheet, then the heat radiation sheet is taken away by air flow caused by the rotation of the fan, and meanwhile, a ventilation fan is also often arranged in a case to drive air in a case to flow.
Semiconductor refrigeration adopts semiconductor material to make, can form the semiconductor material one side refrigeration, the one side special construction that generates heat, recycles the fan and can take away the heat of hot face by heat abstractor, and the face of refrigerating like this probably brings the temperature that still is lower than ambient temperature, but still needs the fan in the case, and the case still needs to ventilate, can bring the dust, simultaneously because the face temperature of refrigerating is lower, probably can cause the short circuit at the face dewfall of refrigerating.
SUMMERY OF THE UTILITY MODEL
In order to solve the existing computer heat dissipation problem, especially the chassis dust, refrigeration effect poor, semiconductor refrigeration dew, etc. shortcoming, the invention provides a computer chassis uses the heat dissipating double-fuselage, use the specific coolant as the cooling medium, replace the traditional forced air cooling or refrigerate directly, the device has stronger heat dissipation effects, can prevent the dust from entering, will not produce the dew, the characteristic with low noises.
The invention provides a heat dissipation device for a computer case, which is arranged in the computer case and comprises a cooling liquid tank for storing cooling liquid, a liquid cooling head for cooling the computer case, a pumping device for promoting the flow of the cooling liquid in the cooling liquid tank, a heat exchanger, a conduit, a temperature sensor and a main controller, wherein the pumping device, the cooling liquid tank, the heat exchanger and the liquid cooling head are connected through the conduit,
the main controller is in communication connection with the temperature sensor, the pumping device and the heat exchanger respectively; the temperature sensor is provided with a plurality of probes which are respectively arranged near the liquid cooling head, the cooling liquid tank and the heat exchanger;
the liquid cooling head comprises a liquid cooling head body, a heat conduction layer, a liquid inlet and a liquid outlet, wherein the liquid inlet is used for allowing cooling liquid to flow in, the liquid cooling head body is of a square structure, the heat conduction layer is arranged on a first side face of the liquid cooling head body, a groove is formed in a second side face of the liquid cooling head body, the liquid inlet and the liquid outlet are arranged in the groove in parallel, an elastic mounting part is arranged at each of four corners of the liquid cooling head body, the mounting part is of a rectangular structure, a round chamfer is arranged at the end part of the mounting part, a mounting hole is formed in the end part of the mounting part, the liquid cooling head can be mounted on the computer mainboard by means of bolts, the heat conduction layer is wrapped on the outer surface of the computer mainboard, and the four mounting parts and the liquid;
the cooling liquid tank is connected with a water inlet pipe of the pumping device through a guide pipe, a water outlet pipe of the pumping device is connected with the liquid inlet, the liquid outlet is connected with the heat exchanger through a guide pipe, the heat exchanger is arranged near the liquid outlet and is connected with the cooling liquid tank through a guide pipe, and the heat exchanger is configured to cool the hot cooling liquid passing through the liquid outlet into cool cooling liquid and convey the cool cooling liquid into the cooling liquid tank through the guide pipe;
the heat exchanger contains serpentine conduit and a plurality of fin, serpentine conduit includes a plurality of vertical first pipes and connects the return bend of two adjacent first pipes, the even cover of a plurality of fin is established on a plurality of vertical first pipes.
Preferably, the elbow is a bellows.
Preferably, the heat conducting layer is a red copper layer, and the mounting piece is a rubber fastener.
Preferably, the liquid inlet and the liquid outlet are respectively screwed and fixed with the conduit by screws.
Preferably, the serpentine conduit is made of red copper for heat conduction, and the heat radiating fins are made of red copper sheets or aluminum sheets.
Preferably, the liquid cooling head is provided with one or more liquid cooling heads, when the liquid cooling head is provided with a plurality of liquid cooling heads, the liquid outlet of the first liquid cooling head is connected with the liquid inlet of the next liquid cooling head, and the liquid outlet of the last liquid cooling head is connected with the heat exchanger through a conduit.
Preferably, the main controller is provided with a display nixie tube and an alarm horn, and a water level sensor is arranged inside the cooling liquid tank.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses can solve present computer heat dissipation problem, especially quick-witted case dust, refrigeration effect are poor, shortcomings such as semiconductor refrigeration dewfall, the invention provides a heat abstractor for computer machine case adopts specific coolant liquid as coolant, replaces traditional forced air cooling or direct refrigeration, and the method has stronger radiating effect, can prevent that the dust from getting into, can not produce the dewfall, characteristics that the noise is low.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of a liquid cooling head according to the present invention;
fig. 3 is a schematic structural diagram of the heat exchanger of the present invention.
FIG. 4 is a schematic structural view of a coolant tank of the present invention;
fig. 5 is a schematic structural view of the pumping device of the present invention; and
fig. 6 is a schematic structural diagram of the main controller of the present invention.
Detailed Description
