CN220629875U - Display backboard structure - Google Patents
Display backboard structure Download PDFInfo
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- CN220629875U CN220629875U CN202322004645.XU CN202322004645U CN220629875U CN 220629875 U CN220629875 U CN 220629875U CN 202322004645 U CN202322004645 U CN 202322004645U CN 220629875 U CN220629875 U CN 220629875U
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- air
- main body
- ventilation
- heat
- fixedly connected
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- 238000009423 ventilation Methods 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 239000000428 dust Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000008602 contraction Effects 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 24
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 9
- 230000005855 radiation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses display backplate structure belongs to display backplate technical field, including main part module and cooling module, the main part module includes the backplate main part, four contained angles departments inside the backplate main part all have seted up the mounting hole, the top and the bottom of backplate main part all are provided with space shrinkage subassembly, cooling module includes that two are seted up the ventilation groove in backplate main part both sides respectively, the rear end face of backplate main part inner wall is provided with the heat absorption subassembly, the heat absorption subassembly extends to the inside of two ventilation grooves, through the setting of heat absorption subassembly, air inlet subassembly, air-cooled subassembly and air-out subassembly, can open the air-cooled subassembly and reduce air temperature when outside air temperature is higher, carries out further heat dissipation to the heat absorption subassembly to promote the cooling effect of cooling to the heat absorption subassembly, lets the display obtain better heat dissipation, avoids the display overheated.
Description
Technical Field
The present application relates to the field of display back plates, and more particularly, to a display back plate structure.
Background
A display (screen) is an I/O device of a computer, i.e., an output device. The display tool is used for displaying certain electronic files on a screen through specific transmission equipment, an external frame of the display comprises a front frame and a back plate, and the back plate is used for protecting the back of the display.
According to the discovery of retrieving, chinese patent No. CN217825803U discloses a display backplate with heat dispersion is high, including the installing frame, the inside wall fixedly connected with heat conduction board of installing frame, the front surface center fixedly connected with heating panel of heat conduction board, the front surface mounting of heating panel has radiating fin, two recesses have been seted up to the inner wall bilateral symmetry of installing frame. According to the utility model, the heat in the backboard base plate is absorbed through the heat conducting plate, the heat is dissipated through the heat dissipating plate and the heat dissipating fins, the hot air is exhausted through the exhaust hole through the exhaust fan, so that the effect of dissipating the heat of the backboard base plate is achieved, when the two rubber plates are driven to be far away through the electric telescopic rod, the external air rapidly flows into the mounting frame, when the two rubber plates are close to each other, the internal hot air can be rapidly exhausted, and the heat dissipating efficiency of the backboard base plate can be improved by accelerating the speed of the external air flowing into the mounting frame and the speed of the hot air exhausting.
For the above related art, the applicant believes that the above back plate can radiate the heat inside the back plate through the arrangement of the inlet fan, the plurality of radiating fins and the radiating fins, but when the temperature of the hot air in summer is higher, the heat absorption of the plurality of radiating fins has a certain amount of heat, so the heat radiation and cooling effects of the inlet fan on the radiating fins through the external air are limited, the temperature of the radiating fins is still higher, and the heat radiation effect of the back plate on the display is further affected, so that the display is still easy to overheat in high-temperature weather.
Disclosure of Invention
In order to solve the above problems, the present application provides a display backboard structure, which adopts the following technical scheme:
the utility model provides a display backplate structure, includes main part module and cooling module, the main part module includes the backplate main part, four contained angles departments of backplate main part inside all have been seted up the mounting hole, the top and the bottom of backplate main part all are provided with space contraction subassembly, the cooling module includes two ventilation slots of seting up in backplate main part both sides respectively, the rear end face of backplate main part inner wall is provided with the heat absorption subassembly, the heat absorption subassembly extends to the inside of two ventilation slots, one of them the inside of ventilation slot is provided with air inlet subassembly and forced air cooling subassembly, forced air cooling subassembly is connected with the heat absorption subassembly, and wherein another one the inside of ventilation slot is provided with the air-out subassembly, the both sides of backplate main part all are provided with the dust screen, two the dust screen is located the outside of two ventilation slots respectively.
Further, the heat absorbing assembly comprises a heat absorbing plate fixedly connected to the rear end face of the inner wall of the backboard main body, the front end face of the heat absorbing plate is provided with a plurality of radiating fins fixedly connected in a straight line at equal intervals, a plurality of heat conducting ventilation pipes are fixedly connected between the interiors of the radiating fins, and two ends of each heat conducting ventilation pipe extend to the interiors of two ventilation grooves respectively.
By adopting the technical scheme, the heat of the display can be absorbed, so that the display is subjected to primary heat dissipation.
