CN111026251A - High-efficiency combined heat dissipation type CPU radiator - Google Patents

High-efficiency combined heat dissipation type CPU radiator Download PDF

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Publication number
CN111026251A
CN111026251A CN201911060482.9A CN201911060482A CN111026251A CN 111026251 A CN111026251 A CN 111026251A CN 201911060482 A CN201911060482 A CN 201911060482A CN 111026251 A CN111026251 A CN 111026251A
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China
Prior art keywords
heat
heat dissipation
fin group
cpu
water
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Pending
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CN201911060482.9A
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Chinese (zh)
Inventor
许晋维
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Suzhou Yongteng Electronic Product Co ltd
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Suzhou Yongteng Electronic Product Co ltd
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Priority to CN201911060482.9A priority Critical patent/CN111026251A/en
Publication of CN111026251A publication Critical patent/CN111026251A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a high-efficiency combined heat dissipation type CPU radiator, which comprises: a heat sink module, the heat sink module comprising: the heat absorption plate and the semiconductor refrigeration sheet; the heat radiating fin group is attached to the hot end of the semiconductor refrigerating fin, and a negative pressure heat radiating fan is assembled on the heat radiating fin group; a water-cooled circulation assembly, the water-cooled circulation assembly comprising: a water cooling tank, a circulating pump, and a circulating pipe. During operation, the heat that CPU during operation produced is absorbed through the absorber plate, the semiconductor refrigeration piece can absorb the heat that absorbs on the absorber plate from the cold junction fast and transmit the hot junction, make the heat on the CPU can dispel fast, and the radiating efficiency is improved, the heat is transmitted to the radiating fin group from the hot junction of semiconductor refrigeration piece afterwards, and carry the heat on the radiating fin group out through negative pressure radiator fan, absorb the heat on the radiating fin group through the circulating pipe simultaneously, and drive the coolant liquid circulation in water-cooling tank and the circulating pipe by the circulating pump, and further improved radiating efficiency and radiating effect.

