200928693 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種對電子元件 散熱之散熱裝置。 【先前技術】 近年來隨著電子產業之發展，電子元件之性能不斷提 升，運算速度越來越快，其内部晶片組之運算速度不斷提 ❹升，晶片數量不斷增加，晶片工作時所散發之熱量也相應 增加，如果不將該等熱量及時散發出去，將極大影響電子 元件之性能，使電子元件之運算速度降低，隨著熱量之不 斷累積，還可能燒毁電子元件，因此必須對電子 散熱。 傳統之散熱器包括-底板及複數自底板向上延伸之韓 片。該底板肖電子元件接觸以吸收其產生之熱量，.讀片則 將底板所吸收之熱量散發至空氣當中’由此實現對電子 件之散熱。 為提高散熱器之散熱效率，通常還在底板上安農複數 熱管。該等熱管可將分饰在底板局部之熱量迅速地散佈至 整個底板上，使熱量更加充分地傳導至鰭片上。 、.為將熱官安裝至底板上，目前業界通常採用兩種方 法·第-種方法為在底板上開設複數嵌設熱管之凹槽。惟， 由於該種方法之凹槽開設於底板上，致使底板之厚度必須 大於凹槽之内從。因此，該種方法所採用之底板需較厚， 200928693 H = 材料亦相應地變多，增加了散熱器之成 第一種方法為直接將熱管焊接至底板上。惟， 法需使用定位夾具將熱管定位在底板之預定位置上^後 $可焊接。如若底板之面積較小，夾具將無法順利地放置 .在底板上，給熱管之定位造成不便。 【發明内容】 —有繁於此，實有必要提供一種可方便實現熱管定位且 ^郎省材料之散熱裝置。 一種散熱裝置，用於對電子元件散熱，其包括一底板 及複數置於底板上之熱管，該底板上形成複數排佈與熱管 之輪廓相一致並將熱管夹置於其間之凸點。 與習知技術相比，本發明之散熱裝置之底板形成有複 數凸點’該等凸點將熱管夾置於其間而實現對熱管之定 位。由此，底板上不需開設凹槽，其厚度可控制在一較小 之範圍内，從而節省材料。另，該等凸點僅佔據底板之少 許面積，其基本不受底板之尺寸大小所影響。因此，即使 底板之尺寸較小’仍可方便地實現對熱管之定位。 【實施方式】 如圖1和2所示，本發明之散熱裝置1〇用於對安裝於 電路板（圖未示）上之電子元件（圖未示）散熱，其包括 一底板20、一結合至底板2〇之頂板3〇、分別結合至底板 20及頂板30之一下鰭片組50及一上鰭片組40及複數夾置 於底板20及頂板30間之熱管60。 200928693 請一併參閱圖4，所述底板20由一金屬板一體形成， 其縱截面大致呈“U”形。該底板20包括一平坦之矩形板體 22、一自板體22相對兩側垂直向上延伸之側壁24及二分 別自側壁24頂端水平反向形成之側邊26。該板體22之部 分區域向下沖擠出一方形之凸臺220 (如圖4 )及對應該凸 臺220之另一面之凹部222，其中該凸臺22〇凸伸出板體 22之底面’該凹部222凹陷入板體22之頂面且朝上開口。 該凸臺220用於與電子元件接觸而吸收其產生之熱量，該 凹部222則用於容置熱管60之相應結構。該板體22之相 應位置處向上沖出複數用於定位熱管6〇之凸點2〇〇，該等 凸點200均按照熱管60之輪廓排佈，其中二凸點形成 於凹部222内，其他凸點200形成於凹部222外。二側壁 24及一侧邊26於罪近其中部位置處向外水平彎折出二翼 片（圖未標）。二矩形之固定部7〇分別置於該二翼片上且 插設入侧壁24及侧邊26内。每一固定部7〇之高度均大於 ❹侧壁24之高度，其頂部延伸超出二側邊％以與頂板扣相 抵接。二穿孔700分別貫穿二固定部7〇及二翼片，供扣且 (圖未示）穿過而將底板2〇固定至電路板上。 所述頂板30通過焊接結合至底板2〇之側邊“上，立 亦由-金屬板一體形成。該頂板3〇呈一平坦之矩形構造， 且n與絲μ之周緣相—致。該職3G平行於底板 之 ’其每一側均開設面積相等且與底板2〇之翼 片相對應之二矩形缺σ 32。頂板％位於其每—侧之二缺口 32之間之部分形成—矩形之彈w %，其用於祕抵麼安裝 200928693 於底板20上之固定部70，其中位於每一側之二缺口 32與 一彈片34之面積之和與每一固定部70之頂面積相等。一 - 圓孔340開設於彈片34中部，其與底板20之相應穿孔700 對齊，以供扣具穿過而將焊接後之底板20及頂板30固定 .至電路板上。 所述上鰭片組40及下鰭片組50分別焊接至頂板30之 頂面及底板20之底面，其均包括複數堆疊串接之鰭片42、 0 52。每一鰭片42、52之中部均垂直於頂板30，其上下兩端 則水平彎折且各自結合至底板20或頂板30上。該上鰭片 組40佔據頂板30之整個頂面，該下鰭片組50靠近底板20 之凸臺220並大致佔據板體22之三分之一之底面（如圖4)。 請一併參閱圖3，所述熱管60通過凸點200定位於底 板20上，其包括二平直之第一熱管62及二彎折之第二熱 管64。該二第一熱管62相互併攏並直接接觸，且該二第一 熱管62之相鄰之兩端共同被二凸點200所夾設。每一第二 〇熱管64包括一平直段640、二自平直段640兩端傾斜向外 彎折之二彎折段642及一形成於一彎折段642末端之木梢 644。第二熱管64之平直段640與第一熱管62併攏並直接 接觸，彎折段642傾斜地與第一熱管62隔開，末梢644則 平行地與第一熱管62隔開。每一第二熱管64之平直段640 與彎折段642之連接處被二凸點200所夾設，彎折段642 與末梢644之連接處亦被二凸點200所夾置，換言之，每 一第二熱管64於其彎折處均被二凸點200所夾設；第二熱 管64之相應之一彎折段642之末端被二凸點200所夾設， 200928693 其末梢644則抵靠於一凸點200並與底板20之侧壁24隔 ' 開，從而在熱管60與底板20間形成複數氣流通道，以此 • 提升散熱裝置10之散熱效率。二第一熱管62於靠近其中 部之位置處向下凸伸出二凸部（圖未示），二第二熱管64 -於其平直段640之底部亦向下凸伸出二凸部646。第一熱管 62之凸部與第二熱管64之凸部646用於容置於底板20之 凹部222内並與凸臺220之頂部相接觸，以將凸臺220所 吸收之熱量傳輸至熱管60内。 組裝該散熱裝置時，只需將熱管60自上至下沿凸點200 置於板體22上即可實現其與底板20間之定位。與習知技術 相比，本發明之散熱裝置10之底板20上不需開設凹槽，其 厚度可控制在一較小之範圍内，從而節省材料。此外，該 等凸點200僅佔據底板20之少許面積，其基本不受底板20之 尺寸大小所影響。因此，即使底板20之尺寸較小，仍可方 便地實現對熱管60之定位。 ❹ 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明之散熱裝置之立體組裝圖。 圖2係圖1之分解圖。 200928693 圖3係圖2之部分組裝圖。 圖4係圖1之倒置圖。200928693 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from electronic components. [Prior Art] In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, the computing speed has become faster and faster, the computing speed of the internal chipset has been continuously increased, the number of wafers has been increasing, and the wafers have been distributed during work. The heat is also increased accordingly. If the heat is not released in time, the performance of the electronic components will be greatly affected, and the operation speed of the electronic components will be reduced. As the heat accumulates, the electronic components may be burned, so the heat must be dissipated to the electrons. . The conventional heat sink includes a bottom plate and a plurality of Korean pieces extending upward from the bottom plate. The bottom plate is in contact with the electronic component to absorb the heat generated by the substrate, and the reading film dissipates the heat absorbed by the substrate into the air, thereby achieving heat dissipation to the electronic component. In order to improve the heat dissipation efficiency of the radiator, a plurality of heat pipes are usually also disposed on the bottom plate. The heat pipes can quickly dissipate the heat locally distributed on the bottom plate to the entire bottom plate, so that the heat is more fully conducted to the fins. In order to install the hot official on the bottom plate, the current method generally adopts two methods and the first method to open a plurality of grooves for inserting the heat pipe on the bottom plate. However, since the groove of the method is opened on the bottom plate, the thickness of the bottom plate must be greater than the inner diameter of the groove. Therefore, the bottom plate used in this method needs to be thicker, 200928693 H = the material is correspondingly increased, and the heat sink is added. The first method is to directly heat the heat pipe to the bottom plate. However, the method requires the positioning fixture to position the heat pipe at a predetermined position on the bottom plate. If the area of the bottom plate is small, the clamp will not be placed smoothly. On the bottom plate, the positioning of the heat pipe is inconvenient. SUMMARY OF THE INVENTION - In view of the above, it is necessary to provide a heat sink that can easily realize heat pipe positioning and materials. A heat dissipating device for dissipating heat from an electronic component, comprising a bottom plate and a plurality of heat pipes disposed on the bottom plate, wherein the bottom plate forms a plurality of bumps that conform to the contour of the heat pipe and sandwich the heat pipe therebetween. In contrast to conventional techniques, the bottom plate of the heat sink of the present invention is formed with a plurality of bumps which are positioned between the heat pipes to effect positioning of the heat pipes. Thereby, no groove is required on the bottom plate, and the thickness thereof can be controlled within a small range, thereby saving material. In addition, the bumps occupy only a small area of the backplane, which is substantially unaffected by the size of the backplane. Therefore, even if the size of the bottom plate is small, the positioning of the heat pipe can be conveniently achieved. [Embodiment] As shown in FIGS. 1 and 2, the heat dissipating device 1 of the present invention is used for dissipating heat from an electronic component (not shown) mounted on a circuit board (not shown), and includes a bottom plate 20 and a combination. The top plate 3 of the bottom plate 2 is coupled to the bottom fin group 50 and the upper fin group 40 of the bottom plate 20 and the top plate 30, respectively, and a plurality of heat pipes 60 sandwiched between the bottom plate 20 and the top plate 30. Referring to FIG. 4 together, the bottom plate 20 is integrally formed by a metal plate and has a longitudinal section of a substantially U-shape. The bottom plate 20 includes a flat rectangular plate body 22, a side wall 24 extending vertically upward from opposite sides of the plate body 22, and side edges 26 formed horizontally opposite from the top end of the side wall portion 24. A portion of the plate body 22 is punched downwardly into a square boss 220 (see FIG. 4) and a recess 222 corresponding to the other side of the boss 220. The boss 22 protrudes from the bottom surface of the plate body 22. The recess 222 is recessed into the top surface of the plate body 22 and opens upward. The boss 220 is for contacting the electronic component to absorb the heat generated thereby, and the recess 222 is for accommodating the corresponding structure of the heat pipe 60. The corresponding position of the plate body 22 is upwardly punched out for positioning the bumps 2〇〇 of the heat pipe 6〇, and the bumps 200 are arranged according to the contour of the heat pipe 60, wherein the two bumps are formed in the concave portion 222, and the other The bump 200 is formed outside the recess 222. The two side walls 24 and one side edge 26 are horizontally bent outwardly from the sin near the middle portion (not shown). The two rectangular fixing portions 7 are respectively placed on the two fins and inserted into the side walls 24 and the side edges 26. The height of each of the fixing portions 7 is greater than the height of the side wall 24, and the top portion extends beyond the two side edges to abut the top plate buckle. The two through holes 700 respectively extend through the two fixing portions 7 and the two fins, and are fastened (not shown) to fix the bottom plate 2 to the circuit board. The top plate 30 is joined to the side of the bottom plate 2 by welding. The top plate is also integrally formed by a metal plate. The top plate 3 is formed in a flat rectangular configuration, and n is aligned with the circumference of the wire μ. 3G is parallel to the bottom plate. Each of the sides has two rectangular sigma σs 32 of equal area and corresponding to the fins of the bottom plate 2〇. The top plate % is formed between the two notches 32 of each side thereof - a rectangular shape The spring w% is used to securely mount the fixing portion 70 of the 200928693 on the bottom plate 20, wherein the sum of the area of the two notches 32 and one of the elastic pieces 34 on each side is equal to the top area of each of the fixing portions 70. - A circular hole 340 is formed in the middle of the elastic piece 34, and is aligned with the corresponding through hole 700 of the bottom plate 20 for the fastener to pass through to fix the welded bottom plate 20 and the top plate 30 to the circuit board. The upper fin set 40 And the lower fin group 50 is respectively soldered to the top surface of the top plate 30 and the bottom surface of the bottom plate 20, each of which includes a plurality of stacked fins 42 and 052. The middle of each of the fins 42 and 52 is perpendicular to the top plate 30. The upper and lower ends are horizontally bent and are respectively coupled to the bottom plate 20 or the top plate 30. The upper fin The group 40 occupies the entire top surface of the top plate 30, and the lower fin group 50 is adjacent to the boss 220 of the bottom plate 20 and substantially occupies one third of the bottom surface of the board body 22 (as shown in Fig. 4). The heat pipe 60 is positioned on the bottom plate 20 by the bumps 200, and includes two flat first heat pipes 62 and two bent second heat pipes 64. The two first heat pipes 62 are close to each other and directly contact, and the first two The adjacent ends of the heat pipe 62 are collectively sandwiched by the two bumps 200. Each of the second heat pipes 64 includes a straight section 640, and two bent sections of the two straight straight sections 640 are bent outward and bent outward. 642 and a wooden tip 644 formed at the end of a bent section 642. The straight section 640 of the second heat pipe 64 is in close contact with and directly in contact with the first heat pipe 62, and the bent section 642 is obliquely spaced from the first heat pipe 62, and the tip 644 Then, it is separated from the first heat pipe 62 in parallel. The connection between the straight section 640 of each second heat pipe 64 and the bent section 642 is sandwiched by the two bumps 200, and the joint between the bent section 642 and the tip 644 is also The second heat pipe 64 is sandwiched by the two bumps 200; in other words, each of the second heat pipes 64 is sandwiched by the two bumps 200; the corresponding of the second heat pipe 64 The end of one of the bending segments 642 is sandwiched by the two bumps 200, and the distal end 644 of the 200928693 abuts against a bump 200 and is separated from the sidewall 24 of the bottom plate 20 to form a space between the heat pipe 60 and the bottom plate 20. a plurality of air flow passages for improving the heat dissipation efficiency of the heat sink 10. The first heat pipe 62 protrudes downwardly from the convex portion (not shown) at a position near the middle portion thereof, and the second heat pipe 64 is flattened The bottom of the straight section 640 also protrudes downwardly from the two convex portions 646. The convex portion of the first heat pipe 62 and the convex portion 646 of the second heat pipe 64 are accommodated in the concave portion 222 of the bottom plate 20 and at the top of the boss 220 The contacts are contacted to transfer the heat absorbed by the boss 220 into the heat pipe 60. When the heat dissipating device is assembled, the heat pipe 60 can be placed on the plate body 22 from the top to the bottom along the bump 200 to realize the positioning between the heat pipe 60 and the bottom plate 20. Compared with the prior art, the bottom plate 20 of the heat dissipating device 10 of the present invention does not need to have a groove, and the thickness thereof can be controlled within a small range, thereby saving material. Moreover, the bumps 200 occupy only a small area of the bottom plate 20, which is substantially unaffected by the size of the bottom plate 20. Therefore, even if the size of the bottom plate 20 is small, the positioning of the heat pipe 60 can be conveniently achieved.综 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat sink of the present invention. Figure 2 is an exploded view of Figure 1. 200928693 Figure 3 is a partial assembly diagram of Figure 2. Figure 4 is an inverted view of Figure 1.
主要元件符號說明】 散熱裝置 10 底板 20 凸點 200 板體 22 凸臺 220 凹部 222 側壁 24 侧邊 26 頂板 30 缺口 32 彈片 34 圓孔 340 上籍片組 40 鰭片 42、52 下鰭片組 50 敎管 1、、、 Ρ» 60 第一熱管 62 第二熱管 64 平直段 640 彎折段 642 末梢 644 凸部 646 固定部 70 穿孔 700 11Main component symbol description] Heat sink 10 Base plate 20 Bump 200 Plate 22 Boss 220 Concave 222 Side wall 24 Side 26 Top plate 30 Notch 32 Spring 34 Round hole 340 Upper film group 40 Fins 42, 52 Lower fin group 50敎 1, 1, Ρ » 60 first heat pipe 62 second heat pipe 64 straight section 640 bending section 642 tip 644 convex portion 646 fixing portion 70 perforation 700 11