CN104197220B - The LED lamp of integral type - Google Patents

The LED lamp of integral type Download PDF

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Publication number
CN104197220B
CN104197220B CN201410453284.XA CN201410453284A CN104197220B CN 104197220 B CN104197220 B CN 104197220B CN 201410453284 A CN201410453284 A CN 201410453284A CN 104197220 B CN104197220 B CN 104197220B
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radiator
led lamp
substrate
heat
several
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CN104197220A (en
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叶伟炳
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Dongguan Wenyu Industrial Co Ltd
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Dongguan Wenyu Industrial Co Ltd
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Abstract

The present invention relates to the LED lamp of a kind of integral type, including: radiator, several LED chip and scatter plate.Radiator includes substrate and some radiating fins, and substrate has the first relative side and the second side, and the first side is provided with installation position and fixed bit, and radiating fin is arranged on the second side;Each LED chip correspondence is installed on an installation position.Scatter plate is fixedly installed on substrate by each fixed bit.The LED lamp of above-mentioned integral type is by being set directly at LED chip on radiator, and structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, the radiator of the LED lamp of above-mentioned integral type can directly use as shell, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively low.

Description

The LED lamp of integral type
Technical field
The present invention relates to LED lamp heat sink field, particularly relate to the LED lamp of a kind of integral type.
Background technology
LED (Light Emitting Diode, light emitting diode), it can directly and efficiently convert electrical energy into Visible ray, and having up to tens thousand of hours~the service life of 100,000 hours, thus be widely used in view, The fields such as safety, special type and general lighting, market potential is beyond measure.
The basic structure of LED is the P N knot of a quasiconductor, when electric current flows through LED element, P N The temperature of knot will rise, and the temperature in P N interface is referred to as the junction temperature of LED, is typically due to element chip equal There is the least size, therefore, also the temperature of LED chip is called the junction temperature of LED chip.
The LED lamp using LED to make is referred to as the most frequently used with the advantage such as of fine quality, durable, energy-conservation Lighting.
But, the drawback that LED lamp self exists is that LED lamp light efficiency is by the shadow of the junction temperature of LED Ringing relatively big, higher junction temperature of chip will cause light efficiency to occur being decreased obviously, and influence whether making of LED lamp Use the life-span.Owing to LED is when luminescence, the temperature of himself can constantly raise, in lasting illumination work In, if the heat that LED produces can not exhale in time, it will cause the damage of LED, impact The service life of LED.Therefore, the heat dissipation problem of LED is solved for promoting the performance of LED extremely Close important.
For the problems referred to above, the heat energy produced during LED luminescence is typically directly delivered to aluminum by some LED lamp Alloy or various metal shell dispel the heat, or by heat conductive silica gel transferring heat energy, thus when reducing LED illumination The high temperature produced, reduces LED light and declines, extend LED illumination service life.
But, for the LED lamp that luminous power is bigger, due to radiating effect and the heat conduction of shell The heat-conducting effect of silica gel is poor can not meet cooling requirements, therefore produces when can not well realize reducing LED illumination Raw high temperature.If other heat abstractor of setting up again is on shell, then can increase manufacture difficulty, and cost is the most relatively High.
Summary of the invention
Based on this, it is necessary to provide a kind of good heat dissipation effect, structure relatively simple and there is integral structure The LED lamp of integral type.
A kind of LED lamp of integral type, comprising: radiator, several LED chip and scatter plate;
Described radiator includes substrate and some radiating fins, described substrate have the first relative side with And second side, described first side is provided with several installation positions and several fixed bits, Ruo Gansuo State radiating fin to be arranged on described second side;
Each described LED chip correspondence is installed on installation position described in;
Described scatter plate is fixedly installed on described substrate by each described fixed bit;
Described substrate is metal basal board.
In one of them embodiment, described fixed bit is screw, described scatter plate be spirally connected be fixedly installed on described On each described fixed bit.
In one of them embodiment, described fixed bit is cylinder.
In one of them embodiment, described cylindrical height is 1 to 5 millimeter.
In one of them embodiment, described cylinder is copper post.
In one of them embodiment, described copper post is bolted in and is fixed on described substrate.
In one of them embodiment, described copper post is bolted in described scatter plate away from one end of described substrate, and And described scatter plate contacts with described substrates into intimate.
In one of them embodiment, described substrate is aluminium base, and described radiating fin is copper sheet.
In one of them embodiment, some described radiating fins are arranged at intervals on described second side successively.
In one of them embodiment, described radiating fin offers several thermal vias.
