CN103906413B - Heat radiation module - Google Patents
Heat radiation module Download PDFInfo
- Publication number
- CN103906413B CN103906413B CN201310072576.4A CN201310072576A CN103906413B CN 103906413 B CN103906413 B CN 103906413B CN 201310072576 A CN201310072576 A CN 201310072576A CN 103906413 B CN103906413 B CN 103906413B
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- heat
- radiating
- heat conduction
- fin
- section
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- 230000005855 radiation Effects 0.000 title abstract description 9
- 230000007423 decrease Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 239000011469 building brick Substances 0.000 description 11
- 238000001149 thermolysis Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat radiation module, which comprises a heat conduction base, at least one fin group and a plurality of heat pipes, wherein the fin group comprises a plurality of heat radiation fins, each heat radiation fin is provided with a plurality of heat radiation sections and a plurality of heat conduction sections which are connected among the plurality of heat radiation sections at intervals, and the thickness of each heat conduction section is larger than that of each heat radiation section. One end of each heat pipe is connected with the heat conduction base, and the other end of each heat pipe is correspondingly connected with the heat conduction sections of the heat dissipation fins in series, so that the heat conduction sections of the adjacent heat dissipation fins are in contact with each other, and heat is uniformly transferred to each heat dissipation section.
Description
【Technical field】
The present invention relates to a kind of radiating module, more particularly to a kind of radiating module for electronic building brick.
【Background technology】
With the fast development of electronic industry, the central processing unit (central for being used electronic installation inside
Processing unit, CPU), north bridge chips, show that the power of electronic building brick such as card are substantially improved, electronic building brick is in unit plane
Long-pending closeness is also more and more high, and the relative heat for causing electronic building brick produced in running is significantly increased, and often results in electricity
The temperature of sub-component itself and its internal system of configuration is raised.Meanwhile, with the rapid accumulation of heat, cause electronic building brick
Operation performance declines, and easily causes computer system crash, the even overheated generation for the situation such as burning of electronic building brick.
Operate to guarantee that electronic building brick can be maintained within the scope of its normal temperature, it will usually which tool is installed on electronic building brick
There is the radiator of radiating fin, and for the heat dissipation of heat radiation device, separately have on the market install additional on a heat sink at present
The modularized radiating device of heat pipe, it is mainly connected to radiator with one end of heat pipe, and the other end concatenates radiating fin, and
Press close to or be directly connected in the surface of electronic building brick by heat pipe and radiator, to act on by the hot superconduction of heat pipe, by electronics
The heat that component is produced rapidly is conducted to the base and radiating fin of radiator, so as to the heat dissipation of heat radiation device.
In this radiating mode, the multiple radiating fins of interval setting mainly on heat pipe, and in multiple heat radiating fins
Only it is connected with each other by the bending structure of itself between piece, or without any connection even between multiple radiating fins
Relation.Therefore, most heats must be transferred to each radiating fin by heat pipe.However, as heat pipe is relative to warm
The distance in source is more remote, and the transmission capacity of its heat can significantly decay, thus, often lead to heat cannot be efficiently transferred to
Radiating fin farther out, therefore make the heat dissipation that radiating fin can be provided have a greatly reduced quality, and cannot be used effectively, and then
The heat conduction efficiency between radiating fin and heat pipe is reduced, and has a strong impact on the integral heat sink efficiency of heat abstractor.
【The content of the invention】
In view of the above problems, in view of the above problems, the invention reside in providing a kind of radiating module, so as to solve to commonly use
In radiating module with heat pipe, hot transfer efficiency can far and significantly decay with heat pipe with the distance of thermal source, and then serious shadow
Ring the problem of its radiating efficiency.
The radiating module of the present invention includes a heat conducting base, at least a fins group and many heat pipes.Fins group includes phase
Mutual multiple radiating fins side by side, each radiating fin has multiple radiating segments and a multiple heat conduction sections, and multiple heat conduction it is intersegmental every
It is connected between multiple radiating segments, wherein the thickness of each heat conduction section is more than the thickness of each radiating segment, and adjacent heat radiating fin
The heat conduction section of piece contacts with each other.The quantity of heat pipe corresponds to the quantity of the heat conduction section of each radiating fin, and the one of multiple heat pipes
End is connected to heat conducting base, multiple heat conduction sections of the multiple radiating fins of other end correspondence concatenation.
The thickness at relative two ends of the radiating module of the invention described above, wherein each heat conduction section is respectively facing dissipating of being connected
Hot arc successively decreases.
The quantity of multiple heat conduction sections of the radiating module of the invention described above, wherein each radiating fin is less than multiple radiating segments
Quantity.
The radiating module of the invention described above, wherein heat conducting base have multiple grooves, and one end correspondence of multiple heat pipes is accommodating
In multiple grooves.
The radiating module of the invention described above, including two fins groups, and each heat pipe has a relative first end with one the
Two ends and the engaging section being connected between first end and the second end, engaging section is connected to heat conducting base, first end and the second end
Multiple radiating fins of two fins groups are concatenated respectively.
The radiating module of the invention described above, wherein heat conducting base include a heat-conducting plate and a radiator, multiple heat pipe folders
System is fixed between heat-conducting plate and radiator, and radiator includes multiple fin, and multiple fin are spaced in heat-conducting plate
On.
The radiating module of the invention described above, wherein the heat conduction section of adjacent radiating fin is bonded to each other.
Effect of the present invention is that multiple radiating fins of fins group are that the heat conduction section by between be combined with each other,
And by the thickness of heat conduction section more than the thickness of radiating segment characteristic, the heat conduction section for making multiple radiating fins formed in fins group
Path is passed with the heat accumulated compared with big carrying surface, it can provide the heat that heat pipe absorbed and rapidly be transferred to from the one end near thermal source
Away from one end of thermal source, that is, heat is allowed quickly to be transferred to the radiating segment of each radiating fin, and by radiating segment
Heat exchange is carried out with outside air, therefore thermolysis can be substantially improved, while solving the known radiating module with heat pipe
The problems of.
【Description of the drawings】
Below in conjunction with the accompanying drawings the present invention is further detailed explanation with embodiment.
Fig. 1 is the combination diagram of the radiating module of the first embodiment of the present invention.
Fig. 2 is the schematic top plan view of the radiating module of the first embodiment of the present invention.
Fig. 3 is the decomposing schematic representation of the radiating module of the second embodiment of the present invention.
Fig. 4 is the combination diagram of the radiating module of the second embodiment of the present invention.
Primary clustering symbol description：
The end of 100 radiating module 132 second
The radiating module of 110 heat conducting base 200
The heat conducting base of 111 groove 210
The groove of 120 fins group 211
The radiator of 121 radiating fin 212
The heat-conducting plate of 1211 radiating segment 213
The fin of 1212 heat conduction section 214
The fins group of 130 heat pipe 220
The radiating fin of 131 first end 221
The first end of 2211 radiating segment 231
The end of 2212 heat conduction section 232 second
2213 perforation 233 engage section
230 heat pipes
【Specific embodiment】
Refer to shown in Fig. 1,
As depicted in figs. 1 and 2, the radiating module 100 disclosed by first embodiment of the invention comprising a heat conducting base 110,
One fins group 120 and many heat pipes 130.Heat conducting base 110 is to be incorporated into central processing unit (central processing
Unit, CPU) or the electricity of amount of heat can be produced during the running such as graphic process unit (graphic processing unit, GPU)
On sub-component.Heat conducting base 110 has a relative top surface and a bottom surface, and the bottom surface of heat conducting base 110 is provided with two
Groove 111, one end of many heat pipes 130 corresponds to and is sticked in groove 111, and is connected to fins group 120 with the other end.
Fins group 120 include multiple radiating fins 121, each radiating fin 121 comprising multiple radiating segments 1211 and
It is to include three with radiating fin 121 in the present embodiment every the multiple heat conduction sections 1212 being connected between multiple radiating segments 1212
As an example, but its quantity is not limited thereto for individual radiating segment 1211 and two heat conduction sections 1212, wherein heat conduction section 1212
Surface area less than radiating segment 1211 surface area, but its thickness more than radiating segment 1211 thickness, additionally, the phase of heat conduction section 1212
Can be to the thickness at two ends but be not limited to towards the direction of the radiating segment 1211 being connected successively decrease.Therefore, dissipate when multiple
When hot fin 121 be combined with each other in side-by-side fashion, can be contacted with each other with heat conduction section 1212 between adjacent radiating fin 121,
And make to be separated by a spacing between radiating segment 1211.
Many heat pipes 130 can be but be not limited to be connected to heat conducting base 110 and fins group 120 in the form of bending
Between, make fins group 120 be suspended in the top surface of heat conducting base 110.Each heat pipe 130 has a relative first end 131 and
Second end 132, the correspondence of first end 131 of heat pipe 130 is sticked in the groove 111 of heat conducting base 110, the second end of heat pipe 130
132 correspondences, positioned at the heat conduction section 1212 of the same side, are serially connected with multiple radiating fins 121 through on multiple radiating fins 121
It is on heat pipe 130 and closely bonded to each other by heat conduction section 1212.Further, it is also possible to coat tin cream on heat pipe 130, make
Radiating fin 121 is combined closely by tin cream with heat pipe 130, to lift rates of heat transfer between the two.
Based on said structure, when multiple radiating fins 121 are serially connected with heat pipe 130, the tight of heat conduction section 1212 can be passed through
Fit and the heat conduction block structure with larger sectional area is formed on heat pipe 130, the heat for making heat pipe 130 absorb from electronic building brick
Amount, can quickly be transferred to each heat conduction section 1212, and by heat conduction section 1212 quickly each radiating fin 121 it
Between transmit, then again heat exchange carried out by the radiating segment 1211 with larger area of dissipation and outside air, thus, can be significantly
Lift the heat dissipation of fins group 120.
As shown in Figure 3 and Figure 4, the radiating module 200 disclosed by second embodiment of the invention include a heat conducting base 210,
Two fins groups 220 and many heat pipes 230.Heat conducting base 210 includes a radiator 212 and a heat-conducting plate 213, and radiator 212 is wrapped
Containing multiple fin 214 mutually side by side, and multiple grooves 211, heat-conducting plate are configured with the side of each fin 214
213 are incorporated on radiator 212 side for being configured with groove 211.
Fins group 220 includes multiple radiating fins 221 mutually side by side, and each radiating fin 221 includes multiple radiating segments
2211 and quantity less than radiating segment 2211 multiple heat conduction sections 2212, and multiple heat conduction sections 2212 interval be connected to multiple radiatings
Between section 2211, the thickness of each of which heat conduction section 2212 makes adjacent radiating fin more than the thickness of each radiating segment 2211
Contacted with each other with heat conduction section 2212 between 221, and make to be separated by a spacing between radiating segment 2211.Additionally, in each heat radiating fin
A perforation 2213 is formed with the heat conduction section 2212 of piece, is worn wherein to heating tube 230.
The quantity of heat pipe 230 can be but be not limited to be less equal than the heat conduction section 2212 of each radiating fin 221
Quantity.There is each heat pipe 230 first end 231, one second end 232 section 233 is engaged with one, and engaging section 233 is connected to
Between the end 232 of first end 231 and second, wherein many heat pipes 230 are correspondingly embedded in heat conducting base 210 to engage section 233 respectively
In groove 211, and it is fixed between the radiator 212 of heat conducting base 210 and heat-conducting plate 213 by clipping.The first of heat pipe 230
End 231 is connected to two fins groups 220 with the second end 232 respectively at relative two side of heat conducting base 210, wherein the of heat pipe 230
The end 232 of one end 231 and second is each passed through the perforation 2213 of the heat conduction section 2212 of radiating fin 221, makes many of two fins groups 220
Individual radiating fin 221 is serially connected with respectively the end 232 of first end 231 and second of heat pipe 230 with friction tight relation, and with heat conduction
Section 2212 contacts with each other, and then the heat conduction section 2212 between multiple radiating fins 221 is formed on heat pipe 230 with larger section
The heat of area passes path.
Therefore, in the application of radiating module 200, when heat conducting base 210 and heat pipe 230 absorb the heat that electronic building brick is produced
After amount, in addition to it can carry out thermolysis by the fin 214 of heat conducting base 210 itself, heat pipe 230 can also be passed through by heat
Amount is transferred to fins group 220, then the heat formed on heat pipe 230 via heat conduction section 2212 passes path and rapidly transfers heat to
The radiating segment 2211 of each radiating fin 221 and each radiating fin 221, then again by radiating segment 221 and outside air
Carry out heat exchange.
Larger sectional area can be had by the heat conduction section of multiple radiating fins composition based on above-mentioned, of the invention radiating module
Heat pass path, so will be helpful to be lifted the transfer rate of heat, the heat for absorbing heat pipe and heat conducting base can be from leaning on
One end of nearly heat conducting base is quickly transferred to the one end away from heat conducting base, in order to pass through the radiating segment of each radiating fin
Carry out thermolysis, therefore can be in the effectively solving typically radiating module with heat pipe, hot transfer efficiency and radiating efficiency can be with
The problem that heat pipe far and significantly successively decreases with the distance of thermal source.
Although embodiments of the present invention are disclosed above described, the present invention is so not limited to, it is any to be familiar with related skill
Skill person, without departing from the spirit and scope of the present invention, such as according to the shape described in the present patent application scope, construction, feature and
Quantity is worked as can do a little change, therefore the scope of patent protection of the present invention must regard the claim institute appended by this specification
The person of defining is defined.
