CN219266882U

CN219266882U - Heat pipe radiator for processor

Info

Publication number: CN219266882U
Application number: CN202222534558.0U
Authority: CN
Inventors: 胥泉; 魏波
Original assignee: Chengdu Wanchuang Technology Co ltd
Current assignee: Chengdu Wanchuang Technology Co ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-06-27
Anticipated expiration: 2032-09-23

Abstract

The utility model relates to the technical field of radiators, in particular to a heat pipe radiator for a processor, which comprises a heat conducting fin, wherein the upper end of the heat conducting fin is connected with at least one heat pipe, the upper end of the heat pipe is connected with a substrate, the upper end of the substrate is connected with a radiating tooth group provided with a plurality of radiating teeth, the substrate is connected with a bracket, and the upper end of the bracket is connected with a fan.

Description

Heat pipe radiator for processor

Technical Field

The utility model relates to the technical field of radiators, in particular to a heat pipe radiator for a processor.

Background

In the field of computers, COM Express is a standard of computer modules defined by the international electrotechnical commission (PICMG), at present, type2 is a core board module which is defined by the standard because a chip is not providing a history stage that PCI will gradually exit, type6 will become mainstream, the size of the COM Express Type6Basic module is 125X95mm, the module can be provided with AMD, ram, INTEL and other processors, two SO-DIMM slots are configured, the module is highly concentrated by miniaturized components, and the radiator needs to effectively and efficiently solve large power consumption of more than 45W-80W in a limited space if the processor is a large power consumption processor such as XEON E2176M, and the radiating area of radiating teeth in an effective space of the traditional processing technology is insufficient and limited by the structure, and has heat conduction and slower heat dissipation.

Disclosure of Invention

The utility model aims at: the heat pipe radiator and the scheme for the processor are provided for improving the radiator to effectively and efficiently radiate heat when the large-power-consumption processor is processed, and the radiator is mainly used for solving the problem that the processor module uses the large-power processor to radiate heat.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a heat pipe radiator for treater, includes the conducting strip, and its conducting strip top is connected with at least one heat pipe for on transferring the heat pipe with the heat on the conducting strip, be connected with the base plate on the above-mentioned heat pipe for on the heat pipe transferred the base plate, be connected with the heat dissipation tooth group on the above-mentioned base plate, on making the heat on the base plate transfer to the heat dissipation tooth group, above-mentioned heat dissipation tooth group is with heat transfer to a plurality of heat dissipation teeth on, above-mentioned base plate is connected with the support for fix whole device, also let the heat dissipation tooth group dispel the heat in limited space, be connected with the fan on the above-mentioned support for the heat dissipation.

The utility model is used for improving the heat dissipation efficiency of the radiator when carrying the high-power processor, because the heat generated by the chip during operation is sequentially transferred to the heat dissipation tooth group through the heat conducting fin, the heat pipe and the base plate, then the bracket is connected with the base plate, and the fan at the upper end of the bracket is used for carrying out heat conversion on the whole relieving radiator.

As a preferable scheme of the utility model, the heat conducting fin body is a red copper sheet, and a heat conducting medium is arranged between the heat conducting fin and the connection surface of the heating end of the chip, so that the heat conducting efficiency is improved.

As a preferable scheme of the utility model, the heat pipes comprise a first heat pipe and a second heat pipe, wherein the first heat pipe and the second heat pipe are standard D6 heat pipes, and D8 heat pipes can also be used.

As a preferable scheme of the utility model, the first heat pipe and the second heat pipe are U-shaped, and the first heat pipe and the second heat pipe are flattened into rectangular cross sections, so that the first heat pipe and the second heat pipe can be better buried below a substrate when being connected, the first heat pipe is U-shaped, the first heat pipe is rectangular in side view, the second heat pipe is also U-shaped, one side of the second heat pipe is connected with the first heat pipe, and the U-shaped bent end of the second heat pipe is higher than the first heat pipe in side view and is used for avoiding internal equipment so as to avoid collision.

As a preferable scheme of the utility model, the substrate body is a red copper substrate, the substrate is rectangular, bolt holes are formed in two sides of the substrate, and the substrate is provided with the accommodating barrel groove which can be matched with the heat pipe, so that the heat conduction of the substrate is quick, the heat pipe can be buried in the substrate, and the mounting of the bracket is also convenient.

As a preferable scheme of the utility model, the radiating tooth group is welded on the substrate, so that heat on the substrate can be quickly transferred to the radiating tooth group.

As the preferable scheme of the utility model, the heat dissipation tooth group is made of aluminum and nickel plating is carried out on the surface of the heat dissipation tooth, so that the corrosion resistance of the tooth plate of the relieved tooth heat radiator is improved.

As the preferable scheme of the utility model, the radiating teeth of the radiating tooth group are set to be 0.4 mm-0.5 mm in width, wherein 0.4mm is the best, and the spacing is 1.6mm, so that the radiating area of the radiating tooth group is increased.

