201107694 、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱模組，特別涉及一種適用 於發熱電子元件散熱的散熱模組。 【先前技術】 隨著電腦產業的迅速發展，CPU追求高速度 化’多功能化及小型化所衍生的散熱問題越來越嚴 重，因此’必須將熱量及時有效地散發出去，否則 會極大地影響電子元件的工作性能，同時還會縮減 電子元件的使用壽命。 在筆記型電腦内，通常使用散熱模組為CPU等 發熱電子元件散熱。如已公開的中國大陸第 200710141298.8號專利申請揭示了一種散熱組件。 該散熱組件包括一風扇，一散熱鰭片組件、一熱管 及一導熱件。該導熱件熱耦接至發熱元件。該風扇 没於遠離該發熱電子元件處。該風扇形成有出風 口 ’該散熱鰭片組件設於該出風口處。該熱管的第 一端熱耦接至導熱件’第二端穿設散熱鰭片元件。 由於熱源遠離風扇及散熱鰭片組件設置，在熱 量從熱源傳遞至散熱鰭片元件的過程中，一部分熱 量流失到系統内部’造成系統内部溫度的升高。影 響系統性能的穩定性。另，該散熱元件包括眾多部 件’且將散熱元件組裝於發熱元件所在的電路板上 201107694 時，不僅需要固定風扇，還要固定導熱件，使得安 ' 裝過程極為繁瑣。又，該散熱元件體積較大，需要 佔用杈多的系統安裝空間，與筆記型電腦朝向輕薄 短小的發展趨勢違背。 【發明内容】 鑒於此，有必要提供一種結構緊湊、安裝方便 且能有效避免熱量流失至系統内的散熱模組。 • 一種散熱模組，包括一離心風扇、一熱管及一 散熱鰭片組，該離心風扇的側向形成一出風口，該 散熱鰭片組設於該出風口處，該熱管具有一蒸發段 及一冷凝段，該熱管的蒸發段與該離心風扇連接， 且該熱管的蒸發段位於該離心風扇所涵蓋的區域 内，該熱管的冷凝段與該散熱鰭片組連接。 與1知政熱模組相比，上述散熱模組中，熱管 的蒸發段與離〜風扇連接且位於離心風扇所涵蓋的 區域内，該散熱模組的結構更為緊湊；且在安裝散 熱模組的過程中，僅需固定離心風扇便可實現熱管 的女裝疋位，組裝方便；另，該熱管的蒸發段位於 離心風扇所涵蓋的區域内，即與熱管的蒸發段連接 的熱源也位於離心風扇所涵蓋的區域内。因而從熱 源表面散發出來的熱量可及時地被離心風扇吹走， 避免了熱里流失到系統内而導致系統内部溫度升 高0 201107694 【實施方式】 明 下面參照附圖結合實施例對本發明作進—步說 請參閲圖1及圖2,該散熱模組100包括—離心 風f10、喪設於離心風扇10底部的兩吸熱板20、 收谷於離心風扇1〇内的一敎管3 40。 一及-散熱韓片組 該兩吸熱板20由導熱性能良好的金屬材料比如 銅製成，該兩吸熱板20均呈方矩形，其用於貼設於 發熱電子元件上（圖未示）以吸收發熱電子元件 的熱量。 該熱管30大致呈u型，包括一呈L型的蒸發段 32及一直線形的冷凝段34。該熱管3〇的内部形成 一真空密閉腔室，該腔室内設有工作液體（圖未 示）。该熱管30呈扁平狀，包括一頂面31及平行於 該頂面31的一底面33。 該離心風扇10包括一頂蓋11、一底蓋、連 接該頂蓋11與底蓋12的一蜗形側壁13及一葉輪 工4。該頂蓋11、底蓋12及側壁13合圍形成一容置 空間’該葉輪14收容於該容置空間内。 該頂蓋11的中央設有一第一進風口 110，該第 一進風口 110的中央設有一支撐部U1，該支撐部 201107694 111上設有定子112。該葉輪14倒吊懸掛於該頂蓋 • 11的支撐部111上，該葉輪14與底蓋12間隔一定 距離。該底蓋12的中央設有一第二進風口 120,該 側壁13上設有一呈直線形的出風口 130。該底蓋12 為鈑金件或經壓鑄成型的金屬件，該側壁13可與該 底蓋12 —體成型。 該底蓋12具有一面向該頂蓋11的上表面121 _ 及與該上表面121相對的一下表面122。該底蓋12 的上表面121於該第二入風口 130的外圍向下凹陷 形成一收容部125，該收容部125用於將所述熱管 30收容於其内。該收容部125包括一狹長的收容槽 123及一直線型的凹台124。該收容槽123大致呈L 形，從遠離出風口 130的一側圍繞第二入風口 120 延伸至出風口 130處。該收容槽123用於收容所述 熱管30的蒸發段32。該收容槽123凹陷的深度小 • 於底蓋12的厚度。該凹台124形成於該底蓋12靠 出風口 130的邊緣。該凹台124順沿該出風口 130 的方向延伸，從出風口 130的一側延伸至另一側。 該凹台124與所述收容槽123靠近出風口 130的末 端相連通。該凹台124用於放置所述熱管30的冷凝 段34。該凹台124沿垂直於其延伸方向的寬度小於 該熱管30的冷凝段34的寬度，因此，該熱管30的 冷凝段34置於凹台124上時，該冷凝段34的内側 抵靠於該凹台124上，該冷凝段34的外側突伸出該 201107694 凹台124外側。 該底蓋12的下表面122於收容槽123的延伸路 徑上分別向上凹陷形成兩凹槽126。該兩凹槽126 的形狀和尺寸分別與所述兩吸熱板20相對應，用於 分別收容該兩吸熱板20。該收容槽123和凹槽126 分別位於底蓋12的上表面121和下表面122。所述 收容槽123與凹槽126連通，從而於該收容槽123 對應該兩凹槽126處形成貫穿該底蓋12的兩通孔 127。因此，熱管30的蒸發段32收容於該收容槽 123内後可與收容於兩凹槽126内的吸熱板20直接 接觸。 在具體實施時，該收容槽123也可以從底蓋12 的下表面122向上凹陷形成，這樣熱管30的蒸發段 32收容於收容槽123後，該蒸發段32的底面33可 以直接跟發熱元件接觸，從而可以省略吸熱板20。 該散熱鰭片組40設於該離心風扇10的出風口 130處。該散熱鰭片組40由複數形狀結構相同的散 熱鰭片41相互堆疊而成。每一散熱鰭片41包括一 本體42及分別自本體42的上下兩側垂直延伸形成 的上折邊43和下折邊44。每一本體42的中部於面 向所述離心風扇4 0的一側形成·一開口向外的“ U ” 形缺口，該本體42於缺口的上下兩侧分別垂直延伸 形成一上接觸板46及一下接觸板47,該兩接觸板 201107694 46、47與折邊43、44的延伸方向相同。該本體42 於缺口上方的部分的寬度大於該缺口下方的部分的 寬度。 所有散熱鰭片41沿平行於離心風扇1〇的出風 口 130的方向呈線性排列。每一散熱鱗# 41的折邊 43、44抵靠於前一散熱鰭片41的本體㈣上下兩 側從而使相鄰的散熱韓片41的本體42之間間隔形 ♦ 絲流通道。所有散減片41上的缺口相互對應從 而於散熱續片組40的中部形成貫穿整個散熱鰭片 組40的-長槽45。所有散熱籍片41的上接觸板牝 共面從而於長槽45的頂部形成一上接觸面，所有散 熱鰭片41的下接觸板47共面從而於長槽的底部 形成下接觸面。該上接觸面和下接觸面與熱管3〇 的冷凝段34接觸時有利於增大散熱韓片41與熱管 _ 3G的接觸面積。該長槽45的形狀和大小與冷凝段 34突伸出該凹台m的外側的形狀和大小相等，當 該散熱鰭片組40安裝於離心風扇1〇的出風口二 處時’該長槽45底部的下接觸面大致與底蓋12的 凹台124的底面相平，該長槽牦與凹台Μ#相互連 通’共同形成—可收容該冷凝段34在内的收容空 間。 士二青同時參閱圖3及圖4，組襄該散熱模組· 該熱管30收容於該離心風扇10的底蓋12的收 201107694 合°^25内。其中，該熱管3G的蒸發段32收容於 該，合槽123 Θ，該熱管3G的冷凝段34搭設於該 凹口 124上。所述兩吸熱板2〇分別收容於該底蓋 12底部的兩凹槽126 π。同時，該熱管％的蒸發 段32對應該兩凹槽126處與該兩吸熱板2〇直接接 =並通過焊接的方式與該兩吸熱板20連接。該熱 g 30的頂面31與該葉輪14相間隔，從而保證該葉 輪14旋轉時不會受到熱管30的干涉。該散熱鰭片 組4〇設於該離心風扇1〇的出風口 130處，該散熱 錯片組40於該長槽45下側的部分與該底i 12的凹 σ 124的外側相抵靠，該散熱鰭片組4〇於該長槽 45上側的部分進一步朝出風口 13〇内側延伸。從而 使該熱管30的冷凝段34嵌設於該散熱鰭片組4〇的 長槽45内，同時，該冷凝段34的整個頂面31與該 長槽45的上接觸面相接觸，該冷凝段％的底面％ • 的外側與該長槽45的下接觸面相接觸。 該散熱模組100工作時，該吸熱板20與發熱電 子兀件接觸吸熱，並將熱量迅速傳遞至熱管30的蒸 發& 32，熱管30的蒸發段32吸熱後，通過其内工 作液體的相變化將熱量迅速傳遞至冷凝段34，熱管 30的冷凝段34再將熱量傳遞至散熱鰭片組4〇，散 熱鰭片組40利用其較大的外表面將熱量散發至其 周圍’離心風扇10的葉輪14運轉產生強制氣流將 散熱鰭片41内高溫氣流帶走。