CN104180350B - LED (Light Emitting Diode) lamp with flat type radiator - Google Patents
LED (Light Emitting Diode) lamp with flat type radiator Download PDFInfo
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- CN104180350B CN104180350B CN201410453301.XA CN201410453301A CN104180350B CN 104180350 B CN104180350 B CN 104180350B CN 201410453301 A CN201410453301 A CN 201410453301A CN 104180350 B CN104180350 B CN 104180350B
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- 238000009434 installation Methods 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 68
- 230000005855 radiation Effects 0.000 claims description 51
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 42
- 229910052782 aluminium Inorganic materials 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 239000011777 magnesium Substances 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
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- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 61
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000004411 aluminium Substances 0.000 description 37
- 238000001816 cooling Methods 0.000 description 24
- 239000006185 dispersion Substances 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
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- 229910017708 MgZn2 Inorganic materials 0.000 description 3
- 241000276425 Xiphophorus maculatus Species 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
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- 239000000741 silica gel Substances 0.000 description 2
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED (Light Emitting Diode) lamp with a flat type radiator. The LED lamp with the flat type radiator comprises a flat type radiator and a plurality of LED chips; the flat type radiator is provided with a plurality of installation positions; every installation position is provided with one LED chip correspondingly; the flat type radiator is a metal flat type radiator. The LED lamp with the flat type radiator has the advantages of being simple in structure, achieving an integral structure, being good in heat dissipation effect and satisfying utilization of a large power LED lamp due to the fact that the LED chips are directly arranged on the flat type radiator and being good in heat conduction and heat dissipation effect and low in manufacturing difficulty and cost compared with a traditional LED lamp which requires adding a heat dissipation device due to the fact that the flat type radiator can be directly served as an outer casing.
Description
Technical field
The present invention relates to LED lamp heat sink field, particularly relate to a kind of LED lamp with flat radiator.
Background technology
LED (Light Emitting Diode, light emitting diode), it can directly and efficiently convert electrical energy into visible
Light, and having up to tens thousand of hours～the service life of 100,000 hours, thus it is widely used in view, safety, extraordinary and general
The fields such as logical illumination, market potential is beyond measure.
The basic structure of LED is the P N knot of a quasiconductor, and when electric current flows through LED element, the temperature of P N knot will
Rising, and the temperature in P N interface is referred to as the junction temperature of LED, is typically due to element chip and is respectively provided with the least size, therefore, also
The temperature of LED chip is referred to as the junction temperature of LED chip.
The LED lamp using LED to make is referred to as the most frequently used lighting with the advantage such as of fine quality, durable, energy-conservation.
But, the drawback that LED lamp self exists is, LED lamp light efficiency is affected relatively big, relatively by the junction temperature of LED
High junction temperature of chip will cause light efficiency to occur being decreased obviously, and influence whether the service life of LED lamp.Owing to LED is being sent out
Light time, the temperature of himself can constantly raise, in lasting illumination work, if the heat that LED produces can not be sent out in time
Shed, it will cause the damage of LED, affect the service life of LED.Therefore, the heat dissipation problem of LED is solved for carrying
The performance rising LED is most important.
For the problems referred to above, the heat energy produced during LED luminescence is typically directly delivered to aluminium alloy or each by some LED lamp
Plant metal shell to dispel the heat, or by heat conductive silica gel transferring heat energy, thus the high temperature produced when reducing LED illumination, reduce LED light
Decline, extend LED illumination service life.
But, for the LED lamp that luminous power is bigger, due to the radiating effect of shell and leading of heat conductive silica gel
Thermal effect is poor can not meet cooling requirements, therefore can not well realize the high temperature produced during reduction LED illumination.If additionally increasing again
If heat abstractor is on shell, then can increase manufacture difficulty, and cost is the highest.
Summary of the invention
Based on this, it is necessary to provide the LED that a kind of good heat dissipation effect, structure are better simply, have flat radiator
Tool.
A kind of LED lamp with flat radiator, it is characterised in that including: flat radiator and several
LED chip；
Described flat radiator arranges several installation positions；
Each described installation position correspondence installs LED chip described in；
Described flat radiator is metal flat flat radiator.
In one of them embodiment, described flat radiator arranges some through holes.
In one of them embodiment, described through hole is that array is arranged.
In one of them embodiment, described installation position is that array is arranged.
In one of them embodiment, each described installation position is arranged at the center of the rectangle that four described through holes surround.
In one of them embodiment, the aperture of described through hole is less than the spacing of described installation position.
In one of them embodiment, the aperture of described through hole is the 20% to 40% of the spacing of described installation position.
In one of them embodiment, described installation position is hemispherical.
In one of them embodiment, described LED chip is arranged on the side of described flat radiator, and is installed on
In described installation position.
In one of them embodiment, also include that a scatter plate, described scatter plate are fixedly installed on described flat radiator
On, and the light that described LED chip is launched is through described scatter plate.
