CN217719578U

CN217719578U - MOS pipe radiator based on CPU mainboard structure

Info

Publication number: CN217719578U
Application number: CN202221948384.6U
Authority: CN
Inventors: 余波
Original assignee: Shenzhen Ferex Electronics Co ltd
Current assignee: Shenzhen Ferex Electronics Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2022-11-01
Anticipated expiration: 2032-07-25

Abstract

The application belongs to the technical field of computer heat dissipation, and discloses a MOS manages radiator based on CPU mainboard structure, and it is including being used for carrying out the fin of conduction to the heat that MOS pipe produced, the fin is installed in the terminal surface of keeping away from the CPU mainboard of MOS pipe, the fin can be dismantled with the CPU mainboard and be connected. This application has and absorbs the most heat that produces when the MOS pipe operation, and the surface of rethread fin and air contact distributes away the heat to play and carry out absorptive effect with the heat that the MOS pipe produced, strengthened the radiating effect of MOS pipe.

Description

MOS pipe radiator based on CPU mainboard structure

Technical Field

The application belongs to the technical field of computer heat dissipation, and relates to an MOS (metal oxide semiconductor) tube radiator based on a CPU (central processing unit) mainboard structure.

Background

The MOS tube is a metal-oxide-semiconductor (semiconductor) field effect transistor, and is used for matching with a voltage control distribution IC on a mainboard to perform DC-DC voltage conversion so as to provide stable power supply required by the work of a CPU, an internal memory, an onboard IC chip, an interface slot and the like. The MOS transistors in the computer motherboard structure are distributed near the CPU and installed on the CPU motherboard in two or three groups, or multi-phase combination.

In the related art, the MOS transistor mainly uses the surface of the MOS transistor to dissipate heat, but when the CPU is in operation, the CPU consumes a large amount of power and generates a large amount of heat, and the heat around the CPU is accumulated to increase the temperature, and a heat dissipation fan adapted to the CPU is used to dissipate the heat, which also requires a certain time to dissipate the heat. The MOS tube is arranged nearby the CPU in a scattered way, and the performance of the MOS tube and the heat dissipation of the MOS tube are influenced by the heat generated by the CPU.

Aiming at the related technical means, the defects that the heat dissipation effect of the MOS tube is poor and the performance of the MOS tube is influenced exist.

SUMMERY OF THE UTILITY MODEL

In order to improve the defect that the heat dissipation effect of an MOS tube is not good and the performance of the MOS tube is affected, the application provides an MOS tube radiator based on a CPU mainboard structure.

The application provides a MOS pipe radiator based on CPU mainboard structure adopts following technical scheme:

the utility model provides a MOS pipe radiator based on CPU mainboard structure, is including the fin that is used for carrying out the conduction to the heat that MOS pipe produced, the fin is installed in the terminal surface of keeping away from the CPU mainboard of MOS pipe and is hugged closely with the MOS pipe, the fin can dismantle with the CPU mainboard and be connected.

By adopting the technical scheme, the radiating fin is arranged on the upper end surface of the MOS tube, and heat generated by the MOS tube is conducted to the radiating fin from the surface of the MOS tube, so that most of heat generated by the MOS tube during operation is absorbed by the radiating fin, and then the heat is radiated out through the surface of the radiating fin contacted with air, so that the effect of conducting the heat generated by the MOS tube is achieved, the radiating effect of the MOS tube is enhanced, and the performance influence caused by heat accumulation is reduced; the radiating fin is positioned above the MOS tube and detachably connected with the CPU mainboard, so that the radiating fin can be conveniently replaced, and the MOS tube cannot be damaged when the radiating fin is replaced.

Optionally, the heat sink is provided with a connecting portion for contacting with the MOS tube, one end of the connecting portion close to the MOS tube is provided with a connecting plate, and the connecting plate is connected with the MOS tube through a bolt.

By adopting the technical scheme, the connecting plate increases the contact area between the radiating fin and the MOS tube, so that the mounting stability of the radiating fin is enhanced; simultaneously, the large-area connecting plate can conduct heat absorbed from the MOS tube to all parts of the radiating fins through the connecting part more quickly to conduct heat, and therefore the radiating effect of the MOS tube is improved.

Optionally, the heat sink is further provided with first heat dissipation fins for increasing the heat dissipation area, one ends of the connection portions, which are far away from the MOS tubes, are fixedly connected with the first heat dissipation fins, the first heat dissipation fins are provided with first heat dissipation grooves, and two ends of the first heat dissipation grooves are located at two ends of the first heat dissipation fins respectively.

By adopting the technical scheme, the contact area of the radiating fins and the air is increased by the first radiating fins, heat absorbed by the connecting part from the MOS tube is subjected to heat convection through the increased surface area of the first radiating fins, and the absorbed heat is dissipated into the air; the contact area of the first radiating fins and the air is further increased through the first radiating grooves, and the radiating effect of the first radiating fins is enhanced.

