CN212965932U - Heat radiator for notebook computer - Google Patents
Heat radiator for notebook computer Download PDFInfo
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- CN212965932U CN212965932U CN202022052657.6U CN202022052657U CN212965932U CN 212965932 U CN212965932 U CN 212965932U CN 202022052657 U CN202022052657 U CN 202022052657U CN 212965932 U CN212965932 U CN 212965932U
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- heat dissipation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation device of a notebook computer, belonging to the technical field of heat dissipation fins, comprising a first heat dissipation module and a second heat dissipation module, wherein the first heat dissipation module comprises a first heat dissipation fan, a first heat pipe, a first heat dissipation plate and first heat dissipation fins; the second heat dissipation module comprises a second heat dissipation fan, a second heat pipe, a second heat dissipation plate and second heat dissipation fins; the inner section of the first heat pipe and the inner section of the second heat pipe are combined and connected together to form a combined section, the outer section of the first heat pipe penetrates through the first radiating fins, the outer section of the second heat pipe penetrates through the second radiating fins, the first radiating fins are arranged at the outlet of the first radiating fan, and the second radiating fins are arranged at the outlet of the second radiating fan; the first cooling plate and the second cooling plate are welded on the merging section, the first cooling plate is arranged on the GPU chip, and the second cooling plate is arranged on the CPU chip. The merging section of the scheme realizes uniform heat dissipation, avoids the situation of overheating on one side, improves the heat dissipation efficiency and ensures the good use performance of the whole machine.
Description
Technical Field
The utility model relates to a heat radiation fins technical field, in particular to heat abstractor of notebook computer.
Background
Aiming at two chips with highest power consumption in a notebook computer, namely a GPU chip and a CPU chip, two sets of heat dissipation modules are adopted by a heat dissipation fin of the traditional notebook computer to respectively dissipate heat of the GPU chip and the CPU chip, but the two sets of heat dissipation modules are mutually independent, so that the heat dissipation effects at two sides are different when the heat is not uniform, namely the heat dissipation is not uniform, and the scheme is developed for overcoming the defect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a notebook computer's heat abstractor realizes evenly dispelling the heat, improves the radiating efficiency, and simple structure, and is with low costs.
To achieve the above object, the solution of the present invention is: a heat sink for notebook computer comprises a first heat sink module and a second heat sink module;
the first heat dissipation module comprises a first heat dissipation fan, a first heat pipe, a first heat dissipation plate and first heat dissipation fins;
the second heat dissipation module comprises a second heat dissipation fan, a second heat pipe, a second heat dissipation plate and second heat dissipation fins;
the inner section of the first heat pipe and the inner section of the second heat pipe are combined and connected together to form a combined section, the outer section of the first heat pipe penetrates through the first radiating fins, the outer section of the second heat pipe penetrates through the second radiating fins, the first radiating fins are arranged at the outlet of the first radiating fan, and the second radiating fins are arranged at the outlet of the second radiating fan;
the first cooling plate and the second cooling plate are welded on the merging section, the first cooling plate is arranged on the GPU chip, and the second cooling plate is arranged on the CPU chip.
Further, the inner section of the first heat pipe and the inner section of the second heat pipe are located on the same horizontal line.
Further, the bottom of the first heat dissipation plate is provided with first heat conduction paste, the first heat dissipation plate is in contact with the GPU chip through the first heat conduction paste, the bottom of the second heat dissipation plate is provided with second heat conduction paste, and the second heat dissipation plate is in contact with the CPU chip through the second heat conduction paste.
Furthermore, spring plates are respectively arranged on the first heat dissipation plate and the second heat dissipation plate, and through holes for mounting bolts are formed in the outer ends of the spring plates.
After the scheme is adopted, the utility model discloses a gain effect lies in:
the merging section plays the most important role of balancing the heat on two sides, realizing uniform heat dissipation, avoiding the situation of overheating on one side, improving the heat dissipation efficiency, enabling the heat dissipation effect to be doubled with half the effort, thereby more easily taking away the heat generated by high power consumption in a limited space, protecting a GPU chip and a CPU chip from overheating, and ensuring the good use performance of the whole machine;
secondly, the rigidity of the whole structure is increased by the merging section, so that the whole structure is reliable and stable;
three, component part are this trade general piece, the utility model discloses structural optimal design at general, easy production, and manufacturing cost is lower.
Drawings
Fig. 1 is an exploded view of an embodiment of the present invention;
fig. 2 is a schematic isometric view of an embodiment of the present invention;
fig. 3 is a schematic front view of an embodiment of the present invention;
fig. 4 is a schematic back view of an embodiment of the present invention.
Description of reference numerals:
the heat dissipation module comprises a first heat dissipation module 1, a first heat pipe 11, a first heat dissipation plate 12, a first heat dissipation fin 13, a second heat dissipation module 2, a second heat pipe 21, a second heat dissipation plate 22, a second heat dissipation fin 23, a merging section 3, a GPU chip 4, a CPU chip 5, a first heat conduction paste 6, a second heat conduction paste 7, an elastic sheet 8 and a bolt 9.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 3, the present invention provides a heat dissipation device for a notebook computer, which includes a first heat dissipation module 1 and a second heat dissipation module 2;
the first heat dissipation module 1 includes a first heat pipe 11, a first heat dissipation plate 12, a first heat dissipation fin 13 and a first heat dissipation fan (not shown in the figure);
the second heat dissipation module 2 includes a second heat pipe 21, a second heat dissipation plate 22, a second heat dissipation fin 23, and a second heat dissipation fan (not shown);
the inner section of the first heat pipe 11 and the inner section of the second heat pipe 21 are bent relative to the outer section, the bent inner ends are combined and connected together to form a combined section 3, the outer section of the first heat pipe 11 penetrates through the first heat dissipation fins 13, the outer section of the second heat pipe 21 penetrates through the second heat dissipation fins 23, the first heat dissipation fins 13 are installed at the outlet of the first heat dissipation fan, and the second heat dissipation fins 23 are installed at the outlet of the second heat dissipation fan;
the first heat dissipation plate 12 and the second heat dissipation plate 22 are soldered on the merging section 3, and the first heat dissipation plate 12 is disposed on the GPU chip 4, and the second heat dissipation plate 22 is disposed on the CPU chip 5. In a preferred embodiment, as shown in fig. 4, the first heat dissipation plate 12 is provided with a first heat conductive paste 6 at the bottom, the first heat dissipation plate 12 is in contact with the GPU chip 4 through the first heat conductive paste 6, the second heat dissipation plate 22 is provided with a second heat conductive paste 7 at the bottom, and the second heat dissipation plate 22 is in contact with the CPU chip 5 through the second heat conductive paste 7.