當該散熱模組1〇〇安 201107694 裝至一電子襄置比如筆記型電腦中時，該電子裝置 的機殼上通常會設有一通風口正對該散熱鰭片組 40 ’以便從離心風扇1〇的出風口 13〇排出並經散熱 鰭片組40加溫後形成的高溫氣流可直接排出至系 統外部。 該散熱模组100的熱管30的蒸發段32整體收 容於離心風扇10的内部，熱管3〇的蒸發段32和發 熱電子元件位於該離心風扇10所涵蓋的區域内，發 熱電子元件產生的熱量存在於離心風扇所涵蓋 的區域内。該發熱電子元件產生的熱量大部分被熱 管30迅速傳導至散熱鯖片組4〇，同時，極少部分 熱量傳遞給離心風扇10的底蓋12，該少部分熱量 可迅速地被葉輪14產生的強制氣流帶走’從而避免 了熱量流失到系統内而導致系統内部溫度升高，有 效地提尚了離心風扇1〇所產生風量的利用效率。此 外’該散熱模組100將離心風扇1〇、熱管3〇以及 吸熱板20整合於一體，體積較小，佔用系統空間較 小；且將該散熱模組100安裝至發熱電子元件所在 的電路板上時，僅需固定離心風扇1〇即可完成散熱 模組10 0的安裝定位，簡化了安裝過程，組裝方便二 综上所述，本發明符合發明專利之要件爰依 法提出專利申請。惟以上所述者僅為本發明之較^ 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 201107694 ' 精神所作之等效修飾或變化，皆應涵蓋於以下之申 * 請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱模組較佳實施例的立體分解BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module suitable for heat dissipation of a heat-generating electronic component. [Prior Art] With the rapid development of the computer industry, the CPU pursues high speed. The problem of heat dissipation derived from multi-function and miniaturization is becoming more and more serious. Therefore, it is necessary to dissipate heat in a timely and effective manner, otherwise it will greatly affect The performance of electronic components, while also reducing the life of electronic components. In a notebook computer, a heat dissipation module is usually used to dissipate heat from electronic components such as a CPU. A heat dissipating assembly is disclosed in the published Japanese Patent Application No. 200710141298.8. The heat dissipating component comprises a fan, a heat sink fin assembly, a heat pipe and a heat conducting component. The heat conductive member is thermally coupled to the heat generating component. The fan is not remote from the hot electronic component. The fan is formed with an air outlet. The heat sink fin assembly is disposed at the air outlet. The first end of the heat pipe is thermally coupled to the heat conducting member. The second end of the heat pipe is disposed through the heat dissipating fin element. Since the heat source is located away from the fan and the fin assembly, a portion of the heat is lost to the interior of the system as heat is transferred from the heat source to the fin assembly, causing an increase in the internal temperature of the system. Affect the stability of system performance. In addition, the heat dissipating component includes a plurality of components' and the heat dissipating component is assembled on the circuit board on which the heating component is located. In the case of the 201107694, not only the fixing of the fan but also the heat conducting member is required, so that the mounting process is extremely cumbersome. Moreover, the heat dissipating component is bulky and requires a large amount of system installation space, which is contrary to the development trend of the notebook computer toward a thin and light short. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipation module that is compact in structure, convenient to install, and capable of effectively preventing heat loss into the system. A heat dissipation module includes a centrifugal fan, a heat pipe and a heat dissipation fin group, the centrifugal fan forms an air outlet laterally, and the heat dissipation fin is disposed at the air outlet, the heat pipe has an evaporation section and In a condensation section, an evaporation section of the heat pipe is connected to the centrifugal fan, and an evaporation section of the heat pipe is located in an area covered by the centrifugal fan, and a condensation section of the heat pipe is connected to the heat dissipation fin set. Compared with the 1 heat management module, in the heat dissipation module, the evaporation section of the heat pipe is connected to the fan and is located in the area covered by the centrifugal fan, and the structure of the heat dissipation module is more compact; In the process of the group, only the centrifugal fan needs to be fixed to realize the woman's position of the heat pipe, and the assembly is convenient; the evaporation section of the heat pipe is located in the area covered by the centrifugal fan, that is, the heat source connected to the evaporation section of the heat pipe is also located. Within the area covered by the centrifugal fan. Therefore, the heat radiated from the surface of the heat source can be blown away by the centrifugal fan in time, thereby avoiding the loss of heat into the system and causing the internal temperature of the system to rise. 0 201107694 [Embodiment] Hereinafter, the present invention will be made in conjunction with the embodiments with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the heat dissipation module 100 includes a centrifugal wind f10, two heat absorbing panels 20 that are disposed at the bottom of the centrifugal fan 10, and a manifold 340 that is received in the centrifugal fan 1〇. . I--heat-dissipating Korean film set The two heat-absorbing plates 20 are made of a metal material having good thermal conductivity, such as copper, and the two heat absorbing plates 20 are each formed in a rectangular shape for attaching to a heat-generating electronic component (not shown) for absorption. The heat of the heating electronic components. The heat pipe 30 is generally u-shaped and includes an L-shaped evaporation section 32 and a linear condensation section 34. The inside of the heat pipe 3 has a vacuum-tight chamber in which a working fluid (not shown) is provided. The heat pipe 30 is flat and includes a top surface 31 and a bottom surface 33 parallel to the top surface 31. The centrifugal fan 10 includes a top cover 11, a bottom cover, a volute side wall 13 connecting the top cover 11 and the bottom cover 12, and an impeller 4. The top cover 11, the bottom cover 12 and the side wall 13 are enclosed to form an accommodating space. The impeller 14 is received in the accommodating space. A first air inlet 110 is disposed in the center of the top cover 11. A support portion U1 is disposed at a center of the first air inlet 110. The stator 112 is disposed on the support portion 201107694 111. The impeller 14 is suspended from the support portion 111 of the top cover 11, and the impeller 14 is spaced apart from the bottom cover 12. A second air inlet 120 is defined in the center of the bottom cover 12. The side wall 13 is provided with a linear air outlet 130. The bottom cover 12 is a sheet metal member or a die-cast metal member, and the side wall 13 can be integrally formed with the bottom cover 12. The bottom cover 12 has an upper surface 121 _ facing the top cover 11 and a lower surface 122 opposite to the upper surface 121. The upper surface 121 of the bottom cover 12 is recessed downwardly at the periphery of the second air inlet 130 to form a receiving portion 125 for receiving the heat pipe 30 therein. The receiving portion 125 includes an elongated receiving groove 123 and a linear recess 124. The receiving groove 123 is substantially L-shaped and extends from the side farther from the air outlet 130 around the second air inlet 120 to the air outlet 130. The receiving groove 123 is for accommodating the evaporation section 32 of the heat pipe 30. The recessed recess of the receiving groove 123 is small in thickness of the bottom cover 12. The recess 124 is formed at the edge of the bottom cover 12 from the air outlet 130. The recess 124 extends in the direction of the air outlet 130 and extends from one side of the air outlet 130 to the other side. The recess 124 communicates with the end of the housing groove 123 near the air outlet 130. The recess 124 is used to place the condensation section 34 of the heat pipe 30. The width of the recess 124 in a direction perpendicular to the extending direction thereof is smaller than the width of the condensation section 34 of the heat pipe 30. Therefore, when the condensation section 34 of the heat pipe 30 is placed on the recess 124, the inner side of the condensation section 34 abuts against the On the recess 124, the outside of the condensation section 34 protrudes outside the 201107694 recess 124. The lower surface 122 of the bottom cover 12 is recessed upwardly on the extending path of the receiving groove 123 to form two recesses 126. The two recesses 126 are respectively shaped and sized to correspond to the two heat absorbing panels 20 for respectively accommodating the two heat absorbing panels 20. The receiving groove 123 and the recess 126 are respectively located on the upper surface 121 and the lower surface 122 of the bottom cover 12. The receiving groove 123 communicates with the groove 126, so that the two through holes 127 penetrating the bottom cover 12 are formed in the receiving groove 123 corresponding to the two grooves 126. Therefore, the evaporation section 32 of the heat pipe 30 is received in the receiving groove 123 and can be in direct contact with the heat absorbing plate 20 accommodated in the two recesses 126. In a specific implementation, the receiving groove 123 can also be recessed upward from the lower surface 122 of the bottom cover 12, so that the evaporation section 32 of the heat pipe 30 is received in the receiving groove 123, and the bottom surface 33 of the evaporation section 32 can directly contact the heating element. Thus, the heat absorbing plate 20 can be omitted. The heat dissipation fin group 40 is disposed at the air outlet 130 of the centrifugal fan 10. The heat dissipation fin group 40 is formed by stacking a plurality of heat dissipation fins 41 having the same shape and structure. Each of the heat dissipation fins 41 includes a body 42 and upper and lower flanges 43 and 44 extending perpendicularly from upper and lower sides of the body 42 respectively. A central portion of each body 42 is formed on the side facing the centrifugal fan 40, and an "U" shaped notch is formed. The main body 42 extends vertically on the upper and lower sides of the notch to form an upper contact plate 46 and a lower portion. The contact plate 47 has the same extension direction of the two contact plates 201107694 46, 47 and the flanges 43, 44. The width of the portion of the body 42 above the indentation is greater than the width of the portion below the indentation. All of the heat radiating fins 41 are linearly arranged in a direction parallel to the air outlet 130 of the centrifugal fan 1〇. The flanges 43 and 44 of each of the heat dissipating fins 41 are abutted against the upper and lower sides of the body (4) of the preceding fins 41 such that the bodies 42 of the adjacent fins 41 are spaced apart from each other. The notches on all of the diffusion fins 41 correspond to each other to form a long groove 45 extending through the entire