CN202473901U - Plate-band-type integrated circuit water cooling heat radiating assembly - Google Patents
Plate-band-type integrated circuit water cooling heat radiating assembly Download PDFInfo
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- CN202473901U CN202473901U CN2012201305554U CN201220130555U CN202473901U CN 202473901 U CN202473901 U CN 202473901U CN 2012201305554 U CN2012201305554 U CN 2012201305554U CN 201220130555 U CN201220130555 U CN 201220130555U CN 202473901 U CN202473901 U CN 202473901U
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- substrate
- cooling assembly
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Abstract
The utility model discloses a plate-band-type integrated circuit water cooling heat radiating assembly which comprises a heat conducting base plate and a heat radiating band, wherein the heat radiating assembly is formed through welding a wave-type metal heat radiating band on the upper surface of a heat conducting metal base plate which is provided with a heat conducting groove or a flow guide hole, and the lower surface of the heat conducting metal base plate is in contact with the heat radiating surface of an integrated circuit. According to the utility model, the water cooling effect can be realized under the condition of small space dimension, and the heat radiating capability of the heat radiating assembly is improved; and heat is taken away by utilizing a circulating cooling liquid under the condition of cooling without a fan, thus the heat radiating capability of the heat radiating assembly is met or improved.
Description
One, technical field
The utility model relates to cooling integrated device field, especially strip formula integrated circuit water-cooling assembly
.
Two, background technology
At present; Along with the integrated level of integrated circuit increases volume-diminished; But power consumption is relatively large, like the integrated circuit on central processing unit (CPU) and the video card etc., if when work untimely the distributing of heat of its generation; Will influence the operate as normal of integrated circuit, when serious even can cause that device is overheated to be burnt out.Traditional integrated circuit wind-cooling heat dissipating assembly, a kind of is the radiating subassembly that adopts heat-conducting substrate and radiating fin one extrusion molding, another kind is to adopt between heat-conducting substrate and radiating fin to wear the radiating subassembly that sheet constitutes.These two kinds air-cooled radiating subassemblies adopt the radiating subassembly of one extrusion molding, the restriction of the technology that is squeezed, and the thickness of its radiating fin is thicker; The spacing of radiating fin is thinner, and the negligible amounts of radiating fin is so its heat radiation gross area is less; Radiating efficiency is lower; Consumable material is more, adds that fan is installed to be cooled off, and increases the interior space of cabinet and the noise in the cabinet.And the radiating subassembly that adopts radiating fin and the thermal conductive metal plate that has guiding gutter or pod apertures to constitute; Its radiating fin can adopt the calendaring molding material of thinner thickness, and the spacing of radiating fin also can be closeer, and the quantity of radiating fin is more; So its heat radiation gross area is bigger; Compare with traditional wind-cooling heat dissipating assembly, radiating efficiency is higher relatively, and noise is also corresponding lower; Also can use simultaneously the air-cooled heat-radiation belt outer circulation of fan (air-cooled) to combine, will submit the efficient of cooling so greatly to the interior circulation of cooling fluid water-cooled (water-cooled).But need the soldering welding fabrication between heat-radiation belt and heat-conducting substrate, manufacturing process is complicated, and manufacturing cost is higher.
Three, summary of the invention
The purpose of the utility model provides a kind of strip formula integrated circuit water-cooling assembly, and it can be constant in the overall dimension of integrated circuit wind-cooling heat dissipating device, under the constant situation of fan dimension and power, significantly improves the radiating effect of integrated circuit.
In order to achieve the above object; The utility model solves the technical scheme that its technical problem adopted: a kind of strip formula integrated circuit water-cooling assembly; Comprise heat-conducting substrate, heat-radiation belt; Said radiating subassembly is a plane welding wave heat dissipation metal band on the heat-conducting metal substrate that has guiding gutter or pod apertures, and the lower plane of heat-conducting metal substrate contacts with the heat-delivery surface of integrated circuit.
The wave-like of said wave heat dissipation metal band is triangular waveform or square waveform.
Said wave heat dissipation metal band towards paralleling with heat-conducting plate or perpendicular with heat-conducting plate.
Have the square hole or the circular hole of all-pass on the as a whole substrate of said heat-conducting metal substrate, by the cold-drawn moulding; Or independently flat tube or square tube and metal inner fin welding combination.
Said heat-conducting metal substrate is that the pod apertures of intercommunication or the metal substrate that groove carries out the cooling fluid circulation are opened in the middle part, and the heat-conducting substrate two ends are the shutoff shape, and the heat-conducting substrate two ends respectively have the interface that connects recirculated water.
Have the some groups of shutters that are parallel to each other on the radiating surface of said wave heat dissipation metal band.
Said heat-conducting metal substrate is by flat tube and inner fin welding fabrication.
The beneficial effect of the utility model is:
1, under the identical condition of radiator volume, enlarges markedly the area of dissipation of heat-radiation belt, improve the heat-sinking capability of radiator; Under the requirement of satisfying identical heat dispersion, significantly reduce the volume and weight of radiator.
2, after integrated circuit water-cooled+air-cooled radiator uses this structure; When passing through the shutter on the heat-radiation belt, the cooling air that fan produces produces turbulent flow; Can strengthen the contact and the heat exchange probability of cooling air exchange hot side; On same area of dissipation, can distribute more heats, water-cooled will have been accelerated the cooldown rate at cooling position simultaneously.
3, make the wave heat-radiation belt,, adopt the minimum pitch of waves because be not squeezed forming technology and the constraint of wearing blade technolgy can be adopted thin calendaring molding material.
4, make heat-conducting metal substrate, can or reduce the pitch of waves of inner fin by the required increase of reality, thereby obtain required heat dispersion.
Four, description of drawings
Fig. 1 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts circular hole substrate square waveform heat-radiation belt.
Fig. 2 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts circular hole substrate triangular waveform heat-radiation belt.
Fig. 3 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts square hole substrate square waveform heat-radiation belt.
Fig. 4 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts square hole substrate triangular waveform heat-radiation belt.
Fig. 5 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts inner fin square wave substrate square waveform heat-radiation belt.
Fig. 6 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts inner fin square wave substrate triangular waveform heat-radiation belt.
Fig. 7 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts inner fin triangular wave substrate square waveform heat-radiation belt.
Fig. 8 is the structural representation that the said strip formula of the utility model integrated circuit water-cooling assembly adopts inner fin triangular wave substrate triangular waveform heat-radiation belt.
Five, embodiment
Below through embodiment the technology of the utility model is constituted and to do further explain.
Embodiment 1
As shown in Figure 1; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise circular hole heat-conducting substrate 2, heat-radiation belt 1, said radiating subassembly is last plane 2-1 and the square waveform heat dissipation metal band 1 lower plane 1-1 welded structure form that has the heat-conducting metal substrate 2 of water conservancy diversion circular hole; The lower plane 2-2 of circular hole heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.The circular hole heat-conducting substrate is the cold-drawn moulding.
As shown in Figure 2; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise circular hole heat-conducting substrate 2, heat-radiation belt 1; Said radiating subassembly is that the lower plane 2-2 of circular hole heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit by the lower plane 1-1 welded structure form of the last plane 2-1 of the heat-conducting metal substrate that has the water conservancy diversion circular hole 2 and triangular waveform heat dissipation metal band 1.The circular hole heat-conducting substrate is the cold-drawn moulding.
As shown in Figure 3; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise square hole heat-conducting substrate 2, heat-radiation belt 1; Said radiating subassembly is last plane 2-1 and the lower plane 2-1 welded structure form of square wave heat dissipation metal band 2 that has the heat-conducting metal substrate 2 of water conservancy diversion square hole, and the lower plane 2-2 of square hole heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.The square hole heat-conducting substrate is the cold-drawn moulding.
Embodiment 4
As shown in Figure 4; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise square hole heat-conducting substrate 2, heat-radiation belt 1, said radiating subassembly is the lower plane 1-1 welded structure form by the last plane 2-1 of the heat-conducting metal substrate that has the water conservancy diversion square hole 2 and triangular wave heat dissipation metal band 1.The lower plane 2-2 of square hole heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.The square hole heat-conducting substrate is the cold-drawn moulding.
Embodiment 5
As shown in Figure 5; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise inner fin square wave guide hot substrate 2, heat-radiation belt 1, said radiating subassembly is the lower plane 1-1 welded structure form by the last plane 2-1 of the heat-conducting metal substrate that has guiding gutter or pod apertures 2 and square wave heat dissipation metal band 1.Inner fin square wave heat-conducting metal substrate 2 is that plane 3-1 welds on plane 2-3 and the inner fin square wave 3 by going up in flat tube or the square tube, and interior lower plane 2-4 and inner fin square wave 3 lower plane 3-2 are welded; The lower plane 2-2 of inner fin square wave heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.Inner fin square wave heat-conducting metal substrate is combined to form for welding.
Embodiment 6
As shown in Figure 6; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise inner fin square wave guide hot substrate 2, heat-radiation belt 1, said radiating subassembly is by the last plane 2-1 of the heat-conducting metal substrate that has guiding gutter or pod apertures 2 and triangular wave heat dissipation metal band 1 lower plane 1-1 welded structure form.Inner fin square wave heat-conducting metal substrate 2 is that plane 3-1 welds on plane 2-3 and the inner fin square wave 3 by going up in flat tube or the square tube, and interior lower plane 2-4 and inner fin square wave 3 lower plane 3-2 are welded; The lower plane 2-2 of heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.Inner fin square wave heat-conducting metal substrate is combined to form for welding.
