CN220020233U - Soaking radiator for electronic hardware - Google Patents

Soaking radiator for electronic hardware Download PDF

Info

Publication number
CN220020233U
CN220020233U CN202321446858.1U CN202321446858U CN220020233U CN 220020233 U CN220020233 U CN 220020233U CN 202321446858 U CN202321446858 U CN 202321446858U CN 220020233 U CN220020233 U CN 220020233U
Authority
CN
China
Prior art keywords
fixedly connected
liquid cooling
heat
chip body
electronic chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202321446858.1U
Other languages
Chinese (zh)
Inventor
王连明
张永博
宁红江
范少普
程然
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hebei Guanshu Technology Co ltd
Original Assignee
Hebei Guanshu Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hebei Guanshu Technology Co ltd filed Critical Hebei Guanshu Technology Co ltd
Priority to CN202321446858.1U priority Critical patent/CN220020233U/en
Application granted granted Critical
Publication of CN220020233U publication Critical patent/CN220020233U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to the technical field of radiators, in particular to a soaking radiator for electronic hardware, which comprises an electronic chip body, wherein a movable heat-conducting plate is inserted at the upper end of the electronic chip body, a fan assembly is fixedly connected at the upper end of the heat-conducting plate, a plurality of heat-radiating fins are fixedly connected in the middle of the upper end of the electronic chip body, a liquid cooling pipe is inserted at the upper end of the electronic chip body and fixedly connected with the upper end of the electronic chip body, a water pump is arranged at the left part of the liquid cooling pipe, the heat-conducting plate and the electronic chip body are connected together in an inserted mode through the arrangement of the heat-conducting plate, and as the liquid cooling pipe is embedded and fixedly connected with the upper end of the heat-conducting plate, cooling liquid flows in the liquid cooling pipe through the operation of the water pump, so that the liquid cooling pipe can cool the heat-conducting plate rapidly. According to the soaking radiator for the electronic hardware, the fan can be flexibly disassembled through the fan assembly, and the radiating efficiency of the radiator is improved.