The first heat pipe 11 and the second heat pipe 21 with the thickness of 1.5mm can be adopted in the scheme, the merging section 3 can be formed by overlapping and merging the inner section of the first heat pipe 11 and the inner section of the second heat pipe 21 or combining the inner sections of the first heat pipe 11 and the second heat pipe 21 in parallel, and because the notebook computer pursues an increasingly thin modeling trend, the inner sections of the first heat pipe 11 and the second heat pipe 21 are merged on the same horizontal line to consider the overall thickness, so that the merging section 3 of the first heat pipe 11 and the second heat pipe 21 does not increase the overall thickness on the premise of ensuring contact connection, and the development trend of extreme thinness is followed.
The working principle of the utility model is as follows: after the GPU chip 4 and the CPU chip 5 generate heat, the GPU chip 4 transfers heat to the first heat dissipation plate 12 through the first heat conductive paste 6, the CPU chip 5 transfers heat to the second heat dissipation plate 22 through the second heat conductive paste 7, then the first heat dissipation plate 12 and the second heat dissipation plate 22 quickly transfer heat to the first heat dissipation fins 13 and the second heat dissipation fins 23 through the first heat pipes 11 and the second heat pipes 21 with the thickness of 1.5mm, respectively, the first and second heat dissipation fans can take away heat at the ends of the fins 13 and 23, the merging section 3 plays the most important role of balancing heat at two sides, uniform heat dissipation is realized, the situation of overheating at one side is avoided, the heat dissipation effect is doubled with half effort, thereby the heat generated by high power consumption can be taken away more easily in a limited space, the GPU chip 4 and the CPU chip 5 are protected from overheating, and good service performance is ensured.
In order to facilitate installation, the first heat dissipation plate 12 and the second heat dissipation plate 22 are respectively provided with an elastic sheet 8, the outer end of the elastic sheet 8 is provided with a through hole for installing the bolt 9, and during installation, the elastic sheet 8 can elastically deform to prevent the heat dissipation plates from crushing the GPU chip 4 and the CPU chip 5.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the design of the present application, and all equivalent changes made according to the design key of the present application fall within the protection scope of the present application.
Claims (4)
1. A heat abstractor of notebook computer which characterized in that: comprises a first heat dissipation module and a second heat dissipation module;
the first heat dissipation module comprises a first heat dissipation fan, a first heat pipe, a first heat dissipation plate and first heat dissipation fins;
the second heat dissipation module comprises a second heat dissipation fan, a second heat pipe, a second heat dissipation plate and second heat dissipation fins;
the inner section of the first heat pipe and the inner section of the second heat pipe are combined and connected together to form a combined section, the outer section of the first heat pipe penetrates through the first radiating fins, the outer section of the second heat pipe penetrates through the second radiating fins, the first radiating fins are arranged at the outlet of the first radiating fan, and the second radiating fins are arranged at the outlet of the second radiating fan;
the first cooling plate and the second cooling plate are welded on the merging section, the first cooling plate is arranged on the GPU chip, and the second cooling plate is arranged on the CPU chip.
2. The heat dissipating device of a notebook computer as claimed in claim 1, wherein: the inner section of the first heat pipe and the inner section of the second heat pipe are positioned on the same horizontal line.
3. The heat dissipating device of a notebook computer as claimed in claim 1, wherein: the bottom of the first heat dissipation plate is provided with first heat conduction paste, the first heat dissipation plate is in contact with the GPU chip through the first heat conduction paste, the bottom of the second heat dissipation plate is provided with second heat conduction paste, and the second heat dissipation plate is in contact with the CPU chip through the second heat conduction paste.
4. The heat dissipating device of a notebook computer as claimed in claim 1, wherein: the first heat dissipation plate and the second heat dissipation plate are respectively provided with an elastic sheet, and the outer end of each elastic sheet is provided with a through hole for mounting a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022052657.6U CN212965932U (en) | 2020-09-18 | 2020-09-18 | Heat radiator for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022052657.6U CN212965932U (en) | 2020-09-18 | 2020-09-18 | Heat radiator for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212965932U true CN212965932U (en) | 2021-04-13 |
Family
ID=75370229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022052657.6U Active CN212965932U (en) | 2020-09-18 | 2020-09-18 | Heat radiator for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212965932U (en) |
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2020
- 2020-09-18 CN CN202022052657.6U patent/CN212965932U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation device for notebook computer Effective date of registration: 20220608 Granted publication date: 20210413 Pledgee: Xiamen SME Financing Guarantee Co.,Ltd. Pledgor: Xiamen liandaxing Technology Co.,Ltd. Registration number: Y2022980007356 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |