CN219936382U - Novel heat dissipation module, mainboard and notebook computer - Google Patents
Novel heat dissipation module, mainboard and notebook computer Download PDFInfo
- Publication number
- CN219936382U CN219936382U CN202321072001.8U CN202321072001U CN219936382U CN 219936382 U CN219936382 U CN 219936382U CN 202321072001 U CN202321072001 U CN 202321072001U CN 219936382 U CN219936382 U CN 219936382U
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- heat
- plate
- conducting plate
- dissipation
- main board
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- 230000017525 heat dissipation Effects 0.000 title claims description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 46
- 230000005855 radiation Effects 0.000 claims abstract description 29
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel heat radiation module, a main board and a notebook computer, wherein the heat radiation module is arranged on the main board in the notebook computer and provides cooling and heat radiation support for a plurality of heating elements of the main board, and the novel heat radiation module comprises a fan assembly, a heat pipe assembly connected with the fan assembly, a first heat conducting plate and a second heat conducting plate which are respectively arranged on the heat pipe assembly, and a heat radiation pressing plate fixedly connected with the main board, wherein the heat radiation pressing plate is arranged above the first heat conducting plate and/or the second heat conducting plate, and the heat radiation pressing plate is in contact connection with at least one heating element. According to the utility model, the first heat conducting plate, the second heat conducting plate and the heat radiating pressing plate are respectively in close contact with a plurality of heating elements of the main board to conduct heat, then the heat pipe transmits the heat to the fan assembly, and the fan assembly discharges the heat through wind power, so that the plurality of heating elements of the main board can be effectively cooled in a targeted manner, and the heat radiating efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of computer hardware, in particular to a novel heat radiation module, a main board and a notebook computer.
Background
In the conventional electronic product, a plurality of heat generating electronic components are arranged on the same circuit board at the same time. In order to save installation space or improve assembly efficiency, a plurality of heat sinks are often required to be combined into an integrated heat dissipation module to dissipate heat of the heat-generating electronic components.
With the continuous increase of power of electronic components such as CPU (Central Processing Unit ), GPU (Graphics Processing Unit, graphics processor), PCH (Platform Controller Hub, integrated south bridge), the problem of heat dissipation is more and more emphasized, especially in notebook computers. In order to efficiently carry away the heat generated by the system in a limited space, a heat dissipation module consisting of heat dissipation fins, heat pipes and fans is mainly used for heat dissipation in the industry at present. The heat conduction path of this embodiment is: heat generated by electronic components such as a CPU is conducted to the radiating fins through the heat pipe, and then air flow generated by the fan and the radiating fins are subjected to heat exchange so as to take away the heat transferred to the radiating fins.
The utility model discloses a radiator for a notebook computer, comprising a flat heat pipe, a radiating fin group connected with one end of the flat heat pipe and a heat absorbing module connected with the other end of the flat heat pipe, wherein a radiating fan is arranged at the air inlet side of the radiating fin group with a plurality of parallel air channels, and the heat absorbing module further comprises: the heat pipe comprises a substrate body and a copper block arranged below the substrate body, wherein a through hole is formed in the middle area of the substrate body, the upper surface of the copper block is exposed from the through hole and is in welded connection with a flat heat pipe arranged above the substrate body, the lower surface of the copper block is used for being in contact with a heating element, pits which are arranged at intervals are formed in the area, below the flat heat pipe, of the upper surface of the substrate body, and therefore a welding area with certain roughness is formed on the substrate body, and the welding area is connected with the flat heat pipe through soldering tin. The welding device can improve the welding planeness, prevent local warping and further ensure the heat conduction efficiency and stability.