Further, the air inlet assembly comprises a plurality of first air inlet fans which are fixedly connected inside one of the ventilation grooves, wherein a plurality of air inlet holes are formed in the inner wall of one of the ventilation grooves, and the air inlet holes are communicated with the inside of the backboard main body.
Through adopting above-mentioned technical scheme, can send into the inside of backplate main part with outside air to dispel the heat to a plurality of fin.
Further, the air cooling assembly comprises a mounting frame fixedly connected inside one of the ventilation grooves, the mounting frame is fixedly connected with one end of the heat conduction ventilation pipe, and a second air inlet fan is fixedly arranged inside the mounting frame.
By adopting the technical scheme, air can enter the heat conduction ventilation pipe to radiate the radiating fins.
Further, the air cooling assembly further comprises a semiconductor refrigerating piece fixedly installed inside the installation frame, and the semiconductor refrigerating piece is located between one end of the heat conduction ventilating pipe and the second air inlet fan.
Through adopting above-mentioned technical scheme, can cool down to the air to promote the radiating effect to a plurality of radiating fins.
Further, the air-out subassembly includes a plurality of air-out fans of fixed connection in wherein another one ventilation groove is inside, and wherein another one the air-out groove's inner wall has seted up a plurality of exhaust holes, and a plurality of exhaust holes all link up with the inside of backplate main part.
Through adopting above-mentioned technical scheme, can get rid of the inside hot air of backplate main part for the flow of air.
Further, the cooling module further comprises four dismounting bolts which are respectively connected with the two dustproof nets in a threaded mode, and the four dismounting bolts extend to the inside of the backboard main body.
Through adopting above-mentioned technical scheme, let the dust screen can dismantle the washing, also be convenient for change.
Further, the space contraction component comprises two mounting grooves formed in the top of the inner wall of the backboard main body, electric push rods are mounted in the two mounting grooves, and an arc plate is fixedly connected between output shafts of the two electric push rods.
Through adopting above-mentioned technical scheme, can control the inside space of backplate main part, be convenient for accelerate the flow of air.
In summary, the present application includes the following beneficial technical effects:
(1) According to the heat absorption assembly, the air inlet assembly, the air cooling assembly and the air outlet assembly, the heat absorption assembly can be cooled through the air inlet assembly and the air outlet assembly, the air cooling assembly can be opened to reduce the air temperature when the external air temperature is higher, the heat absorption assembly is further cooled, the heat dissipation cooling effect of the heat absorption assembly is improved, the display is enabled to be better cooled, and the display is prevented from being overheated;
(2) This application can reduce the space of backplate main part inside air flow through the setting of electric putter and arc to accelerate the velocity of flow of air, further promote the cooling speed to radiating fin.
Drawings
FIG. 1 is a schematic view of a dust screen removal structure of the present application;
FIG. 2 is a schematic overall structure of the present application;
FIG. 3 is a schematic overall cross-sectional view of the present application;
FIG. 4 is a schematic view of an exploded view of the spatial contraction assembly of the present application;
fig. 5 is an enlarged view of the area a in fig. 3.
The reference numerals in the figures illustrate:
100. a main body module; 110. a back plate main body; 120. a mounting hole; 130. a space contraction assembly; 131. a mounting groove; 132. an electric push rod; 133. an arc-shaped plate;
200. a cooling module; 210. a heat sink assembly; 211. a heat absorbing plate; 212. a heat radiation fin; 213. a heat conducting ventilation pipe; 220. an air inlet assembly; 221. a first inlet fan; 222. an air inlet hole; 230. an air cooling assembly; 231. a mounting frame; 232. a semiconductor refrigeration sheet; 233. a second inlet fan; 240. an air outlet assembly; 241. a fan is arranged; 242. an exhaust hole; 250. a dust screen; 260. and (5) disassembling and assembling the bolts.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; it is apparent that the described embodiments are only a part of the embodiments of the present application, not all of the embodiments, and all other embodiments obtained by a person having ordinary skill in the art without making creative efforts based on the embodiments in the present application are within the scope of protection of the present application.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
The present application is described in further detail below in conjunction with figures 1-5.
Referring to fig. 1-5, a display backboard structure includes a main body module 100 and a cooling module 200, the main body module 100 includes a backboard main body 110, four included angles inside the backboard main body 110 are provided with mounting holes 120, the top and bottom of the backboard main body 110 are provided with space shrinkage assemblies 130, the cooling module 200 includes two ventilation slots respectively provided at two sides of the backboard main body 110, a heat absorption assembly 210 is provided at a rear end surface of an inner wall of the backboard main body 110, the heat absorption assembly 210 extends to the inside of the two ventilation slots, an air inlet assembly 220 and an air cooling assembly 230 are provided in one of the ventilation slots, the air cooling assembly 230 is connected with the heat absorption assembly 210, an air outlet assembly 240 is provided in the other ventilation slot, dust screens 250 are provided at two sides of the backboard main body 110, and the two dust screens 250 are respectively located outside of the two ventilation slots.
