1327055 九、發明說明： .【發明所屬之技術領域】 對電子元器 本發明涉及一種散熱模組，特別係指一 件散熱之散熱模組。 【先前技術】 如今，在電腦產業中，為將微處理晶片等發熱電子元 件產生之熱量有效散發，通常採用方法係將散熱模組緊密 地貼5又於發熱電子兀件溢熱表面，以協助發熱電子元件散 熱，保證發熱電子元件在適當溫度下運作。 傳統之散熱模組包括-基座、複數熱導性結合於基座 之散熱片、以及連接散熱W和基座之複數“〔，，形敎 管，該等熱管之蒸發段與基座結合，冷凝段則穿設於W 内。此類散熱模組工作時，一部分熱量直接從基座傳輸至 鶴片，另—部分熱量籍由熱管傳輸至散熱鰭片。由於 管只有-冷凝段穿設㈣片内，從其 洛發段傳輸過來之熱量被集中地傳導至鰭片與冷凝段所接 觸’部分’然後再逐步地散佈至整個_片。在此過程中， 熱罝是從籍片之-部分㈣至_片之其他部分，從而導致 各一刀又熱不均勻’使鰭片不能有效與周圍空氣進行 換熱，由此，該類散熱模組之散熱效率有限。 為克服上述缺點，業界設計φ Μ269704號1中一恭施例所措出—種如中華民國專利第 教與。Q: 例所^之散熱模組，職熱模組之 熱官王S 形，盆包括一诖技社， 接‘"，曰片底部且結合至底板之 7 I327Q55 蒸發段、一穿設於鰭片中部之冷凝庐 n - 又、及—結合於銬片頂 部之另一冷凝段。該散熱模組埶營妁a a 、 • …、s均勻地分佈於鰭片表 面，一部分熱量由底板直接傳導至銬片 ’3々卜邵；由基發段所 #輪之另一部分熱量先經由一冷凝段傳輪至鰭片；部，缺 後剩餘之熱量再經由另一冷凝段傳輪 ’ — ，曰月頂部。由於敎 官之傳熱速率較快，熱量可幾乎同時到達鰭片之上邛、，中、 ，及下部，使鰭片各部分受熱均句，進而有效地將執量 政佈至周圍空^因此’該散熱模組相比于傳統之散熱模 組效率有所提咼。 、 但是，由於上述散熱模組之熱管呈“s”形其蒗 段只能單向將熱量通過二冷凝段傳輸至_片，底板所= 之熱量不能迅速散發出去，進而使該散熱模 =率 受到限制。 狀…'双丰 【發明内容】 有馨於此’有必要提供一種帶有雙向之熱管且散埶效 率較南之散熱模組。 一種散熱模組，用於對電子^器件散熱，其包括一與 電子兀器件接觸之第―崙蝕 ^ ^ ^ ^ #一 政熱态、一设置於弟—散熱器上之 弟一政…态、及連接第-和第二散熱器之至少一埶管，所 述至少一埶管向括 ,,Α 所 fηλΓ 至第一散熱器之蒸發段及從蒸發 又同側相向回彎而出之第一和第二冷凝段，其中第— 冷凝段與第二散熱器結合，第三冷凝段夾設 散熱器之間。 t 乐一 8 1327055 與習知技術相比，本發明散熱模組 一 二冷凝段由-蒸發段同側回彎而出，該第:、s:弟-和第 均直接與料蒸發段 冷凝段 二方向分別傳輪至帛，笛所及收之熱量可同時從 J刀乃寻輸至弟一和弟二冷凝段，進而 和第二散熱器。對於熱傳輸而言，雙向㈣n弟一 效率。由此，本發明散熱模組之散熱效率較高。早°更具有 【實施方式】 η 本發明之散熱模組是用於對安裝於電路板（圖未示 之中央處理器等發熱電子元器件（圖未示）進行散熱丁。 #請參閱圖i和圖2,示出了本發明之散熱模組，其包括 -第-散熱器10、一設置於第一散熱器10上方之第埶 器20、一夾置於第一散熱器1〇和第二散熱器2〇之間之二 導熱板30、以及連接第一散熱器1〇和第二散熱器2〇之二 熱管40。 所述第一散熱器10包括一底板12及設置於底板12上 之複數散熱鰭片14。所述底板12包括一矩形之板體12〇, 該板體120由導熱性良好之金屬材料製成，其下表面與電 子元器件接觸以吸收其產生之熱量；該板體120上表面門 設有平行于其長邊之二凹槽122，該二凹槽122左右對稱， 用於嵌入熱管40相應之部分。該板體120四角處分別水平 向外延伸出四扣耳124，每一扣耳124均設有一通孔126， 以供螺杆件（圖未示）穿設而將底板12固定於電路板上。 所述散熱鰭片14熱導性結合於板體120上方，每一散熱韓 9 1327055 片14均包括一矩形之片體140。該片體140垂直於底板12, 其上、下二對邊分別同向垂直彎折出二折邊142，複數相應 ‘之折邊142通過焊接而將散熱鰭片14固定成一體，從而分 別形成散熱鰭片14之上、下表面。其中，所述散熱鰭片14 之下表面通過焊接固定於底板12上表面，散熱鰭片14之 上表面則與導熱板30熱導性結合。該片體140上、下對邊 靠近該片體140 —側之部分分別設有相互對應之二半圓形 缺口 144,上邊缺口 144之圓心與下邊相應缺口 144之圓心 鲁分別位於平行於片體140短邊之二直線上。每一缺口 144 之内緣與折邊142同向垂直延伸出一半環形之結合片 - 148，複數相應之結合片148相互連接組成四半圓筒形凹槽 • 146。位於散熱鰭片14下部之二凹槽146與底板12相應之 二凹槽122配合，形成二圓筒形通道，供熱管40相應之部 分穿設。 所述導熱板30平行於底板12而設置於第一散熱器10 籲上方，該導熱板30面積小於底板12之面積，其底面與第 一散熱器10散熱鰭片14頂部對應位置處設有二凹槽302， 該二凹槽302與位於第一散熱器10上部相應之二凹槽146 組成二圓筒形通道，以收容熱管30相應之部分。該導熱板 30下表面通過焊接與第一散熱器10散熱鰭片14上表面熱 導性結合，其上表面與第二散熱器20相接觸。 所述第二散熱器20設置於導熱板30上方，其包括複 數與導熱板30結合之散熱鰭片22及與散熱鰭片22相配合 之一蓋板24。每一散熱鰭片22包括一與第一散熱器10之 I327Q55 片體140等大之矩形片體220,該片體220上邊開設有二半 圓形缺口 226，該二缺口 224與第一散熱器10之缺口 144 •相互對應，該二缺口 224之圓心與第一散熱器10相應缺口 144之圓心位於平行於片體220短邊之二直線上。所述片體 220之上、下對邊及缺口 224之内緣分別同向垂直彎折出二 折邊222及二半環形之結合片226。複數相應之折邊222 和結合片226通過焊接而將散熱鰭片22固結為一體。複數 相應之折邊222連接組成散熱鰭片22之上、下表面，該下 ® 表面通過焊接結合於導熱板30上表面。複數結合片226對 應地連接成散熱鰭片22之二凹槽228。所述蓋板24平行於 • 導熱板30，其由熱導性良好之金屬材料製成。該蓋板24 . 由一矩形之板體挖去二凹槽242而形成。該板體面積大於 導熱板30面積，其下表面通過焊接結合於散熱鰭片22之 上表面。該二凹槽242平行地開設於板體下表面，其與散 熱鰭片22之二凹槽228配合，形成容置熱管30相應部分 φ之二圓筒形通道。 所述二熱管40形狀及功能均相同。每一熱管40包括 一平直之蒸發段42及由該蒸發段42兩端同側相向回彎而 出之平直之第一冷凝段44和第二冷凝段46。該蒸發段42 和第一冷凝段44及第二冷凝段44相互平行且位於同一平 面。蒸發段42與第一冷凝段44之間之回彎部分形成第一 絕熱段45，蒸發段42與第二冷凝段46之間之回彎部分形 成第二絕熱段47。所述第一絕熱段45和第二絕熱段47均 位於第一冷凝段44和第二冷凝段46所形成之平面内，該 11 I327Q55 第一絕熱段45進一步包括一垂直于蒸發段42之第一平直 •k 452及由忒第一平直段452兩端同側延伸出之二弧形之 第一連接段454,該二第一連接段454之自由末端分別與蒸 發段42和第一冷凝段44連接，從而將蒸發段42所吸收之 部分熱量從左側傳輸至第一冷凝段44。