CN201476667U - Thermal pipe type radiation fin capable of enlarging radiation areas - Google Patents
Thermal pipe type radiation fin capable of enlarging radiation areas Download PDFInfo
- Publication number
- CN201476667U CN201476667U CN2009201590369U CN200920159036U CN201476667U CN 201476667 U CN201476667 U CN 201476667U CN 2009201590369 U CN2009201590369 U CN 2009201590369U CN 200920159036 U CN200920159036 U CN 200920159036U CN 201476667 U CN201476667 U CN 201476667U
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- heat pipe
- radiating fin
- dissipation
- shape plate
- type radiating
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Abstract
A thermal pipe type radiation fin capable of enlarging radiation areas comprises a flat plate and at least one wave-shaped plate. The wave-shaped plate presents concave or raised fluctuation relative to the flat plate, and the fluctuation is arranged on the flat plate. The wave-shaped plate which is taken in the concave or raised fluctuation has more surface areas relative to the flat plate for being convenient for enhancing the heat exchange efficiency between the thermal pipe type radiation fin and the air.
Description
Technical field
The utility model belongs to a kind of radiating fin, refers to a kind of heat pipe-type radiating fin that increases area of dissipation especially, and it has crooked position and has more surface area so that the heat exchanger effectiveness of enhancement and air than the flat part.
Background technology
Because semiconductor technology is advanced by leaps and bounds, present not only computing frequency of computer processor chip climbs up and up, inner number of transistors is also grown up with multiple, causes the chip heating power constantly to rise violently, and therefore radiator being set on chip is habitual heat radiation way already.
Existing radiator has air cooling and two kinds of big classes of water-cooled, and the former dispels the heat by cross-ventilation, is the radiator kind of popularizing the most at present.Again, a kind of heat pipe-type radiating fin that can promote heat conduction efficiency is arranged again among the air cooling heat radiator, promptly is to run through plurality of radiating fins with plural heat pipe, sees through the capillarity of the fluid of inside heat pipe, can make heat prolong heat pipe rapidly and be delivered on each radiating fin, to promote radiating efficiency.
Among the above-mentioned heat-pipe type radiator, because the heat conduction efficiency of heat pipe is high, the bottleneck that therefore dispels the heat often is the heat exchanger effectiveness of radiating fin and air, and often depends on the surface area size of radiating fin with the heat exchanger effectiveness of air.But present radiating fin is all sheet type and heat exchanger effectiveness is promoted in the design of not having any novelty.
The utility model content
This creator improves its not enough and disappearance, and then creates a kind of heat pipe-type radiating fin that increases area of dissipation because existing heat pipe-type radiating fin does not have the structure of any increase surface area.
For reaching above-mentioned purpose, the utility model provides a kind of heat pipe-type radiating fin that increases area of dissipation, and it comprises:
One flat board; And
At least one unrestrained shape plate is formed on dull and stereotyped going up and has dull and stereotypedly relatively presented recessed or protruding fluctuating.
By above-mentioned technological means, because unrestrained shape plate presents concavo-convex fluctuating compared to flat board, therefore comparing flat board can provide bigger surface area, when air is flowed through unrestrained shape plate surface, can effectively carry out heat exchange with unrestrained shape plate, take away the heat of unrestrained shape plate, therefore, when the heat pipe-type radiating fin is installed on the heat pipe of a heat-pipe type radiator, after thermals source such as semiconductor chip are delivered to the heat pipe-type radiating fin rapidly through heat pipe, the heat pipe-type radiating fin can rapidly carry out heat exchange with air, the radiating efficiency of raising heat-pipe type radiator integral body.
Aforementioned at least one unrestrained shape plate is arcuation.
The aforementioned heat pipe-type radiating fin that increases area of dissipation includes plural unrestrained shape plate, wherein the unrestrained shape plate of part relatively flat board be convex and all the other unrestrained shape plates relatively flat board be concavity.
The aforementioned heat pipe-type radiating fin that increases area of dissipation includes the dull and stereotyped relatively unrestrained shape plate that is convex of plural number.
Aforementioned unrestrained shape plate is convex arc shaped.
The aforementioned heat pipe-type radiating fin that increases area of dissipation includes the dull and stereotyped relatively unrestrained shape plate that is concavity of plural number.
Aforementioned unrestrained shape plate is concave arc shape.
Be penetrated with plural installing hole on the aforementioned flat board.
The vertical respectively projection of the dual-side of aforementioned flat board has a dividing plate.
Description of drawings
Fig. 1 is installed on the stereo appearance figure of a heat-pipe type radiator for the utility model.
Fig. 2 is the front view of the utility model according to Fig. 1.
Fig. 3 is the utility model stereo appearance figure.
Fig. 4 is the utility model front view.
Fig. 5 is the front view of the utility model one embodiment.
Fig. 6 is the front view of another embodiment of the utility model.
The primary clustering symbol description
10,10a, 10b heat pipe-type radiating fin
11 flat boards, 12,13 unrestrained shape plates
15 installing holes, 16 dividing plates
20 heat pipes, 30 radiating blocks
The specific embodiment
Please refer to Fig. 1 to Fig. 3, the heat pipe-type radiating fin 10 that the utility model can increase area of dissipation can be installed to the plural heat pipe 20 of a heat-pipe type radiator, heat pipe 20 1 ends then are installed on the radiating block 30, contact then with the semiconductor chip through radiating block 30 and still semiconductor chip are dispelled the heat.
The heat pipe-type radiating fin 10 that the utility model can increase area of dissipation comprises: a flat board 11; At least one unrestrained shape plate 12,13; Plural number installing hole 15 and two dividing plates 16.
Please with further reference to Fig. 4, this wave shape plate 12,13 is formed on dull and stereotyped 11 and dull and stereotyped 11 has presented recessed or protruding fluctuating relatively.Aforementioned unrestrained shape plate 12,13 can be arcuation, carefully says it, and flat board 11 is convex arc shaped or concave arc shape relatively.When the unrestrained shape plate 12,13 of plural number was formed on dull and stereotyped 11, the unrestrained shape plate 12 of part dull and stereotyped 11 was convex arc shaped and all the other unrestrained shape plates 13 and dull and stereotyped 11 is concave arc shape relatively relatively.
Please refer to Fig. 5, among the utility model one embodiment, heat pipe-type radiating fin 10a can have the dull and stereotyped relatively unrestrained shape plate 12 that all is convex arc shaped of plural number.
Please refer to Fig. 6, among another embodiment of the utility model, heat pipe-type radiating fin 10b can have the unrestrained shape plate 13 that plural flat board 11 relatively all is concave arc shape.
This plural number installing hole 15 runs through and is formed on dull and stereotyped 11 so that pass for corresponding heat pipe 20.
Two dividing plates 16 can make from the vertical projection of dull and stereotyped 11 dual-sides respectively to produce between heat pipe-type radiating fin 10 and adjacent another heat pipe-type radiating fin 10 becomes the air channel that an air feed stream passes through at interval.
By above-mentioned technological means, because unrestrained shape plate 12,13 present concavo-convex fluctuating compared to dull and stereotyped 11, therefore compare dull and stereotyped 11 bigger surface area can be provided, when the air unrestrained shape plate 12 of flowing through, during 13 surfaces, can be effectively and unrestrained shape plate 12,13 carry out heat exchange, take away unrestrained shape plate 12,13 heat, therefore, when heat pipe- type radiating fin 10,10a, when 10b is installed on the heat pipe 20 of heat-pipe type radiator, thermals source such as semiconductor chip see through heat pipe 20 and are delivered to heat pipe-type radiating fin 10 rapidly, 10a, behind the 10b, heat pipe- type radiating fin 10,10a, 10b can rapidly carry out heat exchange with air, the radiating efficiency of raising heat-pipe type radiator integral body.
Claims (9)
1. the heat pipe-type radiating fin that can increase area of dissipation is characterized in that, comprises:
One flat board; And
At least one unrestrained shape plate is formed on dull and stereotyped going up and has dull and stereotypedly relatively presented recessed or protruding fluctuating.
2. the heat pipe-type radiating fin that increases area of dissipation as claimed in claim 1 is characterized in that: wherein at least one unrestrained shape plate is arcuation.
3. the heat pipe-type radiating fin that increases area of dissipation as claimed in claim 1 is characterized in that: it includes plural unrestrained shape plate, wherein the unrestrained shape plate of part relatively flat board be convex and all the other unrestrained shape plates relatively flat board be concavity.
4. the heat pipe-type radiating fin that increases area of dissipation as claimed in claim 1 is characterized in that: it includes the dull and stereotyped relatively unrestrained shape plate that is convex of plural number.
