CN202975955U - Radiating device for CPU (Central Processing Unit) - Google Patents
Radiating device for CPU (Central Processing Unit) Download PDFInfo
- Publication number
- CN202975955U CN202975955U CN2012206516462U CN201220651646U CN202975955U CN 202975955 U CN202975955 U CN 202975955U CN 2012206516462 U CN2012206516462 U CN 2012206516462U CN 201220651646 U CN201220651646 U CN 201220651646U CN 202975955 U CN202975955 U CN 202975955U
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- China
- Prior art keywords
- cpu
- heating radiator
- radiator
- heat
- fan
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiating device for a CPU (Central Processing Unit). The radiating device is characterized in that a position used for installing a fan is arranged on a radiator, and ribs at the position are hollowed out; the rib hollowed-out position and the CPU are non-correspondingly arranged at a set distance, and radiator ribs above the CPU are kept; and the fan is arranged at the hollowed-out position of the radiator, and a heat conducting pad is stuck on the part, to be in contact with the CPU, of the bottom surface of the radiator. The radiating method of the radiating device provided by the utility model mainly comprises the following steps that heat generated by the CPU and other power consumption chips passes through the heat conducting pad through a heat conducting mode and then are conducted to a substrate of the radiator, and then the heat is further conducted to the radiator ribs, and finally the heat is taken away along gaps between the ribs by cold air blown by the fan, so that the temperature of the CPU can be greatly reduced to realize the radiating of the CPU.
Description
Technical field
The utility model relates to the electronic equipment dissipating heat technical field, particularly relates to a kind of CPU heat abstractor.
Background technology
Along with the function of electronic equipment is more and more, to CPU(Central Processing Unit, central processing unit) requirement of processor is more and more higher.Heat radiation to CPU in wide temperature range has proposed Secretary.The radiating mode of CPU mainly contains at present: 1, forced air cooling heat radiation; 2, conduction cooling heat radiation.The little flat-type electronic product of business level and thermal value adopts the radiating mode of conduction cooling heat radiation that CPU is dispelled the heat more, and the general using fans such as the desktop computer that thermal value is large, industrial control equipment add the mode forced air cooling heat radiation of heating radiator.Also do not have in a kind of ready-made particular space scope that can satisfy Flat electronic equipment at present, solve the heat abstractor of 45w power consumption CPU.
The utility model content
The technical problems to be solved in the utility model is a kind of CPU heat abstractor, the problems referred to above that exist in order to solve prior art.
For solving the problems of the technologies described above, the utility model provides a kind of CPU heat abstractor, comprising:
Be provided for the position of provided with fan on heating radiator, the fin of this position is emptied; Empty position and the CPU offset control distance of fin, with the heating radiator fin reservation of CPU top; Fan is installed on the position of emptying of heating radiator, sticks heat conductive pad in the heating radiator bottom surface with the place that CPU will contact.
Further, the aerofoil fan of frame around fan is selected and do not had.
Further, the fin of heating radiator is horizontal, bar shaped fin.
Further, be provided with several longitudinal ventilation grooves on heating radiator.
Further, the position of the corresponding internal memory of heating radiator is emptied, and the heating radiator substrate of the position of emptying exists.
Further, fixed leg and the heating radiator used of installation of heat radiator is structure as a whole.
The utility model beneficial effect is as follows:
To be mainly the heat that produces on CPU and other power consumption chips conduct to the heating radiator substrate by heat conducting mode after through heat conductive pad (or heat-conducting silicone grease) to the utility model radiating mode, then further conduct to heat radiator fin, the cold wind that is blown by fan is at last taken away along the fin gap, can greatly reduce the temperature of CPU, realize the heat radiation of CPU.
Description of drawings
Fig. 1 is the structural representation of a kind of front of CPU heat abstractor in the utility model embodiment;
Fig. 2 is the structural representation of a kind of back of CPU heat abstractor in the utility model embodiment;
Fig. 3 is the structural representation of heating radiator in the utility model embodiment;
Fig. 4 is the rear view of Fig. 3;
Fig. 5 is the right view of Fig. 3.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, does not limit the utility model.
As shown in Figure 1, 2, the utility model embodiment relates to a kind of CPU heat abstractor, comprising: fan 1, the position is emptied in the centre that is installed on heating radiator 2, sticks heat conductive pad 3 in heating radiator 2 bottom surfaces with the place that CPU will contact.Radiating mode be the heat of generation of CPU and other power consumption chips by heat conducting mode through after heat conductive pad 3, conduct to the substrate of heating radiator 2, then conduct to the fin of heating radiator 2, the cold wind of being blowed heating radiator 2 fins by fan 1 is at last taken away.The aerofoil fan 1 of frame around fan 1 is selected and do not had can guarantee that like this fan 1 can dry to surrounding, and fan 1 is towards heating radiator 2 blowings, and cold wind heating radiator 2 fins of flowing through are taken away heat.
As shown in Fig. 3 ~ 5, for the air channel layout of the whole product of correspondence, the fin of heating radiator 2 is horizontal, bar shaped fin.In order to save the space of thickness short transverse, be provided for the position 4 of installation shaft flow fan 1 on heating radiator 2, the fin at these 4 places, position is emptied.Empty fin position 4 can not with the CPU corresponding position, the certain distance of should setovering keeps the heating radiator fin of CPU top, with the heat-sinking capability of heat radiation device 2.Heating radiator one side shown in Fig. 2 has increased several longitudinal ventilation grooves 5, the cold wind that the guarantees aerofoil fan more heating radiator fin of flowing through, thereby heat can be taken away by cold wind, promoted the heat-sinking capability of heating radiator 2.Can the meeting spatial installation requirements for the ease of heating radiator 2,7 places, position of heating radiator 2 corresponding internal memories are emptied, must guarantee the existence of heating radiator substrate after emptying, the heat of heating radiator substrate storage could conduct to the fin above substrate faster.The effect of substrate is the heat of storage area CPU, and is passed to fin corresponding in substrate.If there is no substrate under fin, fin will lose the effect of heat radiation.Be deformed at last special-shaped radiator.Fixed leg 6 and the heating radiator 2 of installation of heat radiator 2 use are structure as a whole, and form by Milling Process, have improved the contact gap precision of the chips such as heating radiator and CPU.
As can be seen from the above-described embodiment, to be mainly the heat that produces on CPU and other power consumption chips conduct to the heating radiator substrate by heat conducting mode after through heat conductive pad or heat-conducting silicone grease to the utility model radiating mode, then further conduct to heat radiator fin, the cold wind that is blown by fan is at last taken away along the fin gap, can greatly reduce the temperature of CPU, realize the heat radiation of CPU.
Although be the example purpose, preferred embodiment of the present utility model is disclosed, it is also possible those skilled in the art will recognize various improvement, increase and replacement, therefore, scope of the present utility model should be not limited to above-described embodiment.
Claims (6)
1. a CPU heat abstractor, is characterized in that, comprising:
Be provided for the position (4) of provided with fan (1) on heating radiator (2), the fin that this position (4) are located is emptied; Empty the position (4) and CPU offset control distance of fin, with the heating radiator fin reservation of CPU top;
Fan (1) is installed on the position (4) of emptying of heating radiator (2) and locates, and sticks heat conductive pad (3) in heating radiator (2) bottom surface with the place that CPU will contact.
2. CPU heat abstractor as claimed in claim 1, is characterized in that, the aerofoil fan of frame around fan (1) is selected and do not had.
3. CPU heat abstractor as claimed in claim 1 or 2, is characterized in that, the fin of heating radiator (2) is horizontal, bar shaped fin.
4. CPU heat abstractor as claimed in claim 3, is characterized in that, is provided with several longitudinal ventilation grooves (5) on heating radiator (2).
5. CPU heat abstractor as claimed in claim 4, is characterized in that, the position (7) of the corresponding internal memory of heating radiator (2) is located to empty, and heating radiator (2) substrate that the position of emptying (7) are located exists.
6. CPU heat abstractor as claimed in claim 5, is characterized in that, the fixed leg (6) of installation of heat radiator (2) use is structure as a whole with heating radiator (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206516462U CN202975955U (en) | 2012-11-30 | 2012-11-30 | Radiating device for CPU (Central Processing Unit) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206516462U CN202975955U (en) | 2012-11-30 | 2012-11-30 | Radiating device for CPU (Central Processing Unit) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202975955U true CN202975955U (en) | 2013-06-05 |
Family
ID=48517007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206516462U Expired - Fee Related CN202975955U (en) | 2012-11-30 | 2012-11-30 | Radiating device for CPU (Central Processing Unit) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202975955U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318250A (en) * | 2017-08-08 | 2017-11-03 | 西安交通大学 | A kind of ion wind forced convertion fin for dissipation from electronic devices |
| CN112312750A (en) * | 2020-11-27 | 2021-02-02 | 天津七一二通信广播股份有限公司 | Heat dissipation device of PCIE interface private network module and implementation method |
-
2012
- 2012-11-30 CN CN2012206516462U patent/CN202975955U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318250A (en) * | 2017-08-08 | 2017-11-03 | 西安交通大学 | A kind of ion wind forced convertion fin for dissipation from electronic devices |
| CN112312750A (en) * | 2020-11-27 | 2021-02-02 | 天津七一二通信广播股份有限公司 | Heat dissipation device of PCIE interface private network module and implementation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20171130 |
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| CF01 | Termination of patent right due to non-payment of annual fee |