所述第二絕熱段471327055 IX. Description of the invention: [Technical field of the invention] The present invention relates to a heat dissipation module, and in particular to a heat dissipation module for heat dissipation. [Prior Art] Nowadays, in the computer industry, in order to effectively dissipate the heat generated by the heat-generating electronic components such as micro-processing wafers, the heat-dissipating module is closely attached to the heat-dissipating surface of the heat-generating electronic component to assist The heat-generating electronic components dissipate heat to ensure that the heat-generating electronic components operate at an appropriate temperature. The conventional heat dissipation module includes a pedestal, a plurality of heat-dissipating heat-dissipating fins coupled to the pedestal, and a plurality of heat-dissipating W and a pedestal, and the evaporation section of the heat-pipe is combined with the pedestal. The condensation section is placed in the W. When such a heat dissipation module is in operation, a part of the heat is directly transmitted from the base to the crane piece, and another part of the heat is transmitted from the heat pipe to the heat dissipation fin. Since the pipe only has a condensation section (4) On-chip, the heat transferred from its Luofa section is concentratedly conducted to the 'portion' where the fin is in contact with the condensation section and then gradually spread to the entire slice. In the process, the enthusiasm is from the film- Part (4) to the other parts of the _ film, resulting in a heat and unevenness of each knife, so that the fins can not effectively exchange heat with the surrounding air. Therefore, the heat dissipation efficiency of the heat dissipation module is limited. To overcome the above shortcomings, the industry design φ Μ 269704 No. 1 in a case of Gong Gong - such as the Republic of China patent teaching and teaching. Q: Example of the heat module, the hot module Wang S-shaped, the basin includes a 诖 诖, Connect '", the bottom of the cymbal and bonded to the bottom plate 7 I327Q55 Evaporation section, a condensate 庐n- and, in the middle of the fin, is combined with another condensation section at the top of the cymbal. The heat dissipation module 埶 妁aa, • ..., s is evenly distributed on the fin On the surface of the sheet, a part of the heat is directly transmitted from the bottom plate to the ' piece '3々卜邵; another part of the heat from the base of the base hair section is first transferred to the fin through a condensation section; the remaining heat remaining after the missing A condensing section passes the wheel'--, the top of the moon. Because the heat transfer rate of the eunuch is faster, the heat can reach the 邛, middle, and lower parts of the fin almost simultaneously, so that the fins are heated and sentenced. Effectively put the amount of control into the surrounding air ^ Therefore, the heat dissipation module has improved efficiency compared with the conventional heat dissipation module. However, since the heat pipe of the above heat dissipation module has an "s" shape, the segment is only The heat can be transferred to the _ piece through the two condensation sections in one direction, and the heat of the bottom plate = can not be quickly dissipated, so that the heat dissipation mode = rate is limited. [...] Shuangfeng [invention content] Provides a heat pipe with two-way heat dissipation A heat dissipation module with a southerly rate. A heat dissipation module for dissipating heat from an electronic device, which includes a first contact with the electronic device, and a