heat dissipation fin group 40 in the middle of the heat dissipation fin group 40. The upper contact plates 所有 of all the heat radiating sheets 41 are coplanar to form an upper contact surface at the top of the long groove 45, and the lower contact plates 47 of all the heat radiating fins 41 are coplanar to form a lower contact surface at the bottom of the long groove. When the upper contact surface and the lower contact surface are in contact with the condensation section 34 of the heat pipe 3〇, it is advantageous to increase the contact area between the heat dissipation fin 41 and the heat pipe _ 3G. The shape and size of the long groove 45 are equal to the shape and size of the outer side of the concave portion m of the condensation portion 34. When the heat dissipation fin group 40 is installed at the air outlet of the centrifugal fan 1 'the long groove The lower contact surface of the bottom portion of the 45 is substantially flush with the bottom surface of the recess 124 of the bottom cover 12, and the long groove 牦 and the recess Μ # are interconnected to form a receiving space for receiving the condensation portion 34. Referring to FIG. 3 and FIG. 4 simultaneously, the heat dissipation module is disposed in the bottom cover 12 of the centrifugal fan 10 in the time of 201107694 and 2525. The evaporation section 32 of the heat pipe 3G is accommodated in the groove 123, and the condensation section 34 of the heat pipe 3G is disposed on the notch 124. The two heat absorbing plates 2 are respectively received in the two recesses 126 π at the bottom of the bottom cover 12. At the same time, the evaporation section 32 of the heat pipe is directly connected to the two heat absorbing plates 2 at the two grooves 126 and connected to the two heat absorbing plates 20 by welding. The top surface 31 of the heat g 30 is spaced from the impeller 14 to ensure that the impeller 14 does not interfere with the heat pipe 30 when rotated. The heat dissipating fin set 4 is disposed at the air outlet 130 of the centrifugal fan 1 , and a portion of the heat dissipating block 40 on the lower side of the long groove 45 abuts against an outer side of the concave σ 124 of the bottom i 12 . The portion of the heat radiating fin group 4 on the upper side of the long groove 45 further extends toward the inner side of the air outlet 13〇. Therefore, the condensation section 34 of the heat pipe 30 is embedded in the long groove 45 of the heat dissipation fin group 4, and at the same time, the entire top surface 31 of the condensation section 34 is in contact with the upper contact surface of the long groove 45, and the condensation section The outer side of % of the bottom surface is in contact with the lower contact surface of the long groove 45. When the heat dissipation module 100 is in operation, the heat absorbing plate 20 is in contact with the heat generating electronic component to absorb heat, and the heat is quickly transmitted to the evaporation & 32 of the heat pipe 30. After the evaporation section 32 of the heat pipe 30 absorbs heat, the phase of the liquid working therein is passed. The change rapidly transfers heat to the condensing section 34, and the condensing section 34 of the heat pipe 30 transfers heat to the heat sink fin set 4, and the heat sink fin set 40 uses its larger outer surface to dissipate heat to its surroundings' centrifugal fan 10 The operation of the impeller 14 produces a forced air flow to carry away the high temperature airflow within the heat sink fins 41. When the heat dissipation module 1 is installed in an electronic device such as a notebook computer, the casing of the electronic device is usually provided with a venting port for the heat dissipation fin set 40' so as to be from the centrifugal fan 1 The high-temperature airflow formed by the air outlet 13 of the crucible and heated by the fin assembly 40 can be directly discharged to the outside of the system. The evaporation section 32 of the heat pipe 30 of the heat dissipation module 100 is entirely housed inside the centrifugal fan 10. The evaporation section 32 of the heat pipe 3 and the heat-generating electronic components are located in the area covered by the centrifugal fan 10, and heat generated by the heat-generating electronic components exists. In the area covered by the centrifugal fan. Most of the heat generated by the heat-generating electronic component is rapidly conducted by the heat pipe 30 to the heat-dissipating die set 4〇, and at the same time, a small amount of heat is transferred to the bottom cover 12 of the centrifugal fan 10, and this small amount of heat can be quickly forced by the impeller 14. The airflow is taken away, thus avoiding the loss of heat into the system and causing the internal temperature of the system to rise, effectively improving the utilization efficiency of the air volume generated by the centrifugal fan. In addition, the heat dissipation module 100 integrates the centrifugal fan 1〇, the heat pipe 3〇 and the heat absorption plate 20 into one body, has a small volume, and occupies less system space; and the heat dissipation module 100 is mounted on the circuit board where the heat generating electronic component is located. In the upper case, only need to fix the centrifugal fan 1〇 to complete the installation and positioning of the heat dissipation module 100, simplify the installation process, and facilitate the assembly. The invention complies with the requirements of the invention patent, and patents are filed according to law. However, the above is only the embodiment of the present invention, and those skilled in the art who are familiar with the art of the present invention, equivalent modifications or variations made in accordance with the spirit of the present invention 201107694 shall be included in the following claims. . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a preferred embodiment of a heat dissipation module of the present invention;
圖2為圖1所示散熱模組的另一視角的立體分 解圖。 圖3為圖1所示散熱模組的部分組合圖。 圖4為圖1所示散熱模組的立體組合圖。 【主要元件符號說明】 離心風扇 10 散熱模組 100 頂蓋 11 第一進風口 110 支撐部 111 定子 112 底蓋 12 第二進風口 120 上表面 121 下表面 122 收容槽 123 凹台 124 收容部 125 凹槽 126 通孔 127 側壁 13 出風口 130 葉輪 14 吸熱板 20 熱管 30 頂面 31 蒸發段 32 底面 33 冷凝段 34 散熱鰭片組 40 散熱鰭片 41 本體 42 上折邊 43 下折邊 44 長槽 45 π 201107694 47 上接觸板 46 下接觸板2 is a perspective exploded view of another perspective view of the heat dissipation module of FIG. 1. 3 is a partial assembled view of the heat dissipation module shown in FIG. 1. 4 is a perspective assembled view of the heat dissipation module shown in FIG. 1. [Main component symbol description] Centrifugal fan 10 Heat dissipation module 100 Top cover 11 First air inlet 110 Support part 111 Stator 112 Bottom cover 12 Second air inlet 120 Upper surface 121 Lower surface 122 Storage groove 123 Recessed table 124 Housing 125 Concave Slot 126 Through hole 127 Side wall 13 Air outlet 130 Impeller 14 Heat absorbing plate 20 Heat pipe 30 Top surface 31 Evaporation section 32 Bottom surface 33 Condensation section 34 Heat sink fin set 40 Heat sink fin 41 Main body 42 Upper flange 43 Lower flange 44 Long groove 45 π 201107694 47 upper contact plate 46 lower contact plate
1212