Claims (5)
1. a kind of radiating module, it is characterised in that the radiating module includes：
One heat conducting base；
An at least fins group, including multiple radiating fins mutually side by side, each described radiating fin have multiple radiating segments and
Multiple heat conduction sections, the plurality of heat conduction is intersegmental every being connected between the plurality of radiating segment, wherein the thickness of each heat conduction section
Degree is more than the thickness of each radiating segment, and the heat conduction section of the adjacent radiating fin contacts with each other, adjacent institute
State heat conduction section to be brought into close contact, to form heat conduction block structure；And
Many heat pipes, the quantity of many heat pipes corresponds to the quantity of the plurality of heat conduction section of each radiating fin,
And one end of many heat pipes is connected to the heat conducting base, the plurality of radiating fin of other end correspondence concatenation is corresponding
The plurality of heat conduction section；
The thickness at wherein relative two ends of each heat conduction section is respectively facing the radiating segment being connected and successively decreases.
2. radiating module according to claim 1, it is characterised in that the plurality of heat conduction section of each radiating fin
Quantity less than the plurality of radiating segment quantity.
3. radiating module according to claim 1, it is characterised in that the heat conducting base has multiple grooves, described many
One end of root heat pipe is placed in the groove.
4. radiating module according to claim 1, including fins group described in two, and each described heat pipe has relative one
First end is connected to one second end and the engaging section being connected between the first end and second end, the engaging section
The heat conducting base, the first end and second end concatenate respectively the plurality of radiating fin of fins group described in two.
5. radiating module according to claim 1, it is characterised in that the heat conducting base dissipates comprising a heat-conducting plate and
Hot device, the plurality of heat pipe clipping is fixed between the heat-conducting plate and the radiator, and the radiator dissipates comprising multiple
Backing, the plurality of fin is spaced on the heat-conducting plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150659 | 2012-12-27 | ||
| TW101150659A TWI498519B (en) | 2012-12-27 | 2012-12-27 | Heat dissipating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103906413A CN103906413A (en) | 2014-07-02 |
| CN103906413B true CN103906413B (en) | 2017-04-26 |
Family
ID=50997490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310072576.4A Active CN103906413B (en) | 2012-12-27 | 2013-03-07 | Heat radiation module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103906413B (en) |
| TW (1) | TWI498519B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105284715B (en) * | 2014-07-04 | 2018-10-30 | 上海晶海实业有限公司 | Small semiconductor aquarium constant temperature machine |
| CN105627798B (en) * | 2014-12-01 | 2018-12-18 | 青岛海尔特种电冰柜有限公司 | Heat-exchange device and semiconductor refrigerating equipment |
| CN106304768A (en) * | 2015-06-02 | 2017-01-04 | 中兴通讯股份有限公司 | Subrack and plug-in card thereof |
| CN104869794A (en) * | 2015-06-22 | 2015-08-26 | 东莞市澍华五金制品有限公司 | Integrated heat-pipe heat dissipating device |
| CN105899051B (en) * | 2016-06-13 | 2019-01-22 | 海信（山东）空调有限公司 | A kind of transducer air conditioning and its electronic module radiator |
| CN106839852A (en) * | 2017-01-22 | 2017-06-13 | 上海交通大学 | A kind of radiator with high performance and its fin method for arranging |
| CN111261476A (en) * | 2018-11-30 | 2020-06-09 | 曾东荣 | Heat sink for microwave magnetron |
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| JP3384066B2 (en) * | 1993-12-21 | 2003-03-10 | 株式会社デンソー | Boiling cooling device |
| JPH08278091A (en) * | 1995-04-04 | 1996-10-22 | Fujikura Ltd | Manufacture of heat pipe type cooling unit |
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| CN2699363Y (en) * | 2004-05-13 | 2005-05-11 | 珍通科技股份有限公司 | Radiator |
| TWM278219U (en) * | 2005-05-31 | 2005-10-11 | Guo-Shing Chen | Heat pipe radiator and cooling fins thereof |
| CN2842733Y (en) * | 2005-06-10 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Radiating apparatus |
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| CN201306694Y (en) * | 2008-09-12 | 2009-09-09 | 奇宏电子(深圳)有限公司 | LED heat dissipation module |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201425854A (en) | 2014-07-01 |
| CN103906413A (en) | 2014-07-02 |
| TWI498519B (en) | 2015-09-01 |
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