M342543 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種熱交換設備，尤指一種用於散逸 積體電路所產生之熱能之散熱裝置。 【先前技術】 隨著科技進步，電腦處理運算速度不斷提升，中央處 -理器等積體電路裝置因運作所產生的熱量亦同時加速提 _ 升’而為了使電腦達到良好的性能，關於裝設於此等積體 電路裝置上的散熱器之散熱效率係為產業研發的重點之 〇 現有技術的散熱器，如第七及八圖所示，係主要具有 一底端設有複數凹槽的第一散熱鰭片組（70)、一設於該第 一散熱鰭片組（70)底端的導熱板（80)、一第二散熱鰭片組（9〇) 以及連結該第一散熱鰭片組（70)與第二散熱鰭片組（9〇)之間 的複數熱管（100)，其中熱管（1〇0)的一端係設於第一散熱鰭 參片組（70)對應的凹槽内並且靠抵於導熱板（80)的一側，而導 *熱板（8〇)的另一側係靠抵於一熱源上。源自該熱源的熱量 係透過導熱板（80)傳遞至第一散熱鰭片組（70)，然而由於熱 管（80)通常是由熱傳導係數較高的金屬例如銅所製成，因 此大部熱量係直接藉由熱管（80)而傳導到第二散熱鰭片組 (90)，而僅有少部分的熱量會傳導至第一散熱鰭片組（7〇) 中，因而無法達到原先設置第一散熱鰭片組㈧以及第二 散熱鰭片組（90)來增加散熱面積以增加散熱效率的目的， 而徒使第一散熱鰭片組（70)佔據空間而未能有效散熱。 M342543 【新型内容】 因此，本創作為了改進現有技術之散熱器之前 ”、、占提供了 一種具有改良的散熱效率之散熱器，其具一、 並：：：2 ·以有效利用散熱器各散熱元件的散熱功能 亚進而以牦加的散熱器整體之散熱效率。 為了達到上述目的，本創作之散熱器係包括一第一噯 熱’片組、-導熱板、-第二散熱鰭片組及複數熱管。 該弟-散熱韓片組具有連結於該固定座的複數轉片以 及-成型於其底端的固定座’該固定座的底端内凹成 複數容置槽1中於至少一部分相鄰的二容置槽之間成型 有至少-固定凸塊，該固定凸塊是由固定座的底端 出； 該導熱板的頂面係靠抵於該第一散熱鰭片組的底端並 且貫穿形成有複數組合孔，該等組合孔係分別對應於並且 套設在固定凸塊上； 該第二散熱鰭片組可以可以設於第一散熱鰭片組的頂 端；以及 各個熱管-端係設於第—散熱鰭片組的容置槽内由固 定座之-側朝向另-側延伸並且靠抵於導熱板的頂面，熱 官另一端係分別穿設於該第二散熱鰭片組中。 基於上述結構’本創作之散熱器可以藉由固定凸塊直 接將導熱板底面一側之部分的熱量傳導至第一散熱鰭片 組’而不會全部直接由熱管傳導至第二散熱鰭片組，因而 可有效利用第一散熱鰭片組來增加散熱效率。 M342543 【實施方式】 如第一及：圖所示，本創作之散熱器其包括-第一散 熱籍片組（H))、-導熱板⑽、—第二散減片組⑽以及 複數熱管（40)。 該第-散熱鰭片組(10) ’具有連結於該固定座⑼的複 數鰭片以及-成型於其底端的固定座⑴），該固定座⑴）的 -底端内凹成型有複數容置槽（12)，較佳地，該容置槽（12)的 槽底面係呈弧面，复φ你$ ,卜 如^ 、 L _ /、T於至少一部分相鄰的二容置槽（12) 之間成型有至少一固定凸塊(13);較佳地，如第五圖所示， 相鄰的容置槽⑽之間成型有一固定凸塊(13);而該固定凸 塊（13)是由固定座⑴）的底端突伸出，並且斷面呈矩形。 該導熱板⑽的頂面係靠抵於該第-散熱‘鰭片組（10)的 底端’並且貫穿形成有複數對應於且形狀相配合於固定凸 塊（13)的組合孔（21)，以套設於固定凸塊（⑼上，並且較佳 地固定凸塊（13)的端部與導熱板㈣的底面齊平，而可與導 φ 熱板（20)底面一側之熱源相接觸。 心二散熱，鳍片組⑽可以設於第—散熱鰭片組的 頂端。 該等熱管（40)可以圓管狀且其__端係設於容置槽⑽内 由第-散熱‘鰭片組（1〇)的固定座⑴）之—側朝向另一側延伸 JL且罪抵於V熱板（2G)的頂面，且熱管（4())與容置槽⑴）孤 面相配合，熱官(40)另一端係分別穿設於該 組_中、，以將源㈣導熱板⑽之熱量傳導至第二散^ 片組（3 0)以加速散熱之速率。 7 M342543 在本創作的一較佳的具體實施例中，進一步配合第三 及四圖所示，相鄰的的容置槽（12A)之間成型有二間隔設置 的固定凸塊（13A)。 在本創作的另一較佳的具體實施例中，進一步配合第 六圖所示，只有一部分相鄰的的容置槽（12B)之間成型有固 定凸塊（13B)。 基於上述可見，第一散熱鰭片組〇 〇B)的固M342543 VIII. New description: [New technical field] This creation is about a heat exchange device, especially a heat sink for dissipating the heat generated by an integrated circuit. [Prior Art] With the advancement of technology, the computer processing speed is constantly increasing, and the heat generated by the central circuit-device and other integrated circuit devices is also accelerated by the operation, and in order to achieve good performance of the computer, The heat dissipation efficiency of the heat sink provided on the integrated circuit device is the focus of the industrial research and development. The prior art heat sink, as shown in the seventh and eighth figures, mainly has a bottom end with a plurality of grooves. a first heat dissipation fin set (70), a heat conduction plate (80) disposed at a bottom end of the first heat dissipation fin set (70), a second heat dissipation fin set (9〇), and a first heat dissipation fin a plurality of heat pipes (100) between the group (70) and the second heat sink fin group (9〇), wherein one end of the heat pipe (1〇0) is disposed on a corresponding groove of the first heat sink fin group (70) Inside and against the side of the heat conducting plate (80), the other side of the heat conducting plate (8 系) is abutted against a heat source. The heat from the heat source is transmitted to the first fin group (70) through the heat conducting plate (80), but since the heat pipe (80) is usually made of a metal having a high thermal conductivity such as copper, most of the heat is generated. The heat is directly transmitted to the second heat sink fin group (90) by the heat pipe (80), and only a small amount of heat is conducted to the first heat sink fin group (7〇), so that the first setting cannot be achieved. The heat sink fin group (8) and the second heat sink fin group (90) are used to increase the heat dissipation area to increase the heat dissipation efficiency, and the first heat sink fin group (70) takes up space and fails to effectively dissipate heat. M342543 [New Content] Therefore, in order to improve the heat sink of the prior art, the present invention provides a heat sink with improved heat dissipation efficiency, and has a::: 2 The heat dissipation function of the component further increases the heat dissipation efficiency of the heat sink as a whole. In order to achieve the above object, the heat sink of the present invention comprises a first heat pack, a heat conductive plate, a second heat sink fin group and a plurality of heat pipes. The brother-heat-dissipation group has a plurality of rotors coupled to the holder and a holder formed at a bottom end thereof. The bottom end of the holder is recessed into at least a portion of the plurality of receiving slots 1 Forming at least a fixing bump between the two receiving grooves, the fixing protrusion is out of the bottom end of the fixing seat; the top surface of the heat conducting plate is abutting against the bottom end of the first heat dissipation fin group and runs through Forming a plurality of combined holes respectively corresponding to and sleeved on the fixed bumps; the second heat sink fin set may be disposed at a top end of the first heat sink fin group; and each heat pipe end is provided Yu Di - the receiving groove of the heat dissipating fin group extends from the side of the fixing seat toward the other side and abuts against the top surface of the heat conducting plate, and the other end of the heat register is respectively disposed in the second heat radiating fin group. In the above structure, the heat sink of the present invention can directly transfer the heat of a portion of the bottom surface of the heat conducting plate to the first heat radiating fin group by the fixing bumps, and not all of them are directly conducted by the heat pipe to the second heat radiating fin group. Therefore, the first heat dissipation fin group can be effectively utilized to increase heat dissipation efficiency. M342543 [Embodiment] As shown in the first and the drawings, the heat sink of the present invention includes a first heat dissipation group (H), and a heat conduction. a plate (10), a second slab group (10), and a plurality of heat pipes (40). The first heat sink fin group (10)' has a plurality of fins coupled to the fixing seat (9) and a fixing seat formed at a bottom end thereof (1) The bottom end of the fixing base (1) is concavely formed with a plurality of accommodating grooves (12). Preferably, the bottom surface of the accommodating groove (12) is curved, and φ you $, Bu Ru ^ And L _ /, T are formed with at least one fixed convex between at least a portion of the adjacent two accommodating grooves (12) (13); preferably, as shown in FIG. 5, a fixing protrusion (13) is formed between adjacent receiving grooves (10); and the fixing protrusion (13) is a bottom end of the fixing seat (1)) Projecting and having a rectangular cross section. The top surface of the heat conducting plate (10) is abutting against the bottom end of the first heat dissipating fin group (10) and is formed with a plurality corresponding to and conforming to the shape of the fixing convex The combined hole (21) of the block (13) is sleeved on the fixing protrusion ((9), and preferably the end of the fixing protrusion (13) is flush with the bottom surface of the heat conducting plate (4), and can be guided with φ heat The heat source on the bottom side of the board (20) is in contact with the heat sink, and the fin group (10) can be disposed at the top end of the first heat sink fin group. The heat pipes (40) can be round tubular and the __ end is fixed in the capacity. In the groove (10), the side of the fixing seat (1) of the first heat-dissipating fin group (1) extends JL toward the other side and sin against the top surface of the V hot plate (2G), and the heat pipe (4 () Cooperating with the singular surface of the accommodating groove (1), the other end of the thermal officer (40) is respectively disposed in the group _ to transfer the heat of the source (four) heat conducting plate (10) to the second scatter plate group (30) To accelerate the rate of heat dissipation . 7 M342543 In a preferred embodiment of the present invention, further in conjunction with the third and fourth figures, two spaced apart fixed projections (13A) are formed between adjacent receiving slots (12A). In another preferred embodiment of the present invention, as further shown in Fig. 6, only a portion of the adjacent receiving grooves (12B) are formed with fixing projections (13B). Based on the above, the first heat sink fin group 〇 ) B)
定座（11)(11A)( 11B)的固定凸塊（13)(13A)(13B)是突伸於導 熱板（20)(20A)(20B)的組合孔（21)(21A)(21B)内，而固定凸 塊（13)(13A)(13B)可與導熱板（2〇)(2〇A)(20B)底面一側之熱 源相接觸，因此相較於現有技術的散熱器，熱量可藉由固 定凸塊（13)(13A)(13B)而被傳導至第一散熱鰭片組（10) (10A)(10B)進行散熱作帛，而不會因為熱管(4〇)的傳導效 率較2而直接由熱管（40)傳導至第二散熱鰭片組（3〇)，本創 作之散熱器可以有效利用第一散熱鰭片組（10)(10A)(10B) 來增加整體散熱之功效。 【圖式間單說明】 =一圖係本創作之第一較佳實施例的立體外觀圖。 ::圖係本創作之第一較佳實施例的立體分解圖。 1 θ系本創作之第二較佳實施例的立體外觀圖。 弟四圖係本創作- ^ ^ m 乍之弟一較佳實施例的立體分解圖。 第五圖係本創作$楚_ ^, 筮丄回 之弟較佳實施例的側面剖視圖。 弟/、圖係本創作夕$ — & 筮 弟二較佳實施例的側面剖視圖〇 圖係現有技術的散熱器的立體外觀圖。 8 M342543 第八圖係現有技術的散熱器的側面剖視圖。 【主要元件符號說明】 (10) (10A)(10B)第一散熱鰭片組 (11) (11A)(11B)固定座 (12) (12A)(12B)容置槽（13)(13A)(13B)固定凸塊 (20)(20A)(20B)導熱板（21)(21A)(21B)組合孔 (3 0)第二散熱鰭片組 （40)熱管 (70)第一散熱鰭片組 （80)導熱板 (9〇)第二散熱鰭片組 （100)熱管The fixing projections (13) (13A) (13B) of the seating (11) (11A) (11B) are combined holes (21) (21A) (21B) projecting from the heat conducting plate (20) (20A) (20B). Inside, the fixed bumps (13) (13A) (13B) can be in contact with the heat source on the bottom side of the heat conducting plate (2〇A) (20B), thus compared to the prior art heat sink, The heat can be conducted to the first heat sink fin group (10) (10A) (10B) by the fixing bumps (13) (13A) (13B) for heat dissipation without the heat pipe (4〇) The conduction efficiency is directly transmitted from the heat pipe (40) to the second heat dissipation fin group (3〇), and the heat sink of the present invention can effectively utilize the first heat dissipation fin group (10) (10A) (10B) to increase the overall efficiency. The effect of heat dissipation. [Description of Schema] = A diagram is a perspective view of the first preferred embodiment of the present invention. The drawings are exploded perspective views of a first preferred embodiment of the present invention. 1 θ is a perspective view of a second preferred embodiment of the present invention. The fourth figure is a three-dimensional exploded view of a preferred embodiment of the present invention. The fifth figure is a side cross-sectional view of the preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS A side view of a preferred embodiment of the prior art is a perspective view of a prior art heat sink. 8 M342543 Figure 8 is a side cross-sectional view of a prior art heat sink. [Explanation of main component symbols] (10) (10A) (10B) First heat sink fin group (11) (11A) (11B) Fixing seat (12) (12A) (12B) accommodating groove (13) (13A) (13B) fixed bump (20) (20A) (20B) heat conducting plate (21) (21A) (21B) combined hole (30) second heat sink fin group (40) heat pipe (70) first heat sink fin Group (80) heat conducting plate (9 〇) second heat sink fin group (100) heat pipe