200846882 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種對電子元器 件散熱之散熱裝置。 【先前技術】 電子元件如中央處理器等在運行過程中產生大量之熱 量，為確保電子元件之正常運行，其產生之熱量需及時地 春散發出去。通常，該電子元件上加裝一散熱裝置。 常用之散熱裝置包括一金屬底板及從該底板延伸之複 數散熱鰭片。該底板貼置於發熱電子元件而吸收其產生之 熱量，進而將熱量傳遞至鰭片而散發到周圍空間。然而隨 著電子產業之發展，電子元件之運行頻率和功能日益提 升，其發熱量也隨之增加。該散熱器需加設複數熱管以提 升其散熱性能。如中國大陸專利第200420003051.1號所揭示 之散熱裝置，其包括一基座、複數設置於基座上方之散熱 β鰭片、以及連接散熱鰭片和基座且相互平行設置之二熱 管。由於該散熱裝置需要配備二熱管才能比較均勻和高速 地把熱量從基座傳輸至鰭片，熱管數量較多，導致其製造 成本較高，不利於業者推廣。 【發明内容】 有鑒於此，有必要提供一種散熱效率較高且成本較低之 散熱裝置。 一種散熱裝置，用於對電子元器件散熱，其包括一基 6 200846882 Λ 板、複數設置於基板上方之散熱鰭片、以及連接基板及散 _熱鰭片之一熱管，該熱管包括二相互連接之蒸發段及由二 蒸發段分別同侧回彎而出且與散熱鰭片結合之二冷凝段， 該熱管二蒸發段和二冷凝段之回彎部分分別形成二弧形之 絕熱段，該二蒸發段結合於基板底面。 與習知技術相比，本發明散熱裝置之熱管一體成型，其 作用相當於二熱管，但其封口數較少，從而使散熱裝置成 本較低；且熱管結合於基板底面，可直接與電子元器件接 ΐ觸，從而更加高效率地將熱量傳輸至散熱鰭片。 【實施方式】 請參閱圖1，本發明散熱裝置用於對電路板（圖未示）之 電子元器件（圖未示）散熱，其包括一座體10、複數設置於 座體10上方之散熱鰭片20、以及連接座體10和散熱鰭片 20之熱管30。 該座體10包括一吸熱板12及一與吸熱板12接觸之基 ®板14，其均由熱導性良好之金屬材料製成。該吸熱板12 包括一本體120,該本體120由一方形塊之相鄰二角處分別 被垂直切削掉二等腰三角形區域而形成，進而在吸熱板12 上形成一短邊。該本體120之上表面均勻地開設有平行於 短邊之三凹槽122,用於與基板14配合以嵌入熱管30之相 應部分；該本體120下表面與電子元器件接觸以吸收其產 生之熱量。該基板14設置於吸熱板12上方且與散熱鰭片 20接觸，其包括一矩形本體140。該矩形本體140面積大 7 200846882 於吸熱板12本體120面積，以將吸熱板12所吸收之熱量 •均勻地傳輸至每一散熱鰭片20。該矩形本體140之下表面 與吸熱板12本體120上表面接觸，其開設有與吸熱板12 三凹槽122對應且相互平行之三凹槽142，該等凹槽142 與吸熱板12之凹槽122相互配合後形成三圓筒形空間，以 將熱管30之相應部分完全收容於其中。該矩形本體140四 角處分別水平向外延伸出四扣耳144，每一扣耳144上均開 設有一通孔146,供螺杆件40穿設而將基板14固定於電路 馨板上。 該等散熱鰭片20設置於座體10上方。每一散熱鰭片 20大致為矩形，其上下二對邊分別同向垂直彎折出二折邊 202，複數上、下折邊202籍由焊接分別連接組成散熱鰭片 20之上、下表面。該下表面與基板14上表面熱接觸，以將 部分熱量由基板14傳輸至散熱鰭片20。每一散熱鰭片20 靠近上表面處開設三圓形通孔204,該三通孔204均勻地排 •列於同一直線上。每一通孔204之内緣與折邊202同向垂 直彎折延伸出一環形結合邊206,複數該環形結合邊206 對應地相互連接，一同組成三圓筒形通道，供熱管30相應 部分穿設。 該熱管30包括連接座體10與散熱鰭片20之第一熱管 32和第二熱管34。該第一熱管32 —體成型，其包括相互 平行且處於同一水平面内之蒸發段320及由二蒸發段320 同侧回彎而出且相互平行於蒸發段320之二冷凝段322,二 蒸發段320和二冷凝段322之回彎部分形成二絕熱段324。 8 200846882 該蒸發段320和冷凝段322截面相等。該冷凝段322處於 ‘與蒸發段320所處水平面平行之另一水平面内，且該另一 水平面平行於基板14。二蒸發段320間籍由一弧形之連接 段326相連接，共同組成一 “U”形構造。該第一熱管32 之二絕熱段324均為弧形，二絕熱段324所處平面所形成 之内角為銳角，從而使二冷凝段322之間距大於二蒸發段 320之間距，以進一步將熱量傳輸至散熱籍片20兩侧，使 散熱鰭片20能更加均勻地散發熱量。由於該第一熱管32 馨之二蒸發段320均吸熱，二者間不存在熱交換，因此該連 接段326僅起一連接作用，而不能傳輸熱量。由此，該熱 管32所起之作用實際相當於二單獨之熱管（圖未示），但由 於其一體成型，相對於二單獨之熱管其封口數少一個，因 此其造價比二單獨之熱管更為低廉。 該第二熱管34亦一體成型，其包括一蒸發段340和一 由蒸發段340回彎而出之冷凝段342,冷凝段342和蒸發段 ⑩340之回彎部分形成一弧形絕熱段344。該第二熱管34之 冷凝段342和蒸發段340分別與該第一熱管32之冷凝段 322和蒸發段320截面相同，且其冷凝段342、蒸發段340、 絕熱段344分別對應位於第一熱管32之二冷凝段322之 間、二蒸發段320之間、二絕熱段324之間，使第一熱管 32關於該第二熱管34左右對稱。該第二熱管34之冷凝段 342平行於第一熱管32之冷凝段322且與其處於同一水平 面，第二熱管34之蒸發段340平行於第一述熱管32之蒸 發段320且與其處於同一水平面，第二熱管34之絕熱段344 9 200846882 所處平面垂直於基板14，從而使該第二熱管34形成一 -“U”形構造。請一併參閱圖2，第一熱管32和第二熱管 34之蒸發段320、340分別對應地收容於基板14凹槽142 和吸熱板12凹槽122共同圍設成之圓筒形空間内，第一熱 管32和第二熱管34之冷凝段322、342分別與散熱鰭片20 結合，而使第一熱管32和第二熱管34之絕熱段324、344 位於基板14之同一側，第一熱管32之連接部326水平凸 出於基板14而位於基板14之相對另一侧。 ® 再如圖1至圖3所示，組裝該散熱裝置時，首先將第 一熱管32之二蒸發段320分別嵌入位於吸熱板12兩侧之 二凹槽122内，使第一熱管32之二冷凝段322平行地設置 於吸熱板12上方；然後將第二熱管34之蒸發段340嵌入 吸熱板12中部之凹槽122内，使第二熱管34之冷凝段342 亦與吸熱板12平行且位於第一熱管32之二冷凝段322之 間；隨後，將基板14貼設於吸熱板12上方，其中，基板 ⑩14之凹槽142與吸熱板12之凹槽122配合而分別嵌入第一 和第二熱管32、34之蒸發段320、340,從而將第一和第二 熱管32、34爽設於基板14和吸熱板12之間。最後，將第 一和第二熱管32、34之冷凝段322、342對應地穿設於散 熱鰭片20之圓筒形通道内，使散熱鰭片20之下表面與基 板14上表面相互接觸。由此，該散熱裝置完成了組裝過程。 本發明散熱裝置之第一熱管32 —體成型，可起到兩個 熱管之作用，從而使散熱裝置成本較低。且，第一熱管32 二冷凝段322之間距大於二蒸發段320之間距，熱量可由 200846882 基座傳輸至散熱鰭片20兩側，使散熱鰭片20受熱均勻， #從而使散熱鰭片20能最大限度地進行散熱。再，第一熱管 32之間夾設一第二熱管34,使熱量更加高速地傳輸至散熱 ϋ片20。由此，相比於習知技術，該散熱裝置之散熱效率 及製造成本均有所優化。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上該者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 ®之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1中座體與熱管之立體組裝圖。 