CN220383421U

CN220383421U - Power supply

Info

Publication number: CN220383421U
Application number: CN202320641689.0U
Authority: CN
Inventors: 李翌嘉; 郑任智; 尹睿泽
Original assignee: Cooler Master Technology Inc
Current assignee: Cooler Master Technology Inc
Priority date: 2023-03-10
Filing date: 2023-03-28
Publication date: 2024-01-23
Anticipated expiration: 2033-03-28
Also published as: DE202023102634U1; TWM642121U

Abstract

A power supply comprises a heat dissipation shell, at least one first heat pipe, a circuit board and a heating module. The heat dissipation shell is provided with an accommodating space. The first heat pipe is positioned in the accommodating space of the heat dissipation shell and thermally contacted with the heat dissipation shell. The circuit board is positioned in the accommodating space of the heat dissipation shell. The heating module is provided with a plurality of pins which penetrate through the circuit board and are electrically connected to the circuit board, and the pins are thermally coupled with the first heat pipe.

Description

Power supply

Technical Field

The present utility model relates to a power supply, and more particularly to a power supply with a heat dissipation housing.

Background

In the prior art, a transformer module is disposed in the power supply, and generates heat during operation, and the heat is mostly taken away only by passive cooling, for example, by flowing air through the transformer module to take away the heat generated by the transformer module. However, such a method cannot quickly and effectively dissipate heat from the transformer module, so that the temperature of the transformer module may be too high to affect the operation.

Disclosure of Invention

The utility model aims to provide a power supply which can rapidly radiate heat for a transformation module in the power supply.

To achieve the above object, the present utility model provides a power supply, comprising:

a heat dissipation shell provided with an accommodating space;

at least one first heat pipe located in the containing space of the heat dissipation shell and thermally contacted with the heat dissipation shell;

the circuit board is positioned in the accommodating space of the heat dissipation shell; and

the heating module is provided with a plurality of pins, and the pins penetrate through the circuit board to be electrically connected to the circuit board and are thermally coupled with the at least one first heat pipe.

The heat dissipation casing comprises a base, a plurality of side plates and a cover body, wherein the side plates are vertically arranged on the base, the cover body is connected with the base through the side plates, the base, the side plates and the cover body jointly form the accommodating space, the at least one first heat pipe is in thermal contact with the base, the at least one second heat pipe is positioned in the accommodating space and in thermal contact with the cover body, and the heating module is thermally coupled with the at least one second heat pipe.

The power supply further comprises a heat conducting shell and a heat conducting fluid, wherein the heat conducting shell is positioned in the accommodating space of the heat radiating shell, part of the heating module is positioned in the heat conducting shell, the heat conducting fluid is filled in the heat conducting shell, and the heating module is thermally coupled with the at least one second heat pipe through the heat conducting fluid and the heat conducting shell.

The power supply further comprises at least one heat conducting block, the number of the at least one second heat pipes is multiple, and the heat conducting shell is thermally coupled with the at least one second heat pipes through the at least one heat conducting block.

In the above power supply, at least one of the base, the side plates and the cover has a fin structure, and the heat conductive housing has a fin structure.

The power supply further comprises a fan, wherein the fan is positioned in the heat dissipation shell and is used for blowing air flow to the heating module.

The power supply further comprises a heat-conducting shell and a heat-conducting fluid, wherein the heat-conducting shell is positioned in the accommodating space of the heat dissipation shell, part of the heating modules are positioned in the heat-conducting shell, the heat-conducting fluid is filled in the heat-conducting shell, and the heating modules are thermally coupled with the heat-conducting shell through the heat-conducting fluid.

In the above power supply, the heat conductive housing is located between the circuit board and the fan.

In the above power supply, the heat dissipation housing and the heat conduction housing each have a fin structure.

The power supply further comprises at least one heat conducting block, the at least one first heat pipe is multiple in number, and the pins are thermally coupled to the first heat pipes through the at least one heat conducting block.

According to the power supply disclosed in the above embodiment, the first heat pipe is disposed in the accommodating space of the heat dissipation housing and thermally contacts the heat dissipation housing, and the pins of the heat generating module pass through the circuit board and are thermally coupled with the first heat pipe, so that heat generated by the heat generating module can be rapidly transferred to the heat dissipation housing through the first heat pipe, and the heat dissipation housing can exchange heat with external air flow in a large area of the heat dissipation housing, thereby rapidly dissipating heat from the heat generating module.

The utility model will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the utility model thereto.

Drawings

Fig. 1 is a schematic perspective view of a power supply according to a first embodiment of the present utility model.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is a schematic cross-sectional view of fig. 1.

Fig. 4 is an exploded view of a power supply according to a second embodiment of the present utility model.

Fig. 5 is a schematic cross-sectional view of fig. 4.

Fig. 6 is an exploded view of a power supply according to a third embodiment of the present utility model.

Fig. 7 is a schematic cross-sectional view of fig. 6.

Wherein reference numerals are used to refer to

1,1a,1b power supply

10,10a,10b radiating casing

11 base

111 accommodating groove

12 side plate

13,13b cover body

131 accommodating groove

132b vent hole

14 Fin structure

20,20a,20b first heat pipe

30,30a second heat pipe

30b fan

40,40a,40b circuit board

50,50a,50b thermally conductive housing

51 Fin structure

60,60a,60b heating module

61 stitch

70,75,70a,75a,70b: heat conducting block

80,80a,80b of a heat-conducting fluid

90 heating module

S is a containing space

Detailed Description

The structural and operational principles of the present utility model are described in detail below with reference to the accompanying drawings:

please refer to fig. 1 to 3. Fig. 1 is a schematic perspective view of a power supply according to an embodiment of the utility model. Fig. 2 is an exploded view of fig. 1. Fig. 3 is a schematic cross-sectional view of fig. 1.

In this embodiment, the power supply 1 is applied in a server or a desktop computer, for example. The power supply 1 comprises a heat dissipation housing 10, a plurality of first heat pipes 20, a circuit board 40 and a heating module 60. In addition, the power supply 1 may further include a plurality of second heat pipes 30, a heat-conducting housing 50, a plurality of heat-conducting blocks 70,75, and a heat-conducting fluid 80.

The heat dissipation case 10 is made of a material with high thermal conductivity, such as metal. The heat dissipation housing 10 includes a base 11, a plurality of side plates 12 and a cover 13. The side plates 12 stand on the base 11, the cover 13 is connected to the base 11 through the side plates 12, and the base 11, the side plates 12 and the cover 13 together form a containing space S. In the present embodiment, the base 11 has a receiving recess 111, and the receiving recess 111 is formed by recessing from a surface of the base 11 facing the receiving space S. In addition, the cover 13 also has a receiving recess 131, and the receiving recess 131 is formed by recessing a surface of the cover 13 facing the receiving space S. At least one of the base 11, the side plates 12 and the cover 13 has a fin structure 14. For example, the base 11, the cover 13 and at least one side plate 12 have fin structures 14 to increase the surface area of the heat dissipation housing 10 contacting the outside air. It should be noted that the fin structure 14 is an optional structure, and may be omitted or added according to the requirement.

These first heat pipes 20 are, for example, U-shaped. The first heat pipes 20 are disposed in the accommodating groove 111 of the base 11 and exposed in the accommodating space S of the heat dissipation housing 10, and the first heat pipes 20 are in thermal contact with the base 11. These second heat pipes 30 are, for example, L-shaped. The second heat pipes 30 are disposed in the accommodating recess 131 of the cover 13 and exposed in the accommodating space S of the heat dissipation housing 10, and the second heat pipes 30 are in thermal contact with the cover 13.

It should be noted that the accommodating recess 111 of the base 11 and the accommodating recess 131 of the cover 13 are optional structures. In other embodiments, the base and the cover may have no receiving recess, the first heat pipe may be in direct thermal contact with a surface of the base facing the receiving space, and the second heat pipe may be in direct thermal contact with a surface of the cover facing the receiving space.

The circuit board 40 is disposed in the accommodating space S of the heat dissipation housing 10 and is adjacent to the base 11 of the heat dissipation housing 10. The heat conductive housing 50 is, for example, a square housing and is made of a material with high heat conductivity, such as metal. The heat conducting housing 50 is located in the accommodating space S of the heat dissipating housing 10, and the heat conducting housing 50 has a fin structure 51, for example, to increase the surface area contacting with the external air. It should be noted that the fin structure 51 is an optional structure, and may be omitted or added according to the requirement.

The heat generating module 60 is, for example, a transformer module. A portion of the heat generating module 60 is located within the thermally conductive housing 50. The heat generating module 60 has a plurality of pins 61, and the pins 61 are located outside the heat conducting housing 50 and pass through the circuit board 40 to be electrically connected to the circuit board 40. The two heat-conducting blocks 70 are located between the pins 61 of the heat-generating module 60 and the first heat pipes 20, and the pins 61 of the heat-generating module 60 are thermally coupled to the first heat pipes 20 through the two heat-conducting blocks 70, so that heat generated during operation of the heat-generating module 60 can be transferred to the base 11 of the heat-dissipating casing 10 via the two heat-conducting blocks 70 and the first heat pipes 20, and then transferred to the side plates 12 via the base 11.

In this way, by the arrangement that the first heat pipe 20 is located in the accommodating space S of the heat dissipation housing 10 and thermally contacts the base 11 of the heat dissipation housing 10, and the pins 61 of the heat generating module 60 pass through the circuit board 40 and are thermally coupled to the first heat pipe 20 through the two heat conducting blocks 70, the heat generated by the heat generating module 60 can be rapidly transferred to the base 11 and the side plate 12 of the heat dissipation housing 10 through the two heat conducting blocks 70 and the first heat pipe 20, so that the base 11 and the side plate 12 of the heat dissipation housing 10 exchange heat with external air flow in a large area, and therefore, the heat dissipation of the heat generating module 60 can be rapidly performed.

It should be noted that the two heat conducting blocks 70 are optional components. In other embodiments, the pins of the heat generating module may be in direct thermal contact with the first heat pipes. Furthermore, the number of the first heat pipes is not intended to limit the present utility model. In other embodiments, the number of first heat pipes may be only one.

The heat-conducting fluid 80 is, for example, a heat-conducting glue or wax, and the heat-conducting fluid 80 fills the heat-conducting housing 50 such that the heat-generating module 60 is thermally coupled to the heat-conducting housing 50 through the heat-conducting fluid 80. Two heat conducting blocks 75 are located between the heat conducting housing 50 and the second heat pipes 30. The heat generating module 60 is thermally coupled to the second heat pipes 30 through the heat conducting fluid 80, the heat conducting housing 50 and the two heat conducting blocks 75, so that heat generated during operation of the heat generating module 60 can be transferred to the cover 13 of the heat dissipating housing 10 through the heat conducting fluid 80, the heat conducting housing 50, the two heat conducting blocks 75 and the second heat pipes 30.

In this way, the heat generating module 60 not only has a heat transfer path for transferring heat to the base 11, but also has another heat transfer path for transferring heat to the cover 13, so that the heat generated by the operation of the heat generating module 60 can be more rapidly transferred to the whole heat dissipating housing 10, and the heat dissipating efficiency of the heat generating module 60 is further improved.

In the present embodiment, by wrapping a portion of the heat generating module 60 with the heat conducting housing 50, the heat conducting housing 50 can transfer the heat generated by the heat generating module 60 to the heat conducting block 75 with a flat surface thereof in thermal contact with the heat conducting block 75, so as to improve the heat conduction efficiency.

It should be noted that the two heat conducting blocks 75 are optional components. In other embodiments, the thermally conductive housing may be in direct thermal contact with the second heat pipes. In addition, the heat conductive housing 50, the heat conductive fluid 80, and the second heat pipes 30 are optional components. If the heat generated by the heat generating module is transferred to the base of the heat dissipating casing to satisfy the heat dissipating requirement of the heat generating module, the heat conducting casing, the heat conducting fluid and the second heat pipes can be omitted.

In the present embodiment, the second heat pipes 30 can transfer the heat generated by other heat generating elements, components or modules to the cover 13 of the heat dissipation housing 10 in addition to the heat generated by the heat generating module 60 to the cover 13 of the heat dissipation housing 10. For example, the power supply 1 may also include another heat generating module 90. The heat generating module 90 is located in the accommodating space S of the heat dissipation housing 10, and the top of the heat generating module is thermally coupled to the second heat pipes 30, such that the generated heat generated by the operation of the heat generating module 90 can be conducted away through the second heat pipes 30 and the cover 13. It should be noted that the heating module 90 is a selected component, which can be omitted or added according to the requirement.

Next, please refer to fig. 4 and fig. 5. Fig. 4 is an exploded view of a power supply according to a second embodiment of the present utility model. Fig. 5 is a schematic cross-sectional view of fig. 4.

The power supply 1a of the present embodiment is similar to the power supply 1 described in the above-mentioned reference fig. 1 to 3, and also includes a heat dissipation housing 10a, a plurality of first heat pipes 20a, a plurality of second heat pipes 30a, a circuit board 40a, a heat conduction housing 50a, a heating module 60a, a plurality of heat conduction blocks 70a,75a and a heat conduction fluid 80a. The difference between the power supply 1a of the present embodiment and the power supply 1 described above with reference to fig. 1 to 3 is mainly that the shape of the second heat pipe is different. As shown in fig. 4, the second heat pipes 30a of the power supply 1a of the present embodiment are in a straight strip shape. For the detailed structures of the elements and the connection relationships between the elements in the present embodiment, please refer to the description of the above embodiments, and the detailed description is omitted.

Next, please refer to fig. 6 and 7. Fig. 6 is an exploded view of a power supply according to a third embodiment of the present utility model. Fig. 7 is a schematic cross-sectional view of fig. 6.

The power supply 1b of the present embodiment is similar to the power supply 1 described in the above-mentioned reference fig. 1 to 3, and also includes a heat dissipation housing 10b, a plurality of first heat pipes 20b, a circuit board 40b, a heat conducting housing 50b, a heating module 60b, a plurality of heat conducting blocks 70b and a heat conducting fluid 80b. The difference between the power supply 1b of the present embodiment and the power supply 1 described in the above-mentioned reference figures 1 to 3 is that the power supply 1b does not include the second heat pipe 30 but further includes a fan 30b. The following mainly describes the installation position of the fan 30b of the power supply 1b, and the detailed structure of other elements of the power supply 1b and the connection relationship therebetween are described with reference to the above embodiments, and are not repeated.

In the present embodiment, the cover 13b of the heat dissipation housing 10b further has a plurality of ventilation holes 132b, and the ventilation holes 132b are communicated with the accommodating space S of the heat dissipation housing 10 b. The fan 30b is located in the accommodating space S of the heat dissipation housing 10b and corresponds to the ventilation holes 132b of the cover 13 b. The fan 30b is located above the thermally conductive housing 50b such that the thermally conductive housing 50b is located between the circuit board 40b and the fan 30b. The fan 30b is configured to blow the air flow toward the heat-conducting housing 50b, so that the heat generated by the heat-generating module 60b absorbed by the heat-conducting housing 50b through the heat-conducting fluid 80b therein can be taken away by heat exchange with the air flow.

According to the power supply disclosed in the above embodiment, the first heat pipe is disposed in the accommodating space of the heat dissipation housing and thermally contacts the base of the heat dissipation housing, and the pins of the heat generating module pass through the circuit board and are thermally coupled to the first heat pipe through the two heat conducting blocks, so that the heat generated by the heat generating module can be rapidly transferred to the base and the side plate of the heat dissipation housing through the two heat conducting blocks and the first heat pipe, and the base and the side plate of the heat dissipation housing exchange heat with external air flow in a large area, thereby rapidly dissipating the heat of the heat generating module.

And the heating module is thermally coupled to the second heat pipes through the heat conducting fluid, the heat conducting shell and the two heat conducting blocks, so that heat generated by the heating module during operation can be transferred to the cover body of the heat dissipation shell through the heat conducting fluid, the heat conducting shell, the two heat conducting blocks and the second heat pipes. Therefore, the heating module not only has a heat transfer path for transferring heat to the base, but also has another heat transfer path for transferring heat to the cover body, so that heat energy generated by the operation of the heating module can be more rapidly transferred to the whole heat dissipation shell, and the heat dissipation efficiency of the heating module is further improved.

Of course, the present utility model is capable of other various embodiments and its several details are capable of modification and variation in light of the present utility model, as will be apparent to those skilled in the art, without departing from the spirit and scope of the utility model as defined in the appended claims.

Claims

1. A power supply, comprising:

a heat dissipation shell provided with an accommodating space;

2. The power supply of claim 1, further comprising at least one second heat pipe, wherein the heat dissipation housing comprises a base, a plurality of side plates and a cover, the side plates are erected on the base, the cover is connected to the base through the side plates, the base, the side plates and the cover together form the accommodating space, the at least one first heat pipe is in thermal contact with the base, the at least one second heat pipe is located in the accommodating space and in thermal contact with the cover, and the heating module is thermally coupled to the at least one second heat pipe.

3. The power supply of claim 2, further comprising a heat-conducting housing and a heat-conducting fluid, wherein the heat-conducting housing is located in the accommodating space of the heat-dissipating housing, a portion of the heat-generating module is located in the heat-conducting housing, the heat-conducting fluid is filled in the heat-conducting housing, and the heat-generating module is thermally coupled to the at least one second heat pipe through the heat-conducting fluid and the heat-conducting housing.

4. The power supply of claim 3, further comprising at least one heat conducting block, the at least one second heat pipe being a plurality of heat conducting blocks, the heat conducting housing being thermally coupled to the at least one second heat pipe via the at least one heat conducting block.

5. The power supply of claim 3, wherein at least one of the base, the side plates and the cover has a fin structure, and the thermally conductive housing has a fin structure.

6. The power supply of claim 1, further comprising a fan located in the heat dissipation housing, the fan configured to blow air toward the heat generating module.

7. The power supply of claim 6, further comprising a heat-conducting housing and a heat-conducting fluid, wherein the heat-conducting housing is located in the accommodating space of the heat-dissipating housing, a portion of the heat-generating module is located in the heat-conducting housing, the heat-conducting fluid is filled in the heat-conducting housing, and the heat-generating module is thermally coupled to the heat-conducting housing through the heat-conducting fluid.

8. The power supply of claim 7, wherein the thermally conductive housing is located between the circuit board and the fan.

9. The power supply of claim 7, wherein the heat dissipation housing and the heat conduction housing each have a fin structure.

10. The power supply of claim 1, further comprising at least one heat conducting block, the at least one first heat pipe being plural in number, the pins being thermally coupled to the first heat pipes through the at least one heat conducting block.