CN209882215U - Circuit board heat dissipation assembly - Google Patents
Circuit board heat dissipation assembly Download PDFInfo
- Publication number
- CN209882215U CN209882215U CN201920309393.2U CN201920309393U CN209882215U CN 209882215 U CN209882215 U CN 209882215U CN 201920309393 U CN201920309393 U CN 201920309393U CN 209882215 U CN209882215 U CN 209882215U
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- CN
- China
- Prior art keywords
- circuit board
- back plate
- metal back
- heat dissipation
- dissipation assembly
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Abstract
The utility model discloses a circuit board heat dissipation assembly contains a circuit board, a radiator, a metal backplate, a heat pipe and a briquetting. A circuit board has a front surface and a back surface, and the front surface has at least one heat-generating region. The radiator is arranged in the heating area. The metal back plate and the back surface of the circuit board are arranged at a spacing distance. The heat pipe is provided with a first end, a bending section and a second end, wherein the first end is connected with the radiator, the second end is contacted with the metal back plate, and the bending section is connected with the first end and the second end at one side edge of the circuit board. The pressing block is fixed on the metal back plate and presses the second end on the metal back plate.
Description
Technical Field
The utility model relates to a heat dissipation configuration of circuit board especially relates to a circuit board heat dissipation assembly.
Background
Circuit boards, in particular computer motherboards, are provided with electronic chips which operate at high power. These electronic chips need to be heat-dissipated by a heat sink to prevent the electronic chips from being inoperable and generate high heat that may further affect other electronic components.
The metal part is added on the back of the computer mainboard to increase the mechanical strength of the mainboard, which is beneficial to the installation of the radiator. This metalwork can provide extra air-cooling radiating surface, but, does not have direct contact between metalwork and the radiating electronic chip of needs, can only utilize bolt, copper post heat conduction to the radiator to dispel the heat, and is not obvious to radiating reinforcing effect.
The design of connecting the radiator and the metal piece by using the heat pipe is also provided. However, the heat pipe is often divided into a plurality of sections and then connected by other metal blocks to connect the heat sinks and the metal members located on different surfaces. Alternatively, the motherboard must have an opening for the bending heat pipe to pass through. The arrangement of the heat pipe penetrating through the opening limits the shape of the heat pipe, otherwise the heat pipe cannot penetrate through the opening to connect the radiator and the metal piece. Meanwhile, the connection between the heat pipe and the metal part is also prone to the problem that the thermal conductivity is affected due to too high contact thermal resistance.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, the present invention provides a circuit board heat dissipation assembly, which comprises a circuit board, a heat sink, a metal back plate, a heat pipe and a press block.
The circuit board has a front surface and a back surface, and the front surface has at least one heat-generating region. The radiator is arranged in the heating area. The metal back plate and the back surface of the circuit board are arranged at a spacing distance. The heat pipe is provided with a first end, a bending section and a second end, wherein the first end is connected with the radiator, the second end is contacted with the metal back plate, and the bending section is connected with the first end and the second end at one side edge of the circuit board. The pressing block is fixed on the metal back plate and presses the second end on the metal back plate.
In at least one embodiment, the circuit board heat dissipation assembly further includes a plurality of connection posts, and the circuit board is connected to the metal back plate through the plurality of connection posts.
In at least one embodiment, the metal back plate covers the whole back surface of the circuit board.
In at least one embodiment, the metal back plate covers a part of the back surface of the circuit board.
In at least one embodiment, the projection of the metal back plate on the circuit board overlaps the projection of the heat sink on the circuit board.
In at least one embodiment, the second end is flat and has a first contact surface and a second contact surface, which are respectively in contact with the pressing block and the metal back plate.
In at least one embodiment, a heat conducting medium is disposed between the first contact surface and the compact, and/or a heat conducting medium is disposed between the second contact surface and the metal back plate.
In at least one embodiment, the pressing block and the second end are located between the metal back plate and the circuit board.
In at least one embodiment, the pressing block has a fixing portion and a pressing portion extending from the fixing portion, the fixing portion is fixed to the metal back plate, and the pressing portion presses the second end.