Optionally, the first heat dissipation fins are further provided with second heat dissipation grooves, one ends of the second heat dissipation grooves are located on one sides of the first heat dissipation fins, and the other ends of the second heat dissipation grooves are located in the middle of the first heat dissipation fins.

Through adopting above-mentioned technical scheme, the further area of contact that has increased first radiating fin and air of second radiating groove, during the same time quantum, can be faster through the inside heat of conducting to first radiating fin of fin in the air of scattering and disappearing through first radiating groove and second radiating groove, improved the efficiency of thermal convection to further reinforcing the radiating effect of fin.

Optionally, the connecting portion is provided with a bending region, the bending region is located between the connecting plate and the first heat dissipation fin, the connecting plate is located on one side of the connecting portion, and the first heat dissipation fin and the bending region enclose to form an accommodating cavity.

By adopting the technical scheme, on one hand, the bending area enables the surface area of the connecting part to be larger under the condition of ensuring that the radiator is at a specific height, the increased surface area is fully utilized to form heat convection, and absorbed heat is dissipated into air; when the cavity is accommodated in the other side and an external component on the CPU mainboard is accommodated in the accommodating cavity, the bending part enables a gap to be reserved between the connecting part and the external component, air enters the gap, and therefore heat of the radiator is taken away.

Optionally, one side of the bending area is provided with two second heat dissipation fins, and the second heat dissipation fins are located in the accommodating cavity.

By adopting the technical scheme, the connecting part conducts the heat absorbed from the MOS tube to the second radiating fin, and the second radiating fin increases the surface area of the radiating fin on one hand, so that the heat convection efficiency is improved; on the other hand, heat generated between the MOS tube and an external component is absorbed through the second radiating fin, and heat accumulation at the accommodating cavity is reduced.

Optionally, one side of the bending area, which is far away from the second heat dissipation fins, is provided with two third heat dissipation fins.

By adopting the technical scheme, the surface area of the radiating fin is further increased by the third radiating fin, the third radiating fin is combined with the first radiating fin and the second radiating fin, the connecting part dissipates the heat absorbed from the MOS tube into the air more quickly, and the radiating effect of the radiating fin is improved.

Optionally, the connecting plate further comprises a heat-conducting rubber pad, and the heat-conducting rubber pad is located between the MOS tube and the connecting plate.

By adopting the technical scheme, the heat conducting rubber pad can effectively conduct heat generated during the running of the MOS tube to the radiating fin and then is dissipated to the ambient air through the radiating fin, and the heat conducting rubber pad reduces heat accumulation between the radiating fin and the MOS tube, so that the performance of the MOS tube is normally exerted.

Optionally, the heat sink is made of an aluminum material.

By adopting the technical scheme, the aluminum material has the advantages of good corrosion resistance, ductility, heat conductivity, low cost and the like, the aluminum material can be extruded to form various shapes, and the radiator made of the aluminum alloy material has economical efficiency and decorative property.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the fin is installed in the up end of MOS pipe, and the heat that the MOS pipe produced conducts to the fin from the surface of MOS pipe to the fin absorbs the most heat that produces when the fin was managed to the MOS, and the surface of rethread fin and air contact distributes away the heat, thereby plays the effect that carries out the heat that the MOS pipe produced and conducts, has strengthened the radiating effect of MOS pipe, has reduced because the performance is influenced in the heat gathering.

2. The connecting part is provided with a bending area which is positioned between the connecting plate and the first radiating fin, so that on one hand, under the condition of ensuring that the radiator is at a specific height, the surface area of the connecting part is larger, the increased surface area is fully utilized to form heat convection, and the absorbed heat is dissipated into the air; when the cavity is accommodated in the other side and an external component on the CPU mainboard is accommodated in the accommodating cavity, the bending part enables a gap to be reserved between the connecting part and the external component, air enters the gap, and therefore heat of the radiator is taken away.

3. The first radiating fins, the second radiating fins and the third radiating fins are arranged, so that the contact area of the radiating fins and the air is increased, the heat absorbed by the connecting part from the MOS tube is subjected to heat convection through the increased surface area of the first radiating fins, the second radiating fins and the third radiating fins, the absorbed heat is dissipated into the air, and the radiating effect of the radiating fins is enhanced.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a MOS transistor heat sink based on a CPU motherboard structure according to the present application.

Fig. 2 is a structural cross-sectional view of a MOS tube heat sink based on a CPU board structure according to the present application.

