CN218601773U

CN218601773U - Double-layer heat conduction riveting direct-contact radiator

Info

Publication number: CN218601773U
Application number: CN202222887617.2U
Authority: CN
Inventors: 全文斌
Original assignee: Zhongshan Quanzhan Superconductor Technology Co ltd
Current assignee: Zhongshan Quanzhan Superconductor Technology Co ltd
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-03-10
Anticipated expiration: 2032-10-28

Abstract

The utility model discloses a double-layer heat conduction riveting direct-contact radiator, which comprises a heat radiation base, a heat radiation fin group and a heat conduction pipe group, wherein the heat conduction pipe group comprises an upper heat pipe group and a lower heat pipe group, the upper heat pipe group and the lower heat pipe group are arranged on the heat radiation base at intervals from top to bottom, and the lower end of the lower heat pipe group is flush and exposed at the bottom end of the heat radiation base; the heat conduction pipe set is divided into the upper heat pipe set and the lower heat pipe set, and the heat dissipation base is additionally provided with a plurality of heat pipes while the contact area of the heat conduction pipe set and a chip is not increased, so that the heat dissipation effect of the heat radiator can be improved; in addition, the lower end of the lower heat pipe set is exposed at the bottom end of the heat dissipation base in a flush mode, so that the heat pipes are in direct contact with the chip heating source, the heat dissipation efficiency and the heat dissipation effect are further improved, and the heat dissipation requirement on the high-performance high-power chip can be met.

Description

Double-layer heat conduction riveting direct-contact radiator

Technical Field

The utility model relates to a radiator technical field especially relates to a double-deck heat conduction riveting direct contact radiator.

Background

With the continuous development of electronic technology, the running speed of a computer is faster and faster, the working frequency of a Central Processing Unit (CPU) of a core part of the computer is higher and higher, more and more integrated circuits are expanded in a case, and the heat productivity and the power consumption of the case are increased accordingly. In recent CPU frequencies, the voltage used by the circuit is increased during overclocking, and the amount of heat generated is enormous. The rapid dissipation of such heat is an important issue for ensuring the stable operation of the computer.

Therefore, there is a need to design a double-layered heat-conducting riveting direct-contact heat sink capable of dissipating heat quickly to solve this problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a double-deck heat conduction riveting directly touches radiator, solve more than one problem among the above-mentioned background art.

In order to achieve the purpose, the utility model adopts the following scheme: a double-layer heat conduction riveting direct-contact radiator comprises a radiating base, a radiating fin group and a heat conduction pipe group, wherein the heat conduction pipe group comprises an upper heat pipe group and a lower heat pipe group, the upper heat pipe group and the lower heat pipe group are arranged on the radiating base at intervals from top to bottom, and the lower end of the lower heat pipe group is flush and exposed at the bottom end of the radiating base.

In some embodiments, the upper heat pipe set and the lower heat pipe set each include a heat absorption end connected to the heat dissipation base, and a condensation end connected to the heat dissipation sheet set.

In some embodiments, the upper end and the lower end of the heat dissipation base are both provided with an upper transverse groove and a lower transverse groove for fixedly mounting the heat absorption end.

In some embodiments, the notch extending directions of the upper transverse groove and the lower transverse groove are arranged to intersect with each other.

In some embodiments, the notch extending directions of the upper transverse groove and the lower transverse groove are parallel to each other.

In some embodiments, the number of heat pipes of the upper heat pipe set is 2-4.

In some embodiments, the number of heat pipes of the lower heat pipe set is 5-8.

In some embodiments, the condensation end is fixedly connected with the Fin group through a Fin-penetrating manner.

In some embodiments, the heat dissipation base is made of copper or aluminum alloy.