Description

Soaking radiator for electronic hardware
Technical Field
The utility model relates to the technical field of soaking radiators, in particular to a soaking radiator for electronic hardware.
Background
Computer hardware, including all physical parts in a computer, to distinguish between data it includes or executes and software that provides instructions to the hardware to accomplish tasks; mainly comprises: the computer comprises a case, a main board, a bus, a power supply, a hard disk, an interface card, a portable storage device, a built-in input device, a buzzer and the like, wherein an electronic chip is often important electronic hardware in a computer, and the electronic chip is often provided with a radiator to improve the radiating efficiency in the use process, and at least the following defects are caused in the use process of the existing soaking radiator: in the use process of the existing soaking radiator, most of the existing soaking radiator directly attaches the radiating fins to the upper end of the chip to radiate heat, but only the radiating fins radiate heat, so that the radiating effect is limited, and therefore, we push out the soaking radiator for electronic hardware.
Disclosure of Invention
The utility model mainly aims to provide a soaking radiator for electronic hardware, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the soaking radiator for the electronic hardware comprises an electronic chip body, wherein a movable heat conducting plate is inserted into the upper end of the electronic chip body, the upper end of the heat conducting plate is fixedly connected with a fan assembly, the middle part of the upper end of the electronic chip body is fixedly connected with a plurality of heat radiating fins, the upper end of the electronic chip body is inserted into a liquid cooling pipe, the left part of the liquid cooling pipe is provided with a water pump, and a plurality of heat radiating fins are distributed equidistantly.
Preferably, the fan assembly comprises an upper mounting plate, the fixedly connected with radiator fan of upper mounting plate lower extreme, radiator fan lower extreme fixedly connected with mounting plate down, the equal interlude swing joint in mounting plate upper end four corners has the threaded rod down, four equal fixedly connected with circular layer board in threaded rod surface lower part, four equal threaded connection in threaded rod surface upper portion has fastening nut, four fastening nut all is located mounting plate upper portion down, four circular layer board all is located mounting plate lower part down.
Preferably, the four threaded rods are fixedly connected with four corners of the upper end of the heat-conducting plate respectively, the lower mounting plate is not contacted with the plurality of heat-radiating fins and the liquid cooling pipe, the lower mounting plate is positioned at the upper parts of the plurality of heat-radiating fins and the liquid cooling pipe, and the plurality of heat-radiating fins and the liquid cooling pipe are positioned between the four threaded rods.
Preferably, the lower end of the heat conducting plate is provided with a clamping groove, and the clamping groove is inserted into the electronic chip body for movable connection.
Preferably, the front part of the right end of the water pump is fixedly connected with a water inlet pipe, the rear part of the right end of the water inlet pipe is fixedly connected with a water outlet pipe, and the liquid cooling pipe is not contacted with the plurality of radiating fins.
Preferably, the water outlet pipe and the water inlet pipe are connected with the liquid cooling pipe in a closed mode.
Compared with the prior art, the utility model has the following beneficial effects:
1. the heat conducting plate is connected with the electronic chip body in a penetrating way through the heat conducting plate, and as the liquid cooling pipe is embedded and fixed at the upper end of the heat conducting plate, and both ends of the liquid cooling pipe are connected with the water pump in a closed way, the cooling liquid flows in the liquid cooling pipe through the operation of the water pump, so that the liquid cooling pipe can quickly cool the heat conducting plate, and the heat radiating efficiency of the heat conducting plate on the electronic chip body can be improved;
2. through setting up the fan subassembly, fix four threaded rods and electronic chip body upper end together, with lower mounting panel and four threaded rods interlude link together again, it is fixed to lower mounting panel through fastening nut, restart radiator fan operation, make radiator fan dispel the heat to heat-conducting plate, liquid cooling pipe and a plurality of radiator fin simultaneously, and then can improve the radiating efficiency of whole radiator, and radiator fan can install in a flexible way and dismantle, the convenience has been improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a soaking heat sink for electronic hardware according to the present utility model;
FIG. 2 is a schematic diagram showing the overall structure of a heat conducting plate of a soaking heat sink for electronic hardware according to the present utility model;
FIG. 3 is a schematic diagram of a water pump connection for a soaking radiator for electronic hardware according to the present utility model;
fig. 4 is a schematic diagram showing the overall structure of a fan assembly of a soaking heat sink for electronic hardware according to the present utility model.
In the figure: 1. an electronic chip body; 2. a heat conductive plate; 3. a fan assembly; 4. a heat radiation fin; 5. a liquid-cooled tube; 6. a water pump; 21. a clamping groove; 31. an upper mounting plate; 32. a fastening nut; 33. a circular pallet; 34. a threaded rod; 35. a lower mounting plate; 36. a heat radiation fan; 61. a water inlet pipe; 62. and a water outlet pipe.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-4, the present utility model provides a technical solution:
a soaking radiator for electronic hardware comprises an electronic chip body 1, wherein a movable heat conducting plate 2 is inserted into the upper end of the electronic chip body 1, a fan assembly 3 is fixedly connected to the upper end of the heat conducting plate 2, a plurality of heat radiating fins 4 are fixedly connected to the middle of the upper end of the electronic chip body 1, a liquid cooling pipe 5 is inserted into the upper end of the electronic chip body 1, a water pump 6 is arranged at the left part of the liquid cooling pipe 5, and the plurality of heat radiating fins 4 are distributed equidistantly.
In this embodiment, the fan assembly 3 includes an upper mounting plate 31, a cooling fan 36 is fixedly connected to the lower end of the upper mounting plate 31, a lower mounting plate 35 is fixedly connected to the lower end of the cooling fan 36, four corners of the upper end of the lower mounting plate 35 are respectively and movably connected with threaded rods 34 in a penetrating manner, round supporting plates 33 are respectively and fixedly connected to the lower parts of the outer surfaces of the four threaded rods 34, fastening nuts 32 are respectively and threadedly connected to the upper parts of the outer surfaces of the four threaded rods 34, the four fastening nuts 32 are respectively located at the upper parts of the lower mounting plates 35, and the four round supporting plates 33 are respectively located at the lower parts of the lower mounting plates 35; the four threaded rods 34 are fixedly connected with four corners of the upper end of the heat conducting plate 2 respectively, the lower mounting plate 35 is not contacted with the plurality of heat radiating fins 4 and the liquid cooling tube 5, the lower mounting plate 35 is positioned on the upper parts of the plurality of heat radiating fins 4 and the liquid cooling tube 5, the plurality of heat radiating fins 4 and the liquid cooling tube 5 are positioned between the four threaded rods 34, and the four circular supporting plates 33 can lift the lower mounting plate 35 to avoid the contact of the lower mounting plate 35 with the liquid cooling tube 5 and the plurality of heat radiating fins 4.
In the embodiment, a clamping groove 21 is formed at the lower end of the heat conducting plate 2, and the clamping groove 21 is inserted and movably connected with the electronic chip body 1; the front part of the right end of the water pump 6 is fixedly connected with a water inlet pipe 61, the rear part of the right end of the water inlet pipe 61 is fixedly connected with a water outlet pipe 62, and the liquid cooling pipe 5 is not contacted with the plurality of heat radiation fins 4; the water outlet pipe 62 and the water inlet pipe 61 are connected with the liquid cooling pipe 5 in a closing way.
It should be noted that, the utility model is a soaking radiator for electronic hardware, in the use process, the upper groove wall of the clamping groove 21 is coated with heat conduction silicone grease, the heat conduction plate 2 is attached to the upper end of the electronic chip body 1, the whole radiator is connected with the electronic chip body 1, in the running process of the electronic chip body 1, the heat conduction plate 2 absorbs the heat generated by the electronic chip body 1 and is dispersed through a plurality of heat dissipation fins 4, then the water pump 6 is started to work by an external control system, at this time, after the water pump 6 runs, the water pump 6 makes the cooling liquid in the liquid cooling tube 5 circulate in the liquid cooling tube 5, thereby the liquid cooling tube 5 brings out the heat absorbed by the heat conduction plate 2, the heat dissipation efficiency of the electronic chip body 1 by the heat conduction plate 2 is improved, when the heat dissipation effect is insufficient, the lower mounting plate 35 is connected with four threaded rods 34 together, the four circular support plates 33 support the lower mounting plate 35, after the support, the four fastening nuts 32 are connected with the four threaded rods 34, the four fastening nuts 32 limit the lower mounting plate 35, the limit the lower mounting plate 35, after the lower mounting plate 35 is completely mounted, the water pump 6 runs, the water cooling tube 5 runs on the heat dissipation tube 4, the heat dissipation tube 4 is further, the heat dissipation fan 4 runs on the heat dissipation tube, and the heat dissipation tube 1 is further, and the heat dissipation efficiency is improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (5)