As a preferable scheme of the utility model, the bracket is box-shaped with a downward opening, an air outlet is arranged at one side of the bracket, the device is connected into a whole, the heat dissipation tooth group dissipates heat in a limited space, the whole radiator is protected from damage, and the air outlet is arranged to form heat conversion circulation with a fan at the upper end of the bracket.

As a preferable scheme of the utility model, the fan adopts an 8025 fan, and the 8025 fan is a PWM speed-regulating fan, and can regulate the rotating speed according to different temperature environments, thereby regulating the air flow.

In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:

1. the heat can be transferred to the heat pipe, the substrate and the heat dissipation tooth group through the heat transfer from the chip to the heat dissipation tooth sheet, and then the heat is cooled by the fan arranged above, so that the cooling effect is good.

2. Through heat conduction silica gel, the contact thermal resistance between chip and the red copper sheet reduces, and realization face that can be better is with the contact of face, promotes heat conduction efficiency.

3. Through the relieved tooth radiator, the relieved tooth radiator comprises a plurality of thin radiating teeth, is relatively dense in a limited space, increases the radiating area, and improves the radiating efficiency of the radiator.

4. The utility model does not need to open the mould for manufacturing, and has simple processing and low cost.

5. The upper fan of the radiator is an 8025 fan:

the fan option for this solution is 35Cfm,

the module has thermal power consumption TDP 60W and temperature difference of 10 DEG C

Calculate the following air volume q= 2X1.76X60/10=21 cfm

The fan is selected to meet the heat dissipation requirement.

Drawings

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is a schematic bottom view of the present utility model.

Fig. 3 is an exploded view of the present utility model.

Fig. 4 is a flowchart of the operation of the present utility model.

Fig. 5 is a cross-sectional view of a heat pipe of the present utility model.

FIG. 6 is a heat pipe structure diagram of the present utility model.

Fig. 7 is a process installation scheme flow chart of the present utility model.

Icon: 1-a first heat pipe; 2-a heat conductive sheet; 3-a second heat pipe; 4-a substrate; 41-accommodating through grooves; 5-fixing pieces; 6-radiating tooth groups; 61-radiating teeth; 7-a bracket; 8-a fan; 9-an air outlet and 10-a chip; 11-heat conducting silica gel.

Detailed Description

The present utility model will be described in detail with reference to the accompanying drawings.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Example 1

As shown in fig. 1-3, the present utility model is a heat pipe radiator for a processor, comprising a heat conducting fin 2, at least one

heat pipe

1, 3 is connected to the heat conducting fin 2, so that heat on the heat conducting fin 2 can be transferred through the

heat pipes

1, 3, a substrate 4 is connected to the

heat pipes

1, 3, so that heat on the

heat pipes

1, 3 can be transferred through the substrate 4, a heat dissipation tooth set 6 formed by a plurality of heat dissipation teeth 61 is connected to the upper end of the substrate 4, so that heat can be transferred to the heat dissipation teeth 61 for heat dissipation, a bracket 7 is connected to the substrate 4, a fan is connected to the upper end of the bracket 7, the heat radiator dissipates heat in a limited space through the fan 8 and the bracket 7, and the device is connected as a whole through the bracket 7, and meanwhile, the device is protected.

The body of the heat conducting fin 2 is a red copper sheet 2, a heat conducting medium is arranged between the heat conducting fin 2 and the heating end of the chip 10, and heat conducting efficiency is improved.

The heat pipe comprises a first heat pipe 1 and a second heat pipe 2, wherein the first heat pipe 1 and the second heat pipe 3 are standard D6 heat pipes or D8 heat pipes, and the heat dissipation capacity is stronger.

The first heat pipe 1 and the second heat pipe 3 are U-shaped, the cross section of the first heat pipe 1 and the cross section of the second heat pipe 3 are flattened to be rectangular, the side view of the first heat pipe 3 is rectangular, the side view of the U-shaped bent end of the second heat pipe 3 is higher than that of the first heat pipe 1, and the heat pipes are buried in the substrate 4 by avoiding other parts conveniently, as shown in fig. 5 to 6.

The substrate 4 is rectangular, and the bottom is provided with a receiving through groove 41 adapted to the heat pipe, so that the heat pipe can be completely embedded into the bottom of the substrate 4.

The substrate 4 is welded with the heat dissipation tooth set 6, so that heat on the substrate 4 can be quickly transferred to the heat dissipation tooth set 6.

The heat dissipation tooth set 6 is mainly nickel plated with aluminum, so that a layer of protective film is arranged on the surface of the heat dissipation tooth 61, and corrosion resistance of the heat dissipation tooth set 6 is improved when the heat dissipation tooth set works and contacts with the external environment. The heat dissipation teeth 61 of the heat dissipation teeth group 6 are processed into a plurality of widths of 0.4 mm-0.5 mm, and gaps among the heat dissipation teeth 61 are 1.6mm, so that the heat dissipation area of the heat dissipation teeth 61 of the heat dissipation teeth group 6 can be increased in a limited space, the heat transferred by the substrate 4 is distributed on the heat dissipation teeth group 6 more uniformly, and the air is brought into the interior of the relieved tooth radiator by the fan 8 at the upper end to cool the interior of the relieved tooth radiator.