Exemplary embodiments, features and aspects of the present invention will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The invention provides a heat dissipation device for a computer case, which is integrated in the computer case, does not need to greatly improve the existing computer case, is convenient to integrate and arrange, has higher heat dissipation efficiency, and can greatly prolong the service life of the existing computer case.
As shown in fig. 1, the heat dissipation device includes a cooling liquid tank 1 for storing cooling liquid, a liquid cooling head 2 for cooling the computer case, a pumping device 3 for promoting the flow of part of the cooling liquid in the cooling liquid tank, a heat exchanger 4, a conduit, a temperature sensor 5, and a main controller 6, wherein the pumping device 3, the cooling liquid tank 1, the heat exchanger 4, and the liquid cooling head 2 are connected by the conduit, and the conduit may be a corrosion-resistant and high-temperature-resistant water pipe.
The main controller 6 is in communication connection with the temperature sensor 5, the pumping device 3 and the heat exchanger 4 respectively; temperature sensor 5 is provided with a plurality of probes, and a plurality of probes set up respectively near liquid cold head 2, coolant liquid case 1 and heat exchanger 4, and temperature sensor 5 can adopt the temperature information of liquid cold head 2, coolant liquid case 1 and heat exchanger 4 respectively and send this temperature information to main control unit 6, and main control unit 6 can control temperature sensor 5, pumping installations 3, heat exchanger 4's work, guarantees that each part can normally work.
As shown in fig. 2, the liquid cooling head 2 includes a liquid cooling head body 21, a heat conductive layer 22, a liquid inlet 23 for the inflow of cooling liquid, and a liquid outlet 24 for the outflow of cooling liquid, the liquid cooling head body 21 is of a square structure, the heat conducting layer 22 is arranged on the first side surface 211 of the liquid cooling head body 21, the second side surface of the liquid cooling head body 21 is provided with a groove 25, the groove 25 is provided with the liquid inlet 23 and the liquid outlet 24 in parallel, four corners of the liquid cooling head body 21 are respectively provided with a mounting piece 26, the mounting part 26 is a rectangular structure with a round chamfer at the end, the end of the mounting part 26 is provided with a mounting hole 261, the liquid cooling head 2 can be mounted on the computer mainboard by means of bolts, the heat conduction layer 22 is wrapped on the outer surface of the computer mainboard, and the four mounting parts 26 and the liquid cooling head body 21 are designed into a whole.
As shown in fig. 4, the coolant tank 1 is connected to a water inlet pipe of the pumping device 3 through a conduit, a water outlet pipe 32 of the pumping device 3 is connected to the liquid inlet 23, the liquid outlet 24 is connected to the coolant tank 1 through a conduit, the heat exchanger 4 is disposed near the liquid outlet 24, and the heat exchanger 4 is configured to cool the hot coolant passing through the liquid outlet 24 into a cool coolant, and is transported into the coolant tank 1 through the conduit;
as shown in fig. 3, the heat exchanger 4 includes a serpentine conduit 41 and a plurality of fins 42, the serpentine conduit 41 includes a plurality of vertical first conduits and a bent pipe connecting two adjacent first conduits, and the plurality of fins 42 are uniformly sleeved on the plurality of vertical first conduits.
Preferably, the heat conductive layer 22 is made of a violet material having excellent thermal conductivity, and the mounting member 26 is made of an elastic material, so that the heat conductive layer 22 is attached to the CPU and the heat generating component by the elastic force.
Preferably, the liquid inlet 23 and the liquid outlet 24 are screwed to the liquid cooling head.
Preferably, the serpentine conduit 41 is made of copper for heat conduction, the heat sink 42 is made of copper or aluminum for heat exchange with air, and the heat exchanger further includes a heat dissipation fan and other refrigeration devices for accelerating cooling of the heat sink.
Preferably, the pumping device 3 and the cooling fan are driven by PWM, and the main controller 6 drives the pumping device 3 and the cooling fan to operate by outputting PWM waveforms, adjusts the operation rates of the pumping device 3 and the cooling fan, adjusts the operation power according to the current state parameters such as temperature, and the like, saves power consumption, and reduces operation noise.
Preferably, the liquid cooling heads 2 can be cascaded, and the liquid outlet of the previous liquid cooling head is connected with the liquid inlet of the next liquid cooling head to perform heat dissipation cascading.
Preferably, the main controller 6 is provided with a display nixie tube and an alarm horn, wherein the display nixie tube is used for displaying parameters such as working temperature, the alarm horn is used for prompting that the working temperature exceeds a threshold value, or a pumping device and a radiator work abnormally, and the situations of leakage of cooling liquid or low liquid quantity and the like are met, so that a user is warned to check faults in time.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses can solve present computer heat dissipation problem, especially quick-witted case dust, refrigeration effect are poor, shortcomings such as semiconductor refrigeration dewfall, the invention provides a heat abstractor for computer machine case adopts specific coolant liquid as coolant, replaces traditional forced air cooling or direct refrigeration, and the method has stronger radiating effect, can prevent that the dust from getting into, can not produce the dewfall, characteristics that the noise is low.
Finally, it should be noted that: the above-mentioned embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (7)