In conclusion, the beneficial effects of the utility model are that:

1. the heat conduction pipe set is divided into the upper heat pipe set and the lower heat pipe set, and the heat dissipation base is additionally provided with a plurality of heat pipes while the contact area of the heat conduction pipe set and a chip is not increased, so that the heat dissipation effect of the heat radiator can be improved;

2. in addition, the lower end of the lower heat pipe set is exposed at the bottom end of the heat dissipation base in a flush mode, so that the heat pipes are in direct contact with the chip heating source, the heat dissipation efficiency and the heat dissipation effect are further improved, and the heat dissipation requirement on the high-performance high-power chip can be met.

Drawings

Fig. 1 is a schematic structural view of the heat sink of the present invention.

FIG. 2 is a schematic view of the cross arrangement of the upper transverse groove and the lower transverse groove of the present invention;

FIG. 3 is a schematic view of the upper transverse groove and the lower transverse groove of the present invention disposed in parallel;

fig. 4 is a schematic structural view of one of the heat pipes according to the present invention.

Detailed Description

The following detailed description provides many different embodiments, or examples, for implementing the invention. Of course, these are merely embodiments or examples and are not intended to be limiting. In addition, repeated reference numbers, such as repeated numbers and/or letters, may be used in various embodiments. These iterations are provided for simplicity and clarity of the description of the invention, and are not intended to suggest any particular relationship between the various embodiments and/or structures discussed.

The invention will be further described with reference to the following description of the drawings and detailed description: the double-layer heat conduction riveting direct-contact radiator shown in fig. 1 to 4 comprises a heat radiation base 1, a heat radiation plate group 2 and a heat conduction plate group 3, wherein the heat conduction plate group 3 comprises an upper heat pipe group 4 and a lower heat pipe group 5, the upper heat pipe group 4 and the lower heat pipe group 5 are arranged on the heat radiation base 1 at an upper-lower interval, and the lower end of the lower heat pipe group 5 is flush and exposed at the bottom end of the heat radiation base 1.

Firstly, the heat conduction pipe set 3 is divided into the upper heat pipe set 4 and the lower heat pipe set 5, so that the heat dissipation base 1 is additionally provided with a plurality of heat pipes without increasing the contact area with a chip, and the heat dissipation effect of the heat sink can be improved.

In addition, the lower end of the lower heat pipe set 5 is exposed at the bottom end of the heat dissipation base 1 in a flush manner, so that the heat pipes are in direct contact with the chip heating source, the heat dissipation efficiency and the heat dissipation effect are further improved, and the heat dissipation requirement on the high-performance and high-power chip can be met.

The upper heat pipe set 4 and the lower heat pipe set 5 both comprise a heat absorption end 21 connected with the heat dissipation base 1 and a condensation end 22 connected with the heat dissipation sheet set 2.

The upper end and the lower end of the heat dissipation base 1 are both provided with an upper transverse groove 31 and a lower transverse groove 32 for fixedly mounting the heat absorption end 21.

The heat pipes of the upper heat pipe set 4 are arranged in the upper transverse groove 31, the heat pipes of the lower heat pipe set 5 are arranged in the lower transverse groove 32, the upper layer is rolled, and the lower layer is integrally formed by matching with a die.

Traditional pipe is pressed in fourth of twelve earthly branches can only be at the coplanar pressure heat pipe in fourth of twelve earthly branches because the reason of technical restriction, and the utility model discloses a two-layer two-sided fourth of twelve earthly branches pipe, the relatively welding cost is reduced at the bottom of the copper, and the relatively heat dispersion of ordinary individual layer fourth of twelve earthly branches pressure heat pipe improves to some extent, has solved high-power chip and has not used the problem of direct contact fourth of twelve earthly branches heat pipe radiator, and the protection chip can not burn out the phenomenon because of overheated.

Preferably, the notch extending directions of the upper transverse groove 31 and the lower transverse groove 32 are arranged in a mutually crossed manner, so that the upper and lower heat absorbing ends 21 are arranged in a crossed manner, the maximization of the effective heat dissipation heat absorbing area is ensured, the heat of the heat pipe of the lower heat pipe set 5 is taken away in the shortest time, the heat of the chip heating surface is not gathered, the direction of the bottom heat pipe is perpendicular to that of the top heat pipe, the heat is absorbed in a crossed manner, the chip heating surface dissipates heat without dead angles, the heat dissipating area of the upper heat pipe is also enlarged, a special optimization effect is realized for a chip with a smaller heating area of a heating body, and the heat absorbing surface of the upper layer can enable the whole heat dissipating base 1 to be effectively utilized.

And the double-layer crossed heat pipes can minimize the occupied space at the bottom of the radiator, so that the radiator is wider in applicability and stronger in compatibility.

In another embodiment, the notch extending directions of the upper transverse groove 31 and the lower transverse groove 32 are parallel to each other, so that the upper and lower heat absorbing ends 21 are arranged in parallel, the upper heat pipe set 4 of the structure can rapidly dissipate heat of the heat pipes of the lower heat pipe set 5 in the middle, but the heat of the heat pipes on two sides of the lower heat pipe set 5 cannot be taken away, and therefore, compared with the cross arrangement, the parallel arrangement is not good enough, but a better heat dissipation effect can be achieved compared with the traditional single-layer structure.

Furthermore, the number of the heat pipes of the upper heat pipe group 4 is 2-4, the number of the heat pipes can be increased or decreased according to the requirements of customers, the residual (heat) power of the FIN can be transmitted to the FIN in time to be consumed, and the chip can be ensured to operate stably and permanently.

Further, the number of the heat pipes of the lower heat pipe set 5 is 5-8.

Further, the condensation end 22 is fixedly connected with the Fin group 2 by a Fin penetrating manner.

In this embodiment, the heat dissipation base 1 is made of copper or aluminum alloy.

The basic principles and main features of the present invention and the advantages of the present invention are shown and described in conjunction with the drawings and above, and it should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only illustrative of the principles of the present invention, and the present invention can also have various changes and improvements, which fall within the scope of the claimed invention, without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a double-deck heat conduction is riveted and is pressed radiator directly, includes heat dissipation base (1), fin group (2) and heat conduction pipe group (3), its characterized in that: the heat conduction pipe set (3) comprises an upper heat pipe set (4) and a lower heat pipe set (5), the upper heat pipe set (4) and the lower heat pipe set (5) are arranged on the heat dissipation base (1) at intervals from top to bottom, and the lower end of the lower heat pipe set (5) is flush and exposed at the bottom end of the heat dissipation base (1).

2. The double-layer thermally conductive riveted direct contact heat sink of claim 1, wherein: the upper heat pipe set (4) and the lower heat pipe set (5) respectively comprise a heat absorption end (21) connected with the heat dissipation base (1) and a condensation end (22) connected with the heat dissipation sheet set (2).

3. The double-layer heat-conducting riveting direct-contact radiator according to claim 2, characterized in that: the upper end and the lower end of the heat dissipation base (1) are both provided with an upper transverse groove (31) and a lower transverse groove (32) which are used for fixedly mounting a heat absorption end (21).

4. The double-layer thermally conductive riveted direct contact heat sink of claim 3, wherein: the extending directions of the notches of the upper transverse groove (31) and the lower transverse groove (32) are mutually crossed.

5. The double-layer heat-conducting riveting direct-contact radiator according to claim 3, characterized in that: the notch extending directions of the upper transverse groove (31) and the lower transverse groove (32) are mutually parallel.

6. The double-layer thermally conductive riveted direct contact heat sink of claim 1, wherein: the number of the heat pipes of the upper heat pipe group (4) is 2-4.

7. The double-layer heat-conducting riveting direct-contact radiator according to claim 1, characterized in that: the number of the heat pipes of the lower heat pipe set (5) is 5-8.

8. The double-layer thermally conductive riveted direct contact heat sink of claim 2, wherein: and the condensation end (22) is fixedly connected with the radiating Fin group (2) in a Fin penetrating mode.

9. The double-layer heat-conducting riveting direct-contact radiator according to claim 1, characterized in that: the heat dissipation base (1) is made of copper or aluminum alloy.