圖3係圖1之立體組裝圖。 【主要元件符號說明】 座體 10 吸熱板 12 本體 120 凹槽 122,142 基板 14 矩形本體 140 凸耳 144 通孔 146,204 散熱鰭片 20 折邊 202 環形結合邊 206 敎管 30 第一熱管 32 第二熱管 34 蒸發段 320,340 冷凝段 322,342 η 200846882 絕熱段 324,344 連接段 326 螺桿件 40200846882 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] Electronic components such as a central processing unit generate a large amount of heat during operation. To ensure the normal operation of electronic components, the heat generated by them needs to be released in time. Usually, a heat sink is attached to the electronic component. A commonly used heat sink includes a metal backplane and a plurality of heat sink fins extending from the backplane. The bottom plate is placed on the heat-generating electronic component to absorb the heat generated thereby, and the heat is transferred to the fins to be radiated to the surrounding space. However, with the development of the electronics industry, the frequency and function of electronic components are increasing, and the amount of heat generated is also increasing. The heat sink needs to be equipped with a plurality of heat pipes to improve its heat dissipation performance. The heat dissipating device disclosed in Chinese Patent No. 200420003051.1 includes a susceptor, a plurality of heat dissipating β fins disposed above the pedestal, and two heat pipes connected to the heat dissipating fins and the pedestal and disposed in parallel with each other. Since the heat dissipating device needs to be equipped with two heat pipes to transfer heat from the susceptor to the fins in a relatively uniform and high speed, the number of heat pipes is large, which results in high manufacturing cost, which is disadvantageous for the promotion of the industry. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having high heat dissipation efficiency and low cost. A heat dissipating device for dissipating heat from an electronic component, comprising: a base 6 200846882 Λ plate, a plurality of heat dissipating fins disposed above the substrate, and a heat pipe connecting the substrate and the heat sink fin, the heat pipe comprising two interconnected The evaporation section and the two condensation sections which are respectively bent back from the same side and are combined with the heat dissipation fins, and the bent portions of the two evaporation sections and the two condensation sections respectively form a two-arc heat insulation section, the two The evaporation section is bonded to the bottom surface of the substrate. Compared with the prior art, the heat pipe of the heat dissipating device of the present invention is integrally formed, and its function is equivalent to the two heat pipes, but the sealing number is small, so that the cost of the heat dissipating device is low; and the heat pipe is coupled to the bottom surface of the substrate, and can directly contact the electronic element. The device contacts the bumps to transfer heat to the heat sink fins more efficiently. Embodiments Referring to FIG. 1 , a heat dissipating device of the present invention is used for dissipating heat from an electronic component (not shown) of a circuit board (not shown), and includes a body 10 and a plurality of heat dissipating fins disposed above the body 10 . The sheet 20 and the heat pipe 30 