In at least one embodiment, the thickness of the fixing portion is greater than that of the pressing portion, a pressing space is formed between the pressing portion and the metal back plate, and the second end is located in the pressing space.
In at least one embodiment, the circuit board has a notch groove located at a side edge of the circuit board, the notch groove is open at the side edge, and the bending section passes through the notch groove.
When the heat sink absorbs heat in the heating area, the heat sink can not only dissipate heat by utilizing the heat dissipation efficiency, but also transfer heat energy to the metal back plate through the heat pipe, so that the metal back plate can perform air cooling heat dissipation by utilizing a large surface area, and the heat dissipation effect is enhanced. In addition, the metal back plate and the heat pipe are combined by the pressing block, so that the installation process can be simplified, and the reliability of the combination of the pressing block and the metal back plate is improved.
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
Drawings
Fig. 1 is an exploded perspective view of an embodiment of the present invention.
Fig. 2 is a perspective view of an embodiment of the present invention.
Fig. 3 is a cross-sectional view of an embodiment of the present invention.
Fig. 4 is a sectional exploded view of an embodiment of the present invention.
Fig. 5 is an exploded perspective view of another embodiment of the present invention.
Fig. 6 is an exploded perspective view of another embodiment of the present invention.
Wherein, the reference numbers:
100 circuit board heat dissipation assembly 110 circuit board
110a front side 110b back side
112 heating area 114 notch groove
116 column 120 heat sink
130 metal back plate 140 heat pipe
141 first end 142 second end
1421 first contact surface 1422 second contact surface
143 bending section 144 heat conducting medium
150 briquetting 152 fixed part
154 hold down 156 bolt
Detailed Description
Referring to fig. 1, fig. 2 and fig. 3, a circuit board heat dissipation assembly 100 according to an embodiment of the present invention includes a circuit board 110, a heat sink 120, a metal back plate 130, a heat pipe 140 and a press block 150.
As shown in fig. 1 and fig. 3, the circuit board 110 has a front surface 110a and a back surface 110 b. The front surface 110a has at least one heat-generating region 112. The heat generating region 112 is used to arrange heat generating elements such as electronic chips operating with high electric power. The electronic chip includes, but is not limited to, a central processing unit, a graphic processing unit, a system logic chip, or an On-board memory module. The circuit board 110 may be a motherboard, but is not excluded to be a circuit having other purposes.
As shown in fig. 1, 2 and 3, the heat sink 120 is disposed on the heat generating region 112 of the front surface 110a for contacting the heat generating components to absorb heat generated by the heat generating components for heat dissipation and cooling of the heat generating components. The heat sink 120 may be a fin heat sink having a plurality of heat dissipating fins, or a water cooling head of a water cooling system. The metal back plate 130 is disposed corresponding to the back surface 110b of the circuit board 110 and is disposed to maintain a spaced distance from the back surface 110b of the circuit board 110. The metal back plate 130 is generally parallel to the circuit board 110. In the embodiment of the present invention, the circuit board heat dissipation assembly 100 further includes a plurality of connecting posts 116, such as copper posts, and the connecting posts 116 are connected between the circuit board 110 and the metal back plate 130, so that the metal back plate 130 and the back surface 110b keep a spacing distance.
As shown in fig. 1, fig. 2 and fig. 3, the heat pipe 140 has a first end 141, a bent section 143 and a second end 142. The first end 141 is connected to the heat sink 120, the second end 142 contacts the metal back plate 130, and the bending section 143 is connected to the first end 141 and the second end 142 at an edge of the circuit board 110.
As shown in fig. 1, the heat pipe 140 formed by combining the first end 141, the bent section 143, and the second end 142 is U-shaped, and the bent section 143 is wound around the side edge of the circuit board 110, so that the first end 141 and the second end 142 are respectively located on the front surface 110a and the back surface 110b of the circuit board 110. The heat sink 120 is provided with a through hole, and the aperture of the through hole is slightly smaller than the outer diameter of the first end 141, so that the first end 141 can be tightly coupled to the heat sink 120 after being inserted into the through hole. The heat sink 120 may also be provided with a clamping mechanism for clamping the first end 141.
