201142579 六、發明說明： 【發明所屬之技術領域】 本發明，是有關於將電子機器內的被冷卻零件例如 CPU、MPU等的發熱零件加以冷卻使用的散熱器。 【先前技術】 近年來，包括個人電腦的各種電器及電子設備的高性 能化、小型化是急速發展。但是被搭載於筆記型個人電腦 和膝上型、或桌上型的個人電腦的CPU、MPU等的高性能 化是隨著其而使發熱量增大。另一方面，電器及電子設備 的小型化的要求愈來愈高，電器及電子設備內的省空間化 的要求也日益增加。 高性能化的CPU、MPU等的發熱零件的冷卻始終爲重 要的技術課題並佔有大的比重。進一步，對於電腦以外的 電器及電子設備的高性能化的發熱零件、發熱元件的冷卻 ，在電器及電子設備內的省空間化的要求也爲重要的課題 並佔有大的比重。 將被搭載於電器及電子設備的電子零件冷卻的方法， 具有例如在機器安裝風扇，藉由電動使風扇旋轉，藉由冷 卻風將機器框體內的空氣的溫度下降的方法。進一步，已 知不使用風扇，而藉由在被冷卻零件安裝冷卻體，將該被 冷卻零件直接地冷卻的方法等。 這種安裝在被冷卻零件的冷卻體，多使用例如銅材和 鋁材等的傳熱性優異的材料的板材。進一步，冷卻體多使 -5- 201142579 用各種熱配管等。具體而言，使用：與發熱零件可傳熱地 連接的基座托板、及由與基座托板可傳熱地連接的薄板鰭 片所構成的散熱器，進一步，將散熱器及各種熱配管組合 使用。 在熱配管的內部設有成爲作動流體的流路的空間，被 收容在該空間的作動流體，是藉由蒸發、凝縮等的相變化 和移動，進行熱的移動。即，在熱配管的吸熱側，藉由將 構成熱配管的容器的材質中熱傳導來的被冷卻零件所發出 的熱，使作動流體蒸發，其蒸氣會朝熱配管的放熱側移動 。在放熱側，作動流體的蒸氣會被冷卻而再度返回至液相 狀態。如此返回至液相狀態的作動流體會再度朝吸熱側移 動（還流）。藉由這種作動流體的相變態和移動來進行熱的 移動。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2009- 1 98 1 73號公報 [專利文獻2]日本特開平1 0- 1 07 1 92號公報 【發明內容】 (本發明所欲解決的課題） 在由與發熱零件可傳熱地連接的基座托板、及與基座 托板可傳熱地連接的薄板鰭片所構成的散熱器中，爲了提 高從鰭片的放熱性會將薄板鰭片的尺寸加大，因而使散熱 器的小型化困難。[Technical Field] The present invention relates to a heat sink for cooling a heat-generating component such as a CPU or an MPU in an electronic device. [Prior Art] In recent years, high performance and miniaturization of various electric appliances and electronic devices including personal computers have been rapidly developed. However, the high performance of the CPU, MPU, etc., which are mounted on a notebook personal computer and a laptop or a desktop personal computer, increases the amount of heat generated. On the other hand, the requirements for miniaturization of electrical and electronic equipment are increasing, and the requirements for space saving in electrical and electronic equipment are increasing. The cooling of high-performance components such as CPUs and MPUs is always an important technical issue and has a large proportion. Further, the cooling of high-performance heat-generating components and heat-generating components for electrical appliances and electronic equipment other than computers, and the need for space saving in electrical appliances and electronic equipment are also important issues and occupy a large proportion. A method of cooling an electronic component mounted on an electric appliance or an electronic device has, for example, a method in which a fan is mounted on a machine, and the fan is rotated by electric power to lower the temperature of the air in the casing of the machine by the cooling air. Further, a method of directly cooling the cooled component by mounting a cooling body on the member to be cooled without using a fan is known. Such a heat sink attached to the member to be cooled is often made of a material having a material having excellent heat conductivity such as copper or aluminum. Further, the heat sink is often made of various heat pipes and the like -5 - 201142579. Specifically, a heat sink is used to heatably connect the base plate and a heat sink formed by heat transferably connected to the base plate, and further, the heat sink and various heats are used. The piping is used in combination. A space serving as a flow path of the actuating fluid is provided inside the heat pipe, and the actuating fluid accommodated in the space is thermally moved by phase change and movement such as evaporation or condensation. In other words, on the heat absorbing side of the heat pipe, the actuating fluid evaporates by the heat generated by the cooled component which thermally conducts the material of the container constituting the heat pipe, and the vapor moves toward the heat releasing side of the heat pipe. On the exothermic side, the vapor of the actuating fluid is cooled and returned to the liquid phase. The actuating fluid thus returned to the liquid phase will again move toward the heat absorbing side (returning). The movement of heat is performed by the phase change and movement of the actuating fluid. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. 2009- 1 98 1 73 [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei No. Hei. Problem to be solved) In order to improve the heat release from the fin, a heat sink formed by a heat transferably connected base plate and a heat sink connected to the base plate The size of the thin plate fins is increased, which makes it difficult to miniaturize the heat sink.
-6- 201142579 安裝風扇的情況時，需要供安裝風扇用的空間，欲配 置於可達成省空間化的薄型的框體中是困難的。進一步， 爲了引出風扇的能力而將風扇大型化或加大旋轉數的話， 會有風扇驅動用的音和振動變大的問題點。 因此，本發明的目的是提供一種散熱器，可以提高放 熱性能，並可減小鰭片的尺寸地省空間化。 且在專利文獻1中，至少1個熱配管是沿著板狀鰭片 的長度方向被延伸設置，於藉由第1托板材及第2托板材 被挾持，並與那些可傳熱地連接。但是，高性能化的CPU 、MPU等的發熱零件的冷卻用的放熱性並不充分。 且如專利文獻2，習知若欲從基座面將散熱器插入鰭 片部的話，在熱配管彎曲R部配置鰭片是困難的’因此在 設計的自由度下有其限制。 (用以解決課題的手段） 發明人是爲了解決習知的問題點，而不斷地專心硏究 。其結果得知，使用高度不同的2種類的薄板鰭片’在主 力的部分配置低薄板鰭片’將高薄板鰭片配置在端部’橫 跨薄板鰭片的整體與熱配管可傳熱地連接’進一步將熱配 管的一部分插通高薄板鰭片的部分的話’即使將鐘片的尺 寸全盤地縮小’仍可以提高從鰭片的放熱性。 即，可橫跨熱配管全長接觸鰭片’從發熱零件傳達至 熱配管的熱’是透過上托板傳到低薄板鰭片’從薄板轄片 被放熱，同時’藉由被插通高薄板鰭片的熱配管’就可以 201142579 有效率地從薄板鰭片放熱。本發明即是依據上述的硏究結 果。 本發明的散熱器的第1態樣，是一種散熱器，具備： 基座托板，其是由一方的面與發熱零件可傳熱地連接、或 與由薄板鰭片所構成的第1放熱鰭片部可傳熱地連接；及 上托板，其是由一方的面與由高度不同的2種類的薄板鰭 片所構成的第2放熱鰭片部可傳熱地連接；及複數熱配管 ，在前述基座托板的另一方的面及前述上托板的另一方的 面之間可傳熱地連接配置，且包含至少一部分被插通前述 第2放熱鰭片部的一部分的熱配管。 本發明的散熱器的第2態樣，是前述第2放熱鰭片部 ，是由：與前述上托板的前述一方的面垂直地被配置的複 數低薄板鰭片、及與前述複數低薄板鰭片鄰接並垂直地被 配置的複數高薄板鰭片所構成。 本發明的散熱器的第3態樣，是前述第2放熱鰭片部 ，是由：與前述上托板的前述一方的面垂直地被配置的複 數低薄板鰭片、及在前述複數低薄板鰭片的一方的端部上 呈水平方向被配置的複數薄板鰭片所構成。 本發明的散熱器的第4態樣，是前述第1放熱鰭片部 ，是由在對應前述複數高薄板鰭片的前述基座托板的前述 一方的面上的部位呈垂直地被配置的複數薄板鰭片所構成 〇 本發明的散熱器的第5態樣，是前述複數熱配管，是 由至少一部分爲扁平形狀的熱配管所構成’在中央部呈平 201142579 行地被配置，在前述上托板的長度方向的兩端部中’一部 分是朝向前述上托板的兩外側擴大被配置。 本發明的散熱器的第6態樣，是被插通前述第2放熱 鰭片部的一部分之熱配管，是由被配置於兩端部的其中任 一的熱配管所構成，將垂直地被配置的前述複數高薄板鰭 片從一方朝向另一方朝橫方向插通。 本發明的散熱器的第7態樣，是被插通前述第2放熱 鰭片部的一部分之熱配管，是由被配置於兩端部的熱配管 所構成，將呈水平方向被配置的複數薄板鰭片朝垂直方向 插通。 [發明的效果] 依據本發明的散熱器，使用高度不同的2種類的薄板 鰭片，於這些高度不同的2種類的薄板鰭片是相鄰接，在 主力的部分配置低薄板鰭片，將高薄板鰭片配置在端部， 橫跨薄板鰭片的整體與熱配管可傳熱地連接，進一步將熱 配管的一部分插通高薄板鰭片的部分的話，即使將鰭片的 尺寸全盤地縮小，仍可以提高從鰭片的放熱性。進一步， 藉由與基座托板的發熱零件所位置的側的面可傳熱地連接 的薄板鰭片，使提高放熱性。 【實施方式】 一邊參照圖面一邊說明本發明的散熱器。 本發明的散熱器的1個態樣，是一種散熱器，具備： -9- 201142579 由一方的面與發熱零件可傳熱地連接且與由薄板鰭片所構 成的第1放熱鰭片部可傳熱地連接的基座托板、及由一方 的面與由高度不同的2種類的薄板鰭片所構成的第2放熱 鰭片部可傳熱地連接之上托板、及在基座托板的另一方的 面及上托板的另一方的面之間可傳熱地連接配置且至少一 部分被插通第2放熱鰭片部的一部分的熱配管之複數熱配 管。第1放熱鰭片是與基座托板連接較佳，但不連接也可 以。連接的情況時可以與除了與發熱零件接觸的部分以外 的基座托板的全面或一部分連接。 第1圖，是說明本發明的散熱器的1個態樣用的立體 圖。在此態樣中，由高度不同的2種類的薄板鰭片所構成 的第2放熱鰭片部，是由：與上托板的一方的面垂直地被 配置的複數低薄板鰭片（A)、及與複數低薄板鰭片鄰接並 呈垂直地被配置的複數高薄板鰭片（B)所構成。 即，如第1圖所示，在與發熱零件可傳熱地連接的基 座托板2(圖中下側）中，在與發熱零件相同側，第1放熱 鰭片7(詳細說明如後）是可傳熱地連接。將複數熱配管8 挾持的方式使上托板3被配置於基座托板2的相反側。在 上托板3的表面（圖中上側），第2放熱鰭片部5是可傳熱 地被連接配置。第2放熱鰭片部5，是由複數平行的低薄 板鰭片（A)及複數平行的高薄板鰭片（B)的高度不同的2種 類的薄板鰭片所構成。在此態樣中，低薄板鰭片（A)及高 薄板鰭片（B)的其中任一皆與上托板的上面垂直地被配置 -10- 201142579 第2放熱鰭片部5，除了一方的端部以外，是橫跨上 托板3的大致整體使複數低薄板鰭片（A)垂直地被配置’ 在上托板3的一方的端部中’複數高薄板，鰭片（B)是垂直 地被配置。如此藉由將上托板3的大部分低薄板鰭片（A) 形成，就可以減小鰭片所需要的空間° 設置鄰接於複數低薄板鰭片（A)於面積的大的複數高 薄板鰭片（B) ’就可提高散熱器的放熱性能。 第2圖，是顯示第1圖所示的態樣的散熱器的背面的 圖。參照第2圖說明熱配管的配置。如第2圖所示，在與 發熱零件10可傳熱地連接的基座托板2的一方的端部中 ，上述的第1放熱鰭片部7是可傳熱地連接配置。第1放 熱鰭片部7，是由可與基座托板2的發熱零件所位置側的 面垂直地傳熱地被連接的複數平行的薄板鰭片（C)所構成 。薄板鰭片（C)，是被配置於對應第2放熱鰭片部5的高 薄板鰭片（B)的側的端部。此放熱鰭片7是被配置於對應 第2放熱鰭片部5的高薄板鰭片（B)的側的端部較佳’但 將面積擴大也可以，不配置也可以。 如上述，複數熱配管8是被挾持於上托板3及基座托 板2之間的方式被配置。在第2圖由點線顯示複數熱配管 的配置例。在第2圖的例中，複數熱配管8中，中央部的 熱配管8-3、8-4，是沿著散熱器1的長度方向大致正直地 被配置，在一方的端部中，各別朝向散熱器1的兩外側變 曲地被配置。在第1圖所示的例中，熱配管8-1〜8-4是成 爲在內部各別被封入作動液的薄管狀的薄的構造，由上下 -11 - 201142579 的大的面積與基座托板2及上托板3接觸地被配置。熱配 管的剖面形狀，在本實施例中，是在基座托板及上托板之 間成爲薄的矩形狀的形狀。熱配管的剖面形狀，是可以對 應其配置場適宜地形成不同形狀。例如，貫通薄板鰭片的 部分是形成剖面圆形的管狀構件，或爲了更增加接觸面積 ，形成寬度更寬的形狀等，可以配合所要求的功能及環境 適宜地變更。 兩側的熱配管8-1、8-2，其長度方向的中央部是與其 他的熱配管大致平行地正直地被配置，一方的端部，是各 別朝向散熱器1的兩外側變曲地被配置。在另一方的端部 (即配置有薄板鰭片（C)的端部）中，外側的一方的熱配管 8-1，是朝向散熱器的外側變曲地被配置，另一方的熱配 管8-2，是朝向散熱器的外側變曲地被配置之後，繼續朝 上方立起，將複數高薄板鰭片（B)朝橫方向貫通地被插入 。在第2圖所示的態樣中，可以確認熱配管的先端部9。 又，複數熱配管8，其中任一除了一部分以外皆形成扁平 ，寬度被壓縮，使與基座托板2、上托板3接觸的面積變 大，熱移動就容易進行。 如上述，複數熱配管8的至少1根，是藉由將面積的 大的複數高薄板鰭片（B)朝橫方向貫通，就但從熱配管8 朝複數薄板鰭片（B)將熱傳達。熱配管8及高薄板鰭片（B) 是儘可能由寬面積接觸，且熱阻力愈小愈佳。因此，例如 ，可以由焊穿加工形成薄板鰭片的貫通孔，進一步藉由錫 焊附及奸焊連接。如此，藉由將熱配管8及高薄板鰭片 •12- 201142579 (B)可傳熱地連接，就可提高放熱鰭片的放熱性能。即， 發熱零件10的熱，是透過基座托板傳到複數熱配管8-1、 8-2、8-3' 8-4’進一步，傳達至上托板3，使放熱被促進 〇 又，在此實施例中，雖只有顯示只有熱配管8-2貫通 高薄板鰭片（B)的構成，但是依據需要，使複數熱配管8 貫通的方式構成也可以。 進一步，藉由具備彎曲部的複數熱配管8，傳達至與 上托板3的上面垂直地被配置可傳熱地連接的複數低薄板 鰭片（A)的整體地被放熱。進一步，複數熱配管8的至少1 根熱配管的端部，是將放熱性能的較高的複數高薄板鰭片 (B)朝橫方向插通，就可將鰭片的放熱性能進一步提高。 因此’在本發明的散熱器中，可以將鰭片小型化，且可以 提高鰭片的放熱性能。 薄板鰭片是從孔或鰭片端部加工成3形狀，將熱配管 插通。孔是由焊穿加工而形成也可以。插通鰭片之後，依 據需要由錫焊或釺焊等連接也可以。 第3圖’是本發明的散熱器的俯視圖。如第3圖所示 ’在上托板的上面，除了一方的端部以外複數低薄板鰭片 (A) 是垂直地被配置在整體。進—步，在—方的端部中， 配置有鄰接於低薄板鰭片（A)且面積大的複數高薄板鰭片 (B) 。在散熱器的兩外側的—部分，具備將複數熱配管8 挾持並供固定上托板3及基座托板2用的固定部6。 第4圖，是從高薄板鰭片（B)所見，本發明的散熱器 -13- 201142579 的後面圖。如第4圖所示，被挾持配置在基座托板2及上 托板3之間的複數熱配管8的1根熱配管的端部9是朝上 方立起，將複數高薄板鰭片（B)朝橫方向插通。在第4圖 中，在對應高薄板鰭片（B)的基座托板的部位配置有薄板 鰭片（C)。 第5圖，是散熱器的側面圖。第6圖，是從第5圖的 相反側所見的側面圖。如第5圖及第6圖所示，第1放熱 鰭片部7也就是複數平行的薄板鰭片（C)是垂直地被配置 在與發熱零件可傳熱地連接的基座托板2的端部。在上托 板3的上面配置有第2放熱鰭片部5的低薄板鰭片（A)及 高薄板鰭片（B)。高薄板鰭片（B)，是設在對應薄板鰭片（C) 側的端部。基座托板2及上托板3，是在將複數熱配管8 挾入的狀態下藉由固定部6被固定β複數熱配管8的至少 1根熱配管的端部9是朝上方立起，將第2放熱鰭片部5 的高薄板鰭片（Β)朝橫方向插通。如上述，由低薄板鰭片 形成放熱鰭片部的大部分’將鰭片小型化，在端部配置面 積的大的高薄板鰭片，將熱配管的一部分朝橫方向插通， 來提高鰭片的放熱性能。 第7圖’是說明本發明的散熱器的其他的1個態樣用 的立體圖。在此態樣中，由高度不同的2種類的薄板鰭片 所構成的第2放熱繪片部，是由：與上托板的—方的面垂 直地被配置的複數低薄板鰭片、及在複數低薄板鰭片的一 方的端部上呈水平方向被層疊配置的複數薄板鰭片所構成 -14- 201142579 即，如第7圖所示，在與發熱零件可傳熱地連接的基 座托板2 (圖中下側）中，在與發熱零件相同側’第1放熱 鰭片7是可傳熱地連接。將複數熱配管8挾持地配置有上 托板3。在上托板3的表面（圖中上側），第2放熱鰭片部5 是可傳熱地被連接配置。第2放熱鰭片部5’是與上托板 3的上面全面呈垂直地被配置的複數平行的低薄板鰭片（E) 、及在複數低薄板鰭片的一方的端部上呈水平方向被層疊 配置的複數薄板鰭片（D)所構成。在此態樣中，低薄板鰭 片（E)，是與上托板3的上面垂直地被配置，被層疊配置 的薄板鰭片（D)，是與上托板3的上面平行地朝向上方地 被層疊配置。 第2放熱鰭片部5，是橫跨上托板3的大致整體地使 複數低薄板鰭片（E)垂直地被配置，進一步，在複數低薄 板鰭片（E)的端部的上面，複數被層疊的薄板鰭片（D)是與 上托板平行地被配置。如此藉由將上托板3的大部分由低 薄板鰭片（E)構成，就可以減小鰭片所需要的空間。 設置與複數低薄板鰭片（E)的一方的端部的上面接觸 且面積的大的複數被層疊的薄板鰭片（D)，就可提高散熱 器的放熱性能。 第8圖，是顯示第7圖所示的態樣的散熱器的背面的 圖》參照第8圖說明熱配管的配置。如第8圖所示，在與 發熱零件10可傳熱地連接的基座托板2的一方的端部中 ，上述的第1放熱鰭片部7是可傳熱地連接配置。第1放 熱鰭片部7，是由可與基座托板2的發熱零件所位置側的 -15- 201142579 面垂直地傳熱地被連接的複數平行的薄板鰭片（c)所構成 。薄板鰭片（C)’是被配置於對應第2放熱鰭片部5的被 層疊的薄板鰭片（D)側的端部。此放熱鰭片7若不與與發 熱零件接觸的話’加大面積也可以’不配置也可以。 參照第8圖如以上說明，使上托板3及基座托板2之 間被挾持的方式配置有複數熱配管8。如第8圖點線所示 ，複數熱配管8，其中央部的熱配管8-3、8-4，是沿著散 熱器的長度方向大致正直地被配置，在一方的端部中，各 別朝向散熱器1的兩外側變曲地被配置。 兩側的熱配管8-1、8-2，其長度方向的中央部是與其 他的熱配管8-3、8-4大致平行地正直地被配置，一方的端 部，是各別朝向散熱器1的兩外側變曲地被配置。在另一 方的端部（即配置有薄板鰭片（C)的端部）中，熱配管8-1的 端部9-1，是朝上方立起，將複數被層疊的薄板鰭片（D)朝 垂直方向地插通配置。同樣地，熱配管8-2的端部9-2， 是朝上方立起，將複數被層疊的薄板鰭片（D)朝垂直方向 地插通配置。複數熱配管8，除了 一部分（端部9-1、9-2) 以外皆爲扁平，且寬度被壓縮，使基座托板2、上托板3 的接觸面積變大，使熱移動容易進行。 如上述，複數熱配管的至少2條端部是藉由各別將複 數被層疊的薄板鰭片（D)朝垂直方向插通，就可提高放熱 鰭片的放熱性能。即，發熱零件10的熱，是透過基座托 板傳到複數熱配管8-1、8-2、8-3、8-4，進一步朝上托板 3傳遞。 -16- 201142579 進一步，藉由具備彎曲部的複數熱配管8，與上托板 3的上面垂直地被配置並傳達至可傳熱地連接的複數低薄 板鰭片（E)的整體而被放熱。進一步，複數熱配管8的至 少2條熱配管8-1、8-2的端部9-1、9-2，是將放熱性能 的較高的複數被層疊的薄板鰭片（D)朝垂直方向插通，將 鰭片的放熱性能進一步提高。因此，在本發明的散熱器中 ，可以將鰭片小型化，且可以提高鰭片的放熱性能。 第9圖，是本發明的散熱器的俯視圖。如第9圖所示 ，在上托板3的上面中，複數低薄板鰭片（E)整體是垂直 地被配置。進一步，在低薄板鰭片（E)的上面的一方的端 部中，與低薄板鰭片（E)的上面接觸地配置有複數被層疊 的薄板鰭片（D)。在散熱器1的兩外側的一部分，具備將 複數熱配管8挾持並供固定上托板3及基座托板2用的固 定部6。 第10圖，是與低薄板鰭片（E)的上面接觸，從複數被 層疊的薄板鰭片（D)側所見，本發明的散熱器的後面圖。 如第10圖所示，被挾持在基座托板2及上托板3地被配 置的複數熱配管8的2條熱配管8-1、8-2的端部9-1、9-2是朝上方立起，將複數被層疊的薄板鰭片（D)朝垂直方向 插通。在第1〇圖中，在對應被層疊的薄板鰭片（D)的基座 托板的部位配置有薄板鰭片（C)。爲了朝垂直方向插通而 在薄型鰭片（D)形成孔，此孔是由焊穿加工而形成也可以 。插通鳍片之後，依據需要由錫焊或奸焊等連接也可以。 第11圖，是散熱器的側面圖。如第11圖所示，第1 -17- 201142579 放熱鰭片部7也就是複數平行的薄板鰭片（C)是垂直地被 配置在與發熱零件可傳熱地連接的基座托板2的端部。在 上托板3的上面配置有第2放熱鰭片部5的低薄板鰭片 (E)及被層疊的薄板鰭片（D)。