When the display device is used, the display device absorbs heat through the heat absorbing component 210, the air inlet component 220 and the air outlet component 240 are opened, air can be respectively inlet and exhausted, so that the heat absorbing component 210 is cooled, the heat absorbing component 210 is prevented from being too high in temperature, when the external air is too high, the air cooling component 230 is opened again, air with lower temperature can be conveyed to penetrate through the heat absorbing component 210 for heat dissipation, and accordingly the air inlet component 220 and the air outlet component 240 are matched to achieve a better heat dissipation effect, and the display device is enabled to be better in heat dissipation.
The heat absorbing assembly 210 includes a heat absorbing plate 211 fixedly connected to a rear end surface of an inner wall of the back plate main body 110, a plurality of heat dissipating fins 212 are fixedly connected to a front end surface of the heat absorbing plate 211 at equal intervals in a straight line, a heat conducting ventilating pipe 213 is fixedly connected between the interiors of the plurality of heat dissipating fins 212, two ends of the heat conducting ventilating pipe 213 respectively extend to the interiors of two ventilating slots, the air inlet assembly 220 includes a plurality of first air inlet fans 221 fixedly connected to the interiors of one of the ventilating slots, a plurality of air inlet holes 222 are formed in the inner wall of one of the ventilating slots, the plurality of air inlet holes 222 are all communicated with the interior of the back plate main body 110, the air cooling assembly 230 includes a mounting frame 231 fixedly connected to the interiors of one of the ventilating slots, one end of the mounting frame 231 is fixedly connected to one end of the heat conducting ventilating pipe 213, a second air inlet fan 233 is fixedly mounted in the interior of the mounting frame 231, the semiconductor cooling piece 232 is located between one end of the heat conducting ventilating pipe 213 and the second air inlet fan 233, and the air outlet assembly 240 includes a plurality of air outlet fans 241 fixedly connected to the interiors of the other ventilating slots, a plurality of air outlet holes 242 are formed in the inner wall of the other ventilating slots, and the air outlet holes 242 are communicated with the interior of the back plate main body 110.
The plurality of air outlet fans 241 and the plurality of first air inlet fans 221 are opened, so that the two ventilation grooves respectively perform air inlet and air exhaust through the plurality of air outlet holes 242 and the air inlet holes 222, the heat absorption plate 211 and the plurality of heat dissipation fins 212 are cooled, the heat absorption plate 211 and the plurality of heat dissipation fins 212 are prevented from being excessively high in temperature, when the outside air is excessively high, the second air inlet fans 233 and the semiconductor refrigerating fins 232 are opened again, the semiconductor refrigerating fins 232 cool the air introduced into the heat conduction ventilation pipes 213 by the second air inlet fans 233, and therefore the air with lower conveying temperature passes through the heat conduction ventilation pipes 213 to further dissipate heat of the plurality of heat dissipation fins 212 and the heat absorption plate 211, and the heat dissipation effect is achieved by matching the first air inlet fans 233 and the air outlet fans 241.
The cooling module 200 further comprises four dismounting bolts 260 which are respectively in threaded connection with the two dustproof nets 250, the four dismounting bolts 260 all extend to the inside of the backboard main body 110, the space contraction assembly 130 comprises two mounting grooves 131 formed in the top of the inner wall of the backboard main body 110, the electric push rods 132 are respectively mounted in the two mounting grooves 131, and an arc plate 133 is fixedly connected between output shafts of the two electric push rods 132.
Through the setting of two dust screens 250, can close the inside that the dust got into backplate main part 110, through the setting of two dismouting bolts 260, can let dust screen 250 be convenient for dismantle, can promote the arc 133 through opening electric putter 132 and remove to can reduce the inside air flow's of backplate main part 110 space, accelerate the velocity of flow of air.