Description

High-efficiency combined heat dissipation type CPU radiator
Technical Field
The invention relates to the technical field of radiators, in particular to a high-efficiency combined heat dissipation type CPU radiator.
Background
The CPU can generate a large amount of heat when working, if the heat is not dissipated in time, the heat is easy to cause a dead halt, and the CPU can be burnt out. The CPU heat sink is a device for dissipating heat from a CPU, and plays a decisive role in stable operation of the CPU. The existing CPU radiator usually adopts a heat pipe, air cooling or heat radiation plate form to radiate heat, the heat radiation effect is single, and the heat radiation effect is poor.
Disclosure of Invention
In order to solve the technical problems, the invention provides an efficient combined heat dissipation type CPU heat radiator which has the advantage of improving the heat dissipation effect.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an efficient combination heat dissipating CPU heat sink comprising:
a heat sink module, the heat sink module comprising: the semiconductor refrigeration device comprises a heat absorption plate and a semiconductor refrigeration piece, wherein the heat absorption plate is assembled with a CPU (central processing unit), and a cold end of the semiconductor refrigeration piece is attached to the heat absorption plate;
the heat radiating fin group is attached to the hot end of the semiconductor refrigerating sheet, and a negative pressure heat radiating fan is assembled on the heat radiating fin group;
a water-cooled circulation assembly, the water-cooled circulation assembly comprising: the cooling device comprises a water cooling tank arranged on one side of the radiating fin group, a circulating pump arranged in the water cooling tank and a circulating pipe arranged around the radiating fin group, wherein one end of the circulating pipe is connected to one side of the water cooling tank, and the other end of the circulating pipe is communicated with a water outlet pipe of the circulating pump.
Realize above-mentioned technical scheme, in operation, absorb the heat that the CPU during operation produced through the absorber plate, the semiconductor refrigeration piece can absorb the heat that absorbs on the absorber plate from the cold junction fast and transmit the hot junction, make the heat on the CPU can dispel fast, and the radiating efficiency is improved, the heat is transmitted to the radiating fin group from the hot junction of semiconductor refrigeration piece afterwards, and carry the heat on the radiating fin group out through negative pressure radiator fan, absorb the heat on the radiating fin group through the circulating pipe simultaneously, and drive the coolant liquid circulation in water-cooling tank and the circulating pipe by the circulating pump, and further improved radiating efficiency and radiating effect.
As a preferred scheme of the present invention, a heat conducting plate is fixedly disposed on a side of the heat absorbing plate away from the side assembled with the CPU, an installation groove is formed between adjacent heat conducting plates, a heat conducting pipe is disposed in the installation groove, and two ends of the heat conducting pipe extend to be attached to the heat dissipating fin group.
According to the technical scheme, the heat absorbed by the heat absorbing plate can be further directly transferred to the radiating fin group through the heat conduction pipe, and the radiating effect of the radiator is further improved.
As a preferable scheme of the invention, the four corners of the heat absorbing plate close to each other are provided with elastic connecting pieces.
According to the technical scheme, the heat absorbing plate and the CPU are conveniently assembled through the elastic connecting sheet.
As a preferable aspect of the present invention, the heat dissipating fin group includes: the semiconductor refrigeration device comprises a heat dissipation bottom plate used for being attached to the semiconductor refrigeration sheet and a plurality of heat dissipation sheets fixed on the heat dissipation bottom plate, wherein heat dissipation grooves are formed between every two adjacent heat dissipation sheets.
As a preferable scheme of the present invention, the circulation pipe is disposed in a reciprocating shape, and the circulation pipe is embedded in the heat dissipation groove and attached to the heat dissipation fins.
By adopting the technical scheme, the installation of the circulating pipe is convenient, and the heat absorption and radiation effects are better.
As a preferable scheme of the present invention, a water return tank is disposed on a side of the heat dissipation fin group opposite to the water cooling tank, and the water return tank is connected to the water cooling tank through a water return pipe.
Realize above-mentioned technical scheme, increased the capacity of coolant liquid through setting up the return water tank, can make things convenient for the coolant liquid to circulate more simultaneously.
As a preferable scheme of the present invention, bearing plates are disposed on two sides of the heat dissipation bottom plate, and the water cooling tank and the water return tank are fixed on the bearing plates.
According to the technical scheme, the water cooling tank, the water return tank and the radiating fin group are assembled conveniently by arranging the bearing plate.
As a preferred scheme of the present invention, the four corners of the cooling fin group are provided with connecting angle pieces, and the negative pressure cooling fan is assembled with the cooling fin group through the connecting angle pieces.
By the technical scheme, the radiating fin group and the negative pressure radiating fan can be assembled conveniently.
In conclusion, the invention has the following beneficial effects:
the embodiment of the invention provides a high-efficiency combined heat dissipation type CPU radiator, which comprises: a heat sink module, the heat sink module comprising: the semiconductor refrigeration device comprises a heat absorption plate and a semiconductor refrigeration piece, wherein the heat absorption plate is assembled with a CPU (central processing unit), and a cold end of the semiconductor refrigeration piece is attached to the heat absorption plate; the heat radiating fin group is attached to the hot end of the semiconductor refrigerating sheet, and a negative pressure heat radiating fan is assembled on the heat radiating fin group; a water-cooled circulation assembly, the water-cooled circulation assembly comprising: the cooling device comprises a water cooling tank arranged on one side of the radiating fin group, a circulating pump arranged in the water cooling tank and a circulating pipe arranged around the radiating fin group, wherein one end of the circulating pipe is connected to one side of the water cooling tank, and the other end of the circulating pipe is communicated with a