CN108489303A - A kind of heat sink arrangement with thermal insulation layer - Google Patents
A kind of heat sink arrangement with thermal insulation layer Download PDFInfo
- Publication number
- CN108489303A CN108489303A CN201810221101.XA CN201810221101A CN108489303A CN 108489303 A CN108489303 A CN 108489303A CN 201810221101 A CN201810221101 A CN 201810221101A CN 108489303 A CN108489303 A CN 108489303A
- Authority
- CN
- China
- Prior art keywords
- water
- coiled pipe
- small pump
- radiator
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D7/08—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being otherwise bent, e.g. in a serpentine or zig-zag
- F28D7/082—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being otherwise bent, e.g. in a serpentine or zig-zag with serpentine or zig-zag configuration
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of heat sink arrangement with thermal insulation layer,Including heat dissipation of water tank fan,It is provided with fixed frame below the heat dissipation of water tank fan,It is provided with fin inserting type heat radiator below the fixed frame,It is provided with for water layer below the fin inserting type heat radiator,It is described to be internally provided with copper water case for water layer,It is provided with the first small pump and the second small pump below the copper water case,It is provided with power supply between first small pump and second small pump,It is connected with the first coiled pipe below first small pump,It is provided with the second coiled pipe below second small pump,It is separated by vacuum insulation panel between first coiled pipe and second coiled pipe,There are two main radiator fans for first coiled pipe and the setting of affiliated second coiled pipe side,First coiled pipe is connect with second coiled pipe one end with water-filled radiator；Heat sink arrangement of this kind with thermal insulation layer is easy to use, and radiating rate is fast, and heat dissipation effect is efficient, is suitble to promote the use of.
Description
Technical field
The present invention relates to a kind of heat sink arrangements with thermal insulation layer, specifically belong to heat sink technology field.
Background technology
The heat that machinery or other utensils are generated during the work time shifts to influence its normal work in time
Device or instrument.Common radiator can be divided into air-cooled, heat-pipe radiator, liquid cooling, semiconductor refrigerating, pressure according to radiating mode
The multiple types such as contracting mechanism cold, cooling fin material refer to specific material used in cooling fin.Its heat conductivility of each material is
Different, it is arranged from high to low by heat conductivility, is silver, copper, aluminium, steel respectively.But if with silver come make cooling fin can be too high
It is expensive, therefore best scheme is copper to use, radiating mode refers to the major way that the radiator distributes heat.In thermodynamics,
Heat dissipation is exactly heat transfer, and there are mainly three types of the transfer modes of heat：Heat transfer, thermal convection current and heat radiation.Substance itself or
When substance and substance contact, the transmission of energy is thus referred to as heat transfer, this is a kind of most common thermaltransmission mode.
Existing water-filled radiator absorbs heat by the water being passed through, and when water flows back into water tank, passes through air cooling system
Cool down to the water in water tank, is passed into water-filled radiator again after water cooling and reuptakes heat, it is continuous to recycle, from
And Cooling Process is completed, but this Cooling Process is slower, if the water in water tank, without completely cooling, inefficient, temperature is held very much
Easily accumulation.
Invention content
The technical problem to be solved by the present invention is to overcome the defects of the prior art, provide a kind of radiator dress with thermal insulation layer
It sets, easy to use, water cooling speed is fast.
In order to solve the problems in background technology, the present invention provides the following technical solutions：
A kind of heat sink arrangement with thermal insulation layer of the present invention, including heat dissipation of water tank fan, heat dissipation of water tank fan lower section setting
There is fixed frame, fin inserting type heat radiator is provided with below the fixed frame, is provided with for water layer below the fin inserting type heat radiator, the confession
Water layer is internally provided with copper water case, is provided with the first small pump and the second small pump below the copper water case, and described first
Power supply is provided between small pump and second small pump, it is snakelike to be connected with first below first small pump
Pipe, the second small pump lower section are provided with the second coiled pipe, lead between first coiled pipe and second coiled pipe
Vacuum insulation panel to be crossed to be separated, first coiled pipe and affiliated second coiled pipe side are arranged there are two main radiator fan,
First coiled pipe is connect with second coiled pipe one end with water-filled radiator, and the water-filled radiator both sides are both provided with
Fixed plate is provided with fixed screw in the fixed plate.
It is the heat dissipation of water tank fan, two main radiator fans, described as a preferred technical solution of the present invention
First small pump, second small pump and the power supply pass through electric connection.
It is the heat dissipation of water tank fan, two main radiator fans, described as a preferred technical solution of the present invention
First small pump, second small pump and the power supply pass through electric connection.
As a preferred technical solution of the present invention, the fixed frame is solid by screw and nut with the fin inserting type heat radiator
It is fixed.
As a preferred technical solution of the present invention, the copper water case, first small pump, the water-cooling
It is interconnected between device, second coiled pipe, second small pump, forms a water-cooling system.