connecting the seat body 10 and the heat dissipation fins 20. The base 10 includes a heat absorbing plate 12 and a base plate 14 in contact with the heat absorbing plate 12, both of which are made of a metal material having good thermal conductivity. The heat absorbing plate 12 includes a body 120 formed by vertically cutting a second isosceles triangle region from adjacent corners of a square block to form a short side on the heat absorbing plate 12. The upper surface of the body 120 is uniformly provided with three grooves 122 parallel to the short sides for engaging with the substrate 14 to be embedded in corresponding portions of the heat pipe 30; the lower surface of the body 120 is in contact with the electronic components to absorb the heat generated therefrom. . The substrate 14 is disposed above the heat absorbing plate 12 and is in contact with the heat dissipation fins 20 and includes a rectangular body 140. The rectangular body 140 has a large area 7 200846882 on the body 120 of the heat absorbing plate 12 to uniformly transfer the heat absorbed by the heat absorbing plate 12 to each of the heat dissipation fins 20. The lower surface of the rectangular body 140 is in contact with the upper surface of the body 120 of the heat absorbing plate 12, and is provided with three grooves 142 corresponding to the three grooves 122 of the heat absorbing plate 12 and parallel to each other, and the grooves 142 and the grooves of the heat absorbing plate 12 122 cooperate to form a three-cylindrical space to completely receive the corresponding portion of the heat pipe 30 therein. Four corners 144 extend horizontally outwardly from the four corners of the rectangular body 140. Each of the buckle ears 144 defines a through hole 146 for the screw member 40 to pass through to fix the substrate 14 to the circuit board. The heat dissipation fins 20 are disposed above the base 10 . Each of the heat dissipating fins 20 is substantially rectangular, and the upper and lower sides are respectively bent perpendicularly to the two folded sides 202, and the upper and lower folded edges 202 are respectively connected by welding to form upper and lower surfaces of the heat dissipating fins 20. The lower surface is in thermal contact with the upper surface of the substrate 14 to transfer a portion of the heat from the substrate 14 to the heat sink fins 20. Each of the heat dissipation fins 20 has three circular through holes 204 near the upper surface, and the three through holes 204 are evenly arranged on the same straight line. The inner edge of each through hole 204 and the flange 202 are bent perpendicularly to extend an annular joint edge 206. The plurality of annular joint edges 206 are correspondingly connected to each other to form a three-cylindrical channel, and the corresponding portion of the heat pipe 30 is disposed. . The heat pipe 30 includes a first heat pipe 32 and a second heat pipe 34 that connect the seat body 10 and the heat dissipation fins 20. The first heat pipe 32 is integrally formed, and includes an evaporation section 320 parallel to each other and in the same horizontal plane, and two condensation sections 322 which are bent back from the same side of the two evaporation sections 320 and parallel to the evaporation section 320, and two evaporation sections. The return portion of the 320 and the two condensation sections 322 forms two adiabatic sections 324. 