heat state, and a heat dissipation. And the at least one manifold connecting the first and second heat sinks, the at least one manifold, the fηλΓ to the evaporation section of the first heat sink and the same evaporation The first and second condensation sections are turned back toward each other, wherein the first condensation section is combined with the second heat sink, and the third condensation section is sandwiched between the heat sinks. t Le Yi 8 1327055 Compared with the prior art, The first and second condensation sections of the heat dissipation module of the invention are bent back from the same side of the evaporation section, and the first:, s: brother-and the first one are directly conveyed to the condensing section of the evaporation section of the material respectively to the crucible, and the flute is collected. The heat can be simultaneously transferred from the J knife to the second and the second condensation section of the brother and the second radiator. For heat transfer, two-way (four) n-one efficiency. Therefore, the heat dissipation module of the present invention has high heat dissipation efficiency. [Embodiment] η The heat dissipation module of the present invention is used for heat dissipation of a heat-generating electronic component (not shown) mounted on a circuit board (not shown). #See Figure i FIG. 2 shows a heat dissipation module of the present invention, including a first-heat sink 10, a second device 20 disposed above the first heat sink 10, and a first heat sink 1 and a first Two heat conducting plates 30 between the two heat sinks 2 and two heat pipes 40 connecting the first heat sink 1 and the second heat sink 2 . The first heat sink 10 includes a bottom plate 12 and is disposed on the bottom plate 12 The plurality of heat dissipation fins 14. The bottom plate 12 includes a rectangular plate body 12, which is made of a metal material having good thermal conductivity, and a lower surface thereof is in contact with the electronic component to absorb heat generated therefrom; The upper surface of the plate body 120 is provided with two grooves 122 parallel to the long sides thereof. The two grooves 122 are bilaterally symmetrical and are used for embedding corresponding portions of the heat pipe 40. The four corners of the plate body 120 extend horizontally outwardly from the four corners. The ear 124, each of the buckle ears 124 is provided with a through hole 126 for the screw member (not shown) The heat sink fins 14 are thermally coupled to the upper surface of the board 120. Each of the heat sinks 9 1327055 sheets 14 includes a rectangular sheet body 140. The sheet body 140 is perpendicular to the sheet body 140. The upper and lower sides of the bottom plate 12 are respectively bent perpendicularly to the two folded edges 142, and the plurality of corresponding flanges 142 are fixed by welding to fix the heat dissipation fins 14 to form the heat dissipation fins 14 respectively. The lower surface of the heat dissipating fin 14 is fixed to the upper surface of the bottom plate 12 by soldering, and the upper surface of the heat dissipating fin 14 is thermally conductively combined with the heat conducting plate 30. The upper and lower sides of the sheet body 140 The portions adjacent to the side of the sheet body 140 are respectively provided with mutually corresponding semi-circular notches 144, and the center of the upper side notch 144 and the center of the lower side corresponding notch 144 are respectively located on two straight lines parallel to the short side of the sheet body 140. The inner edge of a notch 144 and the flange 142 extend perpendicularly to the semi-annular bond piece 148. The plurality of corresponding bond pieces 148 are connected to each other to form a semi-cylindrical groove 146. The lower part of the heat sink fin 14 is concave. The slot 146 corresponds to the bottom plate 12 The slot 122 is matched to form a two-cylindrical channel, and the corresponding portion of the heat pipe 40 is disposed. The heat conducting plate 30 is disposed above the first heat sink 10 parallel to the bottom plate 12, and the area of the heat conducting plate 30 is smaller than the area of the bottom plate 12. The bottom surface of the heat sink fin 14 is disposed at a position corresponding to the top of the heat sink fin 14 of the first heat sink 10, and the two recesses 302 form a two-cylindrical channel with two corresponding recesses 146 located at the upper portion of the first heat sink 10. The lower surface of the heat conducting plate 30 is thermally conductively bonded to the upper surface of the heat sink fin 14 of the first heat sink 10 by soldering, and the upper surface thereof is in contact with the second heat sink 20. The second heat sink 20 is disposed above the heat conducting plate 30 and includes a plurality of heat dissipating fins 22 combined with the heat conducting plate 30 and a cover plate 24 matching the heat dissipating fins 22. Each of the heat dissipation fins 22 includes a rectangular body 220 that is larger than the I327Q55 body 140 of the first heat sink 10. The upper surface of the body 220 is provided with two semi-circular notches 226, and the two notches 224 and the first heat sink The notches 144 of 10 are corresponding to each other, and the center of the two notches 224 and the center of the corresponding notch 144 of the first heat sink 10 are located on two straight lines parallel to the short side of the sheet body 220. The upper edge of the sheet body 220, the lower side and the inner edge of the notch 224 are respectively bent perpendicularly to the two-folded edge 222 and the two-half annular joint piece 226. The plurality of corresponding flanges 222 and bonding tabs 226 are integrally bonded by heat sinking fins 22. The corresponding hem 222 is joined to form an upper surface and a lower surface of the heat dissipation fin 22, and the lower surface is bonded to the upper surface of the heat conduction plate 30 by soldering. The plurality of bond pads 226 are correspondingly coupled into two recesses 228 of the heat sink fins 22. The cover plate 24 is parallel to the heat conducting plate 30, which is made of a metal material having good thermal conductivity. The cover plate 24 is formed by digging the two recesses 242 from a rectangular plate body. The plate body area is larger than the area of the heat conducting plate 30, and the lower surface thereof is bonded to the upper surface of the heat radiating fin 22 by welding. The two recesses 242 are parallelly formed on the lower surface of the plate body, and cooperate with the two recesses 228 of the heat radiating fins 22 to form two cylindrical passages for accommodating the corresponding portions φ of the heat pipes 30. The shape and function of the two heat pipes 40 are the same. Each heat pipe 40 includes a flat evaporating section 42 and a flat first condensing section 44 and a second condensing section 46 which are bent back from opposite sides of the evaporating section 42. The evaporation section 42 and the first condensation section 44 and the second condensation section 44 are parallel to each other and on the same plane. The return portion between the evaporation section 42 and the first condensation section 44 forms a first insulation section 45, and the return portion between the evaporation section 42 and the second condensation section 46 forms a second insulation section 47. The first thermal insulation section 45 and the second thermal insulation section 47 are both located in a plane formed by the first condensation section 44 and the second condensation section 46. The 11 I327Q55 first insulation section 45 further includes a section perpendicular to the evaporation section 42. a straight • k 452 and a first curved connecting portion 454 extending from the same side of the first straight portion 452, the free ends of the two first connecting segments 454 and the evaporation portion 42 and the first The condensing section 44 is connected to transfer a portion of the heat absorbed by the evaporation section 42 from the left side to the first condensing section 44. The second thermal insulation section 47
包括一垂直于蒸發段42之第二平直段472及由該第二平直 段472兩端同側延伸出之二弧形之第二連接段474。該第二 平直段472之長度小於第一平直段452之長度。該二第二 連接段474之自由末端分別連接至蒸發段42及第二冷凝段 46，以將蒸發段42所吸收之另一部分熱量從右側傳輸至第 二冷凝段46。由於熱量可從雙方向分別傳輸至第一冷凝段 44和第二冷凝段46，蒸發段42所積蓄之熱量可迅速地得 到釋放，從而使熱管4〇具有一較高之傳熱效率。 一熱官40所處平面相互平行，且二熱管4〇各部分之 位置一 一對應。所述每一熱管4〇所處平面垂直於散熱鰭片 14和底板12。請一併參閱圖3,組裝該散熱模組時，首先 將二熱管4〇之二蒸發段42嵌入第-散熱器10底板12之 二凹槽m 0 ;然後，將二熱管4〇之二第二冷凝段仏之 自曰由末端相對于蒸發段42略微向上提起-段距離，再將已 =接成:體之第一散熱器1〇之散熱鰭片14從一側垂直穿 。又=熱g 4〇之第二冷凝段46、蒸發段42、第一和第二絕 熱段45、47所圍設出之空間内。由於熱管4Q呈有彈性， 在散熱韓片U穿設過程中，熱管4〇之 形變，使熱管40之第凝段46且右 ·，，、+又4/&生 心弟一々凌& 46具有一向下移動之趨勢， 12 1327055 從而與散熱鰭片14之上表面發生干涉，直至該二第二冷凝 段46嵌入散熱鰭片14上部之二凹槽146内，使第二絕熱 段47恢復形變，第二冷凝段46恢復至原有位置。此時， 散熱鰭片14之下表面與底板12上表面緊密接觸而將熱管 40之二蒸發段42收容於散熱鰭片14下部之凹槽146和底 板12之凹槽122配合形成之二圓筒形通道内。熱管40之 二第一絕熱段45位於第一散熱器10之一側，二第二絕熱 段47位於第一散熱器10之相對另一側；之後，再將導熱 •板30之下表面貼設於散熱鰭片14之上表面，使導熱板30 之二凹槽302與散熱鰭片14上部之二凹槽146配合形成之 - 二圓筒型通道容置二熱管30之二第二冷凝段46;隨後，使 - 已焊接成一體之第二散熱器20之散熱鰭片22之二凹槽228 對準熱管40之二第一冷凝段44之下半部分，再將散熱鰭 片22沿熱管40之第一冷凝段44向内移動，直至散熱鰭片 22之下表面與導熱板30之上表面完全貼合，此時熱管40 鲁之二第一冷凝段44對應嵌入於散熱鰭片22之二凹槽228 内；最後，將第二散熱器20之蓋板24下表面貼設於散熱 鰭片22上表面，使該蓋板24之二凹槽242與散熱鰭片22 之二凹槽228所形成之二圓筒形空間將二熱管40之二第一 冷凝段44收容於其中。由此，該散熱模組完成了組裝過程。 綜上所述，本發明散熱模組每一熱管40之二冷凝段 44、46由一蒸發段42同側相向回彎而出，其中第一冷凝段 44結合於第二散熱器20頂部，第二冷凝段46夾置於第一和 第二散熱器10、20之間，底板12所吸收之熱量一部分直接 13 1327055 傳導至散熱.it片14、22 ’另—部分熱量被熱管敏蒸發段 42所吸收後分別籍由二冷凝段44、46從二方向傳輸至第一 和第二散熱器1G、2G’其散熱效率較單方向之熱傳輸高。 且，由於熱管40之第-和第二冷凝段4[46分別與導紙性 良好之盍板24和導熱板3〇結合，熱量可更加均勻之從 24和導熱板30傳輸至每—散熱鰭片14、22，使第一和 月文熱為10、20能充分進行散熱。 綜上所述，本發明確已符合發明專利之 提出專利申請。惟， 文干逐依决 上居者僅為本發明之較佳實施例， 不能以此限制本案之巾請專·圍。舉凡熟悉本案技龜 二士巧本發明之精神所作之等效修•或變 盍於以下申請專利範圍内。 ^ 【圖式簡單說明】 圖1係本發明散熱模組之立體組合圖。 