CN209784927U

CN209784927U - Energy-saving cooling device for computer server

Info

Publication number: CN209784927U
Application number: CN201920547555.6U
Authority: CN
Inventors: 黎志
Original assignee: Chongqing Gouzheng Data Technology Co Ltd
Current assignee: Chongqing Gouzheng Data Technology Co Ltd
Priority date: 2019-04-19
Filing date: 2019-04-19
Publication date: 2019-12-13
Anticipated expiration: 2029-04-19

Abstract

The utility model belongs to the technical field of computer servers, and particularly discloses an energy-saving cooling device for a computer server, which comprises a plurality of fins, wherein the fins are meandered along the length direction to form a wave shape, and each fin is obliquely provided with a ventilation hole; the heat sink also comprises a first memory alloy spring which is connected with the heat sink. The utility model aims at solving the problem that the current radiator energy consumption is high.

Description

Energy-saving cooling device for computer server

Technical Field

The utility model belongs to the technical field of computer server, specifically disclose energy-saving heat sink of computer server.

Background

Servers, also known as servers, are devices that provide computing services. The server is constructed to include a processor, a hard disk, a memory, a system bus, etc., similar to a general-purpose computer architecture, but requires high processing power, stability, reliability, security, scalability, manageability, etc., due to the need to provide highly reliable services.

The server is mainly composed of various electronic elements, each electronic element is responsible for functions such as storage, calculation and the like, meanwhile, heat productivity of part of the electronic elements is large, and equipment such as a radiator and the like needs to be installed to conduct heat dissipation and cooling treatment on the electronic elements, so that the electronic elements can work normally. The existing radiator generally comprises a fan and radiating fins, the fan and the radiating fins are arranged in a shell of a server, the server is cooled through the fan, meanwhile, the radiating fins are generally arranged in the server, and heat absorption capacity and heat conduction capacity of the radiating fins are good, so that heat in electronic elements can be absorbed and dissipated into the air rapidly. Because the electronic elements in the server are numerous and the number of required radiating fins is large, the space occupancy rate in the whole server is high and the air circulation effect is poor; for this reason, the existing fans are high in power, high in energy consumption and high in noise.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an energy-saving heat sink of computer server to solve the problem that current radiator energy consumption is high.

In order to achieve the above object, the basic scheme of the utility model is:

The energy-saving cooling device for the computer server comprises a cooling fin, wherein the cooling fin comprises a plurality of fins, the fins are meandered along the length direction to form a wave shape, and each fin is obliquely provided with a ventilation hole; the heat sink also comprises a first memory alloy spring which is connected with the heat sink.

The working principle and the beneficial effects of the basic scheme are as follows:

1. When the fin sets up to the wave, its surface area is big, the time of contact air is long, the radiating effect is better, sets up the ventilation hole, and the ventilation hole also can increase the surface area of fin, and the ventilation hole can communicate the clearance between each fin simultaneously, makes the air in each clearance can flow each other, and the heat is more even, the radiating effect is better.

2. In the scheme, the first memory alloy spring can extend or shorten under the condition of temperature change, so that the lengths of the first memory alloy spring at different temperatures are different, the positions of the radiating fins are also different, and the radiating fins can radiate different electronic components. Therefore, a plurality of radiating fins are not needed to meet the radiating requirement of a plurality of electronic elements, meanwhile, the residual space in the case is large, the air flow efficiency is high, the requirement on the fan power is reduced, the energy consumption and the noise of the fan are reduced, and the radiating effect and the radiating efficiency are also ensured.

Further, still include quick-witted case and fan, fin and fan all set up in quick-witted case, the fan is located one side of fin. This scheme of adoption, the fan can blow off hot-air quick-witted case, reduces quick-witted incasement portion's temperature.

Further, the vent hole is inclined along the length direction of the fin at an angle of 30 ° to 80 °. This scheme of adoption, the inclination in ventilation hole is big more, and the surface area of fin is big more.

Further, the inclination angle of the vent holes is 70 °. This scheme of adoption, the inclination in ventilation hole is enough big, can increase the surface area of fin as far as.

Furthermore, the vent hole is provided with an air deflector which is parallel to the vent hole. This scheme of adoption, the aviation baffle can intercept partly air current to in with the leading-in ventilation hole of air current.

Furthermore, a contact layer is arranged on the fin and is in contact with the electronic element. This scheme of adoption touches the heat conduction effect on layer good, can be more fast with the leading-in fin of the heat on the electronic component.

furthermore, a rail is arranged in the case, the radiating fins are arranged on the rail in a sliding mode, and one end of the second memory alloy spring is connected with the inside of the case. This scheme of adoption, the fin can slide on the track.

Further, the cooling fin further comprises a base, the base is arranged on the rail in a sliding mode, the fins are arranged on the base in a sliding mode, second memory alloy springs are arranged on two sides of each fin, and the second memory alloy springs are connected with the adjacent fins. This scheme of adoption, the distance between two adjacent fins can be adjusted to the second memory alloy spring, and the radiating efficiency of fin can be adjusted in the clearance that increases or reduces between two fins.

furthermore, a plurality of connecting columns are vertically arranged in the vent holes. This scheme of adoption, the spliced pole can play the supporting role, improves the intensity of fin.

Further, the connecting column and the fins are integrally formed. This scheme of adoption is convenient for make the fin.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present invention;

fig. 2 is an enlarged view of a point a in fig. 1.

Detailed Description

The following is further detailed by way of specific embodiments:

Reference numerals in the drawings of the specification include: the air conditioner comprises a track 1, a base 2, a groove 3, a sliding chute 4, a sliding block 5, a fin 6, a vent hole 7, an air deflector 8, a first memory alloy spring 9, a second memory alloy spring 10 and a fan 11.