Above-mentioned have the LED lamp of flat radiator by LED chip being set directly on flat radiator, knot
Structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, relatively
Tradition in traditional LED lamp, needs to set up heat abstractor at shell, the above-mentioned LED lamp with flat radiator flat
Flat radiator can directly use as shell, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, cost
Relatively low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp of an embodiment of the present invention；
Fig. 2 is the structural representation of the LED lamp with flat radiator of an embodiment of the present invention；
Fig. 3 is the structural representation of the flat radiator shown in Fig. 2；
Fig. 4 is the structural representation at another visual angle of the flat radiator shown in Fig. 3；
Fig. 5 is the structural representation at the another visual angle of the flat radiator shown in Fig. 2；
Fig. 6 is the structural representation of the LED lamp with panel radiator of an embodiment of the present invention；
Fig. 7 is the structural representation of the aluminium base shown in Fig. 6；
Fig. 8 is the structural representation of the thermal column shown in Fig. 6；
Fig. 9 is the structural representation of the integral LED lamp of an embodiment of the present invention；
Figure 10 is the structural representation of the scatter plate shown in Fig. 9.
Detailed description of the invention
Understandable, below in conjunction with the accompanying drawings to the present invention for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from
Detailed description of the invention be described in detail.Elaborate a lot of detail in the following description so that fully understanding this
Bright.But the present invention can implement to be much different from alternate manner described here, and those skilled in the art can be not
Doing similar improvement in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
Refer to Fig. 1, have the LED lamp 10 of flat radiator include radiator 70, several LED chip 80 and
Scatter plate 90.Several LED chip 80 and scatter plate 90 are installed on radiator 70, by LED chip 80 directly being set
Putting on radiator 70, radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, it is relatively conventional in traditional
LED lamp, needs to set up heat abstractor at shell, and the radiator 70 of above-mentioned LED lamp 10 can directly use as shell, and
Having fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
It is specific embodiment part below.
Embodiment 1
Referring to Fig. 2, have the LED lamp 20 of flat radiator, it includes flat radiator 400, several LED
Chip (Chip) 500 and scatter plate 600.Several LED chip 500 and scatter plate 600 are respectively provided with flat radiator 400
On.By LED chip 500 directly being arranged on flat radiator 400, radiating effect is preferable, can meet high-power LED
Light fixture uses.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor, above-mentioned flat radiator at shell
LED lamp 20 flat radiator 400 can directly as shell use, and have fabulous heat conduction and heat radiation effect
Really, manufacture difficulty is relatively low, and cost is relatively low.
Referring to Fig. 3 to Fig. 5, it is the structural representation of three different directions of the flat radiator 400 shown in Fig. 2
Figure.Flat radiator 400 include several heat-conducting substrates 410, two heat radiation 420, two fixing radiating fins 430 of wing plate,
Several main radiating fins 440 and several auxiliary radiating fins 450.Heat radiation wing plate 420, fixing radiating fin 430 and master
Radiating fin 440 is all fixedly installed on heat-conducting substrate 410, and auxiliary radiating fin 450 is arranged on heat radiation wing plate 420.And for example, lead
Hot substrate 410, two heat radiation 420, two fixing radiating fins 430 of wing plate, several main radiating fins 440 and several are auxiliary
Radiating fin 450 is formed in one structure.Wherein, as shown in Figure 3, Figure 4, the flat design of heat-conducting substrate 410, such as, it is thick
Degree is 3 to 5 millimeters, as such, it is possible to effectively reduce the integral thickness of flat radiator 400, reaches overall flat effect.
Several heat-conducting substrates 410 be spaced successively be fixedly installed on fixing radiating fin 430, main radiating fin 440 and
One side of heat radiation wing plate 420, say, that the bearing of trend of several heat-conducting substrates 410 is parallel, fixing radiating fin 430,
The bearing of trend of main radiating fin 440 and heat radiation wing plate 420 is vertical with the bearing of trend of heat-conducting substrate 410, as such, it is possible to
Improve the hollow out degree of flat radiator 400, it is simple to be internally formed more heat-dissipating space at flat radiator 400, from
And improve the cooling surface area of flat radiator 400, and then improve the radiating effect of flat radiator 400.