water outlet pipe of the circulating pump. During operation, the heat that CPU during operation produced is absorbed through the absorber plate, the semiconductor refrigeration piece can absorb the heat that absorbs on the absorber plate from the cold junction fast and transmit the hot junction, make the heat on the CPU can dispel fast, and the radiating efficiency is improved, the heat is transmitted to the radiating fin group from the hot junction of semiconductor refrigeration piece afterwards, and carry the heat on the radiating fin group out through negative pressure radiator fan, absorb the heat on the radiating fin group through the circulating pipe simultaneously, and drive the coolant liquid circulation in water-cooling tank and the circulating pipe by the circulating pump, and further improved radiating efficiency and radiating effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is an exploded view of an embodiment of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. a heat absorption module; 11. a heat absorbing plate; 111. a heat conducting plate; 112. a heat conducting pipe; 113. an elastic connecting sheet; 12. a semiconductor refrigeration sheet; 2. a heat-dissipating fin group; 21. a heat dissipation base plate; 22. a heat sink; 23. a support plate; 3. a negative pressure heat radiation fan; 4. a water-cooled circulation component; 41. a water cooling tank; 42. a circulation pump; 43. a circulation pipe; 44. returning to a water tank; 45. a water return pipe; 5. and connecting the corner pieces.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
An efficient combined heat dissipation type CPU heat sink, as shown in fig. 1 and fig. 2, comprises: the heat absorption module 1, heat absorption module 1 includes: the refrigerator comprises a heat absorption plate 11 used for being assembled with a CPU, and a semiconductor refrigeration piece 12 with a cold end attached to the heat absorption plate 11; the heat radiating fin group 2 is attached to the hot end of the semiconductor refrigerating fin 12, and a negative pressure heat radiating fan 3 is assembled on the heat radiating fin group 2; and a water-cooling circulation unit 4.
Specifically, a heat conducting plate 111 is fixedly arranged on one side of the heat absorbing plate 11, which is away from the side assembled with the CPU, a mounting groove is formed between adjacent heat conducting plates 111, a heat conducting pipe 112 is arranged in the mounting groove, two ends of the heat conducting pipe 112 extend to be attached to the heat radiating fin group 2, the heat conducting pipe 112 is flat and fixed to the heat absorbing plate 11 by soldering, and the whole heat conducting pipe 112 is C-shaped, so that two ends of the heat conducting pipe 112 are attached to two sides of the heat radiating fin group 2; the heat absorbed by the absorber plate 11 can be further directly transferred to the heat dissipating fin group 2 by the heat conduction pipe 112, so that the heat dissipating effect of the heat sink is further improved. Meanwhile, the elastic connecting sheets 113 are arranged at the four corners close to the heat absorbing plate 11, the elastic connecting sheets 113 are fixed with the heat absorbing plate 11 through rivets, and the heat absorbing plate 11 is conveniently assembled with the CPU through the elastic connecting sheets 113.
The heat radiation fin group 2 includes: the cooling device comprises a heat dissipation bottom plate 21 and a plurality of heat dissipation fins 22, wherein the heat dissipation bottom plate 21 is used for being attached to the semiconductor refrigeration fins 12, the heat dissipation fins 22 are fixed on the heat dissipation bottom plate 21, heat dissipation grooves are formed between every two adjacent heat dissipation fins 22, the cold ends of the semiconductor refrigeration fins 12 are fixed with a heat conduction plate 111, the hot ends of the semiconductor refrigeration fins 12 are fixed with the heat dissipation bottom plate 21, and heat dissipation silicone grease is coated between the two sides of the semiconductor refrigeration fins 12 and the joint portion of the heat conduction plate 111 and the heat.
The water-cooling circulation module 4 includes: the water-cooling tank 41 of setting in cooling fin group 2 one side, set up circulating pump 42 in water-cooling tank 41, and the circulating pipe 43 that encircles cooling fin group 2 and set up, the one end of circulating pipe 43 is connected in one side of water-cooling tank 41, the other end is linked together with the outlet pipe of circulating pump 42, the filler has been seted up on water-cooling tank 41, the filler passes through threaded connection's jam shutoff, circulating pipe 43 is reciprocal shape setting, circulating pipe 43 inlays to be established in the radiating groove and laminates mutually with fin 22, thereby make things convenient for the installation of circulating pipe 43, and the heat absorption radiating effect is better.
The water return tank 44 is arranged on the side, opposite to the water cooling tank 41, of the heat radiating fin group 2, the water return tank 44 is connected with the water cooling tank 41 through the water return pipe 45, the capacity of cooling liquid is increased through the arrangement of the water return tank 44, and meanwhile, the cooling liquid can be circulated more conveniently. The bearing plates 23 are arranged on two sides of the heat dissipation bottom plate 21, the water cooling tank 41 and the water return tank 44 are fixed on the bearing plates 23 through screws, and the water cooling tank 41 and the water return tank 44 are convenient to assemble with the heat dissipation fin group 2 through the arrangement of the bearing plates 23.
Furthermore, four corners of the cooling fin group 2 are provided with connecting angle pieces 5, the negative pressure cooling fan 3 is assembled with the cooling fin group 2 through the connecting angle pieces 5, connecting holes are formed in two end portions of each connecting angle piece 5, and screws are screwed into the connecting holes, so that the cooling fin group 2 is connected and fixed with the negative pressure cooling fan 3.
During operation, absorb the heat that the CPU during operation produced through absorber plate 11, semiconductor refrigeration piece 12 can absorb the heat that absorbs on the absorber plate 11 from the cold junction fast and transmit the hot junction, make the heat on the CPU can dispel fast, raise the radiating efficiency, the heat transmits radiating fin group 2 from the hot junction of semiconductor refrigeration piece 12 afterwards, and carry the heat on radiating fin group 2 out through negative pressure radiator fan 3, absorb the heat on radiating fin group 2 through circulating pipe 43 simultaneously, and drive the coolant liquid circulation in water-cooling tank 41 and circulating pipe 43 by circulating pump 42, further raised radiating efficiency and radiating effect.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (8)