圖3係本發明散熱模組第—散熱器與熱管之立體組農 圖2係本發明散熱模組之立體分解圖 圖 主要元件符號說明】 第一散熱器 10 底板 板體 120 凹槽 扣耳 124 通孔 散熱鰭片 14,22 片體 12 122,146,228,242, 302 126 140,220 14 1327055 折邊 142,222 缺口 144,224 結合片 148,226 第二散熱器 20 蓋板 24 導熱板 30 執管 40 蒸發段 42 第一冷凝段 44 第一絕熱段 45 第一平直段 452 第一連接段 454 第二冷凝段 46 第二絕熱段 47 第二平直段 472 第二連接段 474 15A second straight section 472 perpendicular to the evaporation section 42 and a second curved section 474 extending from the same side of the second straight section 472 are included. The length of the second straight section 472 is less than the length of the first straight section 452. The free ends of the second connecting segments 474 are coupled to the evaporating section 42 and the second condensing section 46, respectively, to transfer another portion of the heat absorbed by the evaporating section 42 from the right side to the second condensing section 46. Since heat can be transferred from the two directions to the first condensation section 44 and the second condensation section 46, respectively, the heat accumulated in the evaporation section 42 can be quickly released, so that the heat pipe 4 has a high heat transfer efficiency. The planes of a thermal officer 40 are parallel to each other, and the positions of the respective portions of the two heat pipes 4 are one-to-one correspondence. The plane of each of the heat pipes 4 is perpendicular to the heat dissipation fins 14 and the bottom plate 12. Referring to FIG. 3 together, when assembling the heat dissipation module, firstly insert two evaporation pipes 42 of the two heat pipes 4 into the two grooves m 0 of the bottom plate 12 of the first radiator 10; then, the second heat pipe 4 The self-twisting of the second condensation section is slightly raised upward by the end portion relative to the evaporation section 42, and the heat dissipation fins 14 which have been connected to the first heat sink of the body are vertically penetrated from one side. Further, in the space surrounded by the second condensation section 46 of the heat g 4 , the evaporation section 42, and the first and second heat insulation sections 45, 47. Since the heat pipe 4Q is elastic, during the process of dissipating the heat-dissipating film U, the heat pipe 4 is deformed, so that the first condensation section 46 of the heat pipe 40 and the right, the, the +, and the 4/& 46 has a tendency to move downward, 12 1327055 to interfere with the upper surface of the heat dissipation fin 14 until the two second condensation sections 46 are embedded in the two recesses 146 of the upper portion of the heat dissipation fins 14, so that the second insulation section 47 is restored. After deformation, the second condensation section 46 returns to its original position. At this time, the lower surface of the heat dissipation fin 14 is in close contact with the upper surface of the bottom plate 12, and the two evaporation sections 42 of the heat pipe 40 are received in the groove 146 of the lower portion of the heat dissipation fin 14 and the groove 122 of the bottom plate 12 are formed into a two cylinder. Inside the shaped channel. The first heat insulating section 45 of the heat pipe 40 is located on one side of the first heat sink 10, and the second second heat insulating section 47 is located on the opposite side of the first heat sink 10. After that, the lower surface of the heat conducting plate 30 is attached. On the upper surface of the heat dissipation fin 14, the two grooves 302 of the heat conduction plate 30 are formed by the two grooves 146 of the upper portion of the heat dissipation fins 14 - the two cylindrical channels are accommodated by the second heat transfer pipe 30 and the second condensation portion 46 Then, the two recesses 228 of the heat sink fins 22 of the second