In order to increase the cooling surface area of flat radiator 400, meanwhile, it is beneficial to flow through both sides heat radiation wing plate 420 relatively
Cold air is taken away heat-conducting substrate 410 and is passed to the heat of heat radiation wing plate 420, forms cross-ventilation heat transfer, such that it is able to further
Improve the radiating effect of flat radiator 400, such as, refer to Fig. 3, if a side of heat radiation wing plate 420 is fixedly installed on
On the end, one end of dry heat-conducting substrate 410, and the plane at heat radiation wing plate 420 and several heat-conducting substrate 410 places forms folder
Angle, such as, the angle of described angle is 30 degree to 90 degree.It is appreciated that the heat radiation wing plate 420 side away from heat-conducting substrate 410
Extraneous air is stretched in inclined direction, limit, as such, it is possible to increase the cooling surface area of flat radiator 400, additionally, be additionally favorable for
Flow through both sides heat radiation wing plate 420 cooler air take away heat-conducting substrate 410 pass to dispel the heat wing plate 420 heat, formed air
Convection heat transfer' heat-transfer by convection, such that it is able to improve the radiating effect of flat radiator 400 further.And for example, heat radiation wing plate 420 is square plate
Shape structure, and for example, heat radiation wing plate 420 is arc platy structure.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 4, several auxiliary heat radiations
Fin 450 is spaced successively and is fixedly installed on heat radiation wing plate 420, and the bearing of trend of several auxiliary radiating fins 450 is identical, and
The bearing of trend of several auxiliary radiating fins 450 is vertical with the bearing of trend of heat-conducting substrate 410, as such, it is possible to increase further
Add the cooling surface area of flat radiator 400, such that it is able to improve the radiating effect of flat radiator 400 further.
In order to preferably install flat radiator 400, such as, refer to Fig. 5, a side of fixing radiating fin 430
Being fixedly installed on the medium position of several heat-conducting substrates 410, another side edge bending of fixing radiating fin 430 is arranged
Buckle installation portion 431, so, flat radiator 400 can be directly installed on outside support by buckle installation portion 431,
Such that it is able to preferably install flat radiator 400.Such as, it is arranged on floor body of wall.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 5, main radiating fin
One side of 440 is fixedly installed on two side positions of several heat-conducting substrates 410, the extension of several main radiating fins 440
Direction is identical, and the bearing of trend of several main radiating fins 440 is vertical with the bearing of trend of heat-conducting substrate 410, so,
The cooling surface area of flat radiator 400 can be increased further, such that it is able to improve flat radiator 400 further
Radiating effect.
In order to preferably install flat radiator 400, meanwhile, it is beneficial to optimize the structure of flat radiator 400, more preferably
Ground improves radiating effect, such as, refers to Fig. 5, two fixing radiating fins 430, several main radiating fins 440 and some
Individual auxiliary radiating fin 450 is fixedly installed after heat-conducting substrate 410 and forms sector structure, the height of i.e. two fixing radiating fins 430,
The height of main radiating fin 440 and the height of auxiliary radiating fin 450 successively decrease successively, so, on the one hand can avoid main heat radiation
Fin 440 and auxiliary radiating fin 450 are to installing the interference that fixing radiating fin 430 produces, by which better fixing radiating fin
Sheet 430 installs flat radiator 400, at the same time it can also be play the effect of the structure optimizing flat radiator 400, more preferably
Ground improves heat dispersion.
For more progressive the heat dispersion improving described flat radiator, such as, described flat radiator is gold
Belonging to flat radiator, and for example, described flat radiator is the flat radiator of alloy.
Such as, the flat radiator of an embodiment includes each component of following mass percent:
Silicon 0.4 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.4 part of manganese, 2.1 parts of magnesium
～2.9 parts, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and the aluminum of surplus.It is appreciated that
By using zinc and the magnesium of above-mentioned mass percent, the strengthening significant MgZn2 of effect can be formed so that the heat of flat radiator
Treatment effect will be greatly improved far better than a zinc bianry alloy, tensile strength, and stress corrosion resistant and anti-stripping
The ability corroded that falls also can increase, and heat-conductive characteristic is the biggest, the good heat dispersion performance of the most flat radiator.
Referring to Fig. 2, heat-conducting substrate 410 is away from two heat radiation 420, two fixing radiating fins 430 of wing plate, several masters
The one side of radiating fin 440 and several auxiliary radiating fins 450 arranges several installation positions 411, is used for installing LED chip
500。
In order to preferably be arranged on LED chip and protect LED chip, such as, described installation position is hemispherical, described
LED chip is arranged on the side of described heat-conducting substrate, and described LED chip is fixed and is placed in described installation position, so,
Can preferably be arranged on LED chip and protect LED chip.
In order to increase the radiating effect of heat-conducting substrate 410 further, such as, refer to Fig. 2, heat-conducting substrate 410 is arranged
Some through holes 412, through hole 412 can increase the cooling surface area of heat-conducting substrate 410, and heat-conducting substrate 410 is positioned at and is provided with
The relatively warm air of the side of LED chip 500 can expand via through holes 412 inflow by own vol and be provided with two heat radiation wing plates
420, two fixing radiating fins 430, several main radiating fins 440 and the opposite side of several auxiliary radiating fins 450, this
Sample, by above-mentioned air's circulation, can increase the radiating effect of heat-conducting substrate 410 further.
In order to further increase the radiating effect of heat-conducting substrate 410, take away the heat that LED chip 500 produces more quickly
Amount, such as, refers to Fig. 2, and through hole 412 is arranged in array, and installation position 411 is arranged in array.And for example, each installation position 411 sets
It is placed in the center of the rectangle that four through holes 412 surround.And for example, the aperture of through hole 412 be installation position 411 spacing 20% to
40%.And for example, the aperture of through hole 412 is less than the spacing of installation position 411.
