1308051 .九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱裝置，特別係用以冷卻電子元 '件之散熱裝置。 【先前技術】 隨著電腦產業不斷發展，電子元件如中央處理器等運 行頻率及速度不斷提升，發熱量越來越大，若不及時散發， 熱量累積引起溫度升高，影響電子元件之正常運行。通常 在電子元件上安裝一散熱裝置，以便將電子元件產生之熱 量及時散發。 圖1所示為習知技術中之一種散熱裝置20，該散熱裝置 20包括與電子元件30接觸之導熱塊22及自導熱塊22向外放 射狀延伸而出之複數散熱片24。電子元件30產生之熱量首 先被導熱塊22吸收，然後通過導熱塊22上之散熱片24散發 到周圍環境中，以達到冷卻電子元件30之目的。惟，導熱 塊22為對稱圓柱結構，散熱片24均勻地分佈在導熱塊22之 外表面，導熱塊22吸收之熱量最終只能散發到被冷卻電子 元件30之附近環境中，造成被冷卻電子元件30周圍氣體溫 度升高，導致氣流與散熱裝置20之間之熱交換效率降低， 影響散熱裝置20之散熱性能。 【發明内容】 有鑒於此，有必要提供一種具有較佳散熱性能之散熱 裝置。 6 1308051 本發明實施例之散熱裝置，包括-導熱基座，該導熱 基座包括-本體部，該本體部上設有複數第—散熱片，其 中該本體部&向延伸而出_擴展部，該擴展部域有複數 第二散熱片’―導熱元件與導熱基座導熱連接，該導敎元 件之熱傳導率比本體部及擴展部高。 ^相較于S知技術，所述散熱裝置中本體部可與被冷卻 電子疋件接觸，而擴展部從本體部延伸而出，故擴展部可 以將本體部吸收之部分熱量轉移到遠離本體部 之區域内並 散發’這樣&置有利於降低被冷卻電子元件周圍環境中空 氣之溫度’進而提升氣流與散熱裝置之間之熱交換效率， 提升散熱裝置之散熱效果。 【實施方式】 圖2所示為本發明散熱裝置之第一實施例。該散熱裝 置100為偏心結構，包括一導熱基座及設於導熱基座上之 複數散熱片。該導熱基座包括一本體部110及一擴展部 20該擴展邛120從本體部橫向（垂直本體部轴 線或其延伸方向）延伸而出並伸展到有利於散熱之位置， 如具有較低溫度或較大空間以增大散熱裝置1〇〇之散熱面 積。本體部110及擴展部120可由相同之導熱材料如金屬 銅或銘荨體成型，且擴展部120與本體部11〇之外部形 狀或内部結構不同，如圖2中所示，擴展部12〇之橫截面 要小於本體部110之橫截面。 上述之本體部110為一四棱柱，其底面，通常為其底 .1308051 -面之中心位置與被冷卻電子元件接觸，以吸收電子元件產 之”、、量其中，本體部110周圍設有複數第一散埶片 ㈣將本體部⑽所吸收之部分熱量散發職冷卻電 子元件附近％境中去。該等第一散熱片112可以從本體部 110之外表面垂直延伸而出（如圖2所示）。當然也可以自 本體部110之外表面向外放射狀地延伸（圖中未示）。 一沿本體部I10之橫向延伸之擴展部120係較本體部11〇 寬度小之四棱柱’其周圍上設有複數第二散熱片122,且該 等第二散熱片122可以從擴展部12G之外表面垂直延伸而 出（如圖2所示）。當然，也可以自擴展部之夕卜表面 向外放射狀地延伸（圖中未示）。該擴展部120為本體部 110之輔助散熱元件，用以將本體部11〇吸收之部分熱量傳 遞到有利於散熱之空間，並通過第二散熱片122將熱量散 發到遠離被冷卻電子元件之空間内。這樣，擴展部12〇及 其上之第二散熱片122可將熱量傳遞到比本體部11〇及第 一散熱片112更遠之地方，即本體部11〇及第一散熱片 112、擴展部120及第二散熱片122可將被冷卻電子元件產 生之熱量分別散發到不同區域内，環繞被冷卻電子元件之 較近區域，遠離被冷卻電子元件之較遠區域。這樣設置有 利於降低被冷卻電子元件周圍環境中空氣之溫度，進而提 升氣流與散熱裝置100之間之熱交換效率，提升散熱裝置 100之散熱效果。 ' 圖2中所示之本體部110為一四棱柱’根據實際需要， 本體部110還可以為其他多面體，如三棱柱、五棱柱等。 1308051 圖3至6所示為本發明散熱裝置之其他幾個實施例，以下 針對該幾個實施例分別作一簡要說明。 圖3所示為本發明散熱裝置之第二實施例。該散熱裝 置l〇〇a包括一呈三棱錐狀或金字塔狀之本體部，及從 本體部110a之-棱邊115a上延伸而出之板狀擴展部 12〇a，該擴展部l2〇a上形成有複數直立之第二散熱片 i22a。本體部11〇a包括與被冷卻電子元件接觸之底面113a 及三個側面114a。其中，在本體部u〇a之三個侧面μ 上分別設有複數沿水平方向延伸之第—散熱片ιΐ2”該等 第：散熱片112a呈針狀，並位於環繞該被冷卻電子元件之 區域内；而該第二散熱片122a位於遠離該被冷卻電子元件 之區域内，以便將電子元件產生之熱量散發到不同之區域 内’以降低被冷卻電子元件周圍環境之溫度，提升氣流鱼 ，熱裝置100a之間之熱交換效率。此外，該本體部工施 逛可以為其他棱錐或棱臺等；或者其他具有導流作用之傳 熱元件，也可以按照上述相同之方式作為本體部使用。 圖4所示為本發明散熱裝置之第三實施例。該散熱裝 置io〇b包括一圓柱狀之本體部11〇b，及自本體部⑽向 外延伸而出之板狀擴展部i施。本體部i勘之底面與被冷 卻電子元件接觸’在本體部！勘之外周表面上設有自擴^ 部nob向外放射狀延伸之複數第—散熱片n2b，該等第— 散熱片H2b環繞該被冷卻電子元件。在擴展冑·之外 表面上向外傾斜地設置複數第二散熱片122b，該第二散敎 片mb及擴展部i通之横截面呈魚骨狀，且該第二散= 1308051 片122b位於遠離第一散熱片之區域内，以降低被冷 邠電子7L件周圍空氣之溫度。此外，該本體部只仙也可以 -根據相似原理設計成圓錐或圓臺狀。 圖5所不為本發明散熱裝置之第四實施例。該散熱裝 置1〇〇C與第三實施例中之散熱裝置l〇〇b之結構相似。該 f熱裝置酿呈亞鈐狀，包括-對本體部110c及將本體 邛110c連接之擴展部12〇c。該本體部ii〇c與第三實施例 中之本體il〇b結構相同，其中一本體部11〇c與被冷卻 電子凡件接觸，並吸收該電子元件產生之熱量；而另-本 f部11〇e用以散發本體部⑽吸收之部分熱量；而擴展 — 主要用於將一本體部ll〇c上之部分熱量傳遞到另 2體部⑽上。此外’在擴展部i施上也可以設有複 乂小之第二散熱片122c，使熱量在傳遞過程中向外散發。 署為本發明散熱裝置之第五實施例。該散熱裝 L與第一實施例中之散熱裝置⑽之結構相似，其主 H另在於該散熱|置刪進—步包括_f折部刪，該 :=0d從擴展部120d之一端垂直彎折 Γ第二上折部咖上之散熱片垂直1308051. Nine, the invention relates to: [Technical Field] The present invention relates to a heat dissipating device, in particular to a heat dissipating device for cooling an electronic component. [Prior Art] With the continuous development of the computer industry, the operating frequency and speed of electronic components such as the central processing unit are constantly increasing, and the heat generation is getting larger and larger. If it is not distributed in time, the heat accumulation causes the temperature to rise, affecting the normal operation of the electronic components. . A heat sink is typically mounted on the electronic component to dissipate the heat generated by the electronic component in time. 1 shows a heat sink 20 of the prior art. The heat sink 20 includes a heat conducting block 22 that is in contact with the electronic component 30 and a plurality of heat sinks 24 that extend outwardly from the heat conducting block 22. The heat generated by the electronic component 30 is first absorbed by the heat conducting block 22 and then dissipated through the heat sink 24 on the heat conducting block 22 to the surrounding environment for the purpose of cooling the electronic component 30. However, the heat conducting block 22 has a symmetrical cylindrical structure, and the heat sink 24 is evenly distributed on the outer surface of the heat conducting block 22. The heat absorbed by the heat conducting block 22 can only be dissipated into the environment near the cooled electronic component 30, resulting in the cooled electronic component. The temperature of the surrounding gas rises, resulting in a decrease in heat exchange efficiency between the airflow and the heat sink 20, which affects the heat dissipation performance of the heat sink 20. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device having better heat dissipation performance. 6 1308051 The heat dissipating device of the embodiment of the invention comprises a heat conducting base, the heat conducting base comprises a body portion, and the body portion is provided with a plurality of heat sinks, wherein the body portion & The extension portion has a plurality of second heat sinks ′—the heat conductive element is thermally connected to the heat transfer base, and the heat conduction rate of the guide element is higher than that of the body portion and the extension portion. Compared with the S-knowledge technology, the body portion of the heat dissipating device can be in contact with the cooled electronic component, and the expansion portion extends from the body portion, so that the expansion portion can transfer part of the heat absorbed by the body portion away from the body portion. In the area, it is also effective to reduce the temperature of the air in the environment around the cooled electronic components, thereby improving the heat exchange efficiency between the airflow and the heat sink, and improving the heat dissipation effect of the heat sink. Embodiments Fig. 2 shows a first embodiment of a heat sink according to the present invention. The heat dissipating device 100 is an eccentric structure and includes a heat conducting base and a plurality of heat sinks disposed on the heat conducting base. The heat-conducting base includes a body portion 110 and an expansion portion 20 extending from the body portion laterally (the vertical body portion axis or its extending direction) and extending to a position favorable for heat dissipation, such as having a lower temperature Or a larger space to increase the heat dissipation area of the heat sink 1〇〇. The body portion 110 and the expansion portion 120 may be formed of the same heat conductive material such as metal copper or an inscribed body, and the expanded portion 120 is different from the outer shape or internal structure of the body portion 11〇, as shown in FIG. 2, the expanded portion 12 The cross section is smaller than the cross section of the body portion 110. The body portion 110 is a quadrangular prism, and the bottom surface thereof is generally in contact with the cooled electronic component at a center position of the surface of the 1308051 surface to absorb the electronic component, and the amount is provided around the body portion 110. The first diverging sheet (4) disperses part of the heat absorbed by the body portion (10) in the vicinity of the cooling electronic component. The first fins 112 may extend vertically from the outer surface of the body portion 110 (as shown in FIG. 2). Of course, it may also extend radially outward from the outer surface of the body portion 110 (not shown). An extended portion 120 extending transversely of the body portion I10 is a quadrangular prism having a smaller width than the body portion 11' A plurality of second fins 122 are disposed on the periphery, and the second fins 122 may extend vertically from the outer surface of the expanded portion 12G (as shown in FIG. 2). Of course, the surface of the self-expanding portion may also be Radially extending outwardly (not shown). The expansion portion 120 is an auxiliary heat dissipating component of the body portion 110 for transferring part of the heat absorbed by the body portion 11 to a space for facilitating heat dissipation and for passing the second heat dissipation. Slice 122 will be hot Dissipated into the space away from the electronic component to be cooled. Thus, the expansion portion 12 and the second heat sink 122 thereon can transfer heat to a position farther than the body portion 11A and the first heat sink 112, that is, the body portion 11〇 and the first heat sink 112, the expansion portion 120 and the second heat sink 122 can respectively dissipate heat generated by the cooled electronic components into different regions, surround the near region of the cooled electronic component, and away from the cooled electronic component. The remote area is provided in such a manner as to reduce the temperature of the air in the environment surrounding the cooled electronic component, thereby improving the heat exchange efficiency between the airflow and the heat sink 100, and improving the heat dissipation effect of the heat sink 100. The portion 110 is a quadrangular prism. The main body portion 110 may also be other polyhedrons, such as triangular prisms, pentagonal prisms, etc. 1308051 FIGS. 3 to 6 show other embodiments of the heat dissipating device of the present invention. A brief description of each of the several embodiments is shown in Fig. 3. Fig. 3 shows a second embodiment of the heat dissipating device of the present invention. The heat dissipating device 10a includes a triangular pyramid or gold. a tower-shaped main body portion and a plate-like expansion portion 12a extending from the edge 115a of the main body portion 110a, and the plurality of upright second fins i22a are formed on the expansion portion 12a. The body portion 11 〇a includes a bottom surface 113a and three side surfaces 114a that are in contact with the electronic component to be cooled. Among them, a plurality of first heat sinks ιΐ2 extending in the horizontal direction are respectively disposed on the three side surfaces μ of the body portion u〇a. The heat sink 112a is needle-shaped and located in a region surrounding the cooled electronic component; and the second heat sink 122a is located in a region away from the cooled electronic component to dissipate heat generated by the electronic component to different regions. Internal 'to reduce the temperature of the environment around the cooled electronic components, improve the heat exchange efficiency between the airflow fish and the heat device 100a. Further, the body portion may be other pyramids or ribs or the like; or other heat transfer elements having a flow guiding function may be used as the body portion in the same manner as described above. Figure 4 shows a third embodiment of the heat sink of the present invention. The heat dissipating device io 〇 b includes a cylindrical body portion 11 〇 b and a plate-like expansion portion extending outward from the body portion (10). The bottom surface of the body part i is in contact with the cooled electronic component 'in the body part! On the outer peripheral surface of the survey, a plurality of first heat sinks n2b extending radially outward from the expansion portion nob are provided, and the first heat sinks H2b surround the cooled electronic components. A plurality of second fins 122b are disposed obliquely outwardly on the outer surface of the expanded crucible, the cross section of the second dimpling sheet mb and the expanding portion i are fishbone, and the second dispersing = 1308051 sheet 122b is located far away The area of the first heat sink is to reduce the temperature of the air surrounding the 7L of the cold-cooled electron. In addition, the body portion can also be designed as a cone or a truncated cone according to a similar principle. Figure 5 is not a fourth embodiment of the heat sink of the present invention. The heat dissipating device 1C is similar in structure to the heat dissipating device 10b in the third embodiment. The f-heating device is in the form of a sub-turn, and includes a pair of main body portions 110c and an extension portion 12〇c connecting the main body 邛110c. The body portion ii〇c has the same structure as the body il〇b in the third embodiment, wherein a body portion 11〇c contacts the cooled electronic component and absorbs heat generated by the electronic component; and the other portion f 11〇e is used to dissipate part of the heat absorbed by the body part (10); and expansion is mainly used to transfer part of the heat on one body part 11〇c to the other 2 body parts (10). Further, the second heat sink 122c may be provided in the expansion portion i to dissipate the heat outward during the transfer. The present invention is a fifth embodiment of the heat sink of the present invention. The heat dissipating device L is similar in structure to the heat dissipating device (10) in the first embodiment, and the main H is further disposed in the heat dissipating/removing step, including the _f folding portion, and the: 0d is vertically bent from one end of the expanding portion 120d. Folding the heat sink on the second upper fold
避免料刀第—散熱片。該彎折部⑽主要用於 避免該散熱裝置l〇〇d與其他雷早分彼政L n〇d 間，可以為機箱内部，也可以為機 利於政熱之空 :、裝=刪之政熱性能。此外，可根據實際需要-折擴展 。使形成之管折部與擴展部之間形成一定爽角，該爽角 1308051 可介於0度至180度之間，例如15度、30度、45度、60 度、120度、150度等，以便根據實際使用情況更好地繞過 其他電子元件，同時提升整體之散熱性能。 上述之幾個實施例中，每一散熱裝置包括一擴展部， 用以將本體部吸收之部分熱量轉移並散發到遠離熱源即被 冷卻電子元件、有利於散熱之區域，既可以降低熱源周圍 空氣之溫度，同時也可以充分利用擴展部及第二散熱片進 行散熱’從而提升散熱裝置之散熱性能。 為進一步提升上述散熱裝置之性能，本發明之散熱裝 置可以進一步包含嵌置於上述本體部、擴展部内之導熱元 件。與上述本體部、擴展部相比較，該導熱元件具有較高 之熱傳導率，例如本體部及擴展部可由金屬鋁、銅等製成， 導熱元件可以由銅、熱管、液冷系統中之液冷塊（其包括 一進液口及一出液口，以便冷卻液在液冷塊内循環流動）、 熱電冷卻結構等製成。導熱元件與本體部、擴展部之間之 具體結合位置關係’可以參考下述幾個實施例。 圖7至9所示為本發明散熱裝置之第六實施例。該影 熱裝置lGGe與第-實施例中之散熱裳置⑽結構相近似， :包括-本體部110e、_擴展部12〇e及礙置於該本體部 -Γμ擴展部12如内之導熱元件_，該本體部㈣及 間之不狀處在之體部iig、擴展部⑽之 ⑽之—開Π me,該擴形成有貫穿該本體部 ㈣之-槽道124e，且卩1⑹上形成有貫穿該擴展部 且該槽道124e與本體部11〇e上之開 11 1308051 口 114e相通而組成一容置空間，用以容納該導熱元件 140e。該導熱元件u〇e之外形結構與本體部ii〇e、擴展部 120e連接而成之外形結構相似，其可劃分為容致於開口 114e内之一第一部分142e及容致於槽道12扑内之一第二 P刀144e其中該導熱元件140e之底面與本體部之 底面共面，以便與被冷卻電子元件直接接觸。使用時，導 熱元件140e吸收被冷卻電子元件產生之熱量，然後通過本 體部ll〇e、擴展部120e將熱量分別傳遞給第一散熱片n2e 及第一散熱片122e，最後通過位於不同區域内之第一散熱 片112e、第二散熱片122e將熱量散發到不同之區域内。由 於導熱το件14〇e具有較高之熱傳導率，可以將電子元件產 生之熱里迅速吸收並快速傳遞到遠離被冷卻電子元件之區 域，提升整體之散熱性能。 圖至12所示為本發明散熱裝置之其他三個實施 7其刀別與上述第三實施例、第四實施例、第五實施例 、。構相似’其主要不同之處在於：每—散熱裝置進一步包 括一導熱讀，該導熱元件與相應本體部、擴展部連接而 成之外部形狀相似，該導熱元件與相應之本體部、擴展部 1之’、且&方式與上述第六實施例中之相應元件之間之組 σ方式相似。 如圖7-12至所示，每一散熱裝置中之容置空間都貫穿 =應本體部、擴展部’以容置相應之導熱元件。根據設計、 a產等要素之需要’可以對導熱元件與相應本體部、擴展 邛之間之組合方式進行適當改變。如圖13所示，散熱裝置 12 1308051 100f底部形成有一容置空間用以容置扁平之導熱元件 140f。該容置空間係由設於本體部之一凹陷部142f及從該 凹陷部142f延伸而出之一溝槽144f。可以理解地，容置空 間可以由貝穿本體部（擴展部）之開口（槽道）與設於擴 展部（或本體部）底部之溝槽（凹陷部）組合而成；此外， 該扁平導熱元件14〇f可以直接貼附於本體部、擴展部之底 面而無需設置容置空間。 上述導熱το件之熱傳導率比本體部、擴展部高。此外， 本體部、擴展部及導熱元件也可以為其他結構，且令本體 部、擴展部至少具有一個性質與導熱元件不同。例如，本 體#、擴展部可以由發泡金屬如發泡銅、發泡紹等製成， 而導熱7G件則可以為金屬如銅、㉟、熱管、液冷系統中之 液冷，、熱電冷卻結構等。這樣，本體部、擴展部之散熱 面積遠大於導熱元件之散熱面積，有利於加速熱量之散發。 可以理解地 散熱片可以垂直或傾斜地沿本體部 表面k伸而出第—散熱片也可以垂直或傾 表面延伸而出，而且第一、第一^ ^ 。 乐 弟一散熱片也可以分別自本體 部、擴展部向外呈放射狀延伸。此外，每一實施例中 熱裝置都可以進^一步句；τι»使4电JS *17 括由其擴展部一端彎折延伸而出之 臂折部’此結構與第五實施例中之結構相似。 綜上所述，本發明符合發明專利要件 利申請。惟，以上所述者僅以相± 托出專 為本發明之較佳實施例，舉凡 二、悉本案技藝之人士，在著依太I 2 «化，比精神所作之等效修飾 次變化，白應涵盍於以下之申請專利範圍内。 13 Ϊ308051 -【圖式簡單說明】 圖1係習知技術中之一種散熱裝置之立體圖。 圖2係本發明散熱裝置之第一實施例之立體圖。 圖3係本發明散熱裝置之第二實施例之示意圖。 圖4係本發明散熱裝置之第三實施例之俯視圖。 圖5係本發明散熱裝置之第四實施例之俯視圖。 圖6係本發明散熱裝置之第五實施例之俯視圖。 圖7係本發明散熱裝置之第六實施例之立體圖。 圖8係圖7中散熱裝置之立體分解圖。 圖9係圖7中散熱裝置之仰視圖。 圖10係本發明散熱裝置之第七實施例之俯視圖。 圖11係本發明散熱裝置之第八實施例之俯視圖。 圖12係本發明散熱裝置之第九實施例之俯視圖。 圖13係本發明散熱裝置之第十實施例之底部朝上時立 體圖。 【主要元件符號說明】 散熱裴置 100、l〇〇a、100b、100c、100d、100e、100f 本體部 110、110a、110b、110c、llOd、llOe 第一散熱片 112、112a、112b、112e 底面 113a 侧面 114a 開口 114e 棱邊 115a 擴展部 120、120a、120b、120c、120d、120e 14 1308051 第二散熱片 槽道 導熱元件 第二部分 溝槽 122、122a、122b、122c 124e 彎折部 140e、140f 第一部分 144e 凹陷部 144f 、122e 130d 142e 142f 15Avoid the knife-heat sink. The bending portion (10) is mainly used to prevent the heat dissipating device l〇〇d from being separated from other thunders, and may be internal to the chassis, or may be a machine for political heat: Thermal performance. In addition, it can be expanded according to actual needs. Forming a certain refresh angle between the formed tube fold portion and the expansion portion, the refresh angle 1308051 may be between 0 degrees and 180 degrees, for example, 15 degrees, 30 degrees, 45 degrees, 60 degrees, 120 degrees, 150 degrees, etc. In order to better bypass other electronic components according to the actual use, while improving the overall heat dissipation performance. In each of the above embodiments, each of the heat dissipating devices includes an expansion portion for transferring and dissipating a portion of the heat absorbed by the body portion to an area away from the heat source, that is, the cooled electronic component, and facilitating heat dissipation, thereby reducing air around the heat source. At the same time, the expansion portion and the second heat sink can be fully utilized for heat dissipation, thereby improving the heat dissipation performance of the heat sink. In order to further improve the performance of the heat sink, the heat sink of the present invention may further comprise a heat conducting component embedded in the body portion and the extension portion. Compared with the body portion and the expansion portion, the heat conducting element has a high thermal conductivity. For example, the body portion and the expanding portion may be made of metal aluminum, copper, etc., and the heat conducting element may be liquid-cooled in copper, heat pipes, and liquid cooling systems. The block (which includes a liquid inlet and a liquid outlet for circulating cooling liquid in the liquid cooling block), a thermoelectric cooling structure, and the like. The specific bonding positional relationship between the heat conducting member and the body portion and the expanding portion can be referred to the following embodiments. 7 to 9 show a sixth embodiment of the heat sink of the present invention. The heat-collecting device lGGe is similar to the heat-dissipating device (10) structure in the first embodiment, and includes: a body portion 110e, an expansion portion 12〇e, and a heat-conducting member that is disposed inside the body portion-Γμ expansion portion 12 _, the body portion (four) and the gap between the body portion iig, the expansion portion (10) (10) - opening me, the expansion formed through the body portion (four) - channel 124e, and the formation of the 卩 1 (6) Through the expansion portion, the channel 124e communicates with the opening 11 1308051 port 114e of the body portion 11〇e to form an accommodating space for accommodating the heat conducting element 140e. The outer shape of the heat conducting element u〇e is similar to the outer portion ii〇e and the expanded portion 120e, and can be divided into a first portion 142e and a channel 12 in the opening 114e. A second P-knife 144e is disposed therein, wherein a bottom surface of the heat-conducting element 140e is coplanar with a bottom surface of the body portion for direct contact with the cooled electronic component. In use, the heat conducting element 140e absorbs the heat generated by the cooled electronic component, and then transfers the heat to the first heat sink n2e and the first heat sink 122e through the body portion 110e and the expansion portion 120e, respectively, and finally passes through different regions. The first fins 112e and the second fins 122e dissipate heat to different regions. Since the heat-conducting material 14〇e has a high thermal conductivity, the heat generated by the electronic component can be quickly absorbed and quickly transmitted to a region away from the cooled electronic component, thereby improving the overall heat dissipation performance. Figures 12 through 12 show the other three embodiments of the heat sink of the present invention, the third embodiment, the fourth embodiment, and the fifth embodiment. The main difference is that each of the heat dissipating devices further includes a heat-conducting reading, and the heat-conducting element is similar to the outer shape of the corresponding body portion and the expansion portion, and the heat-conducting element and the corresponding body portion and the expansion portion 1 The ', and & mode is similar to the group σ mode between the corresponding elements in the sixth embodiment described above. As shown in Fig. 7-12, the accommodating space in each heat sink penetrates through the body portion and the expansion portion to accommodate the corresponding heat conducting elements. The combination of the heat-conducting element and the corresponding body portion and the expansion 适当 can be appropriately changed according to the needs of the design, the production, and the like. As shown in FIG. 13, an accommodating space is formed at the bottom of the heat sink 12 1308051 100f for accommodating the flat heat conducting element 140f. The accommodating space is formed by a recess 142f provided in one of the body portions and a groove 144f extending from the recess 142f. It can be understood that the accommodating space can be formed by combining an opening (channel) of the body portion (expansion portion) and a groove (recess portion) provided at the bottom of the expansion portion (or the body portion); The element 14〇f can be directly attached to the bottom surface of the body portion and the expansion portion without providing an accommodation space. The thermal conductivity of the heat transfer member is higher than that of the main body portion and the expanded portion. Further, the body portion, the expansion portion, and the heat conductive member may have other structures, and the body portion and the expansion portion have at least one property different from that of the heat conductive member. For example, the body # and the expansion portion may be made of a foamed metal such as foamed copper, foamed, etc., and the thermally conductive 7G member may be a metal such as copper, 35, a heat pipe, a liquid cooling in a liquid cooling system, and a thermoelectric cooling. Structure, etc. In this way, the heat dissipation area of the body portion and the extension portion is much larger than the heat dissipation area of the heat conduction member, which is advantageous for accelerating heat dissipation. It can be understood that the heat sink can extend vertically or obliquely along the surface k of the body portion. The heat sink can also extend vertically or obliquely, and the first and first surfaces are first and first. A heat sink of the music can also extend radially outward from the body and the extension. In addition, in each of the embodiments, the thermal device can be further stepped; the τι»4 electric JS*17 includes an arm fold portion which is bent and extended from one end of the expansion portion. This structure and the structure in the fifth embodiment similar. In summary, the present invention is in accordance with the application for the invention patent. However, the above is only a preferred embodiment of the invention, and the person who knows the skill of the present invention changes in the equivalent modification of the Yitai I 2 Bai Yinghan is within the scope of the following patent application. 13 Ϊ 308051 - [Simple Description of the Drawings] Fig. 1 is a perspective view of a heat dissipating device in the prior art. Figure 2 is a perspective view of a first embodiment of the heat sink of the present invention. 3 is a schematic view of a second embodiment of the heat sink of the present invention. Figure 4 is a plan view of a third embodiment of the heat sink of the present invention. Figure 5 is a plan view showing a fourth embodiment of the heat sink of the present invention. Figure 6 is a plan view showing a fifth embodiment of the heat sink of the present invention. Figure 7 is a perspective view of a sixth embodiment of the heat sink of the present invention. Figure 8 is an exploded perspective view of the heat sink of Figure 7. Figure 9 is a bottom plan view of the heat sink of Figure 7. Figure 10 is a plan view showing a seventh embodiment of the heat sink of the present invention. Figure 11 is a plan view showing an eighth embodiment of the heat sink of the present invention. Figure 12 is a plan view showing a ninth embodiment of the heat sink of the present invention. Figure 13 is a perspective view of the tenth embodiment of the heat sink of the present invention with the bottom facing upward. [Description of main component symbols] Heat dissipation devices 100, 10a, 100b, 100c, 100d, 100e, 100f Main body portions 110, 110a, 110b, 110c, 11Od, 11Oe The bottom surfaces of the first heat sinks 112, 112a, 112b, 112e 113a side 114a opening 114e edge 115a expansion portion 120, 120a, 120b, 120c, 120d, 120e 14 1308051 second fin channel heat conducting element second portion groove 122, 122a, 122b, 122c 124e bending portion 140e, 140f First portion 144e recess 144f, 122e 130d 142e 142f 15