Description of the reference numerals:

1. a heat sink; 11. a connecting portion; 111. a connecting plate; 112. a bending region; 12. a first heat radiation fin; 121. a first heat sink; 122. a second heat sink; 13. an accommodating chamber; 14. a second heat radiation fin; 15. a third heat radiation fin; 2. a heat-conducting rubber pad.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses MOS pipe radiator based on CPU mainboard structure.

Referring to fig. 1, an MOS tube radiator based on a CPU motherboard structure includes a heat dissipation fin 1 and a heat conductive rubber mat 2 for conducting heat generated by an MOS tube, where the heat conductive rubber mat 2 is located between the MOS tube and the heat dissipation fin 1 and is fixedly connected to the heat dissipation fin 1, and the heat dissipation fin 1 is installed on an end surface of the MOS tube far away from the CPU motherboard. The heat that the MOS pipe produced is from the surface of MOS pipe through heat conduction cushion 2, conduct to fin 1 on then, and most heat that fin 1 produced when moving to the MOS pipe absorbs, and the surface of rethread fin 1 and air contact distributes away the heat to the radiating effect of MOS pipe has been strengthened, has reduced because the performance is influenced in the heat gathering.

The heat conducting rubber pad 2 can effectively conduct heat generated during the running of the MOS tube to the radiating fin 1 and then is dissipated to the surrounding air through the radiating fin 1, and the heat conducting rubber pad 2 reduces heat accumulation between the radiating fin 1 and the MOS tube.

The heat sink 1 is provided with a connecting portion 11 for contacting the MOS tube, and one end of the connecting portion 11 near the MOS tube is provided with a connecting plate 111, and the connecting plate 111 is integrally formed with the connecting portion 11. The connecting plate 111 increases the contact area of the radiating fin 1 and the MOS tube, so that the mounting stability of the radiating fin 1 is enhanced; meanwhile, the large-area connecting plate 111 can conduct heat absorbed from the MOS transistor more quickly to each part of the heat sink 1 through the connecting portion 11. Connecting plate 111 is provided with the mounting hole, and the bolt is worn to establish the mounting hole and can be dismantled with the CPU mainboard and be connected, the change of the fin 1 of being convenient for, and can not produce the damage to the MOS pipe when changing fin 1.

The heat dissipation plate 1 is further provided with a first heat dissipation fin 12 for increasing the heat dissipation area, and one end, away from the MOS tube, of the connection portion 11 is fixedly connected with the first heat dissipation fin 12. In the present embodiment, the connecting portion 11 is integrally formed with the first heat dissipating fin 12. The first heat dissipation fins 12 increase the contact area between the heat dissipation plate 1 and the air, and the heat absorbed by the connection portion 11 from the MOS tube is subjected to heat convection through the increased surface area of the first heat dissipation fins 12, so that the absorbed heat is dissipated into the air.

The first heat dissipation fins 12 are provided with first heat dissipation grooves 121 and second heat dissipation grooves 122, two ends of the first heat dissipation grooves 121 are respectively located at two ends of the first heat dissipation fins 12, one ends of the second heat dissipation grooves 122 are located on one side of the first heat dissipation fins 12, and the other ends of the second heat dissipation grooves 122 are located in the middle of the first heat dissipation fins 12. The central axes of the first heat dissipation groove 121 and the second heat dissipation groove 122 are parallel, and the first heat dissipation groove 121 and the second heat dissipation groove 122 are provided in plurality. In the present embodiment, the first heat dissipation grooves 121 are provided in three, and the second heat dissipation grooves 122 are provided in seven. The contact area of the first heat dissipation fins 12 and the air is further increased by the first heat dissipation grooves 121 and the second heat dissipation grooves 122, and in the same period, the heat conducted to the first heat dissipation fins 12 through the inside of the heat dissipation plate 1 can be dissipated to the air through the first heat dissipation grooves 121 and the second heat dissipation grooves 122 more quickly, so that the heat convection efficiency is improved, and the heat dissipation effect of the heat dissipation plate 1 is further enhanced.

Referring to fig. 1 and 2, in order to ensure that the surface area of the connecting portion 11 is larger under the condition of a specific height of the heat sink, the connecting portion 11 is provided with a bending region 112, and the bending region 112 is located between the connecting plate 111 and the first heat dissipation fin 12, so that the surface area of the connecting portion 11 is larger, and heat convection is formed by making full use of the increased surface area, and absorbed heat is dissipated into the air.

In the present embodiment, the connection board 111 is located at one side of the connection portion 11, and the first heat dissipation fin 12 and the bending portion 112 enclose a receiving cavity 13 for receiving an external component on the CPU board. When the accommodating cavity 13 accommodates an external component on the CPU board, the bending portion makes a gap between the connecting portion 11 and the external component, so that air enters, thereby taking away heat of the heat sink.