Referring to Fig. 2, scatter plate 600 is fixedly installed on heat-conducting substrate 410, and LED chip 500 is positioned at heat-conducting substrate
Between 410 and scatter plate 600, the light that LED chip 500 is launched exposes to outside through scatter plate 600.
Above-mentioned have the LED lamp 20 of flat radiator by LED chip 500 is set directly at flat radiator
On 400, structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture and use.This
Outward, relatively conventional in traditional LED lamp, need to set up heat abstractor, the above-mentioned LED with flat radiator at shell
The flat radiator 400 of tool 20 can directly use as shell, and has fabulous heat conduction and radiating effect, manufactures difficulty
Spending relatively low, cost is relatively low.
Embodiment 2
Referring to Fig. 6 and Fig. 7, the LED lamp with flat radiator is the LED lamp 30 with panel radiator,
It includes panel radiator 700, several LED chip 800 and scatter plate 900.Several LED chip 800 and scatter plates
900 are respectively provided with on panel radiator 700.By directly arranging on panel radiator 700 by LED chip 800, radiating effect is relatively
Good, high-power LED light fixture can be met and use.Additionally, relatively conventional in traditional LED lamp, needs are set up scattered at shell
Thermal, the panel radiator 700 of the LED lamp 30 of above-mentioned panel radiator directly can use as shell, and have pole
Good heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low
Referring to Fig. 6, panel radiator 700 includes 710, two heat-dissipating fins 720 of an aluminium base, several fixing heat radiations
Post 730, several main thermal columns 740 and several auxiliary thermal columns 750.Heat-dissipating fin 720, fixing thermal column 730 and master
Thermal column 740 is all fixedly installed on aluminium base 710, and auxiliary thermal column 750 is arranged on heat-dissipating fin 720.
Several fixing thermal columns 730 are arranged in array on aluminium base 710, such as, and several fixing thermal columns 730 points
Cloth is that two rows are arranged on aluminium base 710, and often the line of fixing thermal column 730 in row is straight line.Several main thermal columns
740 are arranged on aluminium base 710 in array, and such as, several main thermal columns 740 are arranged on aluminium base 710 in some rows, and
Often the line of the main thermal column 740 in row is straight line.Several auxiliary thermal columns 750 are arranged in array on heat-dissipating fin 720, example
As, several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in some rows, and often the line of auxiliary thermal column 750 in row is straight
Line.As such, it is possible to improve the hollow out degree of panel radiator 700, it is simple to be internally formed more heat radiation at panel radiator 700
Space, thus improve the cooling surface area of panel radiator 700, and then improve the radiating effect of panel radiator 700.
In order to increase the cooling surface area of panel radiator 700, meanwhile, it is beneficial to flow through the colder of both sides heat-dissipating fin 720
Air is taken away aluminium base 710 and is passed to the heat of heat-dissipating fin 720, forms cross-ventilation heat transfer, such that it is able to improve further
The radiating effect of panel radiator 700, such as, refers to Fig. 6, and a side of heat-dissipating fin 720 is fixedly installed on aluminium base 710
A side on, and the plane at heat-dissipating fin 720 and aluminium base 710 place forms angle, and such as, the angle of described angle is 30
Degree is to 90 degree.It is appreciated that heat-dissipating fin 720 stretches into extraneous air away from an inclined direction of side of aluminium base 710, this
Sample, can increase the cooling surface area of panel radiator 700, additionally, be additionally favorable for flowing through the cooler air of both sides heat-dissipating fin 720
Take away aluminium base 710 and pass to the heat of heat-dissipating fin 720, form cross-ventilation heat transfer, such that it is able to improve board-like further
The radiating effect of radiator 700.And for example, heat-dissipating fin 720 is square laminated structure, and and for example, heat-dissipating fin 720 is arc-shaped flaky
Structure.
In order to increase the cooling surface area of panel radiator 700 further, such as, refer to Fig. 6, several auxiliary thermal columns
750 successively interval be fixedly installed on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 are arranged on heat-dissipating fin in array
On 720, and for example, several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in some rows, and the often auxiliary thermal column 750 in row
Line is straight line.As such, it is possible to increase the cooling surface area of panel radiator 700 further, such that it is able to improve plate further
The radiating effect of formula radiator 700.
For preferably mounting plate type radiator 700, such as, referring to Fig. 6, several fixing thermal columns 730 are in array
Being arranged on aluminium base 710, such as, several fixing thermal columns 730 are distributed and are arranged on aluminium base 710 in two rows, and often arrange
In the line of fixing thermal column 730 be straight line.And for example, one end of fixing thermal column 730 is fixedly installed on several aluminium bases
On the medium position of 710, the other end end bending of fixing thermal column 730 arranges buckle installation portion 731, so, plate type radiator
Device 700 can be directly installed on outside support by buckle installation portion 731, such that it is able to preferably mounting plate type radiator
700.Such as, it is arranged on floor body of wall.
