US20050199377A1 - Heat dissipation module with heat pipes - Google Patents

Heat dissipation module with heat pipes Download PDF

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Publication number
US20050199377A1
US20050199377A1 US11/053,616 US5361605A US2005199377A1 US 20050199377 A1 US20050199377 A1 US 20050199377A1 US 5361605 A US5361605 A US 5361605A US 2005199377 A1 US2005199377 A1 US 2005199377A1
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US
United States
Prior art keywords
heat
dissipation module
heat dissipation
fin assembly
seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/053,616
Inventor
Chi-Hung Chuang
Wen-Liang Hwang
Chao-Jung Chen
Hung-Chou Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quanta Computer Inc
Original Assignee
Quanta Computer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanta Computer Inc filed Critical Quanta Computer Inc
Assigned to QUANTA COMPUTER INC. reassignment QUANTA COMPUTER INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAN, HUNG-CHOU, CHEN, CHAO-JUNG, CHUANG, CHI-HUANG, HWANG, WEN-LIANG
Publication of US20050199377A1 publication Critical patent/US20050199377A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation module, and in particular to a heat dissipation module using heat pipes to increase heat transfer efficiency thereof.
  • Heat sinks are a common component in conventional heat dissipation modules.
  • Conventional heat sinks comprise aluminum extrusion type or copper adhering type, mounted directly on a chip or CPU and utilize the flow provided by preset passages or fans mounted thereon to dissipate heat.
  • heat sinks In order to increase stability of conventional severs, heat sinks must continue to dissipate heat even when some of system fans malfunction. Hence, there is a need for a better heat sink with higher heat dissipation efficiency for conventional barebone servers.
  • an object of the invention is to provide a heat sink with higher heat dissipation efficiency for conventional barebone servers.
  • the present invention provides a heat dissipation module with heat pipes.
  • the heat dissipation module comprises a seat with grooves, heat pipes and two fin assemblies.
  • the seat is disposed directly on a heat source.
  • the first fin assembly with parallel first fins is disposed on the seat, covering the grooves.
  • the second fin assembly with parallel second fins is disposed on a side of the first fin assembly.
  • Each heat pipe comprises a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.
  • the heat pipes are soldered in the grooves, perpendicular to the first and second fins.
  • the first fin assembly is soldered on the seat.
  • the second fin assembly is soldered on the cantilevered ends of the heat pipes.
  • the seat, heat pipes, first fin assembly and second fin assembly comprise copper or aluminum.
  • the heat dissipation module of the present invention utilizes heat pipes to transfer heat from a first fin assembly to an additional second fin assembly, increasing the effective area of the heat dissipation module.
  • the additional second fin assembly can be arranged in a residual area of a system or a position with better dissipation efficiency.
  • the first and second fin assemblies are connected by heat pipes, thus improving heat dissipation efficiency of the heat dissipation module and effectively utilizing the limited space provided in a conventional sever.
  • FIG. 1 is an exploded view of a heat dissipation module of present invention.
  • FIG. 2 is a schematic view of the heat dissipation module.
  • FIG. 1 is an exploded view of a heat dissipation module of the present invention.
  • the heat dissipation module 10 comprises a seat 20 , heat pipes 24 and two fin assemblies 30 , 40 .
  • the seat 20 is a metal plate directly disposed on a heat source 2 , such as a CPU, graphic chip or other chips.
  • the seat 20 comprises a plurality of parallel grooves 22 with width and depth similar to the bore diameter of the heat pipes 24 .
  • the heat pipes 24 are hollow elliptic pipes with low-pressure heat conductive liquid therein, transferring heat by convection.
  • the heat pipes 24 are secured in the grooves 22 at one end and protrudes from the grooves 22 .
  • the first fin assembly 30 is disposed on the seat 20 , covering the grooves 22 and heat pipes 24 , and comprises a plate 32 , a plurality of parallel first fins 34 and two fixing protectors 36 .
  • the first fins 34 are adhered or soldered on the plate 32 .
  • the fixing protectors 36 prevent damage to the edges of the first fins 34 .
  • the second fin assembly 40 comprises a plate 42 , a plurality of parallel second fins 44 and two fixing protectors 46 .
  • the second fins 44 are adhered or soldered on the plate 42 .
  • the fixing protectors 46 prevent damage to the edges of the second fins 44 .
  • Each second fin 44 has through holes 48 for access to the cantilevered ends of the heat pipes 24 , such that the second fin assembly 40 can be soldered thereon.
  • FIG. 2 shows the heat dissipation module of the invention.
  • the heat pipes 24 are first soldered in the grooves 22 , and solder is applied on the surface of the seat 20 and the cantilevered ends of the heat pipes 24 .
  • the first and second fin assemblies 30 , 40 are disposed on the seat 20 and the cantilevered ends of the heat pipes 24 .
  • the entire module 10 is place in an oven, securing the first and second fin assemblies 30 , 40 thereon by baking.
  • the heat dissipation module 10 is fixed on a printed circuit board 1 , the bottom surface of the seat 20 contacting the chip 2 , by the screws 28 passing through the openings 26 thereof.
  • the heat dissipation module 10 can dissipate heat generated by the chip 2 .
  • the seat 20 , heat pipes 24 , first and second fin assemblies 30 and 40 comprise copper or aluminum.
  • Conventional heat dissipation paste can be applied between the chip 2 and the seat 20 and in the grooves 22 to facilitate heat conduction.
  • the heat pipes 24 are perpendicular to the first fins 34 and second fins 44 , preventing obstruction of provided flow.
  • the heat pipes 24 can be directly soldered on the top surface of the seat 20 .
  • the plate 20 and the first fins 34 comprise notches, such that the first fin assembly 30 can be secured on the seat 20 without forming grooves 22 .
  • the additional second fin assembly 40 can be arranged in a residual area of a system or a position with better dissipation efficiency.
  • the first and second fin assemblies 30 and 40 are connected by heat pipes 24 , transferring heat, such that heat dissipation efficiency of the heat dissipation module 10 can be improved, and space inside a conventional severs can be utilized effectively.