1. A soaking radiator for electronic hardware, comprising an electronic chip body (1), characterized in that: the electronic chip comprises an electronic chip body (1), wherein a movable heat conducting plate (2) is inserted into the upper end of the electronic chip body (1), a fan assembly (3) is fixedly connected to the upper end of the heat conducting plate (2), a plurality of heat radiating fins (4) are fixedly connected to the middle of the upper end of the electronic chip body (1), a liquid cooling pipe (5) is inserted into the upper end of the electronic chip body, a water pump (6) is arranged at the left part of the liquid cooling pipe (5), and the plurality of heat radiating fins (4) are distributed at equal intervals;
the fan assembly (3) comprises an upper mounting plate (31), the lower end of the upper mounting plate (31) is fixedly connected with a cooling fan (36), the lower end of the cooling fan (36) is fixedly connected with a lower mounting plate (35), four corners of the upper end of the lower mounting plate (35) are respectively inserted with a threaded rod (34), the lower parts of the outer surfaces of the threaded rods (34) are respectively fixedly connected with a round supporting plate (33), the upper parts of the outer surfaces of the threaded rods (34) are respectively connected with a fastening nut (32), the fastening nuts (32) are respectively located on the upper parts of the lower mounting plate (35), and the round supporting plates (33) are respectively located on the lower parts of the lower mounting plate (35).
2. A soaking heat sink for electronic hardware according to claim 1, wherein: the four threaded rods (34) are fixedly connected with four corners at the upper end of the heat conducting plate (2) respectively, the lower mounting plate (35) is not contacted with the plurality of radiating fins (4) and the liquid cooling pipe (5), the lower mounting plate (35) is positioned on the upper parts of the plurality of radiating fins (4) and the liquid cooling pipe (5), and the plurality of radiating fins (4) and the liquid cooling pipe (5) are positioned among the four threaded rods (34).
3. A soaking heat sink for electronic hardware according to claim 1, wherein: the lower end of the heat conducting plate (2) is provided with a clamping groove (21), and the clamping groove (21) is in penetrating and movable connection with the electronic chip body (1).
4. A soaking heat sink for electronic hardware according to claim 1, wherein: the front part of the right end of the water pump (6) is fixedly connected with a water inlet pipe (61), the rear part of the right end of the water inlet pipe (61) is fixedly connected with a water outlet pipe (62), and the liquid cooling pipe (5) is not contacted with the plurality of radiating fins (4).
5. A soaking heat sink for electronic hardware according to claim 4, wherein: the water outlet pipe (62) and the water inlet pipe (61) are connected with the liquid cooling pipe (5) in a closing way.
CN202321446858.1U 2023-06-08 2023-06-08 Soaking radiator for electronic hardware Active CN220020233U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321446858.1U CN220020233U (en) 2023-06-08 2023-06-08 Soaking radiator for electronic hardware