In order to increase the cooling surface area of panel radiator 700 further, such as, refer to Fig. 6, main thermal column 740
One end is fixedly installed on two side positions of several aluminium bases 710, and and for example, several main thermal columns 740 are arranged in array
On aluminium base 710, such as, several main thermal columns 740 are arranged on aluminium base 710 in some rows, and often row in main heat radiation
The line of post 740 is straight line, as such, it is possible to increase the cooling surface area of panel radiator 700 further, such that it is able to further
Improve the radiating effect of panel radiator 700.
For preferably mounting plate type radiator 700, meanwhile, it is beneficial to optimize the structure of panel radiator 700, preferably carries
High radiating effect, such as, refers to Fig. 6, two fixing thermal columns 730, several main thermal columns 740 and several auxiliary heat radiations
Post 750 forms bow-shaped structural after being fixedly installed aluminium base 710, so, on the one hand can avoid main thermal column 740 and auxiliary heat radiation
Post 750 is to installing the interference that fixing thermal column 730 produces, by which better fixing thermal column 730 mounting plate type radiator 700,
At the same time it can also be play the effect of the structure optimizing panel radiator 700, preferably improve heat dispersion.
In order to further improve the heat dispersion of described panel radiator, such as, described panel radiator is metal
Panel radiator, and for example, described panel radiator is alloy plate type radiator.
Such as, the panel radiator of an embodiment includes each component of following mass percent:
Silicon 0.7 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.7 part of manganese, 2.1 parts of magnesium
～2.9 parts, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and the aluminum of surplus.It is appreciated that
By using zinc and the magnesium of above-mentioned mass percent, the strengthening significant MgZn2 of effect can be formed so that at the heat of panel radiator
Reason effect will be greatly improved far better than a zinc bianry alloy, tensile strength, and stress corrosion resistant and anti-strip
The ability of corrosion also can increase, and heat-conductive characteristic is the biggest, i.e. the good heat dispersion performance of panel radiator.
And for example, described aluminium base is identical with described thermal column material or different setting, and and for example, described aluminium base is that aluminum closes
Gold base, described thermal column is copper post.And for example, described thermal column specifically include described fixing thermal column, described main thermal column with
And described auxiliary thermal column.
In order to further enhance the radiating effect of described thermal column, such as, described thermal column is copper post, and for example, and described copper
Post is hollow tubular structure, and for example, refers to Fig. 8, the sidewall of copper post 900a offers several louvres 910a.And for example,
2 times to 5 times of the thickness that height is described aluminium base of described copper post；The thickness that height is described aluminium base of the most described copper post
3.2 times of degree.And for example, described thermal column is that array is arranged.As such, it is possible to increase the heat radiation effect strengthening described thermal column further
Really.
Please refer to Fig. 6 and Fig. 7, aluminium base 710 away from two heat-dissipating fins 720, several fixing thermal columns 730,
The one side of several main thermal columns 740 and several auxiliary thermal columns 750 arranges several installation positions 711, is used for installing LED
Chip 800.
In order to preferably install LED chip and protect LED chip, such as, described installation position is hemispherical, described LED
Chip is arranged on the side of described aluminium base, and described LED chip is fixed and is placed in described installation position, as such, it is possible to
Preferably it is arranged on LED chip and protects LED chip.
In order to increase the radiating effect of aluminium base 710 further, such as, refer to Fig. 7, aluminium base 710 is arranged some
Through hole 712, through hole 712 can increase the cooling surface area of aluminium base 710, and aluminium base 710 is positioned at and is provided with LED chip
If the relatively warm air of the side of 800 can expand via through holes 712 inflow by own vol is provided with two heat-dissipating fins 720
Dry individual fixing thermal column 730, several main thermal columns 740 and the opposite side of several auxiliary thermal columns 750, so, by upper
State air's circulation, the radiating effect of aluminium base 710 can be increased further.
In order to further increase the radiating effect of aluminium base 710, take away the heat that LED chip 800 produces more quickly,
Such as, referring to Fig. 7, through hole 712 is arranged in array, and installation position 711 is arranged in array.And for example, each installation position 711 is arranged at
The center of the rectangle that four through holes 712 surround.And for example, the aperture of through hole 712 be installation position 711 spacing 30% to 70%.
And for example, the aperture of through hole 712 is less than the spacing of installation position 711.
Referring to Fig. 6, scatter plate 900 is fixedly installed on aluminium base 710, and LED chip 800 be positioned at aluminium base 710 with
And between scatter plate 900, the light that LED chip 800 is launched exposes to outside through scatter plate 900.
Such as, described panel radiator is provided with several installation positions and several thermal columns；Described plate type radiator
Device includes that aluminium base and thermal column, described aluminium base have the first relative side and the second side, position, described installation position
On described first side, described thermal column is arranged on described second side.And for example, each described installation position correspondence installs one
Described LED chip；Described installation position is that array is arranged.The 10% of the spacing that radius is described installation position of described copper post to
20%.And for example, described scatter plate is fixedly installed on described first side of described aluminium base, and described LED chip is launched
Light through described scatter plate.
Above-mentioned have the LED lamp 30 of panel radiator by LED chip 800 is set directly at panel radiator 700
On, structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture and use.Additionally,
Relatively conventional in traditional LED lamp, need to set up heat abstractor, the above-mentioned LED lamp 30 with panel radiator at shell
Panel radiator 700 can directly use as shell, and have fabulous heat conduction and radiating effect, manufacture difficulty is relatively
Low, cost is relatively low.
Embodiment 3
Refer to Fig. 9, have the LED lamp 50 of flat radiator include radiator 100, several LED chip 200 with
And scatter plate 300.Several LED chip 200 and scatter plate 300 are respectively provided with on radiator 100.By by straight for LED chip 200
Connecing and arrange on radiator 100, radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, it is relatively conventional in biography
The LED lamp of system, needs to set up heat abstractor at shell, and the radiator 100 of the LED lamp 20 of above-mentioned radiator can directly be worked as
Making shell to use, and have fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low
Referring to Fig. 9, radiator 100 includes several substrates 110, two heat radiation 120, two fixing radiating fins of wing plate
130, several main radiating fins 140 and several auxiliary radiating fins 150.Heat radiation wing plate 120, fixing radiating fin 130 with
And main radiating fin 140 is all fixedly installed on substrate 110, auxiliary radiating fin 150 is arranged on heat radiation wing plate 120.
Several substrates 110 are spaced successively and are fixedly installed on fixing radiating fin 130, main radiating fin 140 and heat radiation
One side of wing plate 120, say, that the bearing of trend of several substrates 110 is parallel, fixing radiating fin 130, main radiating fin
The bearing of trend of sheet 140 and heat radiation wing plate 120 is vertical with the bearing of trend of substrate 110, as such, it is possible to improve radiator
The hollow out degree of 100, it is simple to be internally formed more heat-dissipating space at radiator 100, thus improve the heat radiation table of radiator 100
Area, and then improve the radiating effect of radiator 100.
In order to increase the cooling surface area of radiator 100, meanwhile, it is beneficial to flow through the cooler air of both sides heat radiation wing plate 120
Take away substrate 110 and pass to the heat of heat radiation wing plate 120, form cross-ventilation heat transfer, such that it is able to improve radiator further
The radiating effect of 100, such as, refers to Fig. 9, and a side of heat radiation wing plate 120 is fixedly installed on one end of several substrates 110
On end, and the plane at heat radiation wing plate 120 and several substrate 110 places forms angle, and such as, the angle of described angle is 30
Degree is to 90 degree.It is appreciated that heat radiation wing plate 120 stretches into extraneous air away from an inclined direction of side of substrate 110, so,
The cooling surface area of radiator 100 can be increased, additionally, the cooler air being additionally favorable for flowing through both sides heat radiation wing plate 120 takes away base
Plate 110 passes to the heat of heat radiation wing plate 120, forms cross-ventilation heat transfer, such that it is able to improve the scattered of radiator 100 further
Thermal effect.And for example, heat radiation wing plate 120 is square platy structure, and and for example, heat radiation wing plate 120 is arc platy structure.
In order to increase the cooling surface area of radiator 100 further, such as, refer to Fig. 9, several auxiliary radiating fins
150 successively interval be fixedly installed on heat radiation wing plate 120 on, the bearing of trend of several auxiliary radiating fins 150 is identical and some
The bearing of trend of individual auxiliary radiating fin 150 is vertical with the bearing of trend of substrate 110, as such, it is possible to increase radiator further
The cooling surface area of 100, such that it is able to improve the radiating effect of radiator 100 further.
In order to preferably install radiator 100, such as, referring to Fig. 9, a side of fixing radiating fin 130 is fixing to be set
Being placed on the medium position of several substrates 110, another side edge bending of fixing radiating fin 130 arranges buckle installation portion
131, so, radiator 100 can be directly installed on outside support, such that it is able to preferably pacify by buckle installation portion 131
Dress radiator 100.Such as, it is arranged on floor body of wall.
In order to increase the cooling surface area of radiator 100 further, such as, Fig. 9, the one of main radiating fin 140 are referred to
Side is fixedly installed on two side positions of several substrates 110, and the bearing of trend of several main radiating fins 140 is identical, and
And the bearing of trend of several main radiating fins 140 is vertical with the bearing of trend of substrate 110, as such, it is possible to increase further
The cooling surface area of radiator 100, such that it is able to improve the radiating effect of radiator 100 further.
In order to preferably install radiator 100, meanwhile, it is beneficial to optimize the structure of radiator 100, preferably improves heat radiation effect
Really, such as, Fig. 9 is referred to, two fixing radiating fins 130, several main radiating fins 140 and several auxiliary radiating fins
150 be fixedly installed after substrate 110 and form sector structure, the height of i.e. two fixing radiating fins 130, main radiating fin 140
Height and the height of auxiliary radiating fin 150 successively decrease successively, so, on the one hand can avoid main radiating fin 140 and auxiliary dissipate
Hot fin 150, to installing the interference that fixing radiating fin 130 produces, installs radiator by which better fixing radiating fin 130
100, at the same time it can also be play the effect of the structure optimizing radiator 100, preferably improve heat dispersion.