An air outlet 9 is arranged on one side of the bracket 7, so that heat conversion circulation with the fan 8 is facilitated.

The fan 8 is an 8025 fan 8, the 8025 fan 8 is a PWM fan, the rotation speed and the inflow air quantity can be controlled according to different heat quantity emitted by the chip, when the fan rotates, under the action of pressure, the air flows into each radiating tooth piece of the radiator from the air inlet to perform heat conversion, and the heat is carried by the air to be discharged through the air outlet to achieve the radiating effect.

Therefore, as shown in fig. 4, the heat generated by the chip 10 is conducted to the heat conducting fin 2 when the processor works, and then the heat conducting fin 2 and the heat conducting ends of the first heat pipe 1 and the second heat pipe 2 are transferred to the heat pipes, the first heat pipe 1 and the second heat pipe 3 both contain heat conducting liquid, the liquid gradually changes into gas state along with the lifting of the heat and rises to the upper ends of the first heat pipe 1 and the second heat pipe 3, and flows into the heat conducting end after changing into liquid state, the heat is transferred to the substrate 4 in a circulating way, the substrate 4 and the heat radiating tooth group 6 are welded, so that the heat radiating tooth group 6 absorbs the heat of the substrate 4 and uniformly distributes the heat to each heat radiating tooth 61, the heat is converted into the heat of the relieved tooth radiator by the wind brought by the fan 8 at the upper end 8025, and finally the heat is discharged from the opening at one side of the bracket 8, so that the heat radiating circulation is formed.

Example 2

Compared with embodiment 1, the difference between the embodiment is that a heat conducting medium is added between the chip 10 and the heat conducting strip 2, the heat conducting medium is heat conducting silica gel 11, the heat conducting coefficient of the heat conducting silica gel 11 is greater than 7, the heat conducting silica gel 11 is used for reducing the contact thermal resistance between the heat source surface of the chip 10 and the contact surface of the heat radiating device, so that better surface-to-surface contact can be achieved, and the heat conducting efficiency is improved.

According to the processing method of the present utility model shown in fig. 7, the heat dissipation teeth 6 are formed by processing aluminum, the surfaces of the heat dissipation teeth 61 above the heat dissipation teeth 6 are further plated with nickel to increase corrosion resistance, the first heat pipe 1 and the second heat pipe 3 are flattened and bent to form, the substrate 4 is made of copper to have good thermal conductivity, the first heat pipe 1 and the second heat pipe 3 are welded with the substrate 4 to ensure rapid heat transfer therebetween, the processed heat dissipation teeth 6 are welded with the substrate 4, the bracket is bent to be connected with the fan 8, and the bracket 7 is connected with the substrate 4 to obtain the radiator body.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. A heat pipe radiator for a processor, comprising a heat conducting fin, characterized in that: the heat-conducting fin (2) is characterized in that at least one heat pipe is connected above the heat-conducting fin, a base plate (4) is connected to the heat pipe, a heat dissipation tooth group (6) formed by a plurality of tooth pieces is connected above the base plate (4), a support (7) is further arranged on the base plate (4), and a fan (8) is connected above the support (7).

2. The heat pipe radiator for a processor according to claim 1, wherein the heat conducting sheet (2) is a red copper sheet, and a heat conducting silica gel is arranged between the heat conducting sheet (2) and a chip heating end.

3. A heat pipe radiator for a processor according to claim 1, characterized in that the heat pipe comprises a first heat pipe (1) and a second heat pipe (3).

4. A heat pipe radiator for a processor according to claim 3, characterized in that the first heat pipe (1) and the second heat pipe (3) are at least two standard D6 or D8 heat pipes.

5. A heat pipe radiator for a processor according to claim 3, wherein the first heat pipe (1) and the second heat pipe (3) are respectively in a U shape, the first heat pipe (1) and the second heat pipe (3) are flattened to be rectangular in cross section, the first heat pipe (1) is connected with one side of the second heat pipe (3) and the lower end is provided with the heat conducting fin (2), the second heat pipe (3) is in a U shape and one side surface is connected with the first heat pipe (1), and the U-shaped curved arc end of the second heat pipe (3) is higher than that of the first heat pipe (1).

6. A heat pipe radiator for a processor according to any one of claims 1-5, characterized in that the base plate (4) is rectangular and the lower end of the base plate (4) is provided with a receiving through groove (41) adapted to the heat pipe.

7. A heat pipe radiator for a processor according to claim 6, characterized in that the support above the base plate (4) is provided with a set of heat radiating teeth (6).

8. A heat pipe radiator for a processor according to claim 6, wherein the radiating teeth of the radiating teeth group (6) are relieved teeth.

9. A heat pipe radiator for a processor as defined in claim 6 wherein: the width of the radiating teeth of the radiating tooth group (6) is 0.4-0.5 mm, the gap is 1.2-2.0 mm, and the radiating teeth of the radiating tooth group (6) are nickel plated by aluminum.

10. A heat pipe radiator for a processor according to claim 6, characterized in that the support (7) is provided with an air outlet (9) on one side.