US20090229790A1 - Radiating fin assembly for thermal module - Google Patents
Radiating fin assembly for thermal module Download PDFInfo
- Publication number
- US20090229790A1 US20090229790A1 US12/048,031 US4803108A US2009229790A1 US 20090229790 A1 US20090229790 A1 US 20090229790A1 US 4803108 A US4803108 A US 4803108A US 2009229790 A1 US2009229790 A1 US 2009229790A1
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- US
- United States
- Prior art keywords
- radiating
- heat
- heat pipe
- radiating fin
- fin assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000007769 metal material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/12—Fins with U-shaped slots for laterally inserting conduits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a radiating fin assembly for thermal module, and more particularly to a radiating fin assembly mounted on a heat radiating base of a thermal module to tightly press a heat pipe against the heat radiating base.
- the currently available integrated circuits have a largely reduced volume than before.
- the number of elements and components included in the current ICs is often several times of that in the conventional ICs having the same volume.
- heat produced by the ICs during operation thereof increases with the growing number of electronic elements and components in the ICs.
- the heat produced by a common central processing unit (CPU) at full working load is high enough for burning out the whole CPU. Therefore, it is important to develop effective heat radiating means for the ICs.
- a thermal module is made of a metal material with high heat conductivity.
- the thermal module in the form of a radiating fin assembly is frequently used to obtain an enhanced heat radiating effect.
- heat pipes are further provided on the thermal module to more quickly transfer and dissipate heat, so that products with ICs are protected against burning out.
- FIG. 1 is an exploded perspective view of a conventional thermal module 1 , which includes a heat radiating base 11 , on which a tubular groove 111 is provided; a radiating fin assembly 13 mounted on a top of the heat radiating base 11 , and a heat pipe 12 received in the tubular groove 111 to locate between the heat radiating base 11 and the radiating fin assembly 13 .
- the radiating fin assembly 13 includes a plurality of radiating fins, each of which is bent at a lower edge to form a flange 131 , and a downward opened curved notch 132 is also formed at the lower edge of the radiating fin.
- the radiating fin assembly 13 When the radiating fin assembly 13 is mounted to the top of the heat radiating base 11 , the curved notches 132 are engaged with the heat pipe 12 , and the flanges 131 are pressed against the top of the heat radiating base 11 . With these arrangements, heat transmitted to the heat radiating base 11 and the heat pipe 12 may be quickly transferred to the plurality of radiating fins of the radiating fin assembly 13 via the flanges 131 to thereby provide upgraded heat dissipating efficiency.
- the radiating fin assembly 13 is connected to the heat radiating base 11 by welding the flanges 131 to the top of the heat radiating base 11 . Thereafter, the heat pipe 12 is extended through the tubular groove 111 . Since the heat pipe 12 is not always a fully straight member but might include some bent portions, there are clearances existed between the heat pipe 12 and the tubular groove 111 to create the problem of thermal resistance, resulting in a reduced heat conducting efficiency between the heat radiating base 11 and the radiating fin assembly 13 .
- the conventional thermal module 1 has the drawbacks of (a) having excessively large clearances among the heat radiating base, the heat pipe, and the radiating fin assembly; (b) being subject to the problem of thermal resistance; and (c) having relatively poor connection strength among different parts.
- a primary object of the present invention is to provide a radiating fin assembly, which is mounted on a heat radiating base of a thermal module while presses against a heat pipe, so that the heat pipe is brought to more tightly contact with the heat radiating base.
- the radiating fin assembly for thermal module includes a plurality of radiating fins being mounted on a top of a heat radiating base of the thermal module with a heat pipe located between the radiating fins and the base.
- Each of the radiating fins is provided at a lower side with a flange for contacting with the base and a downward opened curved notch for engaging with the heat pipe.
- a curved extension is provided along an outer edge of the curved notch to outward extend and downward incline from the radiating fin.
- the radiating fin assembly for thermal module has the following advantages: (1) the radiating fin assembly may be produced without increasing any additional manufacturing cost of the thermal module; (2) the use of the radiating fin assembly does not affect the manufacturing process for the thermal module; (3) the radiating fin assembly, the heat radiating base, and the heat pipe are in tight contact with one another without leaving clearances among them; and (4) the problem of thermal resistance is avoided.
- FIG. 1 is an exploded perspective view of a conventional thermal module
- FIG. 2 is an exploded perspective view of a thermal module that adopts a radiating fin assembly according to a preferred embodiment of the present invention
- FIG. 3 is an assembled view of FIG. 2 ;
- FIG. 4 is a fragmentary sectional view of FIG. 3 ;
- FIG. 4B is an enlarged view of the circled area B in FIG. 4 ;
- FIG. 5 is a front view of FIG. 3 .
- FIGS. 2 and 3 are exploded and assembled perspective views, respectively, of a thermal module A that adopts a radiating fin assembly 4 according to a preferred embodiment of the present invention, and to FIG. 4 that is a fragmentary sectional view of FIG. 3 .
- the thermal module A includes a heat radiating base 2 , a heat pipe 3 , and a radiating fin assembly 4 .
- the heat radiating base 2 is provided on a top with a groove 21 having a curved cross section for receiving a lower portion of the heat pipe 3 therein.
- the radiating fin assembly 4 includes a plurality of parallelly arranged radiating fins 41 .
- Each of the radiating fins 41 has one lower side bent into a flange 411 , and a curved notch 412 is formed on the radiating fin 41 at the same lower side with the flange 411 .
- a curved extension 413 outward extended and downward inclined from the radiating fin 41 .
- a cut 414 having a predetermined size is formed between each of two ends of the curved extension 413 and the flange 411 , so that the curved extension 413 is not restricted by the flange 411 and possess a relatively large freeness to elastically deform under an external force applied thereto.
- the thermal module A To assemble the thermal module A, first position the heat pipe 3 in the curved-section groove 21 on the heat radiating base 2 . Then, attach the radiating fin assembly 4 to the top of the heat radiating base 2 and the heat pipe 3 received in the groove 21 , such that the curved notches 412 on the radiating fins 41 of the radiating fin assembly 4 are fitly engaged with an upper portion of the heat pipe 3 protruded from the groove 21 , and the flanges 411 of the radiating fins 41 are pressed against the top of the heat radiating base 2 .
- the curved extensions 413 on the radiating fins 41 are in contact with and apply a downward pressure P against the heat pipe 3 , forcing the heat pipe 3 to be more tightly received in the groove 21 and closely contact with the heat radiating base 2 , so that the clearances between the heat pipe 3 and the heat radiating base 2 and the radiating fin assembly 4 are eliminated to avoid the problem of thermal resistance from occurring on the thermal module A.
- FIG. 4B is an enlarged view of the circled area B in FIG. 4
- FIG. 5 is a front view of FIG. 3 .
- a mechanical property thereof a metal material deformed under an externally applied force would restore to an initial shape when the external force is released.
- Such a mechanical property is referred to as elasticity, and such a restorable deformation is referred to as an elastic deformation of material.
- the radiating fins 41 are made of a metal material with elasticity. Therefore, when the radiating fins 41 are subject to an external force and deformed, they may still elastically restore to an initial shape so long as the external force is lower than a yielding point of the metal material.
- each of the extensions 413 is in a curved form adapted to fitly engage with the upper portion of the heat pipe 3 . Therefore, the downward pressure P applied by the curved extensions 413 to the heat pipe 3 is a uniformly distributed pressure. That is, the pressure P applied to the upper portion of the heat pipe 3 is evenly and uniformly distributed over areas at where the heat pipe 3 is in contact with the curved extensions 413 . Meanwhile, the heat pipe 3 generates an upward resistance P 1 to each of the curved extensions 413 .
- the curved extensions 413 still have elasticity to constantly apply the uniformly distributed downward pressure P against the heat pipe 3 . Meanwhile, since the uniformly distributed downward pressure P applied to the heat pipe 3 via the curved extensions 413 is larger than the upward resistance P 1 from the heat pipe 3 to the curved extensions 413 , the heat pipe 3 is caused to tightly locate in the groove 21 and closely contact with the heat radiating base 2 to ensure the optimal contact of the radiating fin assembly 4 , the heat radiating base 2 , and the heat pipe 3 with one another.
Abstract
A radiating fin assembly for a thermal module includes a plurality of radiating fins being mounted on a top of a heat radiating base of the thermal module with a heat pipe located between the radiating fins and the base. Each of the radiating fins is provided at a lower side with a flange for contacting with the base and a downward opened curved notch for engaging with the heat pipe. A curved extension is provided along an outer edge of the curved notch to outward extend and downward incline from the radiating fin. When the radiating fin assembly is mounted on the top of the heat radiating base, the curved extensions apply a uniformly distributed downward pressure to the heat pipe, bringing the heat pipe to more tightly contact with the heat radiating base.
Description
- The present invention relates to a radiating fin assembly for thermal module, and more particularly to a radiating fin assembly mounted on a heat radiating base of a thermal module to tightly press a heat pipe against the heat radiating base.
- With the highly developed semiconductor technology, the currently available integrated circuits (ICs) have a largely reduced volume than before. To enable the ICs to process more data, the number of elements and components included in the current ICs is often several times of that in the conventional ICs having the same volume. However, heat produced by the ICs during operation thereof increases with the growing number of electronic elements and components in the ICs. For example, the heat produced by a common central processing unit (CPU) at full working load is high enough for burning out the whole CPU. Therefore, it is important to develop effective heat radiating means for the ICs.
- Generally, a thermal module is made of a metal material with high heat conductivity. In addition to the mounting of a cooling fan to carry away the heat produced by heat-producing elements, the thermal module in the form of a radiating fin assembly is frequently used to obtain an enhanced heat radiating effect. In some other cases, heat pipes are further provided on the thermal module to more quickly transfer and dissipate heat, so that products with ICs are protected against burning out.
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FIG. 1 is an exploded perspective view of a conventionalthermal module 1, which includes aheat radiating base 11, on which atubular groove 111 is provided; a radiatingfin assembly 13 mounted on a top of theheat radiating base 11, and aheat pipe 12 received in thetubular groove 111 to locate between theheat radiating base 11 and theradiating fin assembly 13. - The
radiating fin assembly 13 includes a plurality of radiating fins, each of which is bent at a lower edge to form aflange 131, and a downward openedcurved notch 132 is also formed at the lower edge of the radiating fin. - When the
radiating fin assembly 13 is mounted to the top of theheat radiating base 11, thecurved notches 132 are engaged with theheat pipe 12, and theflanges 131 are pressed against the top of theheat radiating base 11. With these arrangements, heat transmitted to theheat radiating base 11 and theheat pipe 12 may be quickly transferred to the plurality of radiating fins of the radiatingfin assembly 13 via theflanges 131 to thereby provide upgraded heat dissipating efficiency. - However, the following disadvantage is found in manufacturing the above-structured conventional thermal module 1:
- Generally, metal parts are connected to one another by way of welding. Therefore, the
radiating fin assembly 13 is connected to theheat radiating base 11 by welding theflanges 131 to the top of theheat radiating base 11. Thereafter, theheat pipe 12 is extended through thetubular groove 111. Since theheat pipe 12 is not always a fully straight member but might include some bent portions, there are clearances existed between theheat pipe 12 and thetubular groove 111 to create the problem of thermal resistance, resulting in a reduced heat conducting efficiency between theheat radiating base 11 and the radiatingfin assembly 13. - In brief, the conventional
thermal module 1 has the drawbacks of (a) having excessively large clearances among the heat radiating base, the heat pipe, and the radiating fin assembly; (b) being subject to the problem of thermal resistance; and (c) having relatively poor connection strength among different parts. - It is therefore tried by the inventor to develop a radiating fin assembly for thermal module that enables a heat pipe to tightly contact with the heat radiating base of the thermal module to ensure good heat conducting efficiency of the thermal module.
- A primary object of the present invention is to provide a radiating fin assembly, which is mounted on a heat radiating base of a thermal module while presses against a heat pipe, so that the heat pipe is brought to more tightly contact with the heat radiating base.
- To achieve the above and other objects, the radiating fin assembly for thermal module according to the present invention includes a plurality of radiating fins being mounted on a top of a heat radiating base of the thermal module with a heat pipe located between the radiating fins and the base. Each of the radiating fins is provided at a lower side with a flange for contacting with the base and a downward opened curved notch for engaging with the heat pipe. A curved extension is provided along an outer edge of the curved notch to outward extend and downward incline from the radiating fin. When the radiating fin assembly is mounted on the top of the heat radiating base, the curved extensions are fitly engaged with an upper portion of the heat pipe and apply uniformly distributed downward pressure to the heat pipe, bringing the heat pipe to more tightly contact with the heat radiating base.
- The radiating fin assembly for thermal module according to the present invention has the following advantages: (1) the radiating fin assembly may be produced without increasing any additional manufacturing cost of the thermal module; (2) the use of the radiating fin assembly does not affect the manufacturing process for the thermal module; (3) the radiating fin assembly, the heat radiating base, and the heat pipe are in tight contact with one another without leaving clearances among them; and (4) the problem of thermal resistance is avoided.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
-
FIG. 1 is an exploded perspective view of a conventional thermal module; -
FIG. 2 is an exploded perspective view of a thermal module that adopts a radiating fin assembly according to a preferred embodiment of the present invention; -
FIG. 3 is an assembled view ofFIG. 2 ; -
FIG. 4 is a fragmentary sectional view ofFIG. 3 ; -
FIG. 4B is an enlarged view of the circled area B inFIG. 4 ; and -
FIG. 5 is a front view ofFIG. 3 . - Please refer to
FIGS. 2 and 3 that are exploded and assembled perspective views, respectively, of a thermal module A that adopts aradiating fin assembly 4 according to a preferred embodiment of the present invention, and toFIG. 4 that is a fragmentary sectional view ofFIG. 3 . As shown, the thermal module A includes a heat radiatingbase 2, aheat pipe 3, and a radiatingfin assembly 4. - The heat radiating
base 2 is provided on a top with agroove 21 having a curved cross section for receiving a lower portion of theheat pipe 3 therein. - The radiating
fin assembly 4 includes a plurality of parallelly arranged radiatingfins 41. Each of theradiating fins 41 has one lower side bent into aflange 411, and acurved notch 412 is formed on theradiating fin 41 at the same lower side with theflange 411. Along an outer edge of thecurved notch 412, there is formed acurved extension 413 outward extended and downward inclined from theradiating fin 41. It is noted acut 414 having a predetermined size is formed between each of two ends of thecurved extension 413 and theflange 411, so that thecurved extension 413 is not restricted by theflange 411 and possess a relatively large freeness to elastically deform under an external force applied thereto. - To assemble the thermal module A, first position the
heat pipe 3 in the curved-section groove 21 on the heat radiatingbase 2. Then, attach theradiating fin assembly 4 to the top of the heat radiatingbase 2 and theheat pipe 3 received in thegroove 21, such that thecurved notches 412 on theradiating fins 41 of theradiating fin assembly 4 are fitly engaged with an upper portion of theheat pipe 3 protruded from thegroove 21, and theflanges 411 of theradiating fins 41 are pressed against the top of the heat radiatingbase 2. At this point, thecurved extensions 413 on theradiating fins 41 are in contact with and apply a downward pressure P against theheat pipe 3, forcing theheat pipe 3 to be more tightly received in thegroove 21 and closely contact with the heat radiatingbase 2, so that the clearances between theheat pipe 3 and the heat radiatingbase 2 and theradiating fin assembly 4 are eliminated to avoid the problem of thermal resistance from occurring on the thermal module A. -
FIG. 4B is an enlarged view of the circled area B inFIG. 4 , andFIG. 5 is a front view ofFIG. 3 . Please refer toFIGS. 4 , 4B, and 5. As a mechanical property thereof, a metal material deformed under an externally applied force would restore to an initial shape when the external force is released. Such a mechanical property is referred to as elasticity, and such a restorable deformation is referred to as an elastic deformation of material. In the present invention, theradiating fins 41 are made of a metal material with elasticity. Therefore, when theradiating fins 41 are subject to an external force and deformed, they may still elastically restore to an initial shape so long as the external force is lower than a yielding point of the metal material. As can be clearly seen fromFIGS. 4 , 4B, and 5, each of theextensions 413 is in a curved form adapted to fitly engage with the upper portion of theheat pipe 3. Therefore, the downward pressure P applied by thecurved extensions 413 to theheat pipe 3 is a uniformly distributed pressure. That is, the pressure P applied to the upper portion of theheat pipe 3 is evenly and uniformly distributed over areas at where theheat pipe 3 is in contact with thecurved extensions 413. Meanwhile, theheat pipe 3 generates an upward resistance P1 to each of thecurved extensions 413. Since the resistance P1 is smaller than the yielding point of thecurved extensions 413 without causing a permanent deformation of thecurved extensions 413, thecurved extensions 413 still have elasticity to constantly apply the uniformly distributed downward pressure P against theheat pipe 3. Meanwhile, since the uniformly distributed downward pressure P applied to theheat pipe 3 via thecurved extensions 413 is larger than the upward resistance P1 from theheat pipe 3 to thecurved extensions 413, theheat pipe 3 is caused to tightly locate in thegroove 21 and closely contact with the heat radiatingbase 2 to ensure the optimal contact of theradiating fin assembly 4, the heat radiatingbase 2, and theheat pipe 3 with one another. - The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications in the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims (2)
1. A radiating fin assembly for a thermal module, the thermal module including a heat radiating base, on a top of which the radiating fin assembly is mounted with a heat pipe located between the radiating fin assembly and the heat radiating base; the radiating fin assembly comprising a plurality of parallelly arranged radiating fins, each of the radiating fins having a lower side being bent to form a flange, and having a downward opened curved notch formed on the same lower side with the flange, and the curved notch being provided along an outer edge with a curved extension outward extended and downward inclined from the radiating fin; the curved extensions being adapted to fitly engage with an upper portion of the heat pipe when the radiating fin assembly is mounted on the top of the heat radiating base, and thereby apply a downward pressure to the heat pipe, bringing the heat pipe to more tightly contact with the heat radiating base.
2. The radiating fin assembly for a thermal module as claimed in claim 1 , wherein a cut of a predetermined size is provided between each of two ends of the curved extension and the flange on each of the radiating fins, so that the curved extension possesses enhanced elasticity when applying the downward pressure against the heat pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/048,031 US20090229790A1 (en) | 2008-03-13 | 2008-03-13 | Radiating fin assembly for thermal module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/048,031 US20090229790A1 (en) | 2008-03-13 | 2008-03-13 | Radiating fin assembly for thermal module |
Publications (1)
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US20090229790A1 true US20090229790A1 (en) | 2009-09-17 |
Family
ID=41061726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/048,031 Abandoned US20090229790A1 (en) | 2008-03-13 | 2008-03-13 | Radiating fin assembly for thermal module |
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US (1) | US20090229790A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090211730A1 (en) * | 2008-02-22 | 2009-08-27 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a bracket |
US20090229789A1 (en) * | 2008-03-13 | 2009-09-17 | Asia Vital Components Co., Ltd. | Radiating fin assembly for thermal module |
US20120241132A1 (en) * | 2011-03-22 | 2012-09-27 | Tsung-Hsien Huang | Non-base block heat sink |
DE102012103519B3 (en) * | 2011-12-22 | 2013-01-31 | Tsung-Hsien Huang | Heat sink and method of making the same |
US20130105121A1 (en) * | 2011-10-28 | 2013-05-02 | Foxconn Technology Co., Ltd. | Heat dissipation device with fin set |
US20130233528A1 (en) * | 2012-03-12 | 2013-09-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating assembly |
US20180168069A1 (en) * | 2016-12-09 | 2018-06-14 | Cooler Master Technology Inc. | Parallel heat-pipes type heat sink and manufacturing method thereof |
CN108859656A (en) * | 2018-06-13 | 2018-11-23 | 安徽省宁国市天成电气有限公司 | A kind of resistance wire parallel connection heating control system |
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US7296617B2 (en) * | 2004-09-15 | 2007-11-20 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink |
US20070006997A1 (en) * | 2005-07-07 | 2007-01-11 | Ama Precision Inc. | Heat sink structure |
US20090120611A1 (en) * | 2007-11-08 | 2009-05-14 | Ching-Hang Shen | Heat dissipation module |
US7950447B2 (en) * | 2007-11-08 | 2011-05-31 | Asia Vital Components, Co. Ltd. | Heat dissipation module |
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