被層疊的薄板鰭片（D)’是在 對應薄板鰭片（C)的側的端部’與低薄板鰭片（E)的上端面 接觸地被設置。基座托板2及上托板3，是在將複數熱配 管8挾入的狀態下藉由固定部6被固定。複數熱配管8的 至少2條熱配管8-1、8-2的端部9-1、9-2是朝上方立起 ，將第2放熱鰭片部5的被層疊的薄板鰭片（D)朝垂直方 向插通。如上述，由低薄板鰭片形成放熱鰭片部的大部分 ，將鰭片小型化，在端部配置被層疊的薄板鰭片，將熱配 管的一部分朝垂直方向插通，就可提高鰭片的放熱性能。 第12圖，是說明將本發明的散熱器的薄板鰭片與基 座托板和上托板等接合的形狀的剖面圖。薄板鰭片，可以 對應散熱器的配置場所、可配置的空間等其他的條件而採 取各種形狀。且可以將各種形狀的薄板鰭片自由地組合。 在第12圖中，雖例示在基座托板2設置薄板鰭片部7時 將各薄板鰭片C連接的形狀，但是將薄板鰭片A、B朝上 托板3連接的情況時也可適用。 在第12圖（a)所示的態樣中，將由底面、垂直面、上 面所構成的剖面的字形狀的薄板鰭片朝橫方向並列配置 而形成放熱鰭片部。在此態樣中，複數底面被並列配置並 形成平面的受熱面，使基座托板2可傳熱地連接在平面的 受熱面。同時在複數放熱鰭片被並列配置的上面也形成平-6- 201142579 When installing a fan, it is necessary to install a space for the fan, and it is difficult to arrange it in a thin frame that can achieve space saving. Further, in order to increase the size of the fan or increase the number of rotations in order to extract the capacity of the fan, there is a problem that the sound and vibration for driving the fan become large. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat sink which can improve heat dissipation performance and which can reduce the size of the fins and save space. Further, in Patent Document 1, at least one of the heat pipes is extended along the longitudinal direction of the plate fins, and is held by the first support plate and the second support plate, and is heat-transferably connected to those. However, the heat dissipation property of the heat-generating components such as the high-performance CPU and MPU is not sufficient. Further, as disclosed in Patent Document 2, it is conventionally known that it is difficult to arrange fins in the R portion of the heat pipe when the heat sink is to be inserted into the fin portion from the base surface. Therefore, there is a limitation in design freedom. (Means for Solving the Problem) The inventor is constantly focusing on solving problems in order to solve conventional problems. As a result, it has been found that two types of thin plate fins having different heights are disposed in the main force portion, and low-thin plate fins are disposed. The high-thin plate fins are disposed at the ends, and the whole of the thin plate fins and the heat pipes are heat-transferable. When the connection is made to further insert a part of the heat pipe into the portion of the high-thin plate fin, the heat dissipation from the fin can be improved even if the size of the disk is reduced in size. That is, the heat that can be transmitted across the entire length of the heat pipe to the fins 'transmitted from the heat-generating parts to the heat pipes' is transmitted to the low-thin plate fins through the upper plate, and is released from the thin plate slabs, while being inserted through the high-thickness plates. The heat pipe of the fins can efficiently dissipate heat from the thin plate fins in 201142579. The present invention is based on the above findings. A first aspect of the heat sink according to the present invention is a heat sink comprising: a susceptor plate that is heat-transferably connected to a heat-generating component by one surface or a first heat-dissipating member formed by a thin plate fin The fin portion is heat-transferably connected; and the upper tray is heat-transferably connected to the second heat-dissipating fin portion composed of two types of thin plate fins having different heights; and the plurality of heat pipes a heat pipe that is heatably connected between the other surface of the susceptor plate and the other surface of the upper tray, and includes at least a part of the heat pipe that is inserted through a part of the second heat radiation fin portion . According to a second aspect of the heat sink of the present invention, the second heat radiation fin portion is formed by a plurality of low-thin plate fins disposed perpendicularly to the one surface of the upper tray, and the plurality of low-thin sheets The fins are formed by a plurality of high-thin plate fins that are adjacent to and vertically disposed. According to a third aspect of the heat sink of the present invention, the second heat radiation fin portion is formed by a plurality of low-thin plate fins disposed perpendicularly to the one surface of the upper tray, and the plurality of low-thin sheets One end of the fin is formed of a plurality of thin plate fins arranged in the horizontal direction. According to a fourth aspect of the heat sink of the present invention, the first heat radiation fin portion is vertically disposed at a portion of the one surface of the susceptor plate corresponding to the plurality of high-thin plate fins. A fifth aspect of the heat sink according to the present invention is the heat exchanger of the present invention, wherein the plurality of heat pipes are formed of at least a part of a heat pipe having a flat shape, and are disposed at a central portion at a height of 201142579 rows. A part of both end portions of the upper pallet in the longitudinal direction is arranged to be enlarged toward both outer sides of the upper pallet. A sixth aspect of the heat sink according to the present invention is a heat pipe that is inserted into a part of the second heat radiation fin portion, and is configured by one of the heat pipes disposed at both ends, and is vertically The plurality of high-thin plate fins disposed are inserted from one side toward the other in the lateral direction. The seventh aspect of the heat sink according to the present invention is a heat pipe that is inserted into a part of the second heat radiation fin portion, and is configured by a heat pipe disposed at both end portions, and is disposed in a horizontal direction. The thin plate fins are inserted in the vertical direction. [Effects of the Invention] According to the heat sink of the present invention, two types of thin plate fins having different heights are used, and two types of thin plate fins having different heights are adjacent to each other, and low-thin plate fins are disposed in the main force portion. The high-thin plate fins are disposed at the ends, and the entire thin plate fins are heat-transferrably connected to the heat pipes, and a part of the heat pipes is further inserted into the portions of the high-thin plate fins, even if the fins are completely reduced in size. , can still improve the heat release from the fins. Further, the heat radiating property is improved by the heat-transfer-connected thin plate fins on the side surface on the side where the heat generating component of the susceptor plate is located. [Embodiment] A heat sink of the present invention will be described with reference to the drawings. One aspect of the heat sink of the present invention is a heat sink comprising: -9- 201142579 which is heat-transferably connected to a heat-generating component by one surface and to a first heat-dissipating fin portion formed of a thin-plate fin a base plate that is heat-transferred and a second heat-dissipating fin portion composed of one surface and two types of thin plate fins having different heights can be thermally connected to the upper plate and the base plate A plurality of heat pipes that are disposed to be heat-transferred and that are at least partially inserted into a heat pipe of a part of the second heat radiation fin portion are disposed between the other surface of the plate and the other surface of the upper plate. The first heat releasing fin is preferably connected to the base tray, but may be connected. In the case of the connection, it may be connected to a whole or a part of the susceptor pallet other than the portion in contact with the heat generating component. Fig. 1 is a perspective view for explaining one aspect of the heat sink of the present invention. In this aspect, the second heat releasing fin portion composed of two types of thin plate fins having different heights is composed of a plurality of low-thin plate fins (A) disposed perpendicularly to one surface of the upper pallet. And a plurality of high-thin plate fins (B) arranged adjacent to the plurality of low-thin plate fins and arranged vertically. That is, as shown in Fig. 1, in the susceptor pallet 2 (lower side in the figure) which is heat-transferably connected to the heat-generating component, the first heat-releasing fin 7 is provided on the same side as the heat-generating component (details are as follows) ) is heat transferable. The upper pallet 3 is placed on the opposite side of the susceptor pallet 2 in such a manner that the plurality of heat pipes 8 are held. On the surface (upper side in the figure) of the upper pallet 3, the second heat releasing fin portions 5 are heatably connected to each other. The second heat releasing fin portion 5 is composed of two types of thin plate fins having different heights of a plurality of parallel low-thin plate fins (A) and a plurality of parallel high-thickness plate fins (B). In this aspect, any of the low-thin plate fins (A) and the high-thin plate fins (B) are disposed perpendicularly to the upper surface of the upper tray. -10- 201142579 The second heat-dissipating fin portion 5, except for one side In addition to the end portion, a plurality of low-thin plate fins (A) are vertically disposed across the entire upper portion of the upper pallet 3 'in one end portion of the upper pallet 3', a plurality of high-thin plates, fins (B) It is configured vertically. Thus, by forming most of the low-thin plate fins (A) of the upper pallet 3, the space required for the fins can be reduced. A large number of high-thickness plates adjacent to the area of the plurality of low-thin plate fins (A) are provided. Fin (B) 'can improve the heat release performance of the heat sink. Fig. 2 is a view showing the back surface of the heat sink shown in Fig. 1. The arrangement of the heat pipes will be described with reference to Fig. 2 . As shown in Fig. 2, in the one end portion of the susceptor plate 2 that is heat-transferably connected to the heat generating component 10, the above-described first heat releasing fin portion 7 is heat-transferably connected. The first heat radiating fin portion 7 is composed of a plurality of parallel thin plate fins (C) which are heatably connected to the surface on the side of the heat generating component of the base pallet 2 to be connected. The thin plate fin (C) is disposed at the end of the side of the high-thickness fin (B) corresponding to the second heat radiation fin portion 5. The heat radiating fins 7 are preferably disposed at the ends of the high-thickness fins (B) corresponding to the second heat-dissipating fin portions 5, but the area may be enlarged or not. As described above, the plurality of heat pipes 8 are disposed to be held between the upper pallet 3 and the susceptor pallet 2. In the second drawing, an example of the arrangement of the plurality of heat pipes is shown by dotted lines. In the example of Fig. 2, in the plurality of heat pipes 8, the heat pipes 8-3 and 8-4 at the center are arranged substantially straight along the longitudinal direction of the heat sink 1, and at one end, each of the ends It is not configured to be curved toward both outer sides of the heat sink 1. In the example shown in Fig. 1, the heat pipes 8-1 to 8-4 are thin and thin structures that are internally sealed with the working fluid, and have a large area of the upper and lower -11 - 201142579 and the pedestal. The pallet 2 and the upper pallet 3 are disposed in contact with each other. In the present embodiment, the cross-sectional shape of the heat pipe is a thin rectangular shape between the susceptor plate and the upper plate. The cross-sectional shape of the heat pipe can be appropriately formed into different shapes in accordance with the arrangement field thereof. For example, the portion that penetrates the thin plate fins is formed into a tubular member having a circular cross section, or a wider width is formed in order to increase the contact area, and can be appropriately changed in accordance with the required function and environment. In the heat pipes 8-1 and 8-2 on both sides, the central portion in the longitudinal direction is disposed substantially in parallel with the other heat pipes, and one end portion is bent toward the outer sides of the heat sink 1 respectively. The ground is configured. In the other end portion (that is, the end portion where the thin plate fins (C) are disposed), the outer one of the heat pipes 8-1 is disposed to be curved toward the outside of the heat sink, and the other heat pipe 8 is disposed. -2 is placed so as to be curved toward the outside of the heat sink, and then continues upward, and the plurality of high-thin plate fins (B) are inserted in the lateral direction. In the aspect shown in Fig. 2, the tip end portion 9 of the heat pipe can be confirmed. Further, the plurality of heat pipes 8 are flattened except for a part thereof, and the width is compressed, so that the area in contact with the base tray 2 and the upper pallet 3 is increased, and heat transfer is facilitated. As described above, at least one of the plurality of heat pipes 8 is formed by passing the large plurality of high-thin plate fins (B) having a large area in the lateral direction, but the heat is transmitted from the heat pipe 8 to the plurality of thin plate fins (B). . The heat pipe 8 and the high-thin plate fins (B) are contacted as much as possible by a wide area, and the smaller the thermal resistance, the better. Therefore, for example, the through holes of the thin plate fins can be formed by the welding process, and further joined by soldering and soldering. Thus, by thermally connecting the heat pipe 8 and the high-thin plate fins 12-201142579 (B), the heat release performance of the heat-releasing fins can be improved. In other words, the heat of the heat generating component 10 is transmitted to the plurality of heat pipes 8-1, 8-2, and 8-3' 8-4' through the susceptor pallet, and is further transmitted to the upper pallet 3, so that the heat release is promoted. In this embodiment, only the configuration in which only the heat pipe 8-2 penetrates the high-thin plate fins (B) is shown. However, the plurality of heat pipes 8 may be formed to penetrate as needed. Further, the plurality of low-thickness fins (A) disposed to be heat-transferably disposed perpendicularly to the upper surface of the upper pallet 3 are radiated by the plurality of heat pipes 8 having the bent portions. Further, at the end of at least one of the plurality of heat pipes of the plurality of heat pipes 8, the heat dissipation performance of the fins can be further improved by inserting a plurality of high-thickness plate fins (B) having a high heat-releasing property in the lateral direction. Therefore, in the heat sink of the present invention, the fins can be miniaturized, and the heat release performance of the fins can be improved. The thin plate fins are machined into a shape of 3 from the end of the hole or fin to insert the heat pipe. The hole may be formed by welding. After the fins are inserted, they may be connected by soldering or soldering as needed. Fig. 3' is a plan view of the heat sink of the present invention. As shown in Fig. 3, on the upper surface of the upper pallet, a plurality of low-thin plate fins (A) are arranged vertically as a whole except for one end portion. Further, in the end portion of the square, a plurality of high-thickness plate fins (B) having a large area adjacent to the low-thin plate fin (A) are disposed. The two outer portions of the heat sink are provided with fixing portions 6 for holding the plurality of heat pipes 8 and for fixing the upper pallet 3 and the base pallet 2. Fig. 4 is a rear view of the heat sink of the present invention -13-201142579 as seen from the high-thin plate fin (B). As shown in Fig. 4, the end portion 9 of one heat pipe of the plurality of heat pipes 8 disposed between the susceptor pallet 2 and the upper pallet 3 is raised upward, and a plurality of high-thin plate fins are B) Insert in the horizontal direction. In Fig. 4, a thin plate fin (C) is disposed at a portion corresponding to the susceptor plate of the high-thin plate fin (B). Figure 5 is a side view of the heat sink. Fig. 6 is a side view seen from the opposite side of Fig. 5. As shown in FIGS. 5 and 6, the first heat releasing fin portion 7, that is, the plurality of parallel thin plate fins (C) are vertically disposed on the susceptor pallet 2 which is heat-transferably connected to the heat generating component. Ends. The low-thin plate fins (A) and the high-thin plate fins (B) of the second heat-dissipating fin portion 5 are disposed on the upper surface of the upper tray 3. The high-thin plate fin (B) is provided at the end of the corresponding thin plate fin (C) side. In the susceptor plate 2 and the upper pallet 3, the end portion 9 of at least one heat pipe in which the β plural heat pipe 8 is fixed by the fixing portion 6 in a state in which the plurality of heat pipes 8 are inserted is raised upward. The high-thin plate fins of the second heat-dissipating fin portion 5 are inserted in the lateral direction. As described above, most of the heat radiating fin portions are formed of low-thin plate fins, and the fins are miniaturized, and large high-thin plate fins having a large area at the end portions are inserted, and a part of the heat pipes is inserted in the lateral direction to raise the fins. The exothermic properties of the sheet. Fig. 7 is a perspective view for explaining another aspect of the heat sink of the present invention. In this aspect, the second heat-dissipating picture piece portion composed of two types of thin plate fins having different heights is composed of a plurality of low-thin plate fins arranged perpendicularly to the surface of the upper plate, and a plurality of thin plate fins stacked in a horizontal direction at one end of a plurality of low-thin plate fins - 14- 201142579, that is, a base that is heat-transferably connected to a heat-generating component as shown in FIG. In the pallet 2 (lower side in the drawing), the first heat releasing fins 7 are heat-transfer-connected on the same side as the heat-generating components. The upper tray 3 is disposed with the plurality of heat pipes 8 held therein. On the surface (upper side in the figure) of the upper pallet 3, the second heat radiation fin portion 5 is heatably connected to each other. The second heat releasing fin portion 5' is a plurality of parallel low-thin plate fins (E) arranged substantially perpendicularly to the upper surface of the upper pallet 3, and horizontally on one end portion of the plurality of low-thin plate fins It is composed of a plurality of thin plate fins (D) arranged in a stacked manner. In this aspect, the low-thin plate fins (E) are disposed perpendicularly to the upper surface of the upper pallet 3, and the thin plate fins (D) which are stacked are arranged to face upward in parallel with the upper surface of the upper pallet 3 The ground is stacked. The second heat-dissipating fin portion 5 is disposed substantially vertically across the upper pallet 3 so that the plurality of low-thin plate fins (E) are vertically disposed, and further, on the upper surface of the end portions of the plurality of low-thin plate fins (E) The plurality of laminated thin plate fins (D) are arranged in parallel with the upper tray. Thus, by arranging most of the upper pallet 3 from the low-profile fins (E), the space required for the fins can be reduced. The heat dissipation performance of the heat sink can be improved by providing a plurality of laminated thin plate fins (D) which are in contact with the upper surface of one end portion of the plurality of low-thin plate fins (E). Fig. 8 is a view showing the back surface of the heat sink shown in Fig. 7. The arrangement of the heat pipes will be described with reference to Fig. 8. As shown in Fig. 8, in the one end portion of the susceptor plate 2 which is heat-transferably connected to the heat generating component 10, the above-described first heat releasing fin portion 7 is heat-transferably arranged. The first heat radiating fin portion 7 is composed of a plurality of parallel thin plate fins (c) which are heatably connected to the surface of the susceptor plate 2 on the side of the heat generating component -15-201142579. The thin plate fins (C)' are disposed at the end portions on the side of the laminated thin plate fins (D) corresponding to the second heat radiation fin portions 5. If the heat radiating fins 7 are not in contact with the heat generating member, the area may be increased or not. As described above with reference to Fig. 8, a plurality of heat pipes 8 are disposed such that the upper pallet 3 and the base pallet 2 are held together. As shown by the dotted line in Fig. 8, the plurality of heat pipes 8 and the heat pipes 8-3 and 8-4 at the center are arranged substantially straight along the longitudinal direction of the heat sink, and at one end, each of the ends It is not configured to be curved toward both outer sides of the heat sink 1. In the heat pipes 8-1 and 8-2 on both sides, the central portion in the longitudinal direction is disposed substantially in parallel with the other heat pipes 8-3 and 8-4, and one end portion is separately oriented to dissipate heat. Both outer sides of the device 1 are arranged to be curved. In the other end portion (that is, the end portion where the thin plate fin (C) is disposed), the end portion 9-1 of the heat pipe 8-1 is raised upward, and a plurality of laminated thin plate fins (D) are stacked. ) Plug in the configuration in the vertical direction. In the same manner, the end portion 9-2 of the heat pipe 8-2 is raised upward, and a plurality of stacked thin plate fins (D) are inserted in the vertical direction. The plurality of heat pipes 8 are flat except for a part (end portions 9-1, 9-2), and the width is compressed, so that the contact area between the base plate 2 and the upper plate 3 is increased, so that heat transfer is easy. . As described above, at least two end portions of the plurality of heat pipes are formed by inserting the plurality of thin plate fins (D) stacked in the vertical direction, thereby improving the heat radiation performance of the heat radiating fins. That is, the heat of the heat generating component 10 is transmitted to the plurality of heat pipes 8-1, 8-2, 8-3, and 8-4 through the susceptor pallet, and is further transmitted to the upper pallet 3. Further, the plurality of heat pipes 8 having the bent portions are disposed perpendicularly to the upper surface of the upper pallet 3 and are transmitted to the entirety of the plurality of low-thin plate fins (E) which are heat-transferably connected, and are radiated . Further, the end portions 9-1, 9-2 of at least two heat pipes 8-1, 8-2 of the plurality of heat pipes 8 are vertically stacked with a plurality of stacked thin plate fins (D) The direction is inserted to further improve the heat release performance of the fins. Therefore, in the heat sink of the present invention, the fins can be miniaturized, and the heat release performance of the fins can be improved. Figure 9 is a plan view of the heat sink of the present invention. As shown in Fig. 9, on the upper surface of the upper pallet 3, the plurality of low-thin plate fins (E) are arranged vertically as a whole. Further, in one of the upper end portions of the low-thin plate fins (E), a plurality of thin plate fins (D) stacked are placed in contact with the upper surface of the low-thin plate fins (E). A part of the outer sides of the heat sink 1 is provided with a fixing portion 6 for holding the plurality of heat pipes 8 and fixing the upper pallet 3 and the base pallet 2. Fig. 10 is a rear view of the heat sink of the present invention as seen from the side of the plurality of laminated thin plate fins (D), in contact with the upper surface of the low-thin plate fin (E). As shown in Fig. 10, the end portions 9-1 and 9-2 of the two heat pipes 8-1 and 8-2 of the plurality of heat pipes 8 disposed on the susceptor pallet 2 and the upper pallet 3 are held. It is raised upward, and the plurality of laminated thin plate fins (D) are inserted in the vertical direction. In the first drawing, a thin plate fin (C) is disposed at a portion corresponding to the susceptor plate of the laminated thin plate fin (D). In order to insert the hole in the vertical direction and form a hole in the thin fin (D), the hole may be formed by welding. After the fins are inserted, they may be connected by soldering or soldering as needed. Figure 11 is a side view of the heat sink. As shown in Fig. 11, the first -17 to 201142579 heat releasing fin portion 7, that is, the plurality of parallel thin plate fins (C) are vertically disposed on the susceptor pallet 2 which is heat-transferably connected to the heat generating component. Ends. The low-thin plate fins (E) of the second heat-dissipating fin portion 5 and the laminated thin plate fins (D) are disposed on the upper surface of the upper pallet 3. The laminated thin plate fins (D)' are provided in contact with the upper end surface of the low-thin plate fin (E) at the end portion ' on the side corresponding to the thin plate fin (C). The base pallet 2 and the upper pallet 3 are fixed by the fixing portion 6 in a state in which the plurality of heat pipes 8 are inserted. The end portions 9-1 and 9-2 of at least two heat pipes 8-1 and 8-2 of the plurality of heat pipes 8 are raised upward, and the laminated thin plate fins of the second heat releasing fin portion 5 are stacked (D ) Insert in the vertical direction. As described above, most of the heat radiating fin portions are formed by the low-thin plate fins, and the fins are miniaturized, and the stacked thin plate fins are disposed at the ends, and a part of the heat pipes is inserted in the vertical direction, thereby improving the fins. The exothermic properties. Fig. 12 is a cross-sectional view showing the shape in which the thin plate fin of the heat sink of the present invention is joined to the base plate, the upper plate, and the like. The thin plate fins can take various shapes depending on other places such as the arrangement place of the heat sink and the configurable space. It is also possible to freely combine thin plate fins of various shapes. In the twelfth figure, the shape in which each thin plate fin C is connected when the thin plate fin portion 7 is provided in the base pallet 2 is exemplified, but the case where the thin plate fins A and B are connected to the upper pallet 3 may be used. Be applicable. In the aspect shown in Fig. 12(a), the thin plate fins of the cross section including the bottom surface, the vertical surface, and the upper surface are arranged side by side in the lateral direction to form the heat radiation fin portion. In this aspect, the plurality of bottom surfaces are juxtaposed and form a planar heating surface, so that the susceptor plate 2 can be thermally coupled to the planar heating surface. At the same time, the plurality of radiating fins are also formed flat on the side of the parallel arrangement.
S -18- 201142579 面的面。連接方法，是除了例如錫焊、釺焊等以外，可以 採用各種公知的技術（其他例也同樣）。 在第12圖（b)所示的態樣中，將由底面及垂直面所構 成的剖面L字形的薄板鰭片朝橫方向配置並列而形成放熱 鰭片部。在此態樣，複數底面也被並列配置並形成平面的 受熱面，放熱鰭片部的上面側是被開放。 在第12圖（c)所示的態樣中，將上述的由底面、垂直 面、上面所構成的剖面：：的字形狀的薄板鰭片、及由底面 及垂直面所構成的剖面L字形的薄板鰭片適宜組合而形成 放熱鰭片部4。組合，不限定於圖示的態樣，在兩端部側 配置第1 2圖（b)的放熱鰭片部，在中央部組合第1 2圖 的放熱鰭片部等的其他的自由組合也可以。上述的第12 圖（a)〜（c)所示的態樣的薄板鰭片，其底面是由錫焊、釺 焊等被接合固定在基座托板2»又，在基座托板2的雙面 上’包含將第12圖（a)至（c)所示的態樣的相同薄板鰭片及 不同的薄板鰭片適宜地組合的薄板鰭片也可以。在例如基 座托板2的下側的面安裝如第〗2圖（a)所示的薄板鰭片， 在基座托板2的上側的面安裝如第1 2圖（a)所示的薄板鰭 片也可以。 如上述，依據本發明的散熱器的話，使用高度不同的 2種類的薄板鰭片，這些高度不同的2種類的薄板鰭片是 相鄰接，兩者之間幾乎沒有空間，就可在第2放熱鰭片部 橫跨包含複數平行的高薄板鰭片（B)或被層疊的薄板鰭片 (D)全長地將熱配管接觸與鰭片，就可提供一種散熱器， -19- 201142579 可以提高放熱性能，減小鰭片的尺寸地省空間化。進一步 ，藉由與基座托板的發熱零件所位置側的面垂直地可傳熱 地連接的薄板鰭片，使提高放熱性。 【圖式簡單說明】 [第1圖]第1圖’是說明本發明的散熱器的1個態樣 用的立體圖。 [第2圖]第2圖，是顯示第1圖所示的態樣的散熱器 的背面的圖。 [第3圖]第3圖，是本發明的散熱器的俯視圖。 [第4圖]第4圖，是從高薄板鰭片（B)側所見，本發明 的散熱器的後面圖。 [第5圖]第5圖，是散熱器的側面圖。 [第6圖]第6圖，是從第5圖的相反側所見的側面圖 〇 [第7圖]第7圖，是說明本發明的散熱器的其他的i 個態樣用的立體圖。 [第8圖]第8圖，是顯示第7圖所示的態樣的散熱器 的背面的圖。 [第9圖]第9圖，是本發明的散熱器的俯視圖。 [第10圖]第10圖，是與低薄板鰭片（E)的上面接觸， 從複數被層疊的薄板鰭片（D)側所見的本發明的散熱器的 後面圖。 [第1 1圖]第1 1圖，是散熱器的側面圖。S -18- 201142579 Face noodles. The connection method is not limited to, for example, soldering, soldering, or the like, and various known techniques can be employed (the same applies to other examples). In the aspect shown in Fig. 12(b), the thin plate fins having the L-shaped cross section formed by the bottom surface and the vertical surface are arranged side by side in the lateral direction to form the heat radiating fin portions. In this aspect, the plurality of bottom surfaces are also arranged side by side to form a planar heating surface, and the upper surface side of the heat releasing fin portion is opened. In the aspect shown in Fig. 12(c), the above-described cross-section of the bottom surface, the vertical surface, and the upper surface is: a thin-plate fin having a shape of a shape, and a cross-section L-shaped by a bottom surface and a vertical surface. The thin plate fins are suitably combined to form the heat releasing fin portion 4. The combination is not limited to the illustrated embodiment, and the heat radiating fin portions of the first and second figures (b) are disposed on both end portions, and the other free combinations of the heat radiating fin portions of the second drawing are also combined in the central portion. can. The thin plate fins of the aspect shown in the above-mentioned 12th (a) to (c) are bonded and fixed to the base plate 2 by soldering, brazing, etc., and the base plate 2 On both sides of the 'thick sheet fins including the same thin plate fins and different thin plate fins as shown in Figs. 12(a) to (c) may be appropriately combined. The thin plate fins as shown in Fig. 2(a) are attached to the lower surface of the base pallet 2, for example, and the upper surface of the base pallet 2 is mounted as shown in Fig. 2(a). Thin plate fins are also available. As described above, according to the heat sink of the present invention, two types of thin plate fins having different heights are used, and the two types of thin plate fins having different heights are adjacent to each other, and there is almost no space between them, and the second sheet can be used in the second The heat radiating fin portion provides a heat sink by contacting the heat pipe with the fins in a plurality of parallel high-thin plate fins (B) or laminated thin plate fins (D) to provide a heat sink, -19-201142579 can be improved The heat release performance reduces the size of the fins and saves space. Further, the heat radiating property is improved by the heat-transfer-connected thin plate fins perpendicular to the surface on the position side of the heat generating component of the susceptor plate. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] Fig. 1 is a perspective view for explaining one aspect of a heat sink according to the present invention. [Fig. 2] Fig. 2 is a view showing the back surface of the heat sink shown in Fig. 1. [Fig. 3] Fig. 3 is a plan view of the heat sink of the present invention. [Fig. 4] Fig. 4 is a rear view of the heat sink of the present invention as seen from the side of the high-thin plate fin (B). [Fig. 5] Fig. 5 is a side view of the heat sink. Fig. 6 is a side view of the opposite side of Fig. 5, and Fig. 7 is a perspective view for explaining another i aspect of the heat sink of the present invention. [Fig. 8] Fig. 8 is a view showing the back surface of the heat sink shown in Fig. 7. [Fig. 9] Fig. 9 is a plan view of the heat sink of the present invention. [Fig. 10] Fig. 10 is a rear view of the heat sink of the present invention seen from the side of a plurality of laminated thin plate fins (D) in contact with the upper surface of the low-thin plate fin (E). [Fig. 1 1] Fig. 1 is a side view of the heat sink.
S -20- 201142579 [第12圖]第12圖，是意示將薄板鰭片接合在基座托 板或上托板的例的剖面圖。 【主要元件符號說明】 A :低薄板鰭片 B :高薄板鰭片 C :薄板鰭片 1 :散熱器 2 :基座托板 3 :上托板 4 =放熱鰭片部 5 :第2放熱鰭片部 6 :固定部 7 :第1放熱鰭片部 8 :熱配管 8- 1〜8-4 :熱配管 9 :熱配管的端部 9- 1，9-2 :端部 1 〇 :發熱零件 -21 -S -20- 201142579 [Fig. 12] Fig. 12 is a cross-sectional view showing an example in which a thin plate fin is joined to a susceptor plate or an upper plate. [Main component symbol description] A: Low-thin plate fin B: High-thin plate fin C: Thin plate fin 1: Heat sink 2: Base plate 3: Upper plate 4 = Heat-dissipating fin 5: Second radiating fin Sheet portion 6 : Fixing portion 7 : First heat releasing fin portion 8 : Heat pipe 8 - 1 to 8 - 4 : Heat pipe 9 : End portion of heat pipe 9 - 1, 9-2 : End portion 1 发热: Heat generating part -twenty one -