The embodiment is basically as shown in the attached figures 1 and 2:

The energy-saving cooling device for the computer server comprises a radiating fin, a fan 11, a track 1 and a first memory alloy spring 9, wherein the radiating fin, the fan 11, the track 1 and the first memory alloy spring are arranged in a case. Track 1 and fan 11 are all fixed to be set up in quick-witted incasement, and the fin includes base 2 and fin 6, has seted up recess 3 on the base 2, has seted up spout 4 on two lateral walls of recess 3, the bottom and the recess 3 sliding contact of fin 6, and the fixed slider 5 that is equipped with in lateral wall bottom of fin 6, slider 5 sliding connection are in spout 4, and slider 5 is the cuboid. A gap is formed between every two adjacent fins 6, the gap is aligned with the fan 11, and the fins 6 are meandered along the length direction to form a wave shape; a contact layer is fixedly arranged on the upper end surface of the fin 6 and is made of heat-conducting silica gel; the fin 6 is vertically provided with a plurality of ventilation holes 7, two adjacent through holes in the length direction of the fin 6 are staggered, the ventilation holes 7 are horizontally arranged and incline to 70 degrees towards one end far away from the fan 11, a plurality of connecting columns are integrally formed in the ventilation holes 7, an air deflector 8 is fixedly arranged on one side of the ventilation holes 7, and the air deflector 8 is parallel to the ventilation holes 7. Wherein, the base 2, the fins 6, the air deflector 8, the slider 5 and the connecting column are made of the same material. Two adjacent fins 6 are connected by a second memory alloy spring 10, and the second memory alloy spring 10 is not arranged on the outer sides of the leftmost and rightmost fins 6. The first memory alloy spring 9 and the second memory alloy spring 10 are both made of CuZnAl memory alloy wires, one end of the first memory alloy spring 9 is fixedly connected with the inner wall of the case, and the other end of the first memory alloy spring is fixedly connected with the base 2. The first memory alloy spring 9 is set to be gradually shortened when the temperature reaches 70-80 ℃; the second memory alloy spring 10 is set to be gradually extended when the temperature reaches 70-80 c.

When the first memory alloy spring 9 is in a natural state, the heat sink is located below the electronic component with the largest heat generation amount, and the contact layer is close to but not in contact with the electronic component. The first memory alloy spring 9 and the second memory alloy spring 10 are both two-way memory alloys.

The specific implementation process is as follows:

The fan 11 is started to form airflow, the airflow blows the fins 6 and takes away heat on the fins 6, when the temperature of the first memory alloy is lower than 70 ℃, the first memory alloy is in a natural state, and the radiating fins are located below the electronic component with the largest heating value and perform radiating treatment on the electronic component. If the temperature of the first memory alloy is higher than 70 ℃, because the first memory alloy spring 9 is positioned on the side surface of the heat sink, the temperature of the first memory alloy is higher than 70 ℃, which indicates that the temperature of the side surface of the heat sink is too high and heat dissipation treatment is needed, at the moment, the first memory alloy is gradually shortened, and the heat sink gradually moves to a position with high temperature and improves the heat dissipation effect at the position. Meanwhile, when the temperature of the second memory alloy spring 10 is high and the pressure is 70 ℃, the second memory alloy spring 10 extends, gaps between the fins 6 are enlarged, the air flowing effect is better, and the efficiency of hot air dissipation is better.

In the embodiment shown in fig. 1, only three fins 6 are shown, and the heat sink is not represented by only three fins 6, and the number of fins 6 can be increased or decreased according to the needs of the user.

the above description is only an example of the present invention, and the common general knowledge of the known specific structures and characteristics of the embodiments is not described herein. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.

Claims

1. Energy-saving heat sink of computer server, including the fin, the fin includes a plurality of fins, its characterized in that: the fins are sinuous along the length direction to form a wave shape, and each fin is obliquely provided with a vent hole; the heat sink also comprises a first memory alloy spring which is connected with the heat sink.

2. The computer server energy saving cooling device according to claim 1, wherein: the fan-type air conditioner further comprises a case and a fan, wherein the radiating fins and the fan are arranged in the case, and the fan is located on one side of the radiating fins.

3. the computer server energy saving cooling device according to claim 2, wherein: the vent hole inclines along the length direction of the fin, and the inclination angle is 30-80 degrees.

4. The computer server energy saving cooling device of claim 3, wherein: the inclination angle of the vent holes is 70 °.

5. The computer server energy saving cooling device of claim 4, wherein: and the air guide plate is arranged on the air vent and is parallel to the air vent.

6. The computer server energy saving cooling device of claim 5, wherein: the fins are provided with contact layers which are in contact with the electronic elements.

7. The computer server energy saving cooling device according to claim 1, wherein: a rail is arranged in the case, the radiating fins are arranged on the rail in a sliding mode, and one end of the second memory alloy spring is connected with the inside of the case.

8. The computer server energy saving cooling device of claim 7, wherein: the heat radiating fin further comprises a base, the base is arranged on the rail in a sliding mode, the fins are arranged on the base in a sliding mode, a second memory alloy spring is arranged on each of two sides of each fin, and the second memory alloy springs are connected with the adjacent fins.

9. The computer server energy saving cooling device of claim 8, wherein: a plurality of connecting columns are vertically arranged in the ventilation holes.

10. The computer server energy saving cooling device of claim 9, wherein: the connecting column and the fins are integrally formed.