US20110146949A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20110146949A1
US20110146949A1 US12/781,821 US78182110A US2011146949A1 US 20110146949 A1 US20110146949 A1 US 20110146949A1 US 78182110 A US78182110 A US 78182110A US 2011146949 A1 US2011146949 A1 US 2011146949A1
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US
United States
Prior art keywords
heat
clip
fastening
dissipation device
tab
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Abandoned
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US12/781,821
Inventor
Hong-Cheng Yang
Lei Cao
Jian Guo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
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Filing date
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Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CAO, LEI, GUO, JIAN, YANG, HONG-CHENG
Publication of US20110146949A1 publication Critical patent/US20110146949A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates generally to heat dissipation devices, and more particularly to a heat dissipation device which is configured for facilitating securing the heat dissipation device to a printed circuit board on which a heat generating element is mounted.
  • a heat dissipation device is used to dissipate heat generated by the electronic device.
  • a typical heat dissipation device includes a heat sink, a heat-absorbing plate, a heat pipe with two opposite ends thereof respectively connecting to the heat-absorbing plate and the heat sink, and a clip disposed on the heat pipe and the heat-absorbing plate.
  • the heat-absorbing plate is provided for contacting the electronic device and absorbing heat therefrom.
  • the heat pipe is utilized to transfer heat from the heat-absorbing plate to the heat sink.
  • Securing holes are defined in two ends of the clip, for fasteners to pass therethrough in order to fix the heat dissipation device onto the electronic device.
  • the clip and the heat pipe and the heat-absorbing plate are combined together by soldering or riveting for facilitating assembling the heat dissipation device on the electronic device.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
  • FIG. 2 is a fully exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is a partly exploded view of the heat dissipation device of FIG. 1 .
  • FIGS. 1-2 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure.
  • the heat dissipation device dissipates heat from a first heat-generating component 10 and a second heat-generating component 11 , such as CPUs mounted on a printed circuit board (not shown).
  • the heat dissipation device comprises a first heat-absorbing plate 20 , a fin unit 30 , a first heat pipe 40 thermally connected with the first heat-absorbing plate 20 and the fin unit 30 , and a clip 50 disposed on the first heat pipe 40 and connected to the first heat-absorbing plate 20 .
  • a fastening tab 22 and a positioning tab 24 are formed on the first heat-absorbing plate 20 .
  • a fastening hole 52 and a positioning hole 54 are defined in the clip 50 , corresponding to the fastening tab 22 and the positioning tab 24 , respectively.
  • the fastening tab 22 engages in the fastening hole 52 , and the positioning tab 24 passes through the positioning hole 54 .
  • the heat dissipation device further comprises a second heat-absorbing plate 70 , and a second heat pipe 60 .
  • the second heat pipe 60 is connected with the second heat-absorbing plate 70 and the fin unit 30 , and rests on the clip 50 .
  • the first heat-absorbing plate 20 is made of material with good heat conductivity, and has a substantially rectangular shape.
  • the first heat-generating component 10 is attached to a bottom surface of the first heat-absorbing plate 20 . Heat generated by the first heat-generating component 10 is absorbed by the first heat-absorbing plate 20 and transferred to the fin unit 30 in order to be dissipated to the ambient environment.
  • the fastening tab 22 and the positioning tab 24 extend upwardly from two diagonally opposite corners of a top surface of the first heat-absorbing plate 20 .
  • the fastening tab 22 and the positioning tab 24 are perpendicular to each other, that is, the fastening tab 22 and the positioning tab 24 are formed from two adjacent lateral sides of the first heat-absorbing plate 20 .
  • the fastening tab 22 has a straight bottom end and a straight enlarged top end coplanar with the bottom end. The top end runs across and straddles a top extremity of the bottom end, whereby the fastening tab 22 presents as a substantially T shape to engage in the fastening hole 52 of the clip 50 .
  • the positioning tab 24 has a straight plate shape, to be capable of inserting into the positioning hole 54 of the clip 50 . Understandably, the fastening tab 22 can be of other configurations in alternative embodiments, as long as the fastening tab 22 can be fixedly engaged in the fastening hole 52 .
  • the positioning tab 24 can also be altered into other shapes such as a larger top end in alternative embodiments, as long as the positioning tab 24 can be conveniently passed through the positioning hole 54 .
  • the second heat-absorbing plate 70 has a substantially rectangular sheet configuration with a bottom surface thereof tightly attached to the second heat-generating component 11 . Heat generated by the second heat-generating component 11 is absorbed by the second heat-absorbing plate 70 and transferred to the fin unit 30 to be dissipated to the ambient environment.
  • Two fixtures 72 are engaged with two lateral sides of the second heat-absorbing plate 70 . Fasteners (not shown) pass through fixing holes (not labeled) in two ends of each of the fixtures 72 to secure the second heat-absorbing plate 70 onto the printed circuit board.
  • the fin unit 30 comprises a plurality of vertical plate-shape fins 31 arranged side by side.
  • a longitudinal opening is defined in each fin 31 , and the openings corporately define a receiving groove 310 receiving the first and second heat pipes 40 , 60 .
  • the first heat pipe 40 comprises an evaporating section 41 connected to the first heat-absorbing plate 20 and a condensing section 42 received in the receiving groove 310 of the fin unit 30 .
  • the clip 50 has a substantially strip-like configuration, and comprises a bulge portion 51 in the middle thereof, and two shoulders 53 extending from two ends of the bulge portion 51 .
  • the bulge portion 51 has a U-shaped configuration to span on the evaporating section 41 of the first heat pipe 40 .
  • the bulge portion 51 can have an arc-shaped configuration.
  • the fastening hole 52 and the positioning hole 54 are respectively defined in the two shoulders 53 , and are aligned along a longitudinal axis (not labeled) of the clip 50 .
  • Each of the fastening and positioning holes 52 , 54 can be considered to have a longitudinal axis and a transverse axis.
  • the longitudinal axis is collinear with the longitudinal axis of the clip 50 , and the transverse axis is perpendicular to the longitudinal axis.
  • Each of the fastening and positioning holes 52 , 54 is generally slightly elongated along the longitudinal axis.
  • a middle portion of each of the fastening and positioning holes 52 , 54 has a substantially elliptical configuration with a long axis of the ellipse being aligned along the longitudinal axis.
  • Each of opposite end portions of each of the fastening and positioning holes 52 , 54 is narrower than the short axis of the ellipse of the middle portion, as measured parallel to the transverse axis.
  • each of the fastening and positioning holes 52 , 54 is symmetrical about its longitudinal axis, and symmetrical about its transverse axis.
  • the fastening and positioning holes 52 , 54 are identical in configuration.
  • the fastening hole 52 is used to engagingly receive the fastening tab 24 of the first heat-absorbing plate 20
  • the positioning hole 54 is used to receive the positioning tab 24 of the first heat-absorbing plate 20 .
  • transverse widths of the ends of the fastening hole 52 should be a little larger than a transverse width of the fastening tab 22 .
  • Two fixing holes (not labeled) are defined in free ends of the two shoulders 53 , respectively. Fasteners can pass through the fixing holes to secure the clip 50 and the first heat-absorbing plate 20 onto the printed circuit board.
  • the second heat pipe 60 comprises an evaporating section 61 connected to the second heat-absorbing plate 79 , a condensing section 62 received in the receiving groove 310 of the fin unit 30 , and a middle section 63 interconnecting the evaporating section 61 and the condensing section 62 .
  • the second heat pipe 60 is arranged beside the first heat pipe 40 .
  • the middle section 63 spans over the first heat-absorbing plate 20 and rests on the shoulder 53 that has the positioning hole 54 .
  • the condensing section 42 of the first heat pipe 40 is received in the groove 310 of the fin unit 30 , and the evaporating section 41 of the first heat pipe 40 is connected to the first heat-absorbing plate 20 .
  • the clip 50 is firstly aligned with the side of the first heat-absorbing plate 20 on which the fastening tab 22 is formed, to allow the fastening tab 22 to be inserted into the fastening hole 52 of the clip 50 .
  • the clip 50 is turned on the fastening tab 22 so that the bulge portion 51 rests on the evaporating section 41 of the first heat pipe 40 and simultaneously the positioning tab 24 passes through the positioning hole 54 of the clip 50 .
  • Both the fastening and positioning tabs 22 , 24 are oriented at oblique angles with respect to the longitudinal axis of the clip 50 (i.e., with respect to the longitudinal axes of the fastening and positioning holes 52 , 54 ).
  • the fastening tab 22 is fixed in the fastening hole 52 due to the larger top end thereof, thereby securing that end of the clip 50 on the first heat-absorbing plate 20 .
  • the middle portions of the fastening and positioning holes 52 , 54 are wider than the ends thereof, certain degrees of freedom of the clip 50 relative to each of the fastening and positioning tabs 22 , 24 are obtained.
  • the condensing section 62 of the second heat pipe 60 is received in the groove 310 , and the evaporating section 61 of the second heat pipe 60 is connected to the second heat-absorbing plate 70 .
  • the middle section 63 of the second heat pipe 60 rests on the shoulder 53 that has the positioning hole 54 , to further secure the clip 50 on the first heat-absorbing plate 20 .
  • the condensing sections 42 , 62 of the first and second heat pipes 40 , 60 are both received in the groove 310 of the fin unit 30 in this embodiment. Understandably, in alternative embodiments, the condensing sections 42 , 62 can further or alternatively be thermally connected to different fin units. Furthermore, in alternative embodiments, the middle section 63 of the second heat pipe 60 can be altered to rest on the shoulder 53 of the clip 50 which has the fastening hole 52 .
  • the clip 50 Due to one end of the clip 50 being secured on the fastening tab 22 of the first heat-absorbing plate 20 , and the other end of the clip 50 being positioned by the positioning tab 24 , it is convenient and time-saving to locate the clip 50 relative to the printed circuit board and assemble the heat dissipation device to the printed circuit board. Compared with the hypothetical situation of securing the clip 50 by soldering, certain degrees of freedom of the clip 50 relative to the first heat-absorbing plate 20 are obtained. Accordingly, the position of the clip 50 can be finely adjusted to eliminate any deviations between the clip 50 and the printed circuit board which may otherwise exist due to ordinary manufacturing tolerances. Furthermore, the clip 50 is positioned and secured without the need for any soldering tools or instruments. Moreover, there is no need for surface treating (e.g. electroplating) of the clip 50 associated with a soldering operation. For at least these reasons, the heat dissipation device with the clip 50 can have a low cost and high market competitiveness.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An exemplary heat dissipation device includes a heat-absorbing plate, a fin unit, a heat pipe connected to the heat-absorbing plate and the fin unit, and a clip spanning over the heat-absorbing plate and resting on the heat pipe. A fastening tab and a positioning tab are formed on the heat-absorbing plate. A fastening hole and a positioning hole are defined in the clip respectively corresponding to the fastening and positioning tabs. The fastening tab is engaged in the fastening hole. The positioning tab is received in the positioning hole.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates generally to heat dissipation devices, and more particularly to a heat dissipation device which is configured for facilitating securing the heat dissipation device to a printed circuit board on which a heat generating element is mounted.
  • 2. Description of Related Art
  • Generally, in order to ensure the normal running of an electronic device such as a central processing unit (CPU) of a personal computer, a heat dissipation device is used to dissipate heat generated by the electronic device.
  • A typical heat dissipation device includes a heat sink, a heat-absorbing plate, a heat pipe with two opposite ends thereof respectively connecting to the heat-absorbing plate and the heat sink, and a clip disposed on the heat pipe and the heat-absorbing plate. The heat-absorbing plate is provided for contacting the electronic device and absorbing heat therefrom. The heat pipe is utilized to transfer heat from the heat-absorbing plate to the heat sink. Securing holes are defined in two ends of the clip, for fasteners to pass therethrough in order to fix the heat dissipation device onto the electronic device. Usually the clip and the heat pipe and the heat-absorbing plate are combined together by soldering or riveting for facilitating assembling the heat dissipation device on the electronic device. However, such a fixing mechanism has shortcomings such as high cost and lack of flexibility. There is a risk that the clip will be fixed in an inaccurate position in which the clip is not able to allow the fasteners to engage with the electronic device. If this happens, the clip is unable to secure the heat dissipation device onto the electronic device.
  • What is needed, therefore, is a heat dissipation device that can overcome the limitations described.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
  • FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
  • FIG. 2 is a fully exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is a partly exploded view of the heat dissipation device of FIG. 1.
  • DETAILED DESCRIPTION
  • FIGS. 1-2 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure. The heat dissipation device dissipates heat from a first heat-generating component 10 and a second heat-generating component 11, such as CPUs mounted on a printed circuit board (not shown). The heat dissipation device comprises a first heat-absorbing plate 20, a fin unit 30, a first heat pipe 40 thermally connected with the first heat-absorbing plate 20 and the fin unit 30, and a clip 50 disposed on the first heat pipe 40 and connected to the first heat-absorbing plate 20. A fastening tab 22 and a positioning tab 24 are formed on the first heat-absorbing plate 20. A fastening hole 52 and a positioning hole 54 are defined in the clip 50, corresponding to the fastening tab 22 and the positioning tab 24, respectively. The fastening tab 22 engages in the fastening hole 52, and the positioning tab 24 passes through the positioning hole 54. The heat dissipation device further comprises a second heat-absorbing plate 70, and a second heat pipe 60. The second heat pipe 60 is connected with the second heat-absorbing plate 70 and the fin unit 30, and rests on the clip 50.
  • Specifically, the first heat-absorbing plate 20 is made of material with good heat conductivity, and has a substantially rectangular shape. The first heat-generating component 10 is attached to a bottom surface of the first heat-absorbing plate 20. Heat generated by the first heat-generating component 10 is absorbed by the first heat-absorbing plate 20 and transferred to the fin unit 30 in order to be dissipated to the ambient environment. The fastening tab 22 and the positioning tab 24 extend upwardly from two diagonally opposite corners of a top surface of the first heat-absorbing plate 20. The fastening tab 22 and the positioning tab 24 are perpendicular to each other, that is, the fastening tab 22 and the positioning tab 24 are formed from two adjacent lateral sides of the first heat-absorbing plate 20. The fastening tab 22 has a straight bottom end and a straight enlarged top end coplanar with the bottom end. The top end runs across and straddles a top extremity of the bottom end, whereby the fastening tab 22 presents as a substantially T shape to engage in the fastening hole 52 of the clip 50. The positioning tab 24 has a straight plate shape, to be capable of inserting into the positioning hole 54 of the clip 50. Understandably, the fastening tab 22 can be of other configurations in alternative embodiments, as long as the fastening tab 22 can be fixedly engaged in the fastening hole 52. The positioning tab 24 can also be altered into other shapes such as a larger top end in alternative embodiments, as long as the positioning tab 24 can be conveniently passed through the positioning hole 54.
  • The second heat-absorbing plate 70 has a substantially rectangular sheet configuration with a bottom surface thereof tightly attached to the second heat-generating component 11. Heat generated by the second heat-generating component 11 is absorbed by the second heat-absorbing plate 70 and transferred to the fin unit 30 to be dissipated to the ambient environment. Two fixtures 72 are engaged with two lateral sides of the second heat-absorbing plate 70. Fasteners (not shown) pass through fixing holes (not labeled) in two ends of each of the fixtures 72 to secure the second heat-absorbing plate 70 onto the printed circuit board.
  • The fin unit 30 comprises a plurality of vertical plate-shape fins 31 arranged side by side. A longitudinal opening is defined in each fin 31, and the openings corporately define a receiving groove 310 receiving the first and second heat pipes 40, 60.
  • The first heat pipe 40 comprises an evaporating section 41 connected to the first heat-absorbing plate 20 and a condensing section 42 received in the receiving groove 310 of the fin unit 30.
  • The clip 50 has a substantially strip-like configuration, and comprises a bulge portion 51 in the middle thereof, and two shoulders 53 extending from two ends of the bulge portion 51. The bulge portion 51 has a U-shaped configuration to span on the evaporating section 41 of the first heat pipe 40. Alternatively, the bulge portion 51 can have an arc-shaped configuration. The fastening hole 52 and the positioning hole 54 are respectively defined in the two shoulders 53, and are aligned along a longitudinal axis (not labeled) of the clip 50. Each of the fastening and positioning holes 52, 54 can be considered to have a longitudinal axis and a transverse axis. The longitudinal axis is collinear with the longitudinal axis of the clip 50, and the transverse axis is perpendicular to the longitudinal axis. Each of the fastening and positioning holes 52, 54 is generally slightly elongated along the longitudinal axis. In particular, a middle portion of each of the fastening and positioning holes 52, 54 has a substantially elliptical configuration with a long axis of the ellipse being aligned along the longitudinal axis. Each of opposite end portions of each of the fastening and positioning holes 52, 54 is narrower than the short axis of the ellipse of the middle portion, as measured parallel to the transverse axis. In the illustrated embodiment, each of the fastening and positioning holes 52, 54 is symmetrical about its longitudinal axis, and symmetrical about its transverse axis. The fastening and positioning holes 52, 54 are identical in configuration.
  • The fastening hole 52 is used to engagingly receive the fastening tab 24 of the first heat-absorbing plate 20, and the positioning hole 54 is used to receive the positioning tab 24 of the first heat-absorbing plate 20. Understandably, in order to permit the fastening tab 22 to insert in the fastening hole 52, transverse widths of the ends of the fastening hole 52 should be a little larger than a transverse width of the fastening tab 22. Two fixing holes (not labeled) are defined in free ends of the two shoulders 53, respectively. Fasteners can pass through the fixing holes to secure the clip 50 and the first heat-absorbing plate 20 onto the printed circuit board.
  • The second heat pipe 60 comprises an evaporating section 61 connected to the second heat-absorbing plate 79, a condensing section 62 received in the receiving groove 310 of the fin unit 30, and a middle section 63 interconnecting the evaporating section 61 and the condensing section 62. The second heat pipe 60 is arranged beside the first heat pipe 40. The middle section 63 spans over the first heat-absorbing plate 20 and rests on the shoulder 53 that has the positioning hole 54.
  • Also referring to FIG. 3, in assembly of the heat dissipation device, the condensing section 42 of the first heat pipe 40 is received in the groove 310 of the fin unit 30, and the evaporating section 41 of the first heat pipe 40 is connected to the first heat-absorbing plate 20. The clip 50 is firstly aligned with the side of the first heat-absorbing plate 20 on which the fastening tab 22 is formed, to allow the fastening tab 22 to be inserted into the fastening hole 52 of the clip 50. After the bottom end of the fastening tab 22 is secured in position in the fastening hole 52, the clip 50 is turned on the fastening tab 22 so that the bulge portion 51 rests on the evaporating section 41 of the first heat pipe 40 and simultaneously the positioning tab 24 passes through the positioning hole 54 of the clip 50. Both the fastening and positioning tabs 22, 24 are oriented at oblique angles with respect to the longitudinal axis of the clip 50 (i.e., with respect to the longitudinal axes of the fastening and positioning holes 52, 54). The fastening tab 22 is fixed in the fastening hole 52 due to the larger top end thereof, thereby securing that end of the clip 50 on the first heat-absorbing plate 20. In addition, since the middle portions of the fastening and positioning holes 52, 54 are wider than the ends thereof, certain degrees of freedom of the clip 50 relative to each of the fastening and positioning tabs 22, 24 are obtained. Then the condensing section 62 of the second heat pipe 60 is received in the groove 310, and the evaporating section 61 of the second heat pipe 60 is connected to the second heat-absorbing plate 70. The middle section 63 of the second heat pipe 60 rests on the shoulder 53 that has the positioning hole 54, to further secure the clip 50 on the first heat-absorbing plate 20.
  • The condensing sections 42, 62 of the first and second heat pipes 40, 60 are both received in the groove 310 of the fin unit 30 in this embodiment. Understandably, in alternative embodiments, the condensing sections 42, 62 can further or alternatively be thermally connected to different fin units. Furthermore, in alternative embodiments, the middle section 63 of the second heat pipe 60 can be altered to rest on the shoulder 53 of the clip 50 which has the fastening hole 52.
  • Due to one end of the clip 50 being secured on the fastening tab 22 of the first heat-absorbing plate 20, and the other end of the clip 50 being positioned by the positioning tab 24, it is convenient and time-saving to locate the clip 50 relative to the printed circuit board and assemble the heat dissipation device to the printed circuit board. Compared with the hypothetical situation of securing the clip 50 by soldering, certain degrees of freedom of the clip 50 relative to the first heat-absorbing plate 20 are obtained. Accordingly, the position of the clip 50 can be finely adjusted to eliminate any deviations between the clip 50 and the printed circuit board which may otherwise exist due to ordinary manufacturing tolerances. Furthermore, the clip 50 is positioned and secured without the need for any soldering tools or instruments. Moreover, there is no need for surface treating (e.g. electroplating) of the clip 50 associated with a soldering operation. For at least these reasons, the heat dissipation device with the clip 50 can have a low cost and high market competitiveness.
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.

Claims (14)

1. A heat dissipation device comprising:
a heat-absorbing plate with a fastening tab and a positioning tab formed thereon;
a fin unit;
a heat pipe with one end connected to the heat-absorbing plate, and the other end connected to the fin unit; and
a clip spanning over the heat-absorbing plate and resting on the heat pipe, the clip defining a fastening hole in which the fastening tab is engaged, and a positioning hole in which the positioning tab is received.
2. The heat dissipation device of claim 1, wherein the fastening tab has a T shape and is perpendicular to the positioning tab, and the fastening hole and the positioning hole are aligned along a long axis of the clip.
3. The heat dissipation device of claim 2, wherein the fastening tab and the positioning tab are both oriented at oblique angles with respect to the long axis of the clip.
4. The heat dissipation device of claim 2, wherein a middle portion of the fastening hole is broader than two end portions thereof as measured along directions transverse to the long axis of the clip, and a middle portion of the positioning hole is broader than two end portions thereof as measured along directions transverse to the long axis of the clip.
5. The heat dissipation device of claim 1, wherein the fastening tab and the positioning tab extend upwardly from two diagonally opposite corners of the heat-absorbing plate.
6. The heat dissipation device of claim 1, wherein the clip comprises a bulge portion resting on the heat pipe and two shoulders extending from two ends of the bulge portion respectively, the fastening hole and the positioning hole being respectively defined in the two shoulders.
7. The heat dissipation device of claim 6, further comprising another heat pipe with one end connected to the fin unit, the another heat pipe resting on the shoulder of the clip that has the positioning hole.
8. The heat dissipation device as claimed in claim 7, further comprising another heat-absorbing plate, wherein the other end of the another heat pipe is connected to the another heat-absorbing plate, and a middle section of the another heat pipe rests on the shoulder of the clip that has the positioning hole.
9. A heat dissipation device comprising:
a first heat-absorbing plate with a fastening tab and a positioning tab formed thereon;
a second heat-absorbing plate;
a fin unit;
a first heat pipe with one end connected to the first heat-absorbing plate, and the other end connected to the fin unit;
a clip spanning over the first heat-absorbing plate and resting on the first heat pipe, the clip defining a fastening hole in which the fastening tab is engaged, and a positioning hole in which the positioning tab is received; and
a second heat pipe with one end connected to the second heat-absorbing plate, the other end connected to the fin unit, and a middle section resting on the clip.
10. The heat dissipation device of claim 9, wherein the clip comprises a bulge portion resting on the first heat pipe and two shoulders extending from two ends of the bulge portion respectively, the fastening hole and the positioning hole being respectively defined in the two shoulders.
11. The heat dissipation device of claim 10, wherein the middle section of the second heat pipe rests on the shoulder of the clip that has the positioning hole.
12. The heat dissipation device of claim 9, wherein the fastening tab has a T shape with a top end thereof larger than a bottom end thereof, and is perpendicular to the positioning tab.
13. The heat dissipation device of claim 12, wherein the fastening hole and the positioning hole are aligned along a long axis of the clip.
14. The heat dissipation device of claim 13, wherein a middle portion of the fastening hole is broader than two end portions thereof as measured along directions transverse to the long axis of the clip, and a middle portion of the positioning hole is broader than two end portions thereof as measured along directions transverse to the long axis of the clip.
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Applications Claiming Priority (2)

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CN2009103119134A CN102105035A (en) 2009-12-21 2009-12-21 Radiating module

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US20100059202A1 (en) * 2008-09-11 2010-03-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100258276A1 (en) * 2009-04-10 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20130014918A1 (en) * 2011-07-13 2013-01-17 Foxconn Technology Co., Ltd. Heat dissipation device
US20190354147A1 (en) * 2014-06-04 2019-11-21 Huawei Technologies Co., Ltd. Electronic Device

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CN210426171U (en) * 2019-06-03 2020-04-28 浙江盾安热工科技有限公司 Flat pipe and heat exchanger

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