  • the heat dissipation module 10 of present invention utilizes heat pipes 24 to transfer heat from the first to the second fin assembly, thus increasing heat dissipation efficiency and stability of conventional barebone servers.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is soldered to the seat, covering the grooves and heat pipes. A second fin assembly with parallel second fins is secured to the cantilevered end of the heat pipes.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat dissipation module, and in particular to a heat dissipation module using heat pipes to increase heat transfer efficiency thereof.
  • 2. Description of the Related Art
  • Presently, CPUs for conventional barebone servers consume excessive power and generate considerable heat. Space reserved inside the server for a heat dissipation module, however, is limited.
  • Heat sinks are a common component in conventional heat dissipation modules. Conventional heat sinks comprise aluminum extrusion type or copper adhering type, mounted directly on a chip or CPU and utilize the flow provided by preset passages or fans mounted thereon to dissipate heat. In order to increase stability of conventional severs, heat sinks must continue to dissipate heat even when some of system fans malfunction. Hence, there is a need for a better heat sink with higher heat dissipation efficiency for conventional barebone servers.
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the invention is to provide a heat sink with higher heat dissipation efficiency for conventional barebone servers.
  • Accordingly, the present invention provides a heat dissipation module with heat pipes. The heat dissipation module comprises a seat with grooves, heat pipes and two fin assemblies. The seat is disposed directly on a heat source. The first fin assembly with parallel first fins is disposed on the seat, covering the grooves. The second fin assembly with parallel second fins is disposed on a side of the first fin assembly. Each heat pipe comprises a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.
  • In a preferred embodiment, the heat pipes are soldered in the grooves, perpendicular to the first and second fins. The first fin assembly is soldered on the seat. The second fin assembly is soldered on the cantilevered ends of the heat pipes. The seat, heat pipes, first fin assembly and second fin assembly comprise copper or aluminum.
  • The heat dissipation module of the present invention utilizes heat pipes to transfer heat from a first fin assembly to an additional second fin assembly, increasing the effective area of the heat dissipation module.
  • Furthermore, the additional second fin assembly can be arranged in a residual area of a system or a position with better dissipation efficiency. The first and second fin assemblies are connected by heat pipes, thus improving heat dissipation efficiency of the heat dissipation module and effectively utilizing the limited space provided in a conventional sever.
  • A detailed description is given in the following embodiments with reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1 is an exploded view of a heat dissipation module of present invention; and
  • FIG. 2 is a schematic view of the heat dissipation module.
    • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 is an exploded view of a heat dissipation module of the present invention. In FIG. 1, the heat dissipation module 10 comprises a seat 20, heat pipes 24 and two fin assemblies 30, 40. The seat 20 is a metal plate directly disposed on a heat source 2, such as a CPU, graphic chip or other chips. The seat 20 comprises a plurality of parallel grooves 22 with width and depth similar to the bore diameter of the heat pipes 24. The heat pipes 24 are hollow elliptic pipes with low-pressure heat conductive liquid therein, transferring heat by convection. The heat pipes 24 are secured in the grooves 22 at one end and protrudes from the grooves 22.
  • The first fin assembly 30 is disposed on the seat 20, covering the grooves 22 and heat pipes 24, and comprises a plate 32, a plurality of parallel first fins 34 and two fixing protectors 36. The first fins 34 are adhered or soldered on the plate 32. The fixing protectors 36 prevent damage to the edges of the first fins 34.
  • The second fin assembly 40 comprises a plate 42, a plurality of parallel second fins 44 and two fixing protectors 46. The second fins 44 are adhered or soldered on the plate 42. The fixing protectors 46 prevent damage to the edges of the second fins 44. Each second fin 44 has through holes 48 for access to the cantilevered ends of the heat pipes 24, such that the second fin assembly 40 can be soldered thereon.
  • FIG. 2 shows the heat dissipation module of the invention. In FIGS. 1 and 2, when fabricating the heat dissipation module 10, the heat pipes 24 are first soldered in the grooves 22, and solder is applied on the surface of the seat 20 and the cantilevered ends of the heat pipes 24. The first and second fin assemblies 30, 40 are disposed on the seat 20 and the cantilevered ends of the heat pipes 24. The entire module 10 is place in an oven, securing the first and second fin assemblies 30, 40 thereon by baking. After fabrication, the heat dissipation module 10 is fixed on a printed circuit board 1, the bottom surface of the seat 20 contacting the chip 2, by the screws 28 passing through the openings 26 thereof. Thus, the heat dissipation module 10 can dissipate heat generated by the chip 2.
  • In order to increase the heat dissipation efficiency, the seat 20, heat pipes 24, first and second fin assemblies 30 and 40 comprise copper or aluminum. Conventional heat dissipation paste can be applied between the chip 2 and the seat 20 and in the grooves 22 to facilitate heat conduction. The heat pipes 24 are perpendicular to the first fins 34 and second fins 44, preventing obstruction of provided flow.
  • Furthermore, the heat pipes 24 can be directly soldered on the top surface of the seat 20. The plate 20 and the first fins 34 comprise notches, such that the first fin assembly 30 can be secured on the seat 20 without forming grooves 22.
  • The additional second fin assembly 40 can be arranged in a residual area of a system or a position with better dissipation efficiency. The first and second fin assemblies 30 and 40 are connected by heat pipes 24, transferring heat, such that heat dissipation efficiency of the heat dissipation module 10 can be improved, and space inside a conventional severs can be utilized effectively.
  • The heat dissipation module 10 of present invention utilizes heat pipes 24 to transfer heat from the first to the second fin assembly, thus increasing heat dissipation efficiency and stability of conventional barebone servers.
  • While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (18)