8 200846882 The evaporation section 320 and the condensation section 322 are of equal cross section. The condensing section 322 is in another horizontal plane parallel to the horizontal plane in which the evaporation section 320 is located, and the other horizontal plane is parallel to the substrate 14. The two evaporation sections 320 are connected by an arc-shaped connecting section 326 to form a "U"-shaped structure. The two heat insulating sections 324 of the first heat pipe 32 are all arc-shaped, and the inner angle formed by the plane of the two heat insulating sections 324 is an acute angle, so that the distance between the two condensation sections 322 is greater than the distance between the two evaporation sections 320 to further transfer heat. Up to the two sides of the heat dissipation sheet 20, the heat dissipation fins 20 can dissipate heat more uniformly. Since the first heat pipe 32, the two evaporation sections 320 absorb heat, there is no heat exchange between the two, so the connection section 326 only serves as a connection and cannot transfer heat. Therefore, the function of the heat pipe 32 is actually equivalent to two separate heat pipes (not shown), but since it is integrally formed, the number of seals is one less than that of the two separate heat pipes, so the cost is more than that of the two separate heat pipes. It is cheap. The second heat pipe 34 is also integrally formed and includes an evaporation section 340 and a condensation section 342 which is bent back by the evaporation section 340. The return section of the condensation section 342 and the evaporation section 10340 form an arc-shaped insulation section 344. The condensation section 342 and the evaporation section 340 of the second heat pipe 34 are respectively the same as the section of the condensation section 322 and the evaporation section 320 of the first heat pipe 32, and the condensation section 342, the evaporation section 340, and the heat insulation section 344 are respectively located corresponding to the first heat pipe. The first heat pipe 32 is symmetrical with respect to the second heat pipe 34 between the two condensing sections 322, the two evaporation sections 320, and the two heat insulating sections 324. The condensation section 342 of the second heat pipe 34 is parallel to and at the same level as the condensation section 322 of the first heat pipe 32, and the evaporation section 340 of the second heat pipe 34 is parallel to and at the same level as the evaporation section 320 of the first heat pipe 32. The adiabatic section of the second heat pipe 34 344 9 200846882 is located perpendicular to the substrate 14 such that the second heat pipe 34 forms a "U" shaped configuration. Referring to FIG. 2, the evaporation sections 320 and 340 of the first heat pipe 32 and the second heat pipe 34 are correspondingly received in the cylindrical space surrounded by the groove 142 of the substrate 14 and the groove 122 of the heat absorbing plate 12, respectively. The condensation sections 322, 342 of the first heat pipe 32 and the second heat pipe 34 are respectively combined with the heat dissipation fins 20, so that the heat insulation sections 324, 344 of the first heat pipe 32 and the second heat pipe 34 are located on the same side of the substrate 14, the first heat pipe The connection portion 326 of the 32 is horizontally protruded from the substrate 14 on the opposite side of the substrate 14. As shown in FIG. 1 to FIG. 3, when the heat dissipating device is assembled, the two evaporation sections 320 of the first heat pipe 32 are first embedded in the two grooves 122 on both sides of the heat absorbing plate 12, so that the first heat pipe 32 is the second. The condensation section 322 is disposed in parallel above the heat absorbing plate 12; then the evaporation section 340 of the second heat pipe 34 is embedded in the groove 122 in the middle of the heat absorbing plate 12, so that the condensation section 342 of the second heat pipe 34 is also parallel to the heat absorbing plate 12 and located Between the two condensation sections 322 of the first heat pipe 32; subsequently, the substrate 14 is attached to the heat absorbing plate 12, wherein the groove 142 of the substrate 1014 cooperates with the groove 122 of the heat absorbing plate 12 to be embedded in the first and second portions, respectively. The evaporation sections 320, 340 of the heat pipes 32, 34 thereby cool the first and second heat pipes 32, 34 between the substrate 14 and the heat absorbing plate 12. Finally, the condensation sections 322, 342 of the first and second heat pipes 32, 34 are correspondingly disposed in the cylindrical passages of the heat dissipation fins 20 such that the lower surface of the heat dissipation fins 20 and the upper surface of the substrate 14 are in contact with each other. Thereby, the heat sink completes the assembly process. The first heat pipe 32 of the heat dissipating device of the present invention is integrally formed, and can function as two heat pipes, so that the cost of the heat dissipating device is low. Moreover, the distance between the two condensation sections 322 of the first heat pipe 32 is greater than the distance between the two evaporation sections 320, and the heat can be transmitted to the two sides of the heat dissipation fins 20 by the base of the 200846882, so that the heat dissipation fins 20 are evenly heated, thereby enabling the heat dissipation fins 20 to Maximize heat dissipation. Further, a second heat pipe 34 is interposed between the first heat pipes 32 to transfer heat to the heat dissipating fins 20 at a higher speed. Thus, the heat dissipation efficiency and manufacturing cost of the heat sink are optimized compared to conventional techniques. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by those skilled in the art of the present invention in accordance with the spirit of the present invention are intended to be within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 2 is a perspective assembled view of the seat body and the heat pipe of FIG. 1. Figure 3 is a perspective assembled view of Figure 1. [Main component symbol description] Seat 10 Heat absorbing plate 12 Body 120 Groove 122, 142 Substrate 14 Rectangular body 140 Lug 144 Through hole 146, 204 Heat sink fin 20 Fold 202 Ring joint edge 206 Pipe 30 First heat pipe 32 Second heat pipe 34 Evaporation section 320, 340 Condensation section 322, 342 η 200846882 Insulation section 324, 344 Connection section 326 Screw member 40
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