The LED lamp of above-mentioned integral type is by being set directly at LED chip on radiator, and structure is relatively simple, Achieving integral structure, radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, Relatively conventional in traditional LED lamp, need to set up heat abstractor, the LED of above-mentioned integral type at shell The radiator of tool can directly use as shell, and has fabulous heat conduction and radiating effect, manufactures difficulty Spending relatively low, cost is relatively low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp of an embodiment of the present invention;
Fig. 2 is the structural representation of the LED lamp with flat radiator of an embodiment of the present invention;
Fig. 3 is the structural representation of the flat radiator shown in Fig. 2;
Fig. 4 is the structural representation of the other direction of the flat radiator shown in Fig. 3;
Fig. 5 is the structural representation in the another direction of the flat radiator shown in Fig. 2;
Fig. 6 is the structural representation of the LED lamp with panel radiator of an embodiment of the present invention;
Fig. 7 is the structural representation of the aluminium base shown in Fig. 6;
Fig. 8 is the structural representation of the thermal column shown in Fig. 6;
Fig. 9 is the structural representation of the LED lamp of the integral type of an embodiment of the present invention;
Figure 10 is the structural representation of the scatter plate shown in Fig. 9.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, the most right The detailed description of the invention of the present invention is described in detail.Elaborate in the following description a lot of detail with It is easy to fully understand the present invention.But the present invention can come real to be a lot different from alternate manner described here Executing, those skilled in the art can do similar improvement in the case of intension of the present invention, therefore this Bright do not limited by following public specific embodiment.
Referring to Fig. 1, the LED lamp 10 of integral type includes radiator 70, several LED chip 80 And scatter plate 90.Several LED chip 80 and scatter plate 90 are installed on radiator 70, logical Crossing and directly arrange on radiator 70 by LED chip 80, radiating effect is preferable, can meet high-power LED Light fixture uses.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, on The radiator 70 stating LED lamp 10 can directly use as shell, and have fabulous heat conduction and dissipate Thermal effect, manufacture difficulty is relatively low, and cost is relatively low.
It is specific embodiment part below.
Embodiment 1
Referring to Fig. 2, the LED lamp of integral type is the LED lamp 20 with flat radiator, its bag Include flat radiator 400, several LED chip (Chip) 500 and scatter plate 200.Several LED chip 500 and scatter plate 200 are respectively provided with on flat radiator 400.By by LED chip 500 Directly arranging on flat radiator 400, radiating effect is preferable, can meet high-power LED light fixture and make With.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, above-mentioned flat The flat radiator 400 of the LED lamp 20 of formula radiator can directly use as shell, and has Fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
Referring to Fig. 3 to Fig. 5, it is the knot of three different directions of the flat radiator 400 shown in Fig. 2 Structure schematic diagram.Flat radiator 400 includes several heat-conducting substrates 410, two heat radiation wing plate 420, two Individual fixing radiating fin 430, several main radiating fins 440 and several auxiliary radiating fins 450.Heat radiation Wing plate 420, fixing radiating fin 430 and main radiating fin 440 are all fixedly installed on heat-conducting substrate 410, Auxiliary radiating fin 450 is arranged on heat radiation wing plate 420.And for example, heat-conducting substrate 410, two heat radiation wing plate 420, two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450 Be formed in one structure.Wherein, as shown in Figure 3, Figure 4, the flat design of heat-conducting substrate 410, such as, Its thickness is 3 to 5 millimeters, as such, it is possible to effectively reduce the integral thickness of flat radiator 400, reaches To overall flat effect.
Several heat-conducting substrates 410 are spaced successively and are fixedly installed on fixing radiating fin 430, main radiating fin 440 and heat radiation wing plate 420 a side, say, that the bearing of trend of several heat-conducting substrates 410 put down OK, fixing radiating fin 430, main radiating fin 440 and the bearing of trend of heat radiation wing plate 420 and heat conduction base The bearing of trend of plate 410 vertical, as such, it is possible to improve the hollow out degree of flat radiator 400, just In being internally formed more heat-dissipating space at flat radiator 400, thus improve flat radiator 400 Cooling surface area, and then improve the radiating effect of flat radiator 400.
In order to increase the cooling surface area of flat radiator 400, meanwhile, it is beneficial to flow through both sides heat radiation wing plate The cooler air of 420 is taken away heat-conducting substrate 410 and is passed to the heat of heat radiation wing plate 420, forms cross-ventilation and passes Heat, such that it is able to improve the radiating effect of flat radiator 400 further, such as, refers to Fig. 3, dissipates One side of hot wing plate 420 is fixedly installed on the end, one end of several heat-conducting substrates 410, and radiating wing Plate 420 forms angle with the plane at several heat-conducting substrate 410 places, and such as, the angle of described angle is 30 degree to 90 degree.It is appreciated that a heat radiation wing plate 420 inclined direction of side away from heat-conducting substrate 410 Stretch into extraneous air, as such, it is possible to increase the cooling surface area of flat radiator 400, additionally, also profit Take away heat-conducting substrate 410 in the cooler air flowing through both sides heat radiation wing plate 420 and pass to the wing plate 420 that dispels the heat Heat, forms cross-ventilation heat transfer, such that it is able to improve the radiating effect of flat radiator 400 further. And for example, heat radiation wing plate 420 is square platy structure, and and for example, heat radiation wing plate 420 is arc platy structure.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 4, some Individual auxiliary radiating fin 450 is spaced successively and is fixedly installed on heat radiation wing plate 420, several auxiliary radiating fins 450 Bearing of trend identical, and the prolonging of the bearing of trend of several auxiliary radiating fins 450 and heat-conducting substrate 410 Stretch the vertical of direction, as such, it is possible to increase the cooling surface area of flat radiator 400 further, thus The radiating effect of flat radiator 400 can be improved further.
In order to preferably install flat radiator 400, such as, refer to Fig. 5, fixing radiating fin 430 A side be fixedly installed on the medium position of several heat-conducting substrates 410, fixing radiating fin 430 The bending of another side edge arranges buckle installation portion 431, and so, flat radiator 400 can pass through buckle Installation portion 431 is directly installed on outside support, such that it is able to preferably install flat radiator 400.Example As, it is arranged on floor body of wall.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 5, main scattered One side of hot fin 440 is fixedly installed on two side positions of several heat-conducting substrates 410, and several are main The bearing of trend of radiating fin 440 is identical, and the bearing of trend of several main radiating fins 440 and heat conduction The bearing of trend of substrate 410 vertical, as such, it is possible to increase the heat radiation of flat radiator 400 further Surface area, such that it is able to improve the radiating effect of flat radiator 400 further.
In order to preferably install flat radiator 400, meanwhile, it is beneficial to optimize the knot of flat radiator 400 Structure, preferably improves radiating effect, such as, refers to Fig. 5, two fixing radiating fins 430, several Main radiating fin 440 and several auxiliary radiating fins 450 form sector after being fixedly installed heat-conducting substrate 410 Structure, the height of i.e. two fixing radiating fins 430, the height of main radiating fin 440 and auxiliary radiating fin The height of sheet 450 successively decreases successively, so, on the one hand can avoid main radiating fin 440 and auxiliary radiating fin Sheet 450, to installing the interference that fixing radiating fin 430 produces, is pacified by which better fixing radiating fin 430 Fill flat radiator 400, at the same time it can also be play the effect of the structure optimizing flat radiator 400, Preferably improve heat dispersion.
For more progressive the heat dispersion improving described flat radiator, such as, described flat heat radiation Device is metal flat flat radiator, and and for example, described flat radiator is the flat radiator of alloy.
Such as, the flat radiator of an embodiment includes each component of following mass percent:
Silicon 0.4 part~0.5 part, ferrum 0.5 part~0.6 part, copper 0.05 part~0.3 part, 0.3 part~0.4 part of manganese, magnesium 2.1 parts~2.9 parts, chromium 0.18 part~0.28 part, 5.1 parts~6.1 parts of zinc, titanium 0.2 part~0.3 part and surplus Aluminum.It is appreciated that zinc and the magnesium by using above-mentioned mass percent, strengthening effect can be formed significant MgZn2 so that the thermal effectiveness of flat radiator is far better than a zinc bianry alloy, and tensile strength will Can be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat conductivity Can be the biggest, the good heat dispersion performance of the most flat radiator.
Refer to Fig. 2, heat-conducting substrate 410 away from two heat radiation 420, two fixing radiating fins 430 of wing plate, The one side of several main radiating fins 440 and several auxiliary radiating fins 450 arranges several installation positions 411, it is used for LED chip 500 is installed.
In order to preferably be arranged on LED chip and protect LED chip, such as, described installation position is hemisphere Shape, described LED chip is arranged on the side of described heat-conducting substrate, and described LED chip is fixing accommodating In described installation position, as such, it is possible to be preferably arranged on LED chip and protect LED chip.
In order to increase the radiating effect of heat-conducting substrate 410 further, such as, refer to Fig. 2, heat-conducting substrate Arranging some through holes 412 on 410, through hole 412 can increase the cooling surface area of heat-conducting substrate 410, and Heat-conducting substrate 410 is positioned at the relatively warm air of the side being provided with LED chip 500 can be swollen by own vol Swollen via through holes 412 flows into and is provided with two heat radiation 420, two fixing radiating fins 430 of wing plate, several masters Radiating fin 440 and the opposite side of several auxiliary radiating fins 450, so, by above-mentioned air Circulation, can increase the radiating effect of heat-conducting substrate 410 further.