The advantageous effect that is reached of the present invention is：Cooling velocity of the present invention is fast, in two small pumps of utilization to copper water case
During carrying out water cycle with water-filled radiator, the first coiled pipe and the second coiled pipe are by two main radiator fans
The serpentine configuration of air cooling effect, the first coiled pipe and the second coiled pipe allows flow can be for a long time in two main radiator fans
It brushes in range, improves the speed of water cooling, when during water being absorbed into heat disturbance to copper water case, water source temperature is just
Can decline, cool down in advance to the hot water of reflux, copper water case to be flowed back into and then using heat dissipation of water tank fan to flowing back into
Water in copper water case carries out second of cooling and heat dissipation, makes the heat spreader of water more thorough, heat would not also gather, and vacuum
Thermal insulation board is isolated by two water pipes, forms two independent heat-dissipating spaces, prevents the heat transfer of one of water pipe to another
A water pipe.
Description of the drawings
Attached drawing is used to provide further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings：
Fig. 1 is internal structure side view of the present invention；
Fig. 2 is front view of the present invention；
Fig. 3 is internal structure front view of the present invention；
In figure：1, heat dissipation of water tank fan；2, fin inserting type heat radiator；3, fixed frame；4, copper water case；5, the first coiled pipe；6, main heat dissipation
Fan；7, water-filled radiator；8, fixed plate；9, fixed screw；10, the first small pump；11, vacuum insulation panel；12, it supplies water
Layer；13, the second small pump；14, the second coiled pipe；15, power supply.
Specific implementation mode
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, it should be understood that preferred reality described herein
Apply example only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.
Embodiment：As shown in Figs. 1-3, including heat dissipation of water tank fan 1,1 lower section of the heat dissipation of water tank fan are provided with fixation
Frame 3,3 lower section of the fixed frame are provided with fin inserting type heat radiator 2, and 2 lower section of the fin inserting type heat radiator is provided with for water layer 12, the confession
Water layer 12 is internally provided with copper water case 4, and 4 lower section of the copper water case is provided with the first small pump 10 and the second small pump 13,
Power supply 15, first small pump, 10 lower section are provided between first small pump 10 and second small pump 13
Be connected with the first coiled pipe 5, second small pump, 13 lower section is provided with the second coiled pipe 11, first coiled pipe 5 with
It is separated by vacuum insulation panel 11 between second coiled pipe 14, first coiled pipe 5 and affiliated second coiled pipe
There are two main radiator fan 6, first coiled pipe 5 and described second coiled pipe, 14 one end and water-filled radiators for the setting of 14 sides
7 connections, 7 both sides of the water-filled radiator are both provided with fixed plate 8, fixed screw 9 are provided in the fixed plate 8.
In order to keep heat sink arrangement of this kind with thermal insulation layer easy to use, 1, two master of the heat dissipation of water tank fan dissipates
Hot-air fan 6, first small pump 10, second small pump 13 and the power supply 15 pass through electric connection, the water
Case radiator fan 1 is fixed with the fixed frame 3 by screw and nut, and the fixed frame 3 passes through screw with the fin inserting type heat radiator 2
Nut is fixed, the copper water case 4, first small pump 10, the water-filled radiator 7, second coiled pipe 14, described
It is interconnected between second small pump 13, forms a water-cooling system.
Structure of the invention reasonable design, it is compact-sized, in use, entire heat sink arrangement is fixed by fixed screw 9
In on the processor for needing to radiate, according to the principle of heat transfer between metal, 7 absorption processor of water-filled radiator of bottom is sent out
Heat, the water in copper water case 4 is transported to by the first coiled pipe 5 in water-filled radiator 7 using the first small pump 10,
The water for absorbing heat, is recovered in copper water case 4 by the heat that water-filled radiator 7 is absorbed using water by the second small pump 13,
During the hot water of absorption, two main radiator fans 6 carry out wind cooling temperature lowering to two coiled pipes, so in advance to returning
The hot water of stream cools down, copper water case 4 to be flowed back into and then using heat dissipation of water tank fan 1 to flowing back into the water in copper water case 4
Second of cooling and heat dissipation is carried out, makes the heat spreader of water more thorough, heat would not also gather, meanwhile, in the first miniature water
During the water cooled down is re-delivered to water-filled radiator 7 by pump 10, another main radiator fan 6 is equally to the first snake
Shape pipe 5 carries out wind cooling temperature lowering.Heat sink arrangement radiating rate of this kind with thermal insulation layer is fast, and cooling efficiency is high, is suitble to promote the use of.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in the present invention's
Within protection domain.
Claims (5)
1. a kind of heat sink arrangement with thermal insulation layer, including heat dissipation of water tank fan（1）, which is characterized in that the heat dissipation of water tank wind
Fan（1）Lower section is provided with fixed frame（3）, the fixed frame（3）Lower section is provided with fin inserting type heat radiator（2）, the fin inserting type heat radiator
（2）Lower section is provided with for water layer（12）, described for water layer（12）It is internally provided with copper water case（4）, the copper water case（4）Lower section is set
It is equipped with the first small pump（10）With the second small pump（13）, first small pump（10）With second small pump
（13）Between be provided with power supply（15）, first small pump（10）Lower section is connected with the first coiled pipe（5）, described second is small
Type water pump（13）Lower section is provided with the second coiled pipe（11）, first coiled pipe（5）With second coiled pipe（14）Between
Pass through vacuum insulation panel（11）It is separated, first coiled pipe（5）With affiliated second coiled pipe（14）Side is provided with two
A main radiator fan（6）, first coiled pipe（5）With second coiled pipe（14）One end and water-filled radiator（7）Connection,
The water-filled radiator（7）Both sides are both provided with fixed plate（8）, the fixed plate（8）On be provided with fixed screw（9）.
2. a kind of heat sink arrangement with thermal insulation layer according to claim 1, which is characterized in that the heat dissipation of water tank fan
（1）, two main radiator fans（6）, first small pump（10）, second small pump（13）With the power supply
（15）Pass through electric connection.
3. a kind of heat sink arrangement with thermal insulation layer according to claim 1, which is characterized in that the heat dissipation of water tank fan
（1）With the fixed frame（3）It is fixed by screw and nut.
4. a kind of heat sink arrangement with thermal insulation layer according to claim 1, which is characterized in that the fixed frame（3）With
The fin inserting type heat radiator（2）It is fixed by screw and nut.
5. a kind of heat sink arrangement with thermal insulation layer according to claim 1, which is characterized in that the copper water case（4）, institute
State the first small pump（10）, the water-filled radiator（7）, second coiled pipe（14）, second small pump（13）
Between be interconnected, formed a water-cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810221101.XA CN108489303A (en) | 2018-03-17 | 2018-03-17 | A kind of heat sink arrangement with thermal insulation layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810221101.XA CN108489303A (en) | 2018-03-17 | 2018-03-17 | A kind of heat sink arrangement with thermal insulation layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108489303A true CN108489303A (en) | 2018-09-04 |
Family
ID=63339812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810221101.XA Pending CN108489303A (en) | 2018-03-17 | 2018-03-17 | A kind of heat sink arrangement with thermal insulation layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108489303A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860948A (en) * | 2019-01-22 | 2019-06-07 | 重庆交通大学 | Battery solenoid heat management device |
| CN112397992A (en) * | 2020-11-06 | 2021-02-23 | 光华临港工程应用技术研发(上海)有限公司 | Heat dissipation device for laser |
| WO2022134142A1 (en) * | 2020-12-22 | 2022-06-30 | 苏州新奇迅网络有限公司 | Heat dissipation network equipment rack for large-scale gateway |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN101592445A (en) * | 2009-04-22 | 2009-12-02 | 林义雄 | Cooler |
| CN204705258U (en) * | 2015-06-17 | 2015-10-14 | 重庆亿能福科技有限公司 | Be applicable to having the closed cooling tower that the area of icing weather uses |
| CN205066501U (en) * | 2015-09-24 | 2016-03-02 | 向泽海 | Clean formula cooling tower |
| CN107328247A (en) * | 2017-08-29 | 2017-11-07 | 李林丹 | A kind of high-temperature flue gas flash cooler |
| CN108268110A (en) * | 2018-04-20 | 2018-07-10 | 郑鸿 | A kind of area of computer aided radiator |
-
2018
- 2018-03-17 CN CN201810221101.XA patent/CN108489303A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN101592445A (en) * | 2009-04-22 | 2009-12-02 | 林义雄 | Cooler |
| CN204705258U (en) * | 2015-06-17 | 2015-10-14 | 重庆亿能福科技有限公司 | Be applicable to having the closed cooling tower that the area of icing weather uses |
| CN205066501U (en) * | 2015-09-24 | 2016-03-02 | 向泽海 | Clean formula cooling tower |
| CN107328247A (en) * | 2017-08-29 | 2017-11-07 | 李林丹 | A kind of high-temperature flue gas flash cooler |
| CN108268110A (en) * | 2018-04-20 | 2018-07-10 | 郑鸿 | A kind of area of computer aided radiator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109860948A (en) * | 2019-01-22 | 2019-06-07 | 重庆交通大学 | Battery solenoid heat management device |
| CN112397992A (en) * | 2020-11-06 | 2021-02-23 | 光华临港工程应用技术研发(上海)有限公司 | Heat dissipation device for laser |
| WO2022134142A1 (en) * | 2020-12-22 | 2022-06-30 | 苏州新奇迅网络有限公司 | Heat dissipation network equipment rack for large-scale gateway |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180904 |
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| WD01 | Invention patent application deemed withdrawn after publication |