For more progressive the heat dispersion improving described radiator, such as, described radiator is metal heat sink, again
As, described radiator is alloy heat-sink device.And for example, described substrate is metal basal board, and and for example, described substrate is aluminium base, and for example,
Described radiating fin is copper sheet, and and for example, described substrate is identical with described radiating fin material or different setting.And for example, described scattered
Hot fin specifically includes described fixing radiating fin, described main radiating fin and described auxiliary radiating fin, and for example, described fixing
Radiating fin, described main radiating fin and described auxiliary radiating fin material be identical or different setting.And for example, some described heat radiations
Several thermal vias are offered on radiating fin described in fin.And for example, between several described thermal vias, radiating wire is set.
And for example, described radiating wire forms network structure.
Such as, the radiator of an embodiment includes each component of following mass percent:
Silicon 0.4 part～0.5 part, ferrum 0.5 part～0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.4 part of manganese, 2.1 parts of magnesium
～2.9 parts, chromium 0.18 part～0.28 part, 5.1 parts～6.1 parts of zinc, titanium 0.2 part～0.3 part and the aluminum of surplus.It is appreciated that
By using zinc and the magnesium of above-mentioned mass percent, the strengthening significant MgZn2 of effect can be formed so that the heat treatment effect of radiator
Fruit is far better than a zinc bianry alloy, and tensile strength will be greatly improved, and stress corrosion resistant and anti-strip are corroded
Ability also can increase, heat-conductive characteristic is the biggest, i.e. the good heat dispersion performance of radiator.
Referring to Fig. 9, substrate 110 is away from two heat radiations 120, two fixing radiating fins 130 of wing plate, several main heat radiations
The one side of fin 140 and several auxiliary radiating fins 150 arranges several installation positions 111 and fixed bit 113.Installation position
111 are used for installing LED chip 200, and such as, each described LED chip is correspondingly arranged installation position described in.Fixed bit 113 is used for
Scatter plate 300 is installed.
In order to preferably be arranged on LED chip and protect LED chip, such as, described installation position is hemispherical, described
LED chip is arranged on the side of described substrate, and described LED chip is fixed and is placed in described installation position, as such, it is possible to
Preferably it is arranged on LED chip and protects LED chip.
In order to increase the radiating effect of substrate 110 further, such as, refer to Fig. 9, substrate 110 arranges some through holes
112, through hole 112 can increase the cooling surface area of substrate 110, and substrate 110 is positioned at the side being provided with LED chip 200
Relatively warm air can expand via through holes 112 by own vol and flow into two fixing heat radiations of heat radiation wing plates 120, two are installed
Fin 130, several main radiating fins 140 and the opposite side of several auxiliary radiating fins 150, so, by above-mentioned cold and hot
Air circulation, can increase the radiating effect of substrate 110 further.
In order to further increase the radiating effect of substrate 110, take away the heat that LED chip 200 produces, example more quickly
As, referring to Fig. 9, through hole 112 is arranged in array, and installation position 111 is arranged in array.And for example, each installation position 111 is arranged at four
The center of the rectangle that individual through hole 112 surrounds.And for example, the aperture of through hole 112 be installation position 111 spacing 20% to 10%.Again
As, the aperture of through hole 112 is less than the spacing of installation position 111.
In order to further increase the radiating effect of substrate 110, such as, refer to Fig. 9, two adjacent substrates 110 it
Between form a radiating groove 115, radiating groove 115 is beneficial to cross-ventilation heat transfer, as such, it is possible to further increase dissipating of substrate 110
Thermal effect.
Please refer to Fig. 9 and Figure 10, scatter plate 300 is fixedly installed on substrate 110 by fixed bit 112, and LED
Chip 200 is between substrate 110 and scatter plate 300, outside the light that LED chip 200 is launched exposes to through scatter plate 300
Portion.Such as, the both sides of scatter plate 300 are provided with strip bulge portion 310, and strip bulge portion 310 is fixedly installed on substrate 110,
And for example, strip bulge portion 310 offers several fixing holes 311, be used for fixing scatter plate 300 and substrate 110 are installed.
In order to preferably install fixing scatter plate, such as, described substrate has the first relative side and the second side,
Being provided with several installation positions and several fixed bits on described first side, some described radiating fins are arranged at described
On two side faces, and for example, described fixed bit is screw, and described scatter plate is spirally connected and is fixedly installed on described each described fixed bit, again
As, described fixed bit is cylinder, and described cylindrical height is 1 to 5 millimeter, and and for example, described cylinder is copper post, described copper
Post is bolted in and is fixed on described substrate, and and for example, described copper post is bolted in described scatter plate away from one end of described substrate, and
Described scatter plate contacts with described substrates into intimate.