As another chinese patent with publication No. CN214504364U, a heat-dissipating and ventilating structure for a notebook computer is disclosed, which includes a heat transfer sheet, a heat transfer pipe connected to the heat transfer sheet, a radiator connected to the heat transfer pipe, and a heat-dissipating fan blowing air toward the radiator; the heat transfer sheet comprises a heat transfer substrate and a spraying base layer which is sprayed and attached to the heat transfer substrate, the heat transfer tube is welded on the heat transfer substrate, the heat transfer tube comprises a connecting part and an outer edge part which is connected with the outer edge of the connecting part in a compound manner, and a plurality of heat dissipation grooves are formed in the surface of the outer edge part; the spraying base layer is matched with the heat transfer base layer for heat transfer, sand holes and irregular surfaces on the heat transfer substrate can be filled through the spraying base layer, so that the bonding effect of the heat transfer substrate and a heating source can be ensured, and the heat transfer efficiency is improved.
However, in practical use, it is found that the above-mentioned comparison document can generally only dissipate heat for a single heating element, and in a notebook with a compact structure, it is difficult to add a heat dissipation module for the remaining heating elements; meanwhile, the copper block and the heat transfer substrate in the above-mentioned reference need to be closely attached to the heating element to achieve good heat conduction effect, but the technical solutions of the above-mentioned reference lack related technical details, so that improvement is needed to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a novel heat radiation module, a main board and a notebook computer, which can jointly radiate heat for a plurality of heating elements, effectively improve heat conduction efficiency and heat radiation efficiency and solve the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a novel heat dissipation module, locates on the mainboard in the notebook computer and for the several heating element of mainboard provides cooling heat dissipation support, including fan unit, with the heat pipe subassembly that the fan unit is connected, locate respectively first heat-conducting plate and second heat-conducting plate on the heat pipe subassembly, with mainboard fixed connection's heat dissipation clamp plate, the heat dissipation clamp plate is located first heat-conducting plate and/or second heat-conducting plate top, just the heat dissipation clamp plate is connected with at least one heating element contact.
Preferably, the heat pipe assembly comprises a heat radiation fin group and at least two heat pipes, the heat radiation fin group is arranged at an air outlet of the fan assembly, the heat radiation fin group is provided with an air duct, the heat pipes are fixedly arranged in the air duct, the first heat conducting plate is fixedly connected with one heat pipe, and the second heat conducting plate is fixedly connected with the other heat pipe.
Preferably, the first heat conducting plate is provided with an elastic pressing strip, the first heat conducting plate is fixedly connected with the main board through the elastic pressing strip, the second heat conducting plate is provided with an elastic sheet, and the elastic sheet is respectively in abutting connection with the heat radiating pressing plate and the second heat conducting plate.
Preferably, the elastic pressing strip is provided with a fixing part and two mounting ends, the two mounting ends and the fixing part are in a ladder-shaped structure, and the two mounting ends are respectively fixedly connected with the main board at two sides of the first heat conducting plate.
Preferably, the fixing portion is provided with a plurality of first fixing holes, the first heat conducting plate is provided with a plurality of first protruding columns, and the first protruding columns penetrate through the first fixing holes and then are riveted with the first fixing holes.
Preferably, the elastic sheet is arched, a plurality of second fixing holes are formed in the center of the elastic sheet, a plurality of second convex columns are formed in the second heat conducting plate, and the second convex columns penetrate through the second fixing holes and then are riveted with the second fixing holes.
Preferably, the heat radiation pressing plate is provided with a fin portion.
Preferably, the second heat conducting plate is provided with a plurality of positioning columns, the heat dissipation pressing plate is provided with a plurality of positioning holes, and the number and the positions of the positioning columns correspond to the positioning holes.
The main board is used for being installed in a notebook computer and providing hardware support for the notebook computer, and is provided with a first heating element, a second heating element and a third heating element, and comprises the heat dissipation module.
A notebook computer comprises the main board.
