IN2012DN02105A - - Google Patents

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Publication number
IN2012DN02105A
IN2012DN02105A IN2105DEN2012A IN2012DN02105A IN 2012DN02105 A IN2012DN02105 A IN 2012DN02105A IN 2105DEN2012 A IN2105DEN2012 A IN 2105DEN2012A IN 2012DN02105 A IN2012DN02105 A IN 2012DN02105A
Authority
IN
India
Prior art keywords
thermal block
thermal
various embodiments
uniformity
block assembly
Prior art date
Application number
Inventor
Janusz Wojtowicz
Geoffrey Dahlhoff
Douglas W Grunewald
Thomas A Conner
Original Assignee
Life Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Life Technologies Corp filed Critical Life Technologies Corp
Publication of IN2012DN02105A publication Critical patent/IN2012DN02105A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0829—Multi-well plates; Microtitration plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B01L2300/1822—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices For Use In Laboratory Experiments (AREA)

Abstract

The present teachings disclose various embodiments of a thermal block assembly having low thermal non-uniformity throughout the thermal block assembly. Accordingly, various embodiments of thermal block assemblies having such low thermal non-uniformity provide for desired performance of bioanalysis instrumentation utilizing such thermal block assemblies.
IN2105DEN2012 2009-09-01 2010-09-01 IN2012DN02105A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23901209P 2009-09-01 2009-09-01
PCT/US2010/047573 WO2011028834A2 (en) 2009-09-01 2010-09-01 Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling

Publications (1)

Publication Number Publication Date
IN2012DN02105A true IN2012DN02105A (en) 2015-08-21

Family

ID=43646772

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2105DEN2012 IN2012DN02105A (en) 2009-09-01 2010-09-01

Country Status (7)

Country Link
US (2) US10049895B2 (en)
EP (1) EP2473893B1 (en)
JP (2) JP5781513B2 (en)
CN (1) CN102483642B (en)
IN (1) IN2012DN02105A (en)
SG (1) SG178411A1 (en)
WO (1) WO2011028834A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103003448B (en) 2010-04-09 2015-06-17 生命技术公司 Improved thermal uniformity for thermal cycler instrumentation using dynamic control
CA2922854A1 (en) 2013-09-16 2015-03-19 Life Technologies Corporation Apparatuses, systems and methods for providing thermocycler thermal uniformity
EP3107658B1 (en) 2014-02-18 2018-07-04 Life Technologies Corporation Apparatuses, systems and methods for providing scalable thermal cyclers and isolating thermoelectric devices
US11003808B2 (en) * 2015-09-30 2021-05-11 Siemens Industry Software Inc. Subtractive design for heat sink improvement
US11150032B2 (en) 2017-01-18 2021-10-19 Bigz Tech Inc. Transient heat absorption and delayed dissipation by high heat capacity material
GB201812192D0 (en) * 2018-07-26 2018-09-12 Ttp Plc Variable temperature reactor, heater and control circuit for the same
CN113287208B (en) 2019-01-14 2025-08-26 生物辐射实验室股份有限公司 Heat pump equipment and components
US20220184612A1 (en) * 2019-03-18 2022-06-16 Seegene, Inc. Thermal cycler comprising sample holder assembly
CN212084987U (en) * 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 Chip cooler with high bearing capacity
WO2023075405A1 (en) * 2021-10-29 2023-05-04 주식회사 씨젠 Thermal block

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US3841853A (en) * 1972-09-05 1974-10-15 Owens Corning Fiberglass Corp Apparatus for production of thermoplastic materials
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US5038852A (en) * 1986-02-25 1991-08-13 Cetus Corporation Apparatus and method for performing automated amplification of nucleic acid sequences and assays using heating and cooling steps
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Also Published As

Publication number Publication date
US20180350628A1 (en) 2018-12-06
EP2473893A2 (en) 2012-07-11
JP2014158505A (en) 2014-09-04
SG178411A1 (en) 2012-04-27
JP2013504181A (en) 2013-02-04
CN102483642B (en) 2014-12-24
EP2473893B1 (en) 2021-07-28
US10049895B2 (en) 2018-08-14
US20110056661A1 (en) 2011-03-10
EP2473893A4 (en) 2017-03-01
CN102483642A (en) 2012-05-30
WO2011028834A2 (en) 2011-03-10
WO2011028834A3 (en) 2011-07-07
JP5781513B2 (en) 2015-09-24

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