Above-mentioned have the LED lamp 50 of flat radiator by LED chip 200 being set directly on radiator 100,
Structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, phase
To tradition in traditional LED lamp, need to set up heat abstractor, the above-mentioned LED lamp 50 with flat radiator at shell
Radiator 100 can directly use as shell, and have fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, becomes
This is relatively low.
It should be noted that other embodiments of the present invention also include, the technical characteristic in the various embodiments described above is mutually tied
Close the LED lamp with flat radiator that formed, that can implement, as such, it is possible to reach good heat dissipation effect, structure relatively
Simple and flat technique effect.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that, for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a LED lamp with flat radiator, it is characterised in that including: flat radiator and several LED
Chip；
Described flat radiator arranges several installation positions；
Described flat radiator includes several heat-conducting substrates, two heat radiation wing plates, two fixing radiating fins, several masters
Radiating fin and several auxiliary radiating fins, several heat-conducting substrates described are spaced successively and are fixedly installed on described fixing heat radiation
Fin, described main radiating fin and a side of described heat radiation wing plate, described auxiliary radiating fin is arranged at described heat radiation wing plate
On, a side of described heat radiation wing plate is fixedly installed on the end, one end of several described heat-conducting substrates, and described radiating wing
Plate forms angle with the plane at several described heat-conducting substrate places, and the angle of described angle is 30 degree to 90 degree, described heat conduction
Substrate away from two described heat radiation wing plates, two described fixing radiating fins, several described main radiating fins and several
The one side of described auxiliary radiating fin arranges several described installation positions；
Each described installation position correspondence installs LED chip described in；
Described flat radiator is metal flat flat radiator；
On described flat radiator, some through holes are set；
Wherein, described flat radiator includes each component of following mass percent: silicon 0.4 part～0.5 part, ferrum 0.5 part～
0.6 part, copper 0.05 part～0.3 part, 0.3 part～0.4 part of manganese, 2.1 parts～2.9 parts of magnesium, chromium 0.18 part～0.28 part, 5.1 parts of zinc
～6.1 parts, titanium 0.2 part～0.3 part and the aluminum of surplus.
The LED lamp with flat radiator the most according to claim 1, it is characterised in that described through hole is array
Arrange.
The LED lamp with flat radiator the most according to claim 2, it is characterised in that described installation position is battle array
Row are arranged.
The LED lamp with flat radiator the most according to claim 3, it is characterised in that each described installation position
It is arranged at the center of the rectangle that four described through holes surround.
The LED lamp with flat radiator the most according to claim 4, it is characterised in that the aperture of described through hole
Spacing less than described installation position.
The LED lamp with flat radiator the most according to claim 5, it is characterised in that the aperture of described through hole
For the spacing of described installation position 20% to 40%.
The LED lamp with flat radiator the most according to claim 1, it is characterised in that described installation position is half
Spherical.
The LED lamp with flat radiator the most according to claim 7, it is characterised in that described LED chip is arranged
On the side of described flat radiator, and it is installed in described installation position.
9. according to the arbitrary described LED lamp with flat radiator of claim 1 to 8, it is characterised in that also include one
Scatter plate, described scatter plate is fixedly installed on described flat radiator, and the light that described LED chip is launched is through institute
State scatter plate.
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| CN201410453301.XA CN104180350B (en) | 2014-09-05 | 2014-09-05 | LED (Light Emitting Diode) lamp with flat type radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3695438A4 (en) * | 2017-10-10 | 2021-07-14 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105927951A (en) * | 2016-06-28 | 2016-09-07 | 储世昌 | Combined type radiator for high-power LED lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852355A (en) * | 2010-06-17 | 2010-10-06 | 浙江大学 | 3D heat dissipation modular high-power LED lighting device |
| CN102260810A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | Novel light emitting diode (LED) radiator base material |
| CN202629987U (en) * | 2012-05-21 | 2012-12-26 | 宣炯华 | Radiator of light emitting diode (LED) lamp |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084726Y (en) * | 2007-05-24 | 2008-07-09 | 北京四方吉思电气有限公司 | Heat radiator |
| KR20130027377A (en) * | 2011-09-07 | 2013-03-15 | 소닉스자펜 주식회사 | Led light with high heat radiating property |
| CN202521556U (en) * | 2012-03-07 | 2012-11-07 | 广州虎辉照明科技公司 | LED (Light Emitting Diode) lamp radiator assembly |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260810A (en) * | 2010-05-24 | 2011-11-30 | 薛洪春 | Novel light emitting diode (LED) radiator base material |
| CN101852355A (en) * | 2010-06-17 | 2010-10-06 | 浙江大学 | 3D heat dissipation modular high-power LED lighting device |
| CN202629987U (en) * | 2012-05-21 | 2012-12-26 | 宣炯华 | Radiator of light emitting diode (LED) lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3695438A4 (en) * | 2017-10-10 | 2021-07-14 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
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