Embodiment 7
As shown in Figure 7; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise inner fin triangular wave heat-conducting substrate 2, heat-radiation belt 1, said radiating subassembly is by the last plane 2-1 of the heat-conducting metal substrate that has guiding gutter or pod apertures 2 and square wave heat dissipation metal band 1 lower plane 1-1 welded structure form.Heat-conducting metal substrate 2 is that plane 3-1 welds on plane 2-3 and the inner fin triangular wave 3 by going up in flat tube or the square tube, and interior lower plane 2-4 and inner fin triangular wave 3 lower plane 3-2 are welded; The lower plane 2-2 of inner fin triangular wave heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.Inner fin triangular wave heat-conducting metal substrate is combined to form for welding.
Embodiment 8
As shown in Figure 8; The described strip formula of the utility model integrated circuit water-cooling assembly; Comprise inner fin triangular wave heat-conducting substrate 2, heat-radiation belt 1, said radiating subassembly is the version that is connect by the last plane 2-1 of the heat-conducting metal substrate that has guiding gutter or pod apertures 2 and triangular wave heat dissipation metal tape welding.Inner fin triangular wave heat-conducting metal substrate 2 is that plane 3-1 welds on plane 2-3 and the inner fin triangular wave 3 by going up in flat tube or the square tube, and interior lower plane 2-4 and inner fin triangular wave 3 lower plane 3-2 are welded; The lower plane 2-2 of heat-conducting metal substrate 2 contacts with the heat-delivery surface of integrated circuit.Inner fin triangular wave heat-conducting metal substrate is combined to form for welding.
Claims (7)
1. strip formula integrated circuit water-cooling assembly; Comprise heat-conducting substrate, heat-radiation belt; It is characterized in that; Said radiating subassembly is a plane welding wave heat dissipation metal band on the heat-conducting metal substrate that has guiding gutter or pod apertures, and the lower plane of heat-conducting metal substrate contacts with the heat-delivery surface of integrated circuit.
2. strip formula integrated circuit water-cooling assembly according to claim 1 is characterized in that the wave-like of said wave heat dissipation metal band is triangular waveform or square waveform.
3. strip formula integrated circuit water-cooling assembly according to claim 1 is characterized in that, said wave heat dissipation metal band towards paralleling with heat-conducting plate or perpendicular with heat-conducting plate.
4. strip formula integrated circuit water-cooling assembly according to claim 1 is characterized in that, has the square hole or the circular hole of all-pass on the as a whole substrate of said heat-conducting metal substrate, by the cold-drawn moulding; Or independently flat tube and heat dissipation metal tape welding connect combination.
5. strip formula integrated circuit water-cooling assembly according to claim 1; It is characterized in that; Said heat-conducting metal substrate is that the pod apertures of intercommunication or the metal substrate that groove carries out the cooling fluid circulation are opened in the middle part, and the heat-conducting substrate two ends are the shutoff shape, and the heat-conducting substrate two ends respectively have the interface that connects recirculated water.
6. strip formula integrated circuit water-cooling assembly according to claim 1 is characterized in that, has the some groups of shutters that are parallel to each other on the radiating surface of said wave heat dissipation metal band.
7. strip formula integrated circuit water-cooling assembly according to claim 1 is characterized in that said heat-conducting metal substrate is by flat tube or square tube and inner fin welding fabrication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201305554U CN202473901U (en) | 2012-03-31 | 2012-03-31 | Plate-band-type integrated circuit water cooling heat radiating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201305554U CN202473901U (en) | 2012-03-31 | 2012-03-31 | Plate-band-type integrated circuit water cooling heat radiating assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202473901U true CN202473901U (en) | 2012-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201305554U Expired - Lifetime CN202473901U (en) | 2012-03-31 | 2012-03-31 | Plate-band-type integrated circuit water cooling heat radiating assembly |
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| CN (1) | CN202473901U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153025A (en) * | 2013-01-28 | 2013-06-12 | 南宁八菱科技股份有限公司 | Foldable type heat exchanger core |
| CN104684368A (en) * | 2015-04-01 | 2015-06-03 | 昆山固德利金属制品有限公司 | Water cooling heat dissipation device |
| CN106684075A (en) * | 2017-02-16 | 2017-05-17 | 张虹 | High-light efficiency light source assembly and preparation method thereof |
-
2012
- 2012-03-31 CN CN2012201305554U patent/CN202473901U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153025A (en) * | 2013-01-28 | 2013-06-12 | 南宁八菱科技股份有限公司 | Foldable type heat exchanger core |
| CN104684368A (en) * | 2015-04-01 | 2015-06-03 | 昆山固德利金属制品有限公司 | Water cooling heat dissipation device |
| CN106684075A (en) * | 2017-02-16 | 2017-05-17 | 张虹 | High-light efficiency light source assembly and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121003 |
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| CX01 | Expiry of patent term |