CN106034394A - Radiator and radiating device - Google Patents

Abstract

A heat sink includes a plurality of thermally conductive clips, a plurality of first fins, and a plurality of second fins. The heat conducting clip comprises a wind approaching section and a wind leaving section which are connected. The included angle between the near wind section and the far wind section is less than 180 degrees. The first fins and the heat conducting clamping pieces are arranged in a staggered mode, and the first fins are combined with the air approaching sections respectively, so that a plurality of first flow channels which are arranged obliquely and at intervals are formed by the first fins. The second fins and the heat conducting clamping pieces are arranged in a staggered mode, and the second fins are respectively combined with the air leaving sections, so that the included angle between the second fins and the first fins is smaller than 180 degrees, the second fins form a plurality of second flow channels which are arranged in an inclined mode at intervals, and the second flow channels are communicated with the first flow channels.

Description

Radiators and heat sinks

technical field

The invention relates to a radiator and a heat dissipation device, in particular to a radiator and a heat dissipation device with inclined fins.

Background technique

As technology in the electronics field continues to evolve, the performance of the electronic components produced is also increasing. However, generally speaking, as the performance of electronic components improves, the heat generated by them will also increase. The continuous accumulation of the heat on the electronic components will cause the temperature of the electronic components to continue to rise. If the heat generated by the electronic components cannot be effectively removed to cool down the electronic components, the electronic components will crash or even be burned. Therefore, the problem generally faced by the electronics industry is not to improve performance, but how to effectively remove the heat generated by electronic components.

Generally speaking, heat dissipation methods of heat sinks are divided into liquid-cooled and air-cooled. The heat dissipation principle of the liquid-cooled heat sink refers to using a compressor or a pump to drive the cooling fluid in the cooling pipe to exchange heat with the electronic components to remove the heat from the electronic components. The heat dissipation principle of the air-cooled heat dissipation device is to use the combination of fans and fins to cool down the temperature of electronic components. The heat dissipation performance of liquid-cooled heat sinks is generally better than that of air-cooled heat sinks. However, since air-cooled heat sinks do not need to install compressors, pumps, and cooling fluids, they have advantages in terms of cost. Therefore, the industry generally uses air-cooled heat sinks. Cool heat sink to remove heat from electronic components.

However, in an air-cooled heat dissipation device, cyclones are likely to be generated in the air passages of the heat dissipation fins, which prevents the heat dissipation airflow from fully contacting the surface of the heat dissipation fins, and this airflow obstruction is especially likely to occur at the end of the flow passages , resulting in that the heat dissipation performance of the air-cooled heat dissipation device cannot be effectively improved. Therefore, how to make the heat dissipation air flow fully in thermal contact with the heat dissipation fins, so as to improve the heat dissipation efficiency of the air-cooled heat dissipation device, will be one of the problems to be solved by the research and development personnel.

Contents of the invention

The present invention provides a radiator and a heat dissipation device, so that the heat dissipation airflow can fully contact the heat dissipation fins, thereby improving the heat dissipation efficiency of the air-cooled heat dissipation device.

The heat sink disclosed in the present invention includes a plurality of heat conducting clips, a plurality of first fins and a plurality of second fins. Each heat-conducting clip includes a connected section near the wind and a section away from the wind. The included angle between the windward section and the windward section is less than 180 degrees. The first fins and the heat conduction clips are alternately arranged, and the first fins are respectively combined with the windward sections of the heat conduction clips, so that the first fins form a plurality of first flow channels inclined and arranged at intervals . The second fins and the heat conduction clips are alternately arranged, and the second fins are respectively combined with the wind-away sections of the heat conduction clips, so that the included angle between the second fins and the first fins is less than 180° degree, and make the second fins form a plurality of second flow channels inclined and arranged at intervals, and the first flow channels communicate with the second flow channels.