1. A heat dissipation module comprising:
a seat with a plurality of grooves, contacting a heat source;
a first fin assembly with a plurality of first fins disposed on the seat, covering the grooves;
a second fin assembly with a plurality of second fins disposed on a side of the first fin assembly; and
a plurality of heat pipes, each heat pipe comprising a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.
2. The heat dissipation module as claimed in claim 1, wherein the first fins are parallel.
3. The heat dissipation module as claimed in claim 1, wherein the second first fins are parallel.
4. The heat dissipation module as claimed in claim 1, wherein the first fins are perpendicular to the heat pipes.
5. The heat dissipation module as claimed in claim 1, wherein the second fins are perpendicular to the heat pipes.
6. The heat dissipation module as claimed in claim 1, wherein the heat pipes are soldered in the grooves.
7. The heat dissipation module 10 as claimed in claim 1, wherein the first fin assembly is soldered on the seat.
8. The heat dissipation module as claimed in claim 1, wherein the second fin assembly is soldered to the second ends of the heat pipes.
9. The heat dissipation module as claimed in claim 1, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.
10. A heat dissipation module comprising:
a seat;
a plurality of heat pipes disposed on the seat and extending from the seat, forming a plurality of cantilevered ends;
a first fin assembly with a plurality of first fins, disposed on the seat and covering the heat pipes; and
a second fin assembly with a plurality of second fins, secured at the cantilevered ends of the heat pipes.
11. The heat dissipation module as claimed in claim 10, wherein the first fins are parallel.
12. The heat dissipation module as claimed in claim 10, wherein the second first fins are parallel.
13. The heat dissipation module as claimed in claim 10, wherein the first fins are perpendicular to the heat pipes.
14. The heat dissipation module as claimed in claim 10, wherein the second fins are perpendicular to the heat pipes.
15. The heat dissipation module as claimed in claim 10, wherein the heat pipes are soldered on the seat.
16. The heat dissipation module as claimed in claim 10, wherein the first fin assembly is soldered on the seat.
17. The heat dissipation module as claimed in claim 10, wherein the second fin assembly is soldered to the cantilevered ends of the heat pipes.
18. The heat dissipation module as claimed in claim 10, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.
US11/053,616 2004-03-11 2005-02-08 Heat dissipation module with heat pipes Abandoned US20050199377A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW93106452 2004-03-11
TW093106452A TW200530549A (en) 2004-03-11 2004-03-11 Heat dissipating module with heat pipes