One side of the bending area 112 is provided with two second radiating fins 14 and two third radiating fins 15, the second radiating fins 14 are located in the accommodating cavity 13, and the third radiating fins 15 are located on one side of the bending area 112 away from the second radiating fins 14. The surface area of the radiating fin 1 is increased by the second radiating fins 14 and the third radiating fins 15, the radiating fin 1 conducts heat absorbed from the MOS tube to each internal area, and the connecting part 11 is matched with the first radiating fins 12 to dissipate the heat absorbed from the MOS tube to the air more quickly, so that the radiating effect of the radiating fin 1 is improved. The heat generated between the MOS transistor and the external component is absorbed by the second heat dissipation fins 14, and the heat accumulation at the accommodating cavity 13 is reduced.

The heat sink 1 is made of aluminum. In this embodiment, the heat sink 1 is made of AL6063-T5 series aluminum alloy with a thermal conductivity of 209W/m-K, and 6063 aluminum alloy is a heat-treatable strengthened alloy with moderate strength in the aluminum-magnesium-silicon series, and belongs to six major series aluminum alloys. It has the advantages of light weight, high heat conductivity, corrosion resistance, easy processing, easy maintenance, low cost, beautiful appearance, etc. The surface of the heat radiating fin 1 is oxidized into iron gray, so that the aesthetic property and the decorative property of the heat radiating fin 1 are improved.

The implementation principle of the MOS pipe radiator based on the CPU mainboard structure in the embodiment of the application is as follows: the radiating fin 1 is installed in the up end of MOS pipe, and the heat that the MOS pipe produced conducts to the radiating fin 1 from the surface of MOS pipe, thereby the radiating fin 1 absorbs thereby most heat that the MOS pipe operation produced inside each part of conducting to radiating fin 1, and the rethread first radiating fin 12, second radiating fin 14 and third radiating fin 15 give off the heat to the air with the surface of air contact to the radiating effect of MOS pipe has been strengthened.

The foregoing is illustrative of the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, wherein like elements are designated by like reference numerals, it being understood that the words "left", "right", "upper" and "lower" as used in the foregoing description are intended to refer to the orientation as shown in the drawings. Therefore, the method comprises the following steps: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a MOS pipe radiator based on CPU mainboard structure, its characterized in that, is including being used for carrying out fin (1) of conduction to the heat that MOS pipe produced, fin (1) are installed in the terminal surface of keeping away from the CPU mainboard of MOS pipe and are hugged closely with the MOS pipe, fin (1) and CPU mainboard can dismantle the connection.

2. The MOS tube radiator based on the CPU main board structure of claim 1, wherein the heat sink (1) is provided with a connecting portion (11) for contacting with the MOS tube, one end of the connecting portion (11) near the MOS tube is provided with a connecting plate (111), and the connecting plate (111) is connected with the MOS tube through a bolt.

3. The MOS tube radiator based on the CPU mainboard structure of claim 2, wherein the heat sink (1) is further provided with first heat dissipating fins (12) for increasing a heat dissipating area, one end of the connecting portion (11) away from the MOS tube is fixedly connected with the first heat dissipating fins (12), the first heat dissipating fins (12) are provided with first heat dissipating grooves (121), and two ends of the first heat dissipating grooves (121) are respectively located at two ends of the first heat dissipating fins (12).

4. The MOS tube radiator based on the CPU board structure of claim 3, wherein the first heat dissipating fin (12) is further provided with a second heat dissipating groove (122), one end of the second heat dissipating groove (122) is located at one side of the first heat dissipating fin (12), and the other end of the second heat dissipating groove (122) is located at the middle of the first heat dissipating fin (12).

5. The MOS tube radiator based on the CPU mainboard structure of claim 3, wherein the connecting portion (11) is provided with a bending region (112), the bending region (112) is located between the connecting plate (111) and the first heat dissipation fin (12), the connecting plate (111) is located at one side of the connecting portion (11), and the first heat dissipation fin (12) and the bending region (112) enclose to form an accommodating cavity (13).

6. The MOS tube radiator based on the CPU main board structure of claim 5, wherein one side of the bending region (112) is provided with two second radiating fins (14), and the second radiating fins (14) are located in the accommodating cavity (13).

7. The MOS tube radiator based on the CPU main board structure of claim 6, wherein one side of the bending region (112) far away from the second heat dissipation fins (14) is provided with third heat dissipation fins (15), and the number of the third heat dissipation fins (15) is two.

8. The MOS tube radiator based on the CPU mainboard structure of claim 2, further comprising a heat conducting rubber pad (2), wherein the heat conducting rubber pad (2) is located between the MOS tube and the connecting plate (111).

9. The MOS tube radiator based on the CPU main board structure of claim 1, wherein the heat dissipation plate (1) is made of aluminum material.