The heat dissipation device disclosed in the present invention includes a heat source, an air flow generator and a heat sink as described above. The airflow generator is located above the heat source. The heat sink is located between the heat source and the airflow generator, the heat sink is in thermal contact with the heat source, and the second fins are closer to the heat source than the first fins.

According to the heat sink and heat dissipation device disclosed in the above-mentioned embodiments, through the guidance of the obliquely arranged first fins and second fins, the heat dissipation airflow can be forced to collide violently with the first fins in the first flow channel, and the heat dissipation airflow can be forced Vigorously collides with the second fin in the second flow channel. In this way, the heat exchange efficiency between the heat dissipation airflow and the radiator can be improved, thereby improving the heat dissipation performance of the heat dissipation device and the radiator.

The above descriptions about the contents of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principles of the present invention, and provide further explanations of the claims of the present invention.

Description of drawings

FIG. 1 is a schematic perspective view of a heat dissipation device according to a first embodiment of the present invention.

FIG. 2 is an exploded schematic diagram of FIG. 1 .

FIG. 3 is a schematic side view of a single thermally conductive clip in FIG. 2 .

FIG. 4 is a schematic side view of the heat dissipation device of FIG. 1 .

FIG. 5 is a schematic partial side view of the first fin and the second fin in FIG. 4 .

FIG. 6 is a schematic side view of a heat dissipation device according to a second embodiment of the present invention.

7 is a schematic partial side view of the first fin and the second fin according to the third embodiment of the present invention.

【Symbol Description】

1.2 Heat sink

10 heat sources

20 airflow generator

30 Radiator

32 First runner

34 Second runner

100, 100' thermal clip

110 near wind section

111 First piercing

120 from the wind section

130 groups of joints

140 extension

141 Second piercing

200 first fin

210 First side edge

220 Third piercing

300 second fin

310 Second side edge

400 heat pipes

410 endothermic section

420 exothermic section

430 curved section

detailed description

Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic perspective view of a heat dissipation device according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1 .

The heat dissipation device 1 of this embodiment includes a heat source 10 , an airflow generator 20 and a radiator 30 . The heat source 10 is, for example, a CPU or a display chip. The airflow generator 20 is, for example, an axial fan, and is located above the heat source 10 . The radiator 30 is located between the heat source 10 and the airflow generator 20 . The heat sink 30 is in thermal contact with the heat source 10 to transfer the heat generated by the heat source 10 to the heat sink 30 . The airflow generator 20 is used for generating a cooling airflow to take away the heat generated by the heat source 10 .

For details, please refer to Figure 2 to Figure 5. FIG. 3 is a schematic side view of a single heat-conducting clip of FIG. 2 . FIG. 4 is a schematic side view of the heat dissipation device of FIG. 1 . FIG. 5 is a schematic partial side view of the first fin and the second fin in FIG. 4 .

The heat sink 30 includes a plurality of heat conducting clips 100 , a plurality of first fins 200 , a plurality of second fins 300 and a heat pipe 400 .

The width W1 of the heat conducting clip 100 of this embodiment is smaller than the width W2 of the first fin 200 and the second fin 300 , and larger than the width W3 of the heat source 10 . Each heat-conducting clip 100 includes a wind-near section 110 , a wind-away section 120 , a set of connection sections 130 and an extension section 140 . The windward section 110 is closer to the airflow generator 20 than the windward section 120 , and has a first through hole 111 . The windward section 110 and the windward section 120 are obliquely connected to opposite sides of the assembly section 130 , and the included angle θ1 between the windward section 110 and the windward section 120 is less than 180 degrees. The assembling sections 130 are assembled continuously, and the windward sections 110 keep a gap with each other, and the windward sections 120 keep a gap with each other.

The extension section 140 is connected to a side of the windward section 120 away from the windward section 110 , and the extension section 140 has a second through hole 141 . The second perforation 141 in this embodiment is a perforation with a notch, but it is not limited thereto. In other embodiments, the second perforation 141 may also be a perforation without a notch.

In addition, in this embodiment, the angle between the extension section 140 and the wind-away section 120 is an obtuse angle, but it is not limited thereto. In other embodiments, the angle between the extension section 140 and the wind-away section 120 can also be The acute angle, or the extension section 140 can also be parallel to the wind-away section 120 .

The first fins 200 are alternately arranged with the heat conducting clips 100 , and the first fins 200 are respectively combined with the windward sections 110 of the heat conducting clips 100 . Due to the spacing between the windward sections 110 of the thermally conductive clips 100 , the parts of the first fins 200 not sandwiched by the windwardly section 110 of the thermally conductive clips 100 form a plurality of inclined and spaced first flow channels 32 . In addition, each of the first fins 200 has a third through hole 220 , and the third through hole 220 is aligned with the first through hole 111 .

The second fins 300 are alternately arranged with the heat conduction clips 100 , and the second fins 300 are combined with the wind-away sections 120 of the heat conduction clips 100 respectively. Through the guidance and spacing of the near-wind section 110 of these heat-conducting clips 100, the included angle θ2 between these second fins 300 and these first fins 200 is less than 180 degrees, and these second fins 300 are not covered by the heat-conducting clip The portion sandwiched by the wind-away section 120 of the sheet 100 forms a plurality of second flow channels 34 that are inclined and arranged at intervals. Moreover, the second flow channels 34 communicate with the first flow channels 32 .

Wherein, the above-mentioned first fins 200 , second fins 300 and the thermally conductive clip 100 are combined by, for example, riveting, screwing or pasting. In detail, in this embodiment, the first fins 200 and the second fins 300 are sandwiched between the heat-conducting clips 100 respectively, and then the first fins 200 are riveted to the heat-conducting clips together. On the windward section 110 of the clip 100 , and the second fins 300 are riveted to the windward section 120 of the heat conducting clip 100 . This combination can improve the production efficiency of the radiator 30 .

The thickness of the above-mentioned thermally conductive clip 100 is, for example, between 0.8 mm and 2 mm. In this embodiment, the thickness of the thermally conductive clip 100 is 1 mm as an example, that is, each first fin 200 can form a first flow channel 32 with a width of 1 mm, and each second fin 300 can form a first flow channel 32 with a width of 1 mm. The gap of the second fin 300 . In this way, not only the first fins 200 and the second fins 300 can be densely arranged to have a larger heat dissipation area, but also the first flow channel 32 and the second flow channel 34 have enough width for the heat dissipation airflow. Pass smoothly.

The heat pipe 400 includes a heat absorbing section 410 , a heat releasing section 420 and a bending section 430 . The heat absorption section 410 of the heat pipe 400 passes through the second through holes 141 of the extension sections 140 . The heat radiation section 420 of the heat pipe 400 runs through the third through holes 220 of the first fins 200 and the first through holes 111 of the near wind section 110 . The curved section 430 connects the heat absorbing section 410 and the heat releasing section 420 . The heat absorbing section 410 of the heat pipe 400 protrudes from the bottom edge of the extending section 140 and is in thermal contact with the heat source 10 . The heat absorbed by the heat absorbing section 410 is conducted to the heat releasing section 420 through the curved section 430 , and then conducted to each first fin 200 , so that the heat generated by the heat source 10 is conducted to the heat sink 30 more uniformly and quickly.

In more detail, as shown in FIG. 5 , each of the first fins 200 in this embodiment has a first side edge 210 away from the airflow generator 20 . Each of the second fins 300 has a second side edge 310 adjacent to the airflow generator 20 . The first side edges 210 of the first fins 200 are respectively adjacent to the second side edges 310 of the second fins 300 and are aligned with each other. In addition, there is a gap between the first side edges 210 of the first fins 200 and the second side edges 310 of the second fins 300 , so that there is a gap between the first flow channels 32 and the second flow channels 34 , while the external airflow f can flow in.

Next, the heat dissipation principle of the heat sink 30 of this embodiment will be described. As shown in FIGS. 4 and 5 , the airflow generator 20 generates a cooling airflow F. As shown in FIG. The initial flow direction of the heat dissipation airflow F (the flow direction when the heat dissipation airflow F does not contact the first heat dissipation fins) maintains a first acute angle θ3 with the first fins 200 . The first acute angle θ3 is, for example, between 30 degrees and 60 degrees. Moreover, the initial flow direction of the heat dissipation airflow F (the flow direction of the heat dissipation airflow F not in contact with the first heat dissipation fin) maintains a second acute angle θ4 with the second fin 300 . The second acute angle θ4 is, for example, between 30 degrees and 60 degrees.

As shown in FIG. 5 , when the heat dissipation airflow F enters the first flow channel 32 , the obliquely arranged first fins 200 can guide the heat dissipation airflow to violently collide with the first fins 200 in the first flow channel 32 to conduct heat from the heat source 10 . To the heat on the radiator 30 away. That is to say, the inclined first fins 200 can force the heat dissipation airflow F to come into thermal contact with the surface of each first fin 200 , thereby effectively improving the heat dissipation performance of the heat sink 30 . In other words, the inclined first fins 200 can prevent the heat dissipation airflow F from being hindered by the cyclone and cannot fully exchange heat with the first fins 200 . In this way, the heat dissipation efficiency of the heat dissipation airflow to the radiator 30 can be improved.

Similarly, when the cooling air flow F enters the second flow channel 34 from the first flow channel 32, the obliquely arranged second fins 300 can also guide the cooling air flow to violently collide with the second fin 300 in the second flow channel 34, thereby The heat conducted from the heat source 10 to the radiator 30 is taken away. In this way, the heat dissipation efficiency of the heat dissipation airflow to the radiator 30 can be improved.

The heat sink 1 of the first embodiment has a heat pipe 400 , but it is not limited thereto. In other embodiments, the heat sink may not have a heat pipe. See Figure 6. FIG. 6 is a schematic side view of a heat dissipation device according to a second embodiment of the present invention.

The heat conduction clip 100' of the heat dissipation device 2 of this embodiment is similar to the heat conduction clip 100 of the first embodiment, the difference is that the heat conduction clip 100' of this embodiment does not have an extension section 140. Since the thermally conductive clip 100 has no extension section 140, and the bottom edge of the wind-away section 120 of the thermally conductive clip 100 is aligned with the bottom edge of the second fin 300 to form a continuous surface to be in thermal contact with the heat source 10, it can be further improved. The heat exchange efficiency between the heat source 10 and the heat sink 30 .

In the first embodiment, the first side edge 210 of the first fin 200 is aligned with the second side edge 310 of the second fin 300 , but the present invention is not limited thereto. See Figure 7. 7 is a schematic partial side view of the first fin and the second fin according to the third embodiment of the present invention.

In this embodiment, each of the first fins 200 has a first side edge 210 away from the airflow generator 20 . Each of the second fins 300 has a second side edge 310 adjacent to the airflow generator 20 . The first side edges 210 of the first fins 200 are respectively adjacent to the second side edges 310 of the second fins 300 and are offset from each other.

Through the dislocation relationship between the first fins 200 and the second fins 300, the heat dissipation airflow F in the first channel 32 can be divided into two and flow into two adjacent second flow channels 34, so as to expand the heat dissipation airflow F The heat dissipation area of the radiator 30.

According to the heat sink and heat dissipation device disclosed in the above-mentioned embodiments, through the guidance of the obliquely arranged first fins and second fins, the heat dissipation airflow can be forced to collide violently with the first fins in the first flow channel, and the heat dissipation airflow can be forced Vigorously collides with the second fin in the second flow channel. In this way, the heat exchange efficiency between the heat dissipation airflow and the radiator can be improved, thereby improving the heat dissipation performance of the heat dissipation device and the radiator.

Although the embodiments of the present invention are disclosed as above, they are not intended to limit the present invention. Anyone skilled in the art, without departing from the concept and scope of the present invention, can use any shape, structure, The characteristics and quantity should be subject to these permissible changes, so the scope of protection of the present invention must be defined by the appended claims of this specification.

Claims (11)

1. a radiator, it is characterised in that comprise:

Multiple heat conduction intermediate plates, this heat conduction intermediate plate each comprises the nearly wind section and of connected one from wind section, and this is near Wind section is less than 180 degree with the angle being somebody's turn to do from wind section；

Multiple first fins, the plurality of first fin is staggered with the plurality of heat conduction intermediate plate, and institute State multiple first fin respectively in connection with in the plurality of near wind section of the plurality of heat conduction intermediate plate, described with order Multiple first fins are formed and tilt and spaced multiple first flow；And

Multiple second fins, the plurality of second fin is staggered with the plurality of heat conduction intermediate plate, and institute State the plurality of from wind section respectively in connection with in the plurality of heat conduction intermediate plate of multiple second fin, described with order Multiple second fins are less than 180 degree with the angle of the plurality of first fin, and make the plurality of second Fin is formed and tilts and spaced multiple second runner, and the plurality of second runner is communicated in described Multiple first flows.

2. radiator as claimed in claim 1, wherein the thickness of this heat conduction intermediate plate is between 0.8 millimeter To 2 millimeters.

3. radiator as claimed in claim 1, wherein the width of this heat conduction intermediate plate be smaller than this first The width of fin and the width of this second fin.

4. radiator as claimed in claim 1, wherein those the plurality of first fins are with described many Individual second fin keeps a gap.

5. radiator as claimed in claim 1, wherein this heat conduction intermediate plate further includes one group of section of connecing, should Nearly wind section and the opposite sides that this group section of connecing should be connected to from wind section, the institute of the plurality of heat conduction intermediate plate State the multiple groups of section of connecing contiguous sets to connect.

6. radiator as claimed in claim 1, also comprises a heat pipe, this heat pipe comprise an endotherm section, One heat release section and a bending section, this bending section is connected this endotherm section and this heat release section, this heat conduction intermediate plate each Further include an extension, this extension be connected to this from wind section away from this close to the side of wind section, this heat pipe This endotherm section runs through the plurality of extension, this heat release section of this heat pipe run through the plurality of first fin with The plurality of nearly wind section.

7. radiator as claimed in claim 1, wherein those the plurality of first fins respectively have one First lateral margin, the plurality of second fin respectively has one second lateral margin, the plurality of first lateral margin neighbour respectively It is bordering on the plurality of second lateral margin, and sequence each other.

8. a heat abstractor, it is characterised in that comprise:

One thermal source；

One gas flow generator, is positioned at above this thermal source；And

Just like the radiator described in any one in claim 1 to 7, this radiator be positioned at this thermal source with Between this gas flow generator, this radiator thermally contacts in this thermal source, and the plurality of second fin is relatively described Multiple first fins are near this thermal source.

9. heat abstractor as claimed in claim 8, wherein this gas flow generator is in order to produce a heat radiation Air-flow, this radiating airflow flows through the plurality of first flow and the plurality of second runner, and the plurality of First fin presss from both sides one first acute angle with the flow direction of this radiating airflow, and the plurality of second fin dissipates with this Flow direction folder one second acute angle of thermal current.

10. heat abstractor as claimed in claim 9, wherein this first acute angle is between 30 degree to 60 degree Between, this second acute angle is between 30 degree to 60 degree.

11. heat abstractors as claimed in claim 8, wherein the width of this heat conduction intermediate plate is more than or equal to being somebody's turn to do The width of thermal source.