As shown in fig. 4, the heat pipe 140 may be first combined with the heat sink 120, such that the U-shaped opening faces the side edge of the circuit board 110, the heat sink 120 is placed in the heat generating region 112, and the second end 142 moves towards the metal back plate 130, such that the second end 142 is located between the metal back plate 130 and the circuit board 110.
As shown in fig. 1, 3 and 4, the pressing block 150 is located between the metal back plate 130 and the circuit board 110. The second end 142 of the heat pipe 140 is flat and has a first contact surface 1421 and a second contact surface 1422, which respectively contact the pressing block 150 and the metal back plate 130. Meanwhile, a heat conducting medium 144 is disposed between the first contact surface 1421 and the compact 150, and/or a heat conducting medium 144 is disposed between the second contact surface 1422 and the metal back plate 130. The aforementioned heat-conducting medium 144 includes, but is not limited to, a heat-conducting adhesive tape or a heat-conducting paste.
As shown in fig. 1, fig. 3 and fig. 4, the pressing block 150 has a fixing portion 152 and a pressing portion 154 extending from the fixing portion 152, the fixing portion 152 is used for fixing to the metal back 130, and the pressing portion 154 is used for pressing the second end 142. The thickness of the fixing portion 152 is greater than that of the pressing portion 154, a pressing space is formed between the pressing portion 154 and the metal back 130, and the second end 142 is located in the pressing space.
As shown in fig. 4, during installation, the pressing block 150 may be coupled to the metal back plate 130 by inserting the bolts 156 through the fixing portions 152 of the pressing block 150, but the bolts 156 are not locked temporarily, so that the pressing space between the pressing portion 154 and the metal back plate 130 is enlarged. Then, the second end 142 is inserted between the pressing portion 154 and the metal back plate 130, the fixing portion 152 of the pressing block 150 is fixed to the metal back plate 130 after the bolt 156 is tightened, and the pressing portion 154 presses the second end 142 against the metal back plate 130, so that a heat conduction path is formed between the heat pipe 140 and the metal back plate 130. The position of the pressing block 150 and the second end 142 is preferably located between the metal back plate 130 and the circuit board 110, so that the outer side surface of the metal back plate 130 is maintained in a non-protruding state; it is not excluded that the pressing block 150 and the second end 142 are located on the outer side of the metal back plate 130.
In addition, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the circuit board 110 has a notch groove 114 located at a side edge of the circuit board 110, and the notch groove 114 is open at the side edge. During installation, the bending section 143 can be horizontally moved into the notch groove 114, such that the bending section 143 passes through the notch groove 114 and the bending section 143 does not protrude out of the side edge. Therefore, the bending portion 143 can be disposed on any edge of the circuit board 110, such as beside the port assembly, without the position of the bending portion 143 being limited due to the protruding structure. Meanwhile, the notch groove 114 is easier to install the heat pipe 140 than a single hole, and does not limit the lengths of the first end 141 and the second end 142 of the heat pipe 140. If the U-shaped heat pipe 140 passes through the single hole, the lengths of the first end 141 and the second end 142 are limited, otherwise, the heat pipe 140 cannot pass through the hole during assembly, so that the first end 141 and the second end 142 are disposed on two sides of the circuit board 110.
In the present embodiment, the shape of the metal back plate 130 is substantially equal to the shape of the circuit board 110, that is, the metal back plate 130 covers the whole of the back surface 110b of the circuit board 110. The large size of the metal backplate 130 provides the maximum air cooling surface area.
As shown in fig. 5, in another embodiment, the area of the metal back plate 130 is smaller than that of the circuit board 110, so that the metal back plate 130 only covers a part of the back surface 110b of the circuit board 110. In this case, the heat sink 120 and the metal back plate 130 may be configured correspondingly, such that the projection of the metal back plate 130 on the circuit board 110 overlaps the projection of the heat sink 120 on the circuit board 110. In this case, the design of the heat pipe 140 can be simplified, so that the shape of the heat pipe 140 becomes a more common U shape, and the first end 141 and the second end 142 are equal in length.