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070285897A1 (en) * 2006-06-08 2007-12-13 Ama Precision Inc. Thermal module with heat pipe
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080289799A1 (en) * 2007-05-23 2008-11-27 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US20110156568A1 (en) * 2009-12-31 2011-06-30 Shyh-Ming Chen Assembly of heat dissipating module

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921041A (en) * 1987-06-23 1990-05-01 Actronics Kabushiki Kaisha Structure of a heat pipe
US6021044A (en) * 1998-08-13 2000-02-01 Data General Corporation Heatsink assembly
US6102110A (en) * 1998-01-19 2000-08-15 Ferraz Date Industries Two-phase or mono-phase heat exchanger for electronic power component
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US20030019610A1 (en) * 2001-07-26 2003-01-30 Jefferson Liu Rapidly self - heat-conductive heat - dissipating module
US20040037039A1 (en) * 2002-07-12 2004-02-26 Takahiro Shimura Heat sink with fins and manufacturing method thereof
US20040114329A1 (en) * 2002-06-28 2004-06-17 Chen Shih-Tsung CPU heatsink fastener
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
US20040182552A1 (en) * 2001-07-31 2004-09-23 Yoshinari Kubo Heat sink for electronic devices and heat dissipating method
US6909608B2 (en) * 2003-02-25 2005-06-21 Datech Technology Co., Ltd. Heat sink assembly with heat pipe
US20050263265A1 (en) * 2004-05-26 2005-12-01 Hon Hai Precision Industry Co., Ltd. Heat dissipating device with heat pipe

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921041A (en) * 1987-06-23 1990-05-01 Actronics Kabushiki Kaisha Structure of a heat pipe
US6102110A (en) * 1998-01-19 2000-08-15 Ferraz Date Industries Two-phase or mono-phase heat exchanger for electronic power component
US6021044A (en) * 1998-08-13 2000-02-01 Data General Corporation Heatsink assembly
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US20030019610A1 (en) * 2001-07-26 2003-01-30 Jefferson Liu Rapidly self - heat-conductive heat - dissipating module
US20040182552A1 (en) * 2001-07-31 2004-09-23 Yoshinari Kubo Heat sink for electronic devices and heat dissipating method
US20040114329A1 (en) * 2002-06-28 2004-06-17 Chen Shih-Tsung CPU heatsink fastener
US20040037039A1 (en) * 2002-07-12 2004-02-26 Takahiro Shimura Heat sink with fins and manufacturing method thereof
US6956740B2 (en) * 2002-07-12 2005-10-18 The Furukawa Electric Co., Ltd. Heat sink with fins and manufacturing method thereof
US6909608B2 (en) * 2003-02-25 2005-06-21 Datech Technology Co., Ltd. Heat sink assembly with heat pipe
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
US20050263265A1 (en) * 2004-05-26 2005-12-01 Hon Hai Precision Industry Co., Ltd. Heat dissipating device with heat pipe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070285897A1 (en) * 2006-06-08 2007-12-13 Ama Precision Inc. Thermal module with heat pipe
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080289799A1 (en) * 2007-05-23 2008-11-27 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US20110156568A1 (en) * 2009-12-31 2011-06-30 Shyh-Ming Chen Assembly of heat dissipating module

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AS Assignment

Owner name: QUANTA COMPUTER INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHUANG, CHI-HUANG;HWANG, WEN-LIANG;CHEN, CHAO-JUNG;AND OTHERS;REEL/FRAME:016264/0745

Effective date: 20050106

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION