CN201476667U - Heat pipe type radiating fin capable of increasing radiating area - Google Patents
Heat pipe type radiating fin capable of increasing radiating area Download PDFInfo
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- CN201476667U CN201476667U CN2009201590369U CN200920159036U CN201476667U CN 201476667 U CN201476667 U CN 201476667U CN 2009201590369 U CN2009201590369 U CN 2009201590369U CN 200920159036 U CN200920159036 U CN 200920159036U CN 201476667 U CN201476667 U CN 201476667U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 238000001816 cooling Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型属于一种散热鳍片,尤指一种可增加散热面积的热管式散热鳍片,其具有弯曲部位而较平坦部位具有较多的表面积以便增进与空气的热交换效率。The utility model belongs to a heat dissipation fin, in particular to a heat pipe type heat dissipation fin which can increase the heat dissipation area. It has a curved part and a relatively flat part has more surface area so as to improve the heat exchange efficiency with air.
背景技术Background technique
由于半导体技术突飞猛进,目前的计算机处理器芯片不但运算频率节节攀升,内部的晶体管数量也以倍数成长,导致芯片发热功率不断飙升,因此在芯片上设置散热器早已是习以为常的散热做法。Due to the rapid advancement of semiconductor technology, the current computer processor chips not only increase the operating frequency, but also increase the number of internal transistors by multiples, resulting in a continuous increase in the heating power of the chip. Therefore, it has long been a common practice to install a heat sink on the chip.
现有的散热器有空冷与水冷两种大类,前者靠空气对流来进行散热,是目前最为普及的散热器种类。又,空冷散热器之中又有一种能增进热传导效率的热管式散热鳍片,即是以复数热管贯穿复数散热鳍片,透过热管内部的流体的毛细作用,能令热量迅速延热管传递到各散热鳍片上,以增进散热效率。There are two types of existing radiators: air-cooled and water-cooled. The former relies on air convection to dissipate heat, and is currently the most popular type of radiator. In addition, there is another kind of heat pipe fin in the air-cooled radiator, which can improve the heat conduction efficiency, that is, a plurality of heat pipes run through the plurality of fins, and through the capillary action of the fluid inside the heat pipe, the heat can be quickly transferred to the heat pipe. Each cooling fin to improve heat dissipation efficiency.
上述的热管式散热器之中,由于热管的热传导效率极高,因此散热瓶颈往往在于散热鳍片与空气的热交换效率,而与空气的热交换效率往往取决于散热鳍片的表面积大小。但,目前的散热鳍片皆为薄片式而无任何新颖的设计来增进热交换效率。Among the above-mentioned heat pipe radiators, due to the extremely high heat conduction efficiency of the heat pipe, the heat dissipation bottleneck often lies in the heat exchange efficiency between the heat dissipation fins and the air, and the heat exchange efficiency with the air often depends on the surface area of the heat dissipation fins. However, the current heat dissipation fins are all thin-sheet type without any novel design to improve heat exchange efficiency.
实用新型内容Utility model content
本创作人有鉴于现有热管式散热鳍片无任何增加表面积的结构,改良其不足与缺失,进而创作出一种可增加散热面积的热管式散热鳍片。In view of the fact that the existing heat pipe heat dissipation fins do not have any structure to increase the surface area, the creators improved their shortcomings and defects, and then created a heat pipe heat dissipation fin that can increase the heat dissipation area.
为达上述目的,本实用新型提供一种可增加散热面积的热管式散热鳍片,其包含:In order to achieve the above purpose, the utility model provides a heat pipe type heat dissipation fin that can increase the heat dissipation area, which includes:
一平板;以及a tablet; and
至少一浪状板,形成在平板上而相对平板呈现起凹或凸的起伏。At least one corrugated plate is formed on the flat plate and exhibits concave or convex undulations relative to the flat plate.
藉由上述技术手段,由于浪状板相较于平板呈现凹凸起伏,因此相较平板可提供更大的表面积,当空气流经浪状板表面时,可有效与浪状板进行热交换,带走浪状板的热量,因此,当热管式散热鳍片安装到一热管式散热器的热管上时,半导体芯片等热源透过热管迅速传递到热管式散热鳍片后,热管式散热鳍片能迅速与空气进行热交换,提高热管式散热器整体的散热效率。With the above-mentioned technical means, since the corrugated plate is concave and convex compared with the flat plate, it can provide a larger surface area than the flat plate. When the air flows through the surface of the corrugated plate, it can effectively exchange heat with the corrugated plate, bringing Therefore, when the heat pipe fins are installed on the heat pipes of a heat pipe radiator, heat sources such as semiconductor chips are quickly transferred to the heat pipe fins through the heat pipes, and the heat pipe fins can Rapid heat exchange with the air improves the overall heat dissipation efficiency of the heat pipe radiator.
前述至少一浪状板呈弧状。The aforementioned at least one corrugated plate is arc-shaped.
前述可增加散热面积的热管式散热鳍片包含有复数浪状板,其中部分浪状板相对平板呈凸状且其余浪状板相对平板呈凹状。The aforementioned heat pipe heat dissipation fins capable of increasing the heat dissipation area include a plurality of corrugated plates, wherein some of the corrugated plates are convex relative to the flat plate and the rest of the corrugated plates are concave relative to the flat plate.
前述可增加散热面积的热管式散热鳍片包含有复数相对平板呈凸状的浪状板。The above-mentioned heat-pipe heat-dissipating fins capable of increasing the heat-dissipating area include a plurality of corrugated plates that are convex relative to the flat plate.
前述浪状板呈凸弧状。The aforementioned corrugated plate is in the shape of a convex arc.
前述可增加散热面积的热管式散热鳍片包含有复数相对平板呈凹状的浪状板。The aforementioned heat pipe type heat dissipation fins capable of increasing the heat dissipation area include a plurality of corrugated plates that are concave relative to the flat plate.
前述浪状板呈凹弧状。The aforementioned corrugated plate is in a concave arc shape.
前述平板上贯穿有复数安装孔。There are a plurality of installation holes running through the aforementioned plate.
前述平板的两侧边分别垂直突伸有一隔板。A partition protrudes vertically from both sides of the aforementioned flat plate.
附图说明Description of drawings
图1为本实用新型安装于一热管式散热器的立体外观图。Fig. 1 is a three-dimensional appearance view of the utility model installed in a heat pipe radiator.
图2为本实用新型根据图1的正视图。Fig. 2 is a front view of the utility model according to Fig. 1 .
图3为本实用新型立体外观图。Fig. 3 is a perspective view of the utility model.
图4为本实用新型正视图。Fig. 4 is a front view of the utility model.
图5为本实用新型一实施例的正视图。Fig. 5 is a front view of an embodiment of the utility model.
图6为本实用新型另一实施例的正视图。Fig. 6 is a front view of another embodiment of the utility model.
主要组件符号说明Explanation of main component symbols
10、10a、10b热管式散热鳍片10, 10a, 10b heat pipe cooling fins
11平板 12、13浪状板11
15安装孔 16隔板15 mounting
20热管 30散热块20
具体实施方式Detailed ways
请参照图1到图3,本实用新型可增加散热面积的热管式散热鳍片10能够安装到一热管式散热器的复数热管20,热管20一端则安装在一散热块30上,透过散热块30与一半导体芯片接触则仍对半导体芯片进行散热。Please refer to Fig. 1 to Fig. 3, the heat pipe type
本实用新型可增加散热面积的热管式散热鳍片10包含:一平板11;至少一浪状板12、13;复数安装孔15以及二隔板16。The heat pipe type
请进一步参照图4,该浪状板12、13形成在平板11上而相对平板11呈现起凹或凸的起伏。前述浪状板12、13可呈弧状,细言之,可相对平板11呈凸弧状或是凹弧状。当有复数浪状板12、13形成于平板11上时,部分浪状板12相对平板11呈凸弧状且其余浪状板13相对平板11呈凹弧状。Please further refer to FIG. 4 , the
请参照图5,本实用新型一实施例中,热管式散热鳍片10a可具有复数相对平板皆呈凸弧状的浪状板12。Please refer to FIG. 5 , in an embodiment of the present invention, the heat pipe
请参照图6,本实用新型另一实施例中,热管式散热鳍片10b可具有复数相对平板11皆呈凹弧状的浪状板13。Please refer to FIG. 6 , in another embodiment of the present invention, the heat pipe type cooling fins 10 b may have a plurality of
该复数安装孔15贯穿形成在平板11上以便供相对应热管20穿过。The plurality of
两隔板16分别自平板11两侧边垂直突伸而可使得热管式散热鳍片10与相邻的另一热管式散热鳍片10之间产生间隔而成为一供气流通过的风道。The two
藉由上述技术手段,由于浪状板12、13相较于平板11呈现凹凸起伏,因此相较平板11可提供更大的表面积,当空气流经浪状板12、13表面时,可有效与浪状板12、13进行热交换,带走浪状板12、13的热量,因此,当热管式散热鳍片10、10a、10b安装到热管式散热器的热管20上时,半导体芯片等热源透过热管20迅速传递到热管式散热鳍片10、10a、10b后,热管式散热鳍片10、10a、10b能迅速与空气进行热交换,提高热管式散热器整体的散热效率。By means of the above-mentioned technical means, since the
Claims (9)
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CN2009201590369U CN201476667U (en) | 2009-06-25 | 2009-06-25 | Heat pipe type radiating fin capable of increasing radiating area |
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CN2009201590369U CN201476667U (en) | 2009-06-25 | 2009-06-25 | Heat pipe type radiating fin capable of increasing radiating area |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104101244A (en) * | 2014-08-01 | 2014-10-15 | 兰州交通大学 | Streamline amplitude-variable corrugated fins for elliptical tube-fin heat exchanger |
CN104110992A (en) * | 2014-08-01 | 2014-10-22 | 兰州交通大学 | Streamline type variable-amplitude arc-shaped corrugated fin for oval tube fin type heat exchanger |
CN104567108A (en) * | 2013-10-12 | 2015-04-29 | 杭州三花微通道换热器有限公司 | Heat exchanger and fin thereof |
CN106211718A (en) * | 2016-08-23 | 2016-12-07 | 无锡金鑫集团股份有限公司 | A kind of heat radiating fin structure of new radiator |
-
2009
- 2009-06-25 CN CN2009201590369U patent/CN201476667U/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104567108A (en) * | 2013-10-12 | 2015-04-29 | 杭州三花微通道换热器有限公司 | Heat exchanger and fin thereof |
CN104567108B (en) * | 2013-10-12 | 2018-12-11 | 杭州三花微通道换热器有限公司 | A kind of heat exchanger and its fin |
CN104101244A (en) * | 2014-08-01 | 2014-10-15 | 兰州交通大学 | Streamline amplitude-variable corrugated fins for elliptical tube-fin heat exchanger |
CN104110992A (en) * | 2014-08-01 | 2014-10-22 | 兰州交通大学 | Streamline type variable-amplitude arc-shaped corrugated fin for oval tube fin type heat exchanger |
CN104101244B (en) * | 2014-08-01 | 2016-06-08 | 兰州交通大学 | The streamlined change wave amplitude corrugated fin of elliptical tube fin-tube type heat exchanger |
CN104110992B (en) * | 2014-08-01 | 2016-06-08 | 兰州交通大学 | Elliptical tube fin-tube type heat exchanger streamlined change wave amplitude circular arc corrugated fin |
CN106211718A (en) * | 2016-08-23 | 2016-12-07 | 无锡金鑫集团股份有限公司 | A kind of heat radiating fin structure of new radiator |
CN106211718B (en) * | 2016-08-23 | 2018-10-26 | 无锡金鑫集团股份有限公司 | A kind of heat radiating fin structure of new radiator |
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Legal Events
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YINGTENG ELCTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: MEGTRON COMPUTER LTD. Effective date: 20101229 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIPEI COUNTY, TAIWAN PROVINCE, CHINA TO: NO.2-2, LANE 20, LANE 142, SECTION 6 OF LUOSIFU ROAD, WENSHAN DISTRICT, TAIPEI CITY, TAIWAN PROVINCE, CHINA |
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TR01 | Transfer of patent right |
Effective date of registration: 20101229 Address after: Wenshan District of Taiwan city of Taipei China Fuk Road six lane 20 Ross 142 Lane No. 2-2 Patentee after: Eagle Electronics Polytron Technologies Inc Address before: Taiwan County, Taipei, China Patentee before: Megtron Computer Ltd. |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20110625 |