The implementation principle of the embodiment of the application is as follows: when the heat absorption device is used, the heat absorption plate 211 and the plurality of radiating fins 212 absorb heat to achieve the effect of preliminary heat radiation, the plurality of outlet fans 241 and the plurality of first inlet fans 221 can be opened subsequently, so that the two ventilation grooves respectively carry out air inlet and air exhaust through the plurality of exhaust holes 242 and the air inlet holes 222, the heat absorption plate 211 and the plurality of radiating fins 212 are cooled, the heat absorption plate 211 and the plurality of radiating fins 212 are prevented from being excessively high in temperature, when the outside air is excessively high, the second inlet fans 233 and the semiconductor refrigerating fins 232 are opened again, the semiconductor refrigerating fins 232 cool the air introduced into the heat conduction ventilating pipes 213 by the second inlet fans 233, and the air with lower conveying temperature further dissipates heat through the heat conduction ventilating pipes 213 to the plurality of radiating fins 212 and the heat absorption plate 211, so that the first inlet fans 221 and the outlet fans 241 are matched to achieve better heat radiation effect, and the display is enabled to obtain better heat radiation. Through the setting of two dust screens 250, can close the inside that the dust got into backplate main part 110, through the setting of two dismouting bolts 260, can let dust screen 250 be convenient for dismantle to let dust screen 250 can dismantle, be convenient for wash, can promote the arc 133 through opening electric putter 132 and remove, thereby can reduce the inside air flow's of backplate main part 110 space, accelerate the velocity of flow of air.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. A display back plate structure, comprising a main body module (100) and a cooling module (200), characterized in that: the main body module (100) comprises a back plate main body (110), mounting holes (120) are formed in four included angles in the back plate main body (110), and space contraction assemblies (130) are arranged at the top and the bottom of the back plate main body (110);
the cooling module (200) comprises two ventilation grooves which are respectively formed in two sides of the backboard main body (110), a heat absorbing component (210) is arranged on the rear end face of the inner wall of the backboard main body (110), the heat absorbing component (210) extends to the inside of the two ventilation grooves, one ventilation groove is internally provided with an air inlet component (220) and an air cooling component (230), the air cooling component (230) is connected with the heat absorbing component (210), the other ventilation groove is internally provided with an air outlet component (240), dust screens (250) are respectively arranged on two sides of the backboard main body (110), and the two dust screens (250) are respectively located outside the two ventilation grooves.
2. A display backplane structure according to claim 1, wherein: the heat absorbing assembly (210) comprises a heat absorbing plate (211) fixedly connected to the rear end face of the inner wall of the back plate main body (110), a plurality of radiating fins (212) are fixedly connected to the front end face of the heat absorbing plate (211) at equal intervals in a straight line, a plurality of heat conducting ventilation pipes (213) are fixedly connected between the interiors of the radiating fins (212), and two ends of each heat conducting ventilation pipe (213) extend to the interiors of two ventilation grooves respectively.
3. A display backplane structure according to claim 2, wherein: the air inlet assembly (220) comprises a plurality of first air inlet fans (221) which are fixedly connected inside one of the ventilation grooves, a plurality of air inlet holes (222) are formed in the inner wall of one of the ventilation grooves, and the air inlet holes (222) are communicated with the inside of the backboard main body (110).
4. A display backplane structure according to claim 3, wherein: the air cooling assembly (230) comprises a mounting frame (231) fixedly connected inside one of the ventilation grooves, the mounting frame (231) is fixedly connected with one end of the heat conduction ventilation pipe (213), and a second air inlet fan (233) is fixedly arranged inside the mounting frame (231).
5. A display backplane structure according to claim 4, wherein: the air cooling assembly (230) further comprises a semiconductor refrigerating sheet (232) fixedly installed inside the installation frame (231), and the semiconductor refrigerating sheet (232) is located between one end of the heat conducting ventilating pipe (213) and the second air inlet fan (233).
6. A display backplane structure according to claim 5, wherein: the air outlet assembly (240) comprises a plurality of air outlet fans (241) fixedly connected to the inside of the other air vent groove, a plurality of exhaust holes (242) are formed in the inner wall of the other air vent groove, and the exhaust holes (242) are communicated with the inside of the back plate main body (110).
7. A display backplane structure according to claim 6, wherein: the cooling module (200) further comprises four dismounting bolts (260) which are respectively in threaded connection with the two dustproof nets (250), and the four dismounting bolts (260) extend to the inside of the backboard main body (110).
8. A display backplane structure according to claim 7, wherein: the space shrinkage assembly (130) comprises two mounting grooves (131) formed in the top of the inner wall of the back plate main body (110), electric push rods (132) are mounted in the two mounting grooves (131), and arc plates (133) are fixedly connected between output shafts of the two electric push rods (132).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322004645.XU CN220629875U (en) | 2023-07-28 | 2023-07-28 | Display backboard structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322004645.XU CN220629875U (en) | 2023-07-28 | 2023-07-28 | Display backboard structure |
Publications (1)
Publication Number | Publication Date |
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CN220629875U true CN220629875U (en) | 2024-03-19 |
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Family Applications (1)
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CN202322004645.XU Active CN220629875U (en) | 2023-07-28 | 2023-07-28 | Display backboard structure |
Country Status (1)
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CN (1) | CN220629875U (en) |
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2023
- 2023-07-28 CN CN202322004645.XU patent/CN220629875U/en active Active
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