In order to further increase the radiating effect of heat-conducting substrate 410, take away LED chip 500 more quickly The heat produced, such as, refers to Fig. 2, and through hole 412 is arranged in array, and installation position 411 is arranged in array. And for example, each installation position 411 is arranged at the center of the rectangle that four through holes 412 surround.And for example, through hole 412 The spacing that aperture is installation position 411 20% to 40%.And for example, the aperture of through hole 412 is less than installation position The spacing of 411.
Referring to Fig. 2, scatter plate 200 is fixedly installed on heat-conducting substrate 410, and LED chip 500 Between heat-conducting substrate 410 and scatter plate 200, the light that LED chip 500 is launched is through scatter plate 200 Expose to outside.
Above-mentioned have the LED lamp 20 of flat radiator by being set directly at flat by LED chip 500 On flat radiator 400, structure is simpler, it is achieved that integral structure, and radiating effect is preferable, Ke Yiman Foot high-power LED light fixture uses.Additionally, relatively conventional in traditional LED lamp, need to increase at shell If heat abstractor, the flat radiator 400 of the above-mentioned LED lamp 20 with flat radiator is permissible Directly using as shell, and have fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively Low.
Embodiment 2
Referring to Fig. 6 and Fig. 7, the LED lamp of integral type is the LED lamp 30 with panel radiator, It includes panel radiator 700, several LED chip 800 and scatter plate 900.Several LED core Sheet 800 and scatter plate 900 are respectively provided with on panel radiator 700.By LED chip 800 is directly set Putting on panel radiator 700, radiating effect is preferable, can meet high-power LED light fixture and use.Additionally, Relatively conventional in traditional LED lamp, need to set up heat abstractor, the LED of above-mentioned panel radiator at shell The panel radiator 700 of light fixture 30 can directly use as shell, and has fabulous heat conduction and heat radiation Effect, manufacture difficulty is relatively low, and cost is relatively low
Referring to Fig. 6, panel radiator 700 includes 710, two heat-dissipating fins 720 of an aluminium base, some Individual fixing thermal column 730, several main thermal columns 740 and several auxiliary thermal columns 750.Heat-dissipating fin 720, Fixing thermal column 730 and main thermal column 740 are all fixedly installed on aluminium base 710, auxiliary thermal column 750 It is arranged on heat-dissipating fin 720.
Several fixing thermal columns 730 are arranged in array on aluminium base 710, and such as, several are fixing scattered Plume 730 is distributed and is arranged on aluminium base 710 in two rows, and the often line of fixing thermal column 730 in row For straight line.Several main thermal columns 740 are arranged in array on aluminium base 710, and such as, several are main scattered Plume 740 is arranged on aluminium base 710 in some rows, and often the line of main thermal column 740 in row is straight Line.Several auxiliary thermal columns 750 are arranged in array on heat-dissipating fin 720, such as, and several auxiliary heat radiations Post 750 is arranged on heat-dissipating fin 720 in some rows, and often the line of auxiliary thermal column 750 in row is straight line. As such, it is possible to improve the hollow out degree of panel radiator 700, it is simple to be internally formed at panel radiator 700 More heat-dissipating space, thus improve the cooling surface area of panel radiator 700, and then improve plate type radiator The radiating effect of device 700.
In order to increase the cooling surface area of panel radiator 700, meanwhile, it is beneficial to flow through both sides heat-dissipating fin 720 Cooler air take away aluminium base 710 and pass to the heat of heat-dissipating fin 720, form cross-ventilation heat transfer, Such that it is able to improve the radiating effect of panel radiator 700 further, such as, refer to Fig. 6, heat-dissipating fin One side of 720 is fixedly installed on a side of aluminium base 710, and heat-dissipating fin 720 and aluminium base 710 The plane at place forms angle, and such as, the angle of described angle is 30 degree to 90 degree.It is appreciated that scattered Hot fin 720 stretches into extraneous air away from an inclined direction of side of aluminium base 710, as such, it is possible to increase Add the cooling surface area of panel radiator 700, additionally, be additionally favorable for flowing through the colder of both sides heat-dissipating fin 720 Air is taken away aluminium base 710 and is passed to the heat of heat-dissipating fin 720, forms cross-ventilation heat transfer, thus can To improve the radiating effect of panel radiator 700 further.And for example, heat-dissipating fin 720 is square lamellar knot Structure, and for example, heat-dissipating fin 720 is arc-shaped flaky structure.
In order to increase the cooling surface area of panel radiator 700 further, such as, refer to Fig. 6, several Auxiliary thermal column 750 is spaced successively and is fixedly installed on heat-dissipating fin 720, and for example, and several auxiliary thermal columns 750 Being arranged in array on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 arrange heat radiation in some rows On fin 720, and often the line of auxiliary thermal column 750 in row is straight line.As such, it is possible to increase further The cooling surface area of panel radiator 700, such that it is able to improve the heat radiation effect of panel radiator 700 further Really.
For preferably mounting plate type radiator 700, such as, refer to Fig. 6, several fixing thermal columns 730 Being arranged in array on aluminium base 710, such as, several fixing thermal columns 730 are distributed and are arranged in two rows On aluminium base 710, and often the line of fixing thermal column 730 in row is straight line.And for example, fixing thermal column One end of 730 is fixedly installed on the medium position of several aluminium bases 710, fixes thermal column 730 another The bending of end end arranges buckle installation portion 731, and so, panel radiator 700 can pass through buckle installation portion 731 are directly installed on outside support, such that it is able to preferably mounting plate type radiator 700.Such as, install On floor body of wall.
In order to increase the cooling surface area of panel radiator 700 further, such as, Fig. 6, main heat radiation are referred to One end of post 740 is fixedly installed on two side positions of several aluminium bases 710, and and for example, several are main scattered Plume 740 is arranged in array on aluminium base 710, and such as, several main thermal columns 740 set in some rows Put on aluminium base 710, and often the line of main thermal column 740 in row is straight line, as such, it is possible to enter one Step increases the cooling surface area of panel radiator 700, such that it is able to improve panel radiator 700 further Radiating effect.
For preferably mounting plate type radiator 700, meanwhile, it is beneficial to optimize the structure of panel radiator 700, Preferably improve radiating effect, such as, refer to Fig. 6, two fixing thermal columns 730, several main heat radiations Post 740 and several auxiliary thermal columns 750 are fixedly installed after aluminium base 710 and form bow-shaped structural, so, On the one hand main thermal column 740 and auxiliary thermal column 750 can be avoided installing what fixing thermal column 730 produced Interference, by which better fixing thermal column 730 mounting plate type radiator 700, at the same time it can also be play optimization The effect of the structure of panel radiator 700, preferably improves heat dispersion.
In order to further improve the heat dispersion of described panel radiator, such as, described panel radiator For metal plate type radiator, and for example, described panel radiator is alloy plate type radiator.
Such as, the panel radiator of an embodiment includes each component of following mass percent:
Silicon 0.7 part~0.5 part, ferrum 0.5 part~0.6 part, copper 0.05 part~0.3 part, 0.3 part~0.7 part of manganese, magnesium 2.1 parts~2.9 parts, chromium 0.18 part~0.28 part, 5.1 parts~6.1 parts of zinc, titanium 0.2 part~0.3 part and surplus Aluminum.It is appreciated that zinc and the magnesium by using above-mentioned mass percent, strengthening effect can be formed significant MgZn2 so that the thermal effectiveness of panel radiator is far better than a zinc bianry alloy, and tensile strength will It is greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic The biggest, i.e. the good heat dispersion performance of panel radiator.
And for example, described aluminium base is identical with described thermal column material or different setting, and for example, and described aluminum base Plate is aluminium alloy base plate, and described thermal column is copper post.And for example, described thermal column specifically includes described fixing scattered Plume, described main thermal column and described auxiliary thermal column.
In order to further enhance the radiating effect of described thermal column, such as, described thermal column is copper post, and for example, Described copper post is hollow tubular structure, and for example, refers to Fig. 8, the sidewall of copper post 900a offers some Individual louvre 910a.And for example, 2 times to 5 times of the thickness that height is described aluminium base of described copper post;Example As described in the height of described copper post is 3.2 times of the thickness of aluminium base.And for example, described thermal column is that array is arranged. As such, it is possible to increase the radiating effect strengthening described thermal column further.
Please refer to Fig. 6 and Fig. 7, aluminium base 710 away from two heat-dissipating fins 720, several fixing dissipate The one side of plume 730, several main thermal columns 740 and several auxiliary thermal columns 750 arranges several peaces Dress position 711, is used for installing LED chip 800.
In order to preferably install LED chip and protect LED chip, such as, described installation position is hemispherical, Described LED chip is arranged on the side of described aluminium base, and described LED chip fixing be placed in described In installation position, as such, it is possible to be preferably arranged on LED chip and protect LED chip.
In order to increase the radiating effect of aluminium base 710 further, such as, Fig. 7 is referred to, on aluminium base 710 Arranging some through holes 712, through hole 712 can increase the cooling surface area of aluminium base 710, and aluminium base 710 relatively warm air being positioned at the side being provided with LED chip 800 can expand via through holes by own vol 712 inflows are provided with two heat-dissipating fins 720, several fixing thermal columns 730, several main thermal columns 740 And the opposite side of several auxiliary thermal columns 750, so, by above-mentioned air's circulation, permissible Increase the radiating effect of aluminium base 710 further.