As shown in fig. 6, in another embodiment, the area of the metal back plate 130 is smaller than the area of the circuit board 110, but the projection of the metal back plate 130 on the circuit board 110 does not necessarily completely overlap the projection of the heat sink 120 on the circuit board 110. In particular, the metal backplate 130 may be irregular, having indentations and openings. The concave gap and the opening can expose a part of the back surface 110b of the circuit board 110, so that the heat generating spot on the back surface 110b of the circuit board 110 is not covered by the metal back plate 130. In addition, the number of the metal back plates 130 or the number of the heat sinks 120 are not limited to one, and the circuit board heat dissipation assembly 100 may be configured with a plurality of metal back plates 130 or a plurality of heat sinks 120, and a plurality of metal back plates 130 or a plurality of heat sinks 120 may be connected to each other by using the heat pipes 140, and then one of the plurality of metal back plates 130 or the plurality of heat sinks 120 may be connected by using the heat pipes 140.
After the heat sink 120 absorbs heat in the heat generating region 112, in addition to utilizing the heat dissipation efficiency to dissipate heat, heat can also be transferred to the metal back plate 130 through the heat pipe 140, so that the metal back plate 130 utilizes a large surface area to perform air cooling heat dissipation, thereby enhancing the heat dissipation effect. In addition, the combination of the metal back plate 130 and the heat pipe 140 using the pressing block 150 can simplify the installation process and the reliability of the combination of the pressing block 150 to the metal back plate 130.
Of course, the present invention can have other embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present invention without departing from the spirit and the essence of the present invention, and these corresponding changes and modifications should fall within the protection scope of the claims of the present invention.
Claims (11)
1. A circuit board heat dissipation assembly, comprising:
the circuit board is provided with a front surface and a back surface, and the front surface is provided with at least one heating area;
a radiator arranged in the heating area;
a metal back plate, which is arranged at a spacing distance from the back surface of the circuit board;
a heat pipe having a first end, a bent section and a second end, wherein the first end is connected to the heat sink, the second end contacts the metal back plate, and the bent section is connected to the first end and the second end at one side edge of the circuit board; and
and the pressing block is fixed on the metal back plate and presses the second end to the metal back plate.
2. The circuit board heat dissipation assembly of claim 1, further comprising a plurality of connection posts, wherein the connection posts connect the circuit board to the metal back plate.
3. The circuit board heat dissipation assembly of claim 1, wherein the metal back plate covers the entire back surface of the circuit board.
4. The circuit board heat dissipation assembly of claim 1, wherein the metal back plate covers a portion of the back side of the circuit board.
5. The circuit board heat dissipation assembly of claim 4, wherein the projection of the metal back plate on the circuit board overlaps the projection of the heat sink on the circuit board.
6. The circuit board heat dissipation assembly of claim 1, wherein the second end is flat and has a first contact surface and a second contact surface contacting the press block and the metal back plate, respectively.
7. The circuit board heat dissipation assembly of claim 6, wherein a heat conducting medium is disposed between the first contact surface and the pressing block, and/or a heat conducting medium is disposed between the second contact surface and the metal back plate.
8. The circuit board heat dissipation assembly of claim 1, wherein the press block and the second end are located between the metal back plate and the circuit board.
9. The circuit board heat dissipation assembly of claim 1, wherein the pressing block has a fixing portion and a pressing portion extending from the fixing portion, the fixing portion is fixed to the metal back plate, and the pressing portion presses the second end.
10. The circuit board heat dissipation assembly of claim 9, wherein the thickness of the fixing portion is greater than the thickness of the pressing portion, a pressing space is formed between the pressing portion and the metal back plate, and the second end is located in the pressing space.
11. The circuit board heat dissipation assembly of claim 1, wherein the circuit board has a notch slot located at the side edge of the circuit board, and the notch slot is open at the side edge, and the bending portion passes through the notch slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920309393.2U CN209882215U (en) | 2019-03-12 | 2019-03-12 | Circuit board heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920309393.2U CN209882215U (en) | 2019-03-12 | 2019-03-12 | Circuit board heat dissipation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209882215U true CN209882215U (en) | 2019-12-31 |
Family
ID=68954643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920309393.2U Active CN209882215U (en) | 2019-03-12 | 2019-03-12 | Circuit board heat dissipation assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209882215U (en) |
-
2019
- 2019-03-12 CN CN201920309393.2U patent/CN209882215U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |