1334527 . 099年10月01日修正替換頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別係指一種對電子元器件 散熱之散熱裝置。 【先前技術】 [0002] 電子元件如中央處理器等在運行過程中產生大量之熱量 ，為確保電子元件之正常運行，其產生之熱量需及時地 散發出去。通常，該電子元件上加裝一散熱裝置。 [0003] 常用之散熱裝置包括一金屬底板及從該底板延伸之複數 散熱鰭片。該底板貼置於發熱電子元件而吸收其產生之 熱量，進而將熱量傳遞至鰭片而散發到周圍空間。然而 隨著電子產業之發展，電子元件之運行頻率和功能曰益 提升，其發熱量也隨之增加。該散熱器需加設複數熱管 以提升其散熱性能。如中國大陸專利第200420003051. 1 號所揭示之散熱裝置，其包括一基座、複數設置於基座 上方之散熱鰭片、以及連接散熱鰭片和基座且相互平行 設置之二熱管。由於該散熱裝置需要配備二熱管才能比 較均勻和高速地把熱量從基座傳輸至鰭片，熱管數量較 多，導致其製造成本較高，不利於業者推廣。 【發明内容】 [0004] 有鑒於此，有必要提供一種散熱效率較高且成本較低之 散熱裝置。 [0005] —種散熱裝置，用於對電子元器件散熱，其包括一基板 、複數設置於基板上方之散熱鰭片、以及連接基板及散 熱鰭片之一熱管，該熱管包括二相互連接之蒸發段及由 096118703 表單編號A0101 第4頁/共16頁 0993354173-0 Γ334527 099年10月01日按正替換頁 二蒸發段分別同側回彎而出且與散熱鰭片結合之二冷凝 段，該熱管二蒸發段和二冷凝段之回彎部分分別形成二 弧形之絕熱段，該二蒸發段結合於基板底面。 [0006] 與習知技術相比，本發明散熱裝置之熱管一體成型，其 作用相當於二熱管，但其封口數較少，從而使散熱裝置 成本較低；且熱管結合於基板底面，可直接與電子元器 件接觸，從而更加高效率地將熱量傳輪至散熱鰭片。 【實施方式】 [0007] 請參閱圖1，本發明散熱裝置用於對電路板（圖未示）之電 子元器件（圖未示）散熱，其包括一座體1〇、複數設置於 座體10上方之散熱鰭片2〇、以及連接座體和散熱鰭片 20之熱管30。 [0008] 該座體10包括一吸熱板12及一與吸熱板12接觸之基板14 其均由熱導性良好之金屬材料製成。該吸熱板12包括 本體120，該本體120由一方形塊之相鄰二角處分別被 垂直切削掉—等腰三角形區域而形成，進而在吸熱板12 上形成一短邊。該本體120之上表面均勻地開設有平行於 短邊之二凹槽122，用於與基板14配合以嵌入熱管3〇之相 應部分，該本體120下表面與電子元器件接觸以吸收其產 生之熱里。s玄基板14設置於吸熱板12上方且與散熱韓片 20接觸，其包括一矩形本體14〇。該矩形本體14〇面積大 於吸熱板12本體120面積，以將吸熱板12所吸收之熱量均 勻地傳輸至每一散熱鰭片20。該矩形本體140之下表面與 吸熱板12本體120上表面接觸，其開設有與吸熱板12三凹 槽122對應且相互平行之三凹槽142 ’該等凹槽ι42與吸 096118703 表單編號A0101 第5頁/共16頁 0993354173-0 1334527 . 099年10月01日修正替换頁 熱板12之凹槽122相互配合後形成三圓筒形空間，以將熱 管30之相應部分完全收容於其中。該矩形本體140四角處 分別水平向外延伸出四扣耳14 4，每一扣耳1 4 4上均開設 有一通孔146，供螺杆件40穿設而將基板14固定於電路板 上。 [0009] 該等散熱鰭片20設置於座體10上方。每一散熱鰭片20大 致為矩形，其上下二對邊分別同向垂直彎折出二折邊202 ，複數上、下折邊202籍由焊接分別連接組成散熱鰭片20 之上、下表面。該下表面與基板14上表面熱接觸，以將 部分熱量由基板14傳輸至散熱鰭片20。每一散熱鰭片20 靠近上表面處開設三圓形通孔204，該三通孔204均勻地 排列於同一直線上。每一通孔204之内緣與折邊202同向 垂直彎折延伸出一環形結合邊20 6，複數該環形結合邊 20 6對應地相互連接，一同組成三圓筒形通道，供熱管30 相應部分穿設。 [0010] 該熱管30包括連接座體10與散熱鰭片20之第一熱管32和 第二熱管34。該第一熱管32 —體成型，其包括相互平行 且處於同一水平面内之蒸發段320及由二蒸發段320同側 回彎而出且相互平行於蒸發段320之二冷凝段322，二蒸 發段320和二冷凝段322之回彎部分形成二絕熱段324。 該蒸發段320和冷凝段322截面相等。該冷凝段322處於 與蒸發段320所處水平面平行之另一水平面内，且該另一 水平面平行於基板14。二蒸發段320間籍由一弧形之連接 段326相連接，共同組成一 “U”形構造。該第一熱管32 之二絕熱段324均為弧形，二絕熱段324所處平面所形成 096118703 表單編號A0101 第6頁/共16頁 0993354173-0 Γ334527 梭正 099年10月〇1日 之内角為銳角，從而使二冷凝段322之間距大於二蒸發段 3 2 0之間距，以進一步將熱量傳輸至散熱鰭片2 0兩側，使 散熱鰭片20能更加均勻地散發熱量。由於該第一熱管32 之二蒸發段320均吸熱，二者間不存在熱交換，因此該連 接段326僅起一連接作用，而不能傳輸熱量。由此，該熱 管32所起之作用實際相當於二單獨之熱管（圖未示），但 由於其一體成型，相對於二單獨之熱管其封口數少一個 ，因此其造價比二單獨之熱管更為低廉。 [0011] 該第二熱管34亦一體成逛，其包括一蒸發段340和一由蒸 發段340回彎而出之冷凝段342，冷凝段342和蒸發段340 之回彎部分形成一弧形絕熱段344。該第二熱管34之冷凝 段342和蒸發段340分別與該第一熱管32之冷凝段322和 蒸·發段3 2 0截面相同，且其冷凝段3 4 2 '蒸發段3 4 0、絕 熱段344分別對應位於第一熱管32之二冷凝段322之間、 二蒸發段320之間、二絕熱段324之間，使第一熱管32關 於該第二熱管34左右對稱。該第二熱管34之冷凝段342平 行於第一熱管32之冷凝段322且與其處於同一水平面，第 二熱管34之蒸發段340平行於第一述熱管32之蒸發段320 且與其處於同一水平面，第二熱管34之絕熱段344所處平 面垂直於基板14,從而使該第二熱管34形成一 “U”形 構造。請一併參閱圖2 ’第一熱管32和第二熱管34之蒸發 段3 2 0、3 4 0分別對應地收容於基板14凹槽14 2和吸熱板 12凹槽122共同圍設成之圓筒形空間内，第一熱管32和第 二熱管34之冷凝段322、342分別與散熱鰭片20結合，而 使第一熱管32和第二熱管34之絕熱段324、344位於基板 096118703 表單編號A0101 第7頁/共16頁 0993354173-0 1334527 . 099年10月01日按正替換頁 14之同一側，第一熱管32之連接部326水平凸出於基板 14而位於基板14之相對另一側。 [0012] 再如圖1至圖3所示，組裝該散熱裝置時，首先將第一熱 管32之二蒸發段320分別嵌入位於吸熱板12兩側之二凹槽 122内，使第一熱管32之二冷凝段322平行地設置於吸熱 板12上方；然後將第二熱管34之蒸發段340嵌入吸熱板 1 2中部之凹槽1 22内，使第二熱管34之冷凝段342亦與吸 熱板12平行且位於第一熱管32之二冷凝段322之間；隨後 ，將基板14貼設於吸熱板12上方，其中，基板14之凹槽 142與吸熱板12之凹槽122配合而分別嵌入第一和第二熱 管32、34之蒸發段3 20、340，從而將第一和第二熱管32 、34夾設於基板14和吸熱板12之間。最後，將第一和第 二熱管32、34之冷凝段322、342對應地穿設於散熱鰭片 20之圓筒形通道内，使散熱鰭片20之下表面與基板14上 表面相互接觸。由此，該散熱裝置完成了組裝過程。 [0013] 本發明散熱裝置之第一熱管32—體成型，可起到兩個熱 管之作用，從而使散熱裳置成本較低。且，第一熱管32 二冷凝段322之間距大於二蒸發段320之間距，熱量可由 基座傳輸至散熱鰭片20兩側，使散熱鰭片20受熱均勻， 從而使散熱鰭片20能最大限度地進行散熱。再，第一熱 管32之間夾設一第二熱管34，使熱量更加高速地傳輸至 散熱鰭片2 0。由此，相比於習知技術，該散熱裝置之散 熱效率及製造成本均有所優化。 [0014] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上該者僅為本發明之較佳實施例， 096118703 表單編號A0101 第8頁/共16頁 0993354173-0 Γ334527 099年10月01日修正替换頁 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技 藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0015] 圖1係本發明散熱裝置之立體分解圖。 [0016] 圖2係圖1中座體與熱管之立體組裝圖。 [0017] 圖3係圖1之立體組裝圖。 【主要元件符號說明】 [0018] 座體：10 [0019] 吸熱板：12 [0020] 本體：120 [0021] 凹槽·· 12 2, 142 [0022] 基板：14 [0023] 矩形本體：140 [0024] 凸耳：144 [0025] 通孔：146,204 [0026] 散熱鰭片：20 [0027] 折邊：202 [0028] 環形結合邊：206 [0029] 熱管：30 [0030] 第一熱管：32 096118703 表單編號A0101 第9頁/共16頁 0993354173-0 1334527 099年10月01日按正替换頁 [0031] 第二熱管 ：34 [0032] 蒸發段： 320, 340 [0033] 冷凝段： 322, 342 [0034] 絕熱段： 324, 344 [0035] 連接段： 326 [0036] 螺桿件： 40 096118703 表單编號 A0101 第 10 頁/共 16 頁 0993354173-01334527. October 01, 099 Amendment Replacement Page VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from electronic components. [Prior Art] [0002] Electronic components such as a central processing unit generate a large amount of heat during operation. To ensure the normal operation of electronic components, the heat generated by them needs to be dissipated in time. Usually, a heat sink is attached to the electronic component. [0003] A commonly used heat sink includes a metal backplane and a plurality of heat sink fins extending from the backplane. The bottom plate is placed on the heat-generating electronic component to absorb the heat generated thereby, and the heat is transferred to the fins to be radiated to the surrounding space. However, with the development of the electronics industry, the operating frequency and functional benefits of electronic components have increased, and the amount of heat generated has also increased. The heat sink needs to be equipped with multiple heat pipes to improve its heat dissipation performance. The heat dissipating device disclosed in the Chinese Patent No. 200420003051. 1 includes a susceptor, a plurality of heat dissipating fins disposed above the pedestal, and two heat pipes connected to the heat dissipating fins and the pedestal and arranged in parallel with each other. Since the heat dissipating device needs to be equipped with two heat pipes, the heat can be transferred from the susceptor to the fins more uniformly and at a high speed, and the number of heat pipes is relatively large, which results in high manufacturing cost, which is disadvantageous for the promotion of the industry. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink having high heat dissipation efficiency and low cost. [0005] A heat dissipating device for dissipating heat from an electronic component, comprising a substrate, a plurality of heat dissipating fins disposed above the substrate, and a heat pipe connecting the substrate and the heat dissipating fin, the heat pipe comprising two interconnected evaporation Section and by 096118703 Form No. A0101 Page 4 / Total 16 Page 0993354173-0 Γ 334527 On October 1, 099, according to the positive replacement page two evaporation sections, the same side back bends and the two condensation sections combined with the heat sink fins, The returning portions of the heat pipe two evaporation sections and the two condensation sections respectively form a two-arc heat insulating section, and the two evaporation sections are coupled to the bottom surface of the substrate. Compared with the prior art, the heat pipe of the heat dissipating device of the present invention is integrally formed, and its function is equivalent to two heat pipes, but the sealing number is small, so that the cost of the heat dissipating device is low; and the heat pipe is directly coupled to the bottom surface of the substrate, which can be directly Contact with electronic components to transfer heat more efficiently to the fins. [Embodiment] [0007] Referring to FIG. 1 , a heat dissipating device of the present invention is used for dissipating heat from an electronic component (not shown) of a circuit board (not shown), and includes a body 1 〇 and a plurality of bodies 10 The upper heat dissipating fins 2 〇 and the heat pipes 30 connecting the seat body and the heat dissipating fins 20 . The base 10 includes a heat absorbing plate 12 and a substrate 14 in contact with the heat absorbing plate 12, both of which are made of a metal material having good thermal conductivity. The heat absorbing plate 12 includes a body 120 formed by vertically cutting away the isosceles triangular regions at adjacent corners of a square block, thereby forming a short side on the heat absorbing plate 12. The upper surface of the body 120 is uniformly provided with two grooves 122 parallel to the short sides for engaging with the substrate 14 to be embedded in corresponding portions of the heat pipe 3, and the lower surface of the body 120 is in contact with the electronic component to absorb the generated portion thereof. Hot. The s-shaped substrate 14 is disposed above the heat absorbing plate 12 and is in contact with the heat-dissipating Korean sheet 20, and includes a rectangular body 14A. The rectangular body 14 has a larger area than the body 120 of the heat absorbing plate 12 to uniformly transfer the heat absorbed by the heat absorbing plate 12 to each of the heat dissipation fins 20. The lower surface of the rectangular body 140 is in contact with the upper surface of the body 120 of the heat absorbing plate 12, and is provided with three grooves 142 corresponding to the three grooves 122 of the heat absorbing plate 12 and parallel to each other. The grooves ι 42 and the suction 096118703 Form No. A0101 5 pages/total 16 pages 0993354173-0 1334527. The groove 122 of the replacement page hot plate 12 is modified to form a three-cylindrical space to completely accommodate the corresponding portion of the heat pipe 30 therein. The four corners of the rectangular body 140 extend horizontally outwardly from the four latching ears 14 4 , and each of the latching ears 14 4 defines a through hole 146 for the screw member 40 to pass through to fix the substrate 14 to the circuit board. [0009] The heat dissipation fins 20 are disposed above the base 10. Each of the heat dissipating fins 20 is substantially rectangular, and the upper and lower sides are respectively bent perpendicularly to the two folded sides 202, and the upper and lower folded edges 202 are respectively connected by welding to form upper and lower surfaces of the heat dissipating fins 20. The lower surface is in thermal contact with the upper surface of the substrate 14 to transfer a portion of the heat from the substrate 14 to the heat sink fins 20. Each of the heat dissipation fins 20 has three circular through holes 204 near the upper surface, and the three through holes 204 are evenly arranged on the same straight line. The inner edge of each through hole 204 and the flange 202 are bent perpendicularly to extend an annular joint edge 20 6 , and the plurality of annular joint edges 20 6 are correspondingly connected to each other to form a three-cylindrical channel together with a corresponding portion of the heat pipe 30 . Wear it. [0010] The heat pipe 30 includes a first heat pipe 32 and a second heat pipe 34 that connect the seat body 10 and the heat dissipation fins 20. The first heat pipe 32 is integrally formed, and includes an evaporation section 320 parallel to each other and in the same horizontal plane, and two condensation sections 322 which are bent back from the same side of the two evaporation sections 320 and parallel to the evaporation section 320, and two evaporation sections. The return portion of the 320 and the two condensation sections 322 forms two adiabatic sections 324. The evaporation section 320 and the condensation section 322 are equal in cross section. The condensation section 322 is in another horizontal plane parallel to the horizontal plane in which the evaporation section 320 is located, and the other horizontal plane is parallel to the substrate 14. The two evaporation sections 320 are connected by an arc-shaped connecting section 326 to form a "U"-shaped structure. The two heat-insulating sections 324 of the first heat pipe 32 are all arc-shaped, and the plane of the two heat-insulating sections 324 is formed by 096118703. Form No. A0101 Page 6 / Total 16 pages 0993354173-0 Γ 334527 Shuttle is the corner of October 1 〇 1 day The acute angle is such that the distance between the two condensation sections 322 is greater than the distance between the two evaporation sections 3 2 0 to further transfer heat to both sides of the heat dissipation fins 20, so that the heat dissipation fins 20 can dissipate heat more uniformly. Since the two evaporation sections 320 of the first heat pipe 32 absorb heat, there is no heat exchange between the two, so the connection section 326 only serves as a connection and cannot transfer heat. Therefore, the function of the heat pipe 32 is actually equivalent to two separate heat pipes (not shown), but since it is integrally formed, the number of seals is one less than that of the two separate heat pipes, so the cost is more than that of the two separate heat pipes. It is cheap. [0011] The second heat pipe 34 is also integrally formed, and includes an evaporation section 340 and a condensation section 342 which is bent back from the evaporation section 340. The return section of the condensation section 342 and the evaporation section 340 form an arc-shaped heat insulation. Segment 344. The condensation section 342 and the evaporation section 340 of the second heat pipe 34 are respectively the same as the condensation section 322 and the steaming section 3 2 0 of the first heat pipe 32, and the condensation section 3 4 2 'evaporation section 3 4 0, heat insulation. The segments 344 are respectively located between the two condensation sections 322 of the first heat pipe 32, between the two evaporation sections 320, and between the two insulation sections 324, so that the first heat pipe 32 is bilaterally symmetric with respect to the second heat pipe 34. The condensation section 342 of the second heat pipe 34 is parallel to and at the same level as the condensation section 322 of the first heat pipe 32, and the evaporation section 340 of the second heat pipe 34 is parallel to and at the same level as the evaporation section 320 of the first heat pipe 32. The plane of the adiabatic section 344 of the second heat pipe 34 is perpendicular to the substrate 14, thereby forming the second heat pipe 34 into a "U" configuration. Referring to FIG. 2 together, the evaporation sections 3 2 0 and 3 4 0 of the first heat pipe 32 and the second heat pipe 34 are respectively received in the circle formed by the groove 14 2 of the substrate 14 and the groove 122 of the heat absorbing plate 12. In the cylindrical space, the condensation sections 322, 342 of the first heat pipe 32 and the second heat pipe 34 are respectively combined with the heat dissipation fins 20, and the heat insulation sections 324, 344 of the first heat pipe 32 and the second heat pipe 34 are located on the substrate 096118703. A0101 Page 7 of 16 Page 0993354173-0 1334527. On October 1, 099, on the same side as the replacement page 14, the connection portion 326 of the first heat pipe 32 protrudes horizontally from the substrate 14 and is located on the substrate 14 opposite to the other. side. [0012] As shown in FIG. 1 to FIG. 3, when the heat dissipating device is assembled, the two evaporation sections 320 of the first heat pipe 32 are first embedded in the two grooves 122 on both sides of the heat absorbing plate 12 to make the first heat pipe 32. The second condensation section 322 is disposed in parallel above the heat absorbing plate 12; then the evaporation section 340 of the second heat pipe 34 is embedded in the groove 1 22 in the middle of the heat absorbing plate 12, so that the condensation section 342 of the second heat pipe 34 is also combined with the heat absorbing plate. 12 is parallel and located between the two condensation sections 322 of the first heat pipe 32; subsequently, the substrate 14 is pasted on the heat absorbing plate 12, wherein the groove 142 of the substrate 14 cooperates with the groove 122 of the heat absorbing plate 12 to be embedded in the first The evaporation sections 3 20, 340 of the first and second heat pipes 32, 34 thereby sandwich the first and second heat pipes 32, 34 between the substrate 14 and the heat absorbing plate 12. Finally, the condensation sections 322, 342 of the first and second heat pipes 32, 34 are correspondingly disposed in the cylindrical passages of the heat dissipation fins 20 such that the lower surface of the heat dissipation fins 20 and the upper surface of the substrate 14 are in contact with each other. Thereby, the heat sink completes the assembly process. [0013] The first heat pipe 32 of the heat dissipating device of the present invention is integrally formed, and can function as two heat pipes, so that the cost of heat dissipation is low. Moreover, the distance between the two condensation sections 322 of the first heat pipe 32 is greater than the distance between the two evaporation sections 320, and heat can be transmitted from the susceptor to both sides of the heat dissipation fins 20, so that the heat dissipation fins 20 are evenly heated, so that the heat dissipation fins 20 can be maximized. Ground heat. Further, a second heat pipe 34 is interposed between the first heat pipes 32 to transfer heat to the heat radiating fins 20 at a higher speed. Thus, the heat dissipation efficiency and manufacturing cost of the heat sink are optimized as compared with the prior art. [0014] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, 096118703 Form No. A0101 Page 8 of 16 0993354173-0 Γ334527 October 01, 099 Amendment Replacement Page The patent application scope of this case cannot be limited. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is an exploded perspective view of a heat sink of the present invention. 2 is a perspective assembled view of the seat body and the heat pipe of FIG. 1. 3 is a perspective assembled view of FIG. 1. [Main component symbol description] [0018] Seat: 10 [0019] Heat absorbing plate: 12 [0020] Body: 120 [0021] Groove · 12 2, 142 [0022] Substrate: 14 [0023] Rectangular body: 140 [0024] lug: 144 [0025] through hole: 146, 204 [0026] heat sink fin: 20 [0027] hemming: 202 [0028] annular joint side: 206 [0029] heat pipe: 30 [0030] first heat pipe: 32 096118703 Form No. A0101 Page 9 / Total 16 Pages 0993354173-0 1334527 October 01, 099 Press the replacement page [0031] Second heat pipe: 34 [0032] Evaporation section: 320, 340 [0033] Condensation section: 322 , 342 [0034] Thermal insulation: 324, 344 [0035] Connection: 326 [0036] Screw: 40 096118703 Form No. A0101 Page 10 of 16 0993354173-0