In order to further increase the radiating effect of aluminium base 710, take away LED chip 800 more quickly and produce Raw heat, such as, refers to Fig. 7, and through hole 712 is arranged in array, and installation position 711 is arranged in array. And for example, each installation position 711 is arranged at the center of the rectangle that four through holes 712 surround.And for example, through hole 712 The spacing that aperture is installation position 711 30% to 70%.And for example, the aperture of through hole 712 is less than installation position The spacing of 711.
Referring to Fig. 6, scatter plate 900 is fixedly installed on aluminium base 710, and LED chip 800 is positioned at Between aluminium base 710 and scatter plate 900, the light that LED chip 800 is launched shines through scatter plate 900 It is incident upon outside.
Such as, described panel radiator is provided with several installation positions and several thermal columns;Described plate Formula radiator includes that aluminium base and thermal column, described aluminium base have the first relative side and the second side Face, described installation position is positioned on described first side, and described thermal column is arranged on described second side.Again As, each described installation position correspondence installs LED chip described in;Described installation position is that array is arranged.Described The radius of copper post is the 10% to 20% of the spacing of described installation position.And for example, described scatter plate is fixedly installed on On described first side of described aluminium base, and the light that described LED chip is launched is through described scatter plate.
Above-mentioned have the LED lamp 30 of panel radiator by being set directly at board-like by LED chip 800 On radiator 700, structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet big The LED lamp of power uses.Additionally, relatively conventional in traditional LED lamp, needs are set up scattered at shell Thermal, the panel radiator 700 of the above-mentioned LED lamp 30 with panel radiator can directly as Shell uses, and has fabulous heat conduction and radiating effect, and manufacture difficulty is relatively low, and cost is relatively low.
Embodiment 3
Referring to Fig. 9, the LED lamp 50 of integral type includes radiator 100, several LED chip 200 And scatter plate 300.Several LED chip 200 and scatter plate 300 are respectively provided with on radiator 100. By directly arranging on radiator 100 by LED chip 200, radiating effect is preferable, can meet high-power LED lamp use.Additionally, relatively conventional in traditional LED lamp, need to set up heat radiation dress at shell Putting, the radiator 100 of the LED lamp 20 of above-mentioned radiator can directly use as shell, and has Fabulous heat conduction and radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
Referring to Fig. 9, radiator 100 includes that several substrates 110, two heat radiation wing plate 120, two is solid Determine radiating fin 130, several main radiating fins 140 and several auxiliary radiating fins 150.Heat radiation wing plate 120, fixing radiating fin 130 and main radiating fin 140 are all fixedly installed on substrate 110, auxiliary heat radiation Fin 150 is arranged on heat radiation wing plate 120.
Several substrates 110 be spaced successively be fixedly installed on fixing radiating fin 130, main radiating fin 140 with And a side of heat radiation wing plate 120, say, that the bearing of trend of several substrates 110 is parallel, fixing The bearing of trend of radiating fin 130, main radiating fin 140 and heat radiation wing plate 120 and the extension of substrate 110 Direction vertical, as such, it is possible to improve the hollow out degree of radiator 100, it is simple to inside radiator 100 Form more heat-dissipating space, thus improve the cooling surface area of radiator 100, and then improve radiator 100 Radiating effect.
In order to increase the cooling surface area of radiator 100, meanwhile, it is beneficial to flow through both sides heat radiation wing plate 120 Cooler air is taken away substrate 110 and is passed to the heat of heat radiation wing plate 120, forms cross-ventilation heat transfer, thus The radiating effect of radiator 100 can be improved further, such as, refer to Fig. 9, the one of heat radiation wing plate 120 Side is fixedly installed on the end, one end of several substrates 110, and dispel the heat wing plate 120 and several substrates The plane at 110 places forms angle, and such as, the angle of described angle is 30 degree to 90 degree.It is appreciated that Heat radiation wing plate 120 stretches into extraneous air away from an inclined direction of side of substrate 110, as such, it is possible to increase Add the cooling surface area of radiator 100, additionally, be additionally favorable for flowing through the cooler air of both sides heat radiation wing plate 120 Take away substrate 110 and pass to the heat of heat radiation wing plate 120, form cross-ventilation heat transfer, such that it is able to enter one Step improves the radiating effect of radiator 100.And for example, heat radiation wing plate 120 is square platy structure, and for example, Heat radiation wing plate 120 is arc platy structure.