1. The utility model provides a heat abstractor for computer machine case which characterized in that: the heat dissipation device is arranged in the computer case and comprises a cooling liquid tank for storing cooling liquid, a liquid cooling head for cooling the computer case, a pumping device for promoting the flow of part of the cooling liquid in the cooling liquid tank, a heat exchanger, a conduit, a temperature sensor and a main controller,
the pumping device, the cooling liquid tank, the heat exchanger and the liquid cooling head are connected through a conduit,
the main controller is in communication connection with the temperature sensor, the pumping device and the heat exchanger respectively; the temperature sensor is provided with a plurality of probes which are respectively arranged near the liquid cooling head, the cooling liquid tank and the heat exchanger;
the liquid cooling head comprises a liquid cooling head body, a heat conduction layer, a liquid inlet and a liquid outlet, wherein the liquid inlet is used for allowing cooling liquid to flow in, the liquid cooling head body is of a square structure, the heat conduction layer is arranged on a first side face of the liquid cooling head body, a groove is formed in a second side face of the liquid cooling head body, the liquid inlet and the liquid outlet are arranged in the groove in parallel, an elastic mounting piece is arranged at each of four corners of the liquid cooling head body, the mounting piece is of a rectangular structure, a round chamfer is arranged at the end part of the mounting piece, a mounting hole is formed in the end part of the mounting piece, the liquid cooling head can be mounted on the computer mainboard by means of bolts, the heat conduction layer is wrapped on the outer surface of the computer mainboard, and the four mounting pieces and the liquid;
the cooling liquid tank is connected with a water inlet pipe of the pumping device through a guide pipe, a water outlet pipe of the pumping device is connected with the liquid inlet, the liquid outlet is connected with the heat exchanger through a guide pipe, the heat exchanger is arranged near the liquid outlet and is connected with the cooling liquid tank through a guide pipe, and the heat exchanger is configured to cool the hot cooling liquid passing through the liquid outlet into cool cooling liquid and convey the cool cooling liquid into the cooling liquid tank through the guide pipe;
the heat exchanger contains serpentine conduit and a plurality of fin, serpentine conduit includes a plurality of vertical first pipes and connects the return bend of two adjacent first pipes, the even cover of a plurality of fin is established on a plurality of vertical first pipes.
2. The heat dissipating device for a computer case according to claim 1, wherein: the bent pipe is a corrugated pipe.
3. The heat dissipating device for a computer case according to claim 1, wherein: the heat-conducting layer is the red copper layer, the installed part is the rubber fastener.
4. The heat dissipating device for a computer case according to claim 1, wherein: the liquid inlet and the liquid outlet are fixed with the guide pipe by screwing with screws respectively.
5. The heat dissipating device for a computer case according to claim 2, wherein: the serpentine conduit is made of red copper materials for heat conduction, and the radiating fins are red copper sheets or aluminum sheets.
6. The heat dissipating device for a computer case according to claim 1, wherein: the liquid cooling head is provided with one or more, when the liquid cooling head is provided with a plurality of, the liquid outlet of the first liquid cooling head is connected with the liquid inlet of the next liquid cooling head, and the liquid outlet of the last liquid cooling head is connected with the heat exchanger through a conduit.
7. The heat dissipating device for a computer case according to claim 1, wherein: the main controller is provided with a display nixie tube and an alarm horn, and a water level sensor is arranged in the cooling liquid tank.
CN201920988491.3U 2019-06-25 2019-06-25 Heat abstractor for computer machine case Expired - Fee Related CN210605614U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920988491.3U CN210605614U (en) 2019-06-25 2019-06-25 Heat abstractor for computer machine case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920988491.3U CN210605614U (en) 2019-06-25 2019-06-25 Heat abstractor for computer machine case

Publications (1)

Publication Number Publication Date
CN210605614U true CN210605614U (en) 2020-05-22

Family

ID=70694563

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920988491.3U Expired - Fee Related CN210605614U (en) 2019-06-25 2019-06-25 Heat abstractor for computer machine case

Country Status (1)

Country Link
CN (1) CN210605614U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111935951A (en) * 2020-08-05 2020-11-13 南京先维信息技术有限公司 Big data server machine case

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111935951A (en) * 2020-08-05 2020-11-13 南京先维信息技术有限公司 Big data server machine case

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200522

Termination date: 20210625

CF01 Termination of patent right due to non-payment of annual fee