Compared with the prior art, the utility model has the following beneficial effects:
in the utility model, the first heat-conducting plate, the second heat-conducting plate and the heat-radiating pressing plate are respectively in close contact with a plurality of heating elements of the main board to conduct heat, the heat is transmitted to the fan assembly through the heat pipe, and the fan assembly discharges the heat through wind power, so that the heat of the plurality of heating elements of the main board can be effectively cooled in a targeted manner, and the heat-radiating efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic structural diagram of a heat dissipation fin set according to the present utility model;
FIG. 3 is a schematic view of a first heat-conducting plate according to the present utility model;
FIG. 4 is a schematic structural view of a second heat-conducting plate according to the present utility model;
FIG. 5 is a schematic diagram illustrating an assembly of a motherboard and a heat sink module according to the present utility model;
FIG. 6 is a second schematic diagram illustrating the assembly of the motherboard and the heat sink module according to the present utility model.
Reference numerals and names in the drawings are as follows:
1. a main board; 11. a first heating element; 12. a second heating element; 13. a third heating element; 14. a screw; 15. a stud; 2. a fan assembly; 3. a heat pipe assembly; 31. a heat radiation fin group; 32. a heat pipe; 33. an air duct; 4. a first heat-conducting plate; 41. a first post; 42. an elastic pressing strip; 421. a fixing part; 422. a mounting end; 423. a first fixing hole; 5. a second heat-conducting plate; 51. a second post; 52. a spring plate; 521. a second fixing hole; 53. positioning columns; 6. a heat radiation pressing plate; 61. a fin section; 62. and positioning holes.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 6, an embodiment of the present utility model provides: the utility model provides a novel heat dissipation module, locate on the mainboard 1 in the notebook computer and for the first heating element 11 of mainboard 1, second heating element 12 and third heating element 13 provide cooling heat dissipation support, including fan unit 2, the heat pipe assembly 3 that is connected with fan unit 2, locate first heat-conducting plate 4 and second heat-conducting plate 5 on the heat pipe assembly 3 respectively, with mainboard 1 fixed connection's heat dissipation clamp plate 6, after the heat dissipation module is fixed with mainboard 1 installation, first heat-conducting plate 4 is connected with first heating element 11 contact, second heat-conducting plate 5 is connected with second heating element 12 contact, heat dissipation clamp plate 6 locates second heat-conducting plate 5 top, and heat dissipation clamp plate 6 is connected with third heating element 13 contact.
Wherein the first heating element 11 and the second heating element 12 are respectively one of a CPU and a GPU, and the third heating element 13 is a PCH. After the heat radiation module is fixedly installed on the main board 1, the first heating element 11 is tightly attached to the first heat conduction plate 4, the second heating element 12 is tightly attached to the second heat conduction plate 5, the third heating element 13 is tightly attached to the heat radiation pressing plate 6, the heat is absorbed by the first heat conduction plate 4, the second heat conduction plate 5 and the heat radiation pressing plate 6 respectively, then the heat is conducted to the fan assembly 2 by the aid of the heat pipe assembly 3, and the fan assembly 2 generates wind power to discharge the heat.
In other embodiments, the heat dissipation pressing plate 6 may also be disposed above the first heat conducting plate 4, or cover the first heat conducting plate 4 and the second heat conducting plate 5 at the same time, so as to provide downward pressure for the heat conducting plates, so as to ensure that the heat conducting plates are closely attached to the heating elements. In addition, besides the third heating element 13PCH in the present embodiment, the heat-dissipating platen 6 may be simultaneously or separately connected to different heating elements, such as a communication module, a hard disk, etc., which is not limited in the present utility model.
Referring to fig. 2, more specifically, the heat pipe assembly 3 includes a heat dissipation fin set 31 and at least two heat pipes 32, the first heat conducting plate 4 is fixedly connected with one heat pipe 32, the second heat conducting plate 5 is fixedly connected with the other heat pipe 32, so that heat is conducted into the heat dissipation fin set 31 connected with the heat conducting plate through the heat pipe 32, the heat dissipation fin set 31 is arranged at an air outlet of the fan assembly 2, and the heat is discharged by wind generated by the fan assembly 2.
More specifically, the heat radiation fin group 31 is formed by arranging and combining a plurality of heat radiation fins which are uniformly spaced from each other, and improves the contact area with air, so that the wind generated by the fan assembly 2 passes through, and improves the heat radiation efficiency.
More specifically, the fin group 31 is provided with an air duct 33, the heat pipe 32 is fixedly arranged in the air duct 33, the air duct 33 is communicated with the air outlet of the fan assembly 2, so that wind power can be conveniently diffused into the fin group 31 through the air duct 33, and the heat dissipation efficiency is further improved.
More specifically, the heat radiation pressing plate 6 is provided with a fin portion 61, and the fin portion 61 can increase the contact area between the heat radiation pressing plate 6 and the air, so that the heat generated by the third heating element 13 is discharged from the fin portion 61 after being conducted through the heat radiation pressing plate 6.
More specifically, the second heat-conducting plate 5 is provided with a plurality of positioning columns 53, the heat-dissipating pressing plate 6 is provided with a plurality of positioning holes 62, the number and the positions of the positioning columns 53 correspond to those of the positioning holes 62, and after the heat-dissipating pressing plate 6 is fixedly installed on the main board, the positioning holes 62 and the positioning columns 53 cooperate to fix the second heat-conducting plate 5 on the second heating element 12, so that the movement of the second heat-conducting plate is avoided.
Referring to fig. 3 and 4, more specifically, the first heat-conducting plate 4 is provided with an elastic pressing strip 42, the first heat-conducting plate 4 is fixedly connected with the main board 1 through the elastic pressing strip 42, the second heat-conducting plate 5 is provided with an elastic sheet 52, and the elastic sheet 52 is respectively in abutting connection with the heat-dissipating pressing plate 6 and the second heat-conducting plate 5.
More specifically, the elastic pressing strip 42 is provided with a fixing portion 421 and two mounting ends 422, the two mounting ends 422 and the fixing portion 421 are in a ladder structure, and the two mounting ends 422 are fixedly connected with the main board 1 at two sides of the first heat conducting plate 4 respectively; after the elastic pressing strip 42 is mounted on the main board 1, elastic deformation is generated due to the shape of the elastic pressing strip, the first heat conducting plate 4 is pressed at the first heat generating element 11, so that the elastic pressing strip and the main board are tightly attached to each other, and the heat conducting efficiency can be effectively improved.
More specifically, the fixing portion 421 is provided with a plurality of first fixing holes 423, and the first heat conductive plate 4 is provided with a plurality of first protruding columns 41, and the first protruding columns 41 are riveted with the first fixing holes 423 after passing through the first fixing holes 423.
More specifically, the elastic sheet 52 is arched, the center of the elastic sheet 52 is provided with a plurality of second fixing holes 521, the second heat-conducting plate 5 is provided with a plurality of second protruding columns 51, and the second protruding columns 51 are riveted with the second fixing holes 521 after passing through the second fixing holes 521.
More specifically, both ends of the elastic sheet 52 are in abutting connection with the heat dissipation pressing plate 6, when the heat dissipation pressing plate 6 is mounted above the second heat conduction plate 5, the elastic sheet 52 is pressed downwards, and the elastic sheet 52 tightly adheres the second heat conduction plate 5 to the second heating element 12 due to self elasticity, so that the heat conduction efficiency can be effectively improved.
Referring to fig. 4 and 5, the present utility model provides a motherboard 1 for being installed in a notebook computer and providing hardware support for the notebook computer, wherein the motherboard 1 is provided with a first heating element 11, a second heating element 12 and a third heating element 13, and the motherboard 1 further comprises a heat dissipation module as described above.
Correspondingly, the utility model also provides a notebook computer, which comprises the main board 1.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. Novel heat dissipation module is located on mainboard (1) in notebook computer and provides cooling heat dissipation support for the several heating element of mainboard (1), its characterized in that: the heat-dissipation device comprises a fan assembly (2), a heat pipe assembly (3) connected with the fan assembly (2), a first heat-conduction plate (4) and a second heat-conduction plate (5) which are respectively arranged on the heat pipe assembly (3), and a heat-dissipation pressing plate (6) fixedly connected with a main board (1), wherein the heat-dissipation pressing plate (6) is arranged above the first heat-conduction plate (4) and/or the second heat-conduction plate (5), and the heat-dissipation pressing plate (6) is in contact connection with at least one heating element.
2. The novel heat dissipation module as set forth in claim 1, wherein: the heat pipe assembly (3) comprises a heat radiation fin group (31) and at least two heat pipes (32), the heat radiation fin group (31) is arranged at an air outlet of the fan assembly (2), the heat radiation fin group (31) is provided with an air duct (33), the heat pipes (32) are fixedly arranged in the air duct (33), the first heat conducting plate (4) is fixedly connected with one heat pipe (32), and the second heat conducting plate (5) is fixedly connected with the other heat pipe (32).
3. A novel heat sink module according to claim 1 or 2, characterized in that: the heat-dissipation plate is characterized in that the first heat-conduction plate (4) is provided with an elastic pressing strip (42), the first heat-conduction plate (4) is fixedly connected with the main board (1) through the elastic pressing strip (42), the second heat-conduction plate (5) is provided with an elastic sheet (52), and the elastic sheet (52) is respectively in abutting connection with the heat-dissipation pressing plate (6) and the second heat-conduction plate (5).
4. A novel heat sink module as claimed in claim 3, wherein: the elastic pressing strip (42) is provided with a fixing part (421) and two mounting ends (422), the two mounting ends (422) and the fixing part (421) are of a ladder-shaped structure, and the two mounting ends (422) are respectively fixedly connected with the main board (1) at two sides of the first heat-conducting plate (4).
5. The novel heat dissipation module as defined in claim 4, wherein: the fixing part (421) is provided with a plurality of first fixing holes (423), the first heat-conducting plate (4) is provided with a plurality of first convex columns (41), and the first convex columns (41) penetrate through the first fixing holes (423) and then are riveted with the first fixing holes (423).
6. A novel heat sink module as claimed in claim 3, wherein: the elastic sheet (52) is arched, a plurality of second fixing holes (521) are formed in the center of the elastic sheet (52), a plurality of second convex columns (51) are arranged on the second heat-conducting plate (5), and the second convex columns (51) penetrate through the second fixing holes (521) and then are riveted with the second fixing holes (521).
7. A novel heat sink module as claimed in claim 3, wherein: the heat radiation pressing plate (6) is provided with a fin part (61).
8. The novel heat dissipation module as set forth in claim 7, wherein: the second heat-conducting plate (5) is provided with a plurality of positioning columns (53), the heat-radiating pressing plate (6) is provided with a plurality of positioning holes (62), and the number and the positions of the positioning columns (53) correspond to the positioning holes (62).
9. A motherboard (1) for installing in a notebook computer and providing hardware support for the notebook computer, the motherboard (1) being provided with a first heating element (11), a second heating element (12) and a third heating element (13), characterized in that: a heat sink module comprising any one of claims 1 to 8.
10. A notebook computer, characterized in that: a motherboard (1) comprising a motherboard according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321072001.8U CN219936382U (en) | 2023-05-06 | 2023-05-06 | Novel heat dissipation module, mainboard and notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321072001.8U CN219936382U (en) | 2023-05-06 | 2023-05-06 | Novel heat dissipation module, mainboard and notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219936382U true CN219936382U (en) | 2023-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321072001.8U Active CN219936382U (en) | 2023-05-06 | 2023-05-06 | Novel heat dissipation module, mainboard and notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219936382U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118034458A (en) * | 2024-02-03 | 2024-05-14 | 深圳市迈乐技术有限公司 | Micro computer |
-
2023
- 2023-05-06 CN CN202321072001.8U patent/CN219936382U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118034458A (en) * | 2024-02-03 | 2024-05-14 | 深圳市迈乐技术有限公司 | Micro computer |
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