In order to increase the cooling surface area of radiator 100 further, such as, referring to Fig. 9, several are auxiliary scattered Hot fin 150 is spaced successively and is fixedly installed on heat radiation wing plate 120, prolonging of several auxiliary radiating fins 150 Stretch direction identical, and the bearing of trend of the bearing of trend of several auxiliary radiating fins 150 and substrate 110 Vertically, as such, it is possible to increase the cooling surface area of radiator 100 further, such that it is able to improve further The radiating effect of radiator 100.
In order to preferably install radiator 100, such as, refer to Fig. 9, the side of fixing radiating fin 130 While be fixedly installed on the medium position of several substrates 110, another side limit of fixing radiating fin 130 Edge bending arranges buckle installation portion 131, and so, radiator 100 directly can be pacified by buckle installation portion 131 It is contained on outside support, such that it is able to preferably install radiator 100.Such as, it is arranged on floor body of wall.
In order to increase the cooling surface area of radiator 100 further, such as, Fig. 9, main radiating fin are referred to One side of 140 is fixedly installed on two side positions of several substrates 110, several main radiating fins 140 Bearing of trend identical, and the extension side of the bearing of trend of several main radiating fins 140 and substrate 110 To vertical, as such, it is possible to increase further the cooling surface area of radiator 100, such that it is able to further Improve the radiating effect of radiator 100.
In order to preferably install radiator 100, meanwhile, it is beneficial to optimize the structure of radiator 100, preferably carries High radiating effect, such as, refers to Fig. 9, two fixing radiating fins 130, several main radiating fins 140 And several auxiliary radiating fins 150 are fixedly installed formation sector structure after substrate 110, i.e. two fixing scattered The height of the height of hot fin 130, the height of main radiating fin 140 and auxiliary radiating fin 150 is passed successively Subtract, so, main radiating fin 140 and auxiliary radiating fin 150 on the one hand can be avoided installing fixing dissipating The interference that hot fin 130 produces, installs radiator 100 by which better fixing radiating fin 130, meanwhile, May also operate as optimizing the effect of the structure of radiator 100, preferably improve heat dispersion.
For more progressive the heat dispersion improving described radiator, such as, described radiator is heat dissipation metal Device, and for example, described radiator is alloy heat-sink device.And for example, described substrate is metal basal board, and for example, and institute Stating substrate is aluminium base, and and for example, described radiating fin is copper sheet, and for example, and described substrate and described radiating fin Sheet material is identical or different setting.And for example, described radiating fin specifically includes described fixing radiating fin, institute State main radiating fin and described auxiliary radiating fin, and for example, described fixing radiating fin, described main radiating fin Sheet and described auxiliary radiating fin material is identical or different setting.And for example, dissipate described in some described radiating fins Several thermal vias are offered on hot fin.And for example, between several described thermal vias, radiating wire is set. And for example, described radiating wire forms network structure.
Such as, the radiator of an embodiment includes each component of following mass percent:
Silicon 0.4 part~0.5 part, ferrum 0.5 part~0.6 part, copper 0.05 part~0.3 part, 0.3 part~0.4 part of manganese, magnesium 2.1 parts~2.9 parts, chromium 0.18 part~0.28 part, 5.1 parts~6.1 parts of zinc, titanium 0.2 part~0.3 part and surplus Aluminum.It is appreciated that zinc and the magnesium by using above-mentioned mass percent, strengthening effect can be formed significant MgZn2 so that the thermal effectiveness of radiator will obtain far better than a zinc bianry alloy, tensile strength Improving greatly, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic is the most relatively Greatly, i.e. the good heat dispersion performance of radiator.
Refer to Fig. 9, if substrate 110 is away from two heat radiation 120, two fixing radiating fins 130 of wing plate The one side of dry main radiating fin 140 and several auxiliary radiating fins 150 arranges several installation positions 111 And fixed bit 113.Installation position 111 is used for installing LED chip 200, such as, each described LED core Sheet is correspondingly arranged installation position described in.Fixed bit 113 is used for installing scatter plate 300.
In order to preferably be arranged on LED chip and protect LED chip, such as, described installation position is hemisphere Shape, described LED chip is arranged on the side of described substrate, and described LED chip is fixed and is placed in institute State in installation position, as such, it is possible to be preferably arranged on LED chip and protect LED chip.
In order to increase the radiating effect of substrate 110 further, such as, refer to Fig. 9, substrate 110 is arranged Some through holes 112, through hole 112 can increase the cooling surface area of substrate 110, and substrate 110 is positioned at peace Relatively warm air equipped with the side of LED chip 200 can expand via through holes 112 inflow peace by own vol If equipped with two heat radiation 120, two fixing radiating fins 130 of wing plate, several main radiating fins 140 and The opposite side of dry auxiliary radiating fin 150, so, by above-mentioned air's circulation, can enter one Step increases the radiating effect of substrate 110.