heat sink 20 that have been soldered are aligned with the lower half of the first condensation section 44 of the heat pipe 40, and the heat dissipation fins 22 are along the heat pipe 40. The first condensation section 44 moves inwardly until the lower surface of the heat dissipation fin 22 completely conforms to the upper surface of the heat conduction plate 30. At this time, the first condensation section 44 of the heat pipe 40 is embedded in the heat dissipation fin 22 In the recess 228, the lower surface of the cover 24 of the second heat sink 20 is attached to the upper surface of the heat sink fin 22, so that the two recesses 242 of the cover 24 and the two recesses 228 of the heat sink fin 22 The two cylindrical spaces formed therein receive the first condensation section 44 of the two heat pipes 40 therein. Thus, the heat dissipation module completes the assembly process. In summary, the two condensation sections 44, 46 of each heat pipe 40 of the heat dissipation module of the present invention are bent back from the same side of an evaporation section 42, wherein the first condensation section 44 is coupled to the top of the second heat sink 20, The two condensation sections 46 are sandwiched between the first and second heat sinks 10, 20. The heat absorbed by the bottom plate 12 is directly conducted to the heat dissipation of the 13 1327055. The sheets 14 and 22 are additionally heat-treated by the heat-sensitive tube. After being absorbed, the heat transfer efficiency is higher than that of the single direction by the two condensation sections 44, 46 respectively from the two directions to the first and second heat sinks 1G, 2G'. Moreover, since the first and second condensation sections 4 [46 of the heat pipe 40 are combined with the guide plate 24 and the heat conduction plate 3 which are excellent in paper guiding property, the heat can be more uniformly transmitted from the 24 and the heat conduction plate 30 to each of the heat dissipation fins. The sheets 14, 22 enable the first and monthly heats to be 10, 20 to sufficiently dissipate heat. In summary, the present invention has indeed met the patent application for the invention patent. However, it is only a preferred embodiment of the present invention that the slogan is based on the present invention, and it is not possible to limit the scope of the case. Any equivalent to the spirit of the present invention, which is familiar to the case, is equivalent to the following claims. ^ [Simple Description of the Drawings] Fig. 1 is a perspective assembled view of the heat dissipation module of the present invention. 3 is a perspective view of a heat dissipating module of the present invention, a heat sink and a heat pipe. FIG. 2 is an exploded perspective view of the heat dissipating module of the present invention. FIG. 3 is a schematic view of a main heat sink 10 bottom plate body 120 groove lug 124 Through Hole Heat Sinks 14, 22 Sheets 12 122, 146, 228, 242, 302 126 140, 220 14 1327055 Folds 142, 222 Notches 144, 224 Bonding Sheets 148, 226 Second Radiator 20 Cover Plate 24 Thermal Conductive Plate 30 Tube 40 Evaporation Section 42 First Condensation Section 44 First Insulation section 45 first straight section 452 first connection section 454 second condensation section 46 second insulation section 47 second straight section 472 second connection section 474 15