1. An efficient combination heat dissipation type CPU heat sink is characterized by comprising:
a heat sink module, the heat sink module comprising: the semiconductor refrigeration device comprises a heat absorption plate and a semiconductor refrigeration piece, wherein the heat absorption plate is assembled with a CPU (central processing unit), and a cold end of the semiconductor refrigeration piece is attached to the heat absorption plate;
the heat radiating fin group is attached to the hot end of the semiconductor refrigerating sheet, and a negative pressure heat radiating fan is assembled on the heat radiating fin group; and the number of the first and second groups,
a water-cooled circulation assembly, the water-cooled circulation assembly comprising: the cooling device comprises a water cooling tank arranged on one side of the radiating fin group, a circulating pump arranged in the water cooling tank and a circulating pipe arranged around the radiating fin group, wherein one end of the circulating pipe is connected to one side of the water cooling tank, and the other end of the circulating pipe is communicated with a water outlet pipe of the circulating pump.
2. The heat sink as recited in claim 1, wherein a heat conducting plate is fixed on a side of said heat absorbing plate away from the side where said heat absorbing plate is assembled with the CPU, a mounting groove is formed between adjacent heat conducting plates, a heat conducting pipe is disposed in said mounting groove, and two ends of said heat conducting pipe extend to be attached to said heat dissipating fin group.
3. The high efficiency combined heat dissipation type CPU heat sink as recited in claim 1 or 2, wherein the heat absorbing plate is provided with elastic connecting pieces at four corners close to the heat absorbing plate.
4. The high efficiency combination heat dissipating CPU heat sink of claim 3, wherein the set of heat dissipating fins comprises: the semiconductor refrigeration device comprises a heat dissipation bottom plate used for being attached to the semiconductor refrigeration sheet and a plurality of heat dissipation sheets fixed on the heat dissipation bottom plate, wherein heat dissipation grooves are formed between every two adjacent heat dissipation sheets.
5. The CPU heat sink with high efficiency and heat dissipation as recited in claim 4, wherein said circulation tube is disposed in a reciprocal loop shape, and said circulation tube is embedded in said heat dissipation slot and attached to said heat dissipation fins.
6. The efficient combined heat dissipation CPU heat sink as recited in claim 5, wherein a return tank is disposed on a side of the heat dissipation fin set opposite to the water cooling tank, and the return tank is connected to the water cooling tank through a return pipe.
7. The efficient combined heat dissipation type CPU heat sink as recited in claim 6, wherein said heat dissipation bottom plate is provided with support plates at both sides thereof, and said water cooling tank and said water return tank are fixed on said support plates.
8. The high efficiency combination heat dissipation type CPU heat sink as recited in claim 1, wherein said set of heat dissipation fins has connection corner pieces at four corners, and said negative pressure heat dissipation fan is assembled with said set of heat dissipation fins through said connection corner pieces.
CN201911060482.9A 2019-11-01 2019-11-01 High-efficiency combined heat dissipation type CPU radiator Pending CN111026251A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112259418A (en) * 2020-11-05 2021-01-22 天水黄河电气有限公司 Reverse/distribution direct current contactor packaging structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008187116A (en) * 2007-01-31 2008-08-14 Toshiba Corp Cooling device
CN106406477A (en) * 2016-10-31 2017-02-15 华南理工大学 Tandem type CPU heat dissipating and cooling device
CN107219907A (en) * 2017-07-12 2017-09-29 苏州明雪电子有限公司 A kind of air-cooled water-filled radiator for electronic equipment
CN207201167U (en) * 2017-04-26 2018-04-06 国网浙江开化县供电有限公司 A kind of complex radiating device of novel high-power inverter
CN108323095A (en) * 2017-12-30 2018-07-24 广州宇江信息科技有限公司 Data processing equipment
CN109668346A (en) * 2017-12-28 2019-04-23 杭州大和热磁电子有限公司 A kind of novel semi-conductor refrigeration radiating module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008187116A (en) * 2007-01-31 2008-08-14 Toshiba Corp Cooling device
CN106406477A (en) * 2016-10-31 2017-02-15 华南理工大学 Tandem type CPU heat dissipating and cooling device
CN207201167U (en) * 2017-04-26 2018-04-06 国网浙江开化县供电有限公司 A kind of complex radiating device of novel high-power inverter
CN107219907A (en) * 2017-07-12 2017-09-29 苏州明雪电子有限公司 A kind of air-cooled water-filled radiator for electronic equipment
CN109668346A (en) * 2017-12-28 2019-04-23 杭州大和热磁电子有限公司 A kind of novel semi-conductor refrigeration radiating module
CN108323095A (en) * 2017-12-30 2018-07-24 广州宇江信息科技有限公司 Data processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112259418A (en) * 2020-11-05 2021-01-22 天水黄河电气有限公司 Reverse/distribution direct current contactor packaging structure

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Application publication date: 20200417

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