In order to further increase the radiating effect of substrate 110, take away LED chip 200 more quickly and produce Heat, such as, refer to Fig. 9, through hole 112 is arranged in array, and installation position 111 is arranged in array.Again As, each installation position 111 is arranged at the center of the rectangle that four through holes 112 surround.And for example, through hole 112 The spacing that aperture is installation position 111 20% to 10%.And for example, the aperture of through hole 112 is less than installation position The spacing of 111.
In order to further increase the radiating effect of substrate 110, such as, Fig. 9, two adjacent bases are referred to Forming a radiating groove 115 between plate 110, radiating groove 115 is beneficial to cross-ventilation heat transfer, as such, it is possible to more enter One step increases the radiating effect of substrate 110.
Please refer to Fig. 9 and Figure 10, scatter plate 300 is fixedly installed on substrate 110 by fixed bit 112 On, and LED chip 200 is between substrate 110 and scatter plate 300, and LED chip 200 is launched Light expose to outside through scatter plate 300.Such as, the both sides of scatter plate 300 are provided with strip bulge Portion 310, strip bulge portion 310 is fixedly installed on substrate 110, and for example, strip bulge portion 310 offers There are several fixing holes 311, are used for fixing scatter plate 300 and substrate 110 are installed.
In order to preferably install fixing scatter plate, such as, described substrate has the first relative side and Two side faces, described first side is provided with several installation positions and several fixed bits, some described scattered Hot fin is arranged on described second side, and and for example, described fixed bit is screw, and described scatter plate is spirally connected solid Surely being arranged on described each described fixed bit, and for example, described fixed bit is cylinder, described cylindrical height Degree is 1 to 5 millimeter, and and for example, described cylinder is copper post, and described copper post is bolted in and is fixed on described substrate On, and for example, described copper post is bolted in described scatter plate, and described scatter plate away from one end of described substrate Contact with described substrates into intimate.
The LED lamp 50 of above-mentioned integral type by LED chip 200 is set directly on radiator 100, Structure is simpler, it is achieved that integral structure, and radiating effect is preferable, can meet high-power LED light fixture Use.Additionally, relatively conventional in traditional LED lamp, need to set up heat abstractor at shell, above-mentioned one The radiator 100 of the LED lamp 50 of body formula can directly use as shell, and has fabulous heat conduction And radiating effect, manufacture difficulty is relatively low, and cost is relatively low.
It should be noted that other embodiments of the present invention also include, the technical characteristic in the various embodiments described above Be combined with each other formed, the LED lamp of integral type that is that can implement, as such, it is possible to reach radiating effect Good, structure is relatively simple and integral type technique effect.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended Claim is as the criterion.

Claims (10)

1. the LED lamp of an integral type, it is characterised in that including: radiator, several LED core Sheet and scatter plate;
Described radiator includes substrate and some radiating fins, described substrate have the first relative side with And second side, described first side is provided with several installation positions and several fixed bits, Ruo Gansuo Stating radiating fin to be arranged on described second side, wherein, described radiator includes following mass percent Each component: silicon 0.4 part~0.5 part, ferrum 0.5 part~0.6 part, copper 0.05 part~0.3 part, 0.3 part~0.4 part of manganese, 2.1 parts~2.9 parts of magnesium, chromium 0.18 part~0.28 part, 5.1 parts~6.1 parts of zinc, titanium 0.2 part~0.3 part and remaining The aluminum of amount;
Each described LED chip correspondence is installed on installation position described in;
Described scatter plate is fixedly installed on described substrate by each described fixed bit;
Described substrate is metal basal board.
LED lamp the most according to claim 1, it is characterised in that described fixed bit is screw, institute State scatter plate to be spirally connected and be fixedly installed on described each described fixed bit.
LED lamp the most according to claim 1, it is characterised in that described fixed bit is cylinder.
LED lamp the most according to claim 3, it is characterised in that described cylindrical height is 1 To 5 millimeters.
LED lamp the most according to claim 4, it is characterised in that described cylinder is copper post.
LED lamp the most according to claim 5, it is characterised in that described copper post is spirally connected and is fixed on On described substrate.
LED lamp the most according to claim 6, it is characterised in that described copper post is away from described substrate One end be bolted in described scatter plate, and described scatter plate contacts with described substrates into intimate.
8. according to the arbitrary described LED lamp of claim 1 to 7, it is characterised in that described substrate is aluminum Substrate, described radiating fin is copper sheet.
LED lamp the most according to claim 8, it is characterised in that some described radiating fins are successively It is arranged at intervals on described second side.
LED lamp the most according to claim 9, it is characterised in that offer on described radiating fin There are several thermal vias.
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CN109882749A (en) * 2019-03-05 2019-06-14 严伯勤 A kind of LED street lamp bulb shell and its production technology

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