5. the heat pipe-type radiating fin that increases area of dissipation as claimed in claim 4 is characterized in that: wherein unrestrained shape plate is convex arc shaped.
6. the heat pipe-type radiating fin that increases area of dissipation as claimed in claim 1 is characterized in that: it includes the dull and stereotyped relatively unrestrained shape plate that is concavity of plural number.
7. the heat pipe-type radiating fin that increases area of dissipation as claimed in claim 6 is characterized in that: wherein unrestrained shape plate is concave arc shape.
8. as each described heat pipe-type radiating fin that increases area of dissipation in the claim 1 to 7, it is characterized in that: be penetrated with plural installing hole on its middle plateform.
9. as each described heat pipe-type radiating fin that increases area of dissipation in the claim 1 to 7, it is characterized in that: the vertical respectively projection of the dual-side of its middle plateform has a dividing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201590369U CN201476667U (en) | 2009-06-25 | 2009-06-25 | Thermal pipe type radiation fin capable of enlarging radiation areas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201590369U CN201476667U (en) | 2009-06-25 | 2009-06-25 | Thermal pipe type radiation fin capable of enlarging radiation areas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201476667U true CN201476667U (en) | 2010-05-19 |
Family
ID=42412916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201590369U Expired - Fee Related CN201476667U (en) | 2009-06-25 | 2009-06-25 | Thermal pipe type radiation fin capable of enlarging radiation areas |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201476667U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101244A (en) * | 2014-08-01 | 2014-10-15 | 兰州交通大学 | Streamline amplitude-variable corrugated fins for elliptical tube-fin heat exchanger |
| CN104110992A (en) * | 2014-08-01 | 2014-10-22 | 兰州交通大学 | Streamline type variable-amplitude arc-shaped corrugated fin for oval tube fin type heat exchanger |
| CN104567108A (en) * | 2013-10-12 | 2015-04-29 | 杭州三花微通道换热器有限公司 | Heat exchanger and fin thereof |
| CN106211718A (en) * | 2016-08-23 | 2016-12-07 | 无锡金鑫集团股份有限公司 | A kind of heat radiating fin structure of new radiator |
-
2009
- 2009-06-25 CN CN2009201590369U patent/CN201476667U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104567108A (en) * | 2013-10-12 | 2015-04-29 | 杭州三花微通道换热器有限公司 | Heat exchanger and fin thereof |
| CN104567108B (en) * | 2013-10-12 | 2018-12-11 | 杭州三花微通道换热器有限公司 | A kind of heat exchanger and its fin |
| CN104101244A (en) * | 2014-08-01 | 2014-10-15 | 兰州交通大学 | Streamline amplitude-variable corrugated fins for elliptical tube-fin heat exchanger |
| CN104110992A (en) * | 2014-08-01 | 2014-10-22 | 兰州交通大学 | Streamline type variable-amplitude arc-shaped corrugated fin for oval tube fin type heat exchanger |
| CN104101244B (en) * | 2014-08-01 | 2016-06-08 | 兰州交通大学 | The streamlined change wave amplitude corrugated fin of elliptical tube fin-tube type heat exchanger |
| CN104110992B (en) * | 2014-08-01 | 2016-06-08 | 兰州交通大学 | Elliptical tube fin-tube type heat exchanger streamlined change wave amplitude circular arc corrugated fin |
| CN106211718A (en) * | 2016-08-23 | 2016-12-07 | 无锡金鑫集团股份有限公司 | A kind of heat radiating fin structure of new radiator |
| CN106211718B (en) * | 2016-08-23 | 2018-10-26 | 无锡金鑫集团股份有限公司 | A kind of heat radiating fin structure of new radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YINGTENG ELCTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: MEGTRON COMPUTER LTD. Effective date: 20101229 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIPEI COUNTY, TAIWAN PROVINCE, CHINA TO: NO.2-2, LANE 20, LANE 142, SECTION 6 OF LUOSIFU ROAD, WENSHAN DISTRICT, TAIPEI CITY, TAIWAN PROVINCE, CHINA |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20101229 Address after: Wenshan District of Taiwan city of Taipei China Fuk Road six lane 20 Ross 142 Lane No. 2-2 Patentee after: Eagle Electronics Polytron Technologies Inc Address before: Taiwan County, Taipei, China Patentee before: Megtron Computer Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20110625 |