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321446858.1U CN220020233U (en) 2023-06-08 2023-06-08 Soaking radiator for electronic hardware

Publications (1)

Publication Number Publication Date
CN220020233U true CN220020233U (en) 2023-11-14

Family

ID=88688259

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321446858.1U Active CN220020233U (en) 2023-06-08 2023-06-08 Soaking radiator for electronic hardware

Country Status (1)

Country Link
CN (1) CN220020233U (en)

Similar Documents

Publication Publication Date Title
JP3068892U (en) CPU heat dissipation device
CN214954895U (en) Water-cooling heat dissipation device
CN208848114U (en) A kind of intelligent computer information processing equipment of excellent in heat dissipation effect
CN214586685U (en) Computer machine case heat abstractor with water-cooling function
CN220020233U (en) Soaking radiator for electronic hardware
CN210605614U (en) Heat abstractor for computer machine case
CN210895329U (en) Module structure for radiating in board
CN209946807U (en) Auxiliary heat dissipation device for computer case
CN213818695U (en) PCBA heat radiation component
CN212411147U (en) Small-space high-performance heat dissipation module and tablet computer
CN210666668U (en) CPU heat dissipation device for server
CN219590784U (en) Water cooling structure of central processing unit
CN220962350U (en) Air-water cooling heat dissipation device of water cooling pipe
CN212933523U (en) SDD main control chip for automobile data recorder
CN219574762U (en) CPU water-cooling heat dissipation assembly
CN219042299U (en) Mainboard heat radiation structure
CN216794700U (en) Uninterrupted power source who contains filtering module
CN219266882U (en) Heat pipe radiator for processor
CN221228070U (en) Heat abstractor of embedded hardware equipment
CN214381951U (en) Water-cooling radiator
CN221303947U (en) Computer CPU radiator
CN218896331U (en) Data storage device with good heat dissipation effect
CN214042241U (en) High-efficient heat dissipation server device
CN218850079U (en) 40w water-cooling heat dissipation laser
CN211293845U (en) Computer hardware heat dissipation case

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant