TW201227244A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TW201227244A
TW201227244A TW099146014A TW99146014A TW201227244A TW 201227244 A TW201227244 A TW 201227244A TW 099146014 A TW099146014 A TW 099146014A TW 99146014 A TW99146014 A TW 99146014A TW 201227244 A TW201227244 A TW 201227244A
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TW
Taiwan
Prior art keywords
heat sink
heat
fan
fins
heat dissipating
Prior art date
Application number
TW099146014A
Other languages
Chinese (zh)
Inventor
zhi-bin Guan
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099146014A priority Critical patent/TW201227244A/en
Priority to US12/981,438 priority patent/US20120160462A1/en
Publication of TW201227244A publication Critical patent/TW201227244A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device adapted for dissipating heat generated by electronic components, includes a heat sink attached on the electronic components, a fan disposed on the heat sink, and a cover board covering the heat sink and the fan. The cover board defines a plurality of through holes located upon the fan, acting as air-intakes for the fan.

Description

201227244 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置’特別涉及一種包含有風扇之 散熱裝置。 【先前技#ϊ】 [0002] 隨著電子產業之蓬勃迅速發展，電子元件之應用越來越 廣泛。安裝於電路板上之電子元件如中央處理器在運行 時會產生大量熱量，熱量如不能及時地散發出去，將導 致電子元件内部溫度越來越高，嚴重影響電子元件運行 之穩定性。如今散熱問題已成為影響電腦運行性能之一 個重要因素，也成為高速處理器實際應用之瓶頸。是故 ’通常在電子元件之表面設置有散熱裝置’以降低電子 元件之工作溫度。 [0003]傳統之散熱裝置包括與電子元件貼設之基板及與基板連 接之鰭片組。有時，為提高散熱裝置今散熱效率，散熱 裝置還加設有風扇以提供流向鰭片組之強制氣流。然， Q 風扇工作時會產生氣動噪音，給使用者帶來困擾。 【發明内容】 剛-種散熱裝置，用於對展設於電路板上之電子元件進行 散熱’包括與電子元件相貼設之散熱器、設置於散熱器 上之風扇及蓋置於散熱器與風扇上之蓋板，該蓋板上開 設有複數通氣孔’該等通氣孔位於該風扇之上方，以作 為該風扇工作時之進氣口。 剛雜熱裝置中該蓋板蓋置於散熱器及風扇上，該蓋板上 開,又有複數通氣孔作為離心風扇之進氣口，該等通氣孔 099146014 表單編號Α0101 第3百/妓 其共 10 頁 0992079156-0 201227244 位於該風扇之上方，該散熱裝置利用氣流通過多個通氣 孔時會產生寬頻噪音，可以有效地降低風扇工作時產生 之氣動噪音，進而降低該散熱裝置工作時產生之整體噪 音。 【實施方式】 [0006] 請參閱圖1，本發明之散熱裝置用於對安裝於電路板（圖 未示）上之電子元件（圖未示）進行散熱，其包括散熱 器10、設置於該散熱器10上之離心風扇20用以向該散熱 器10提供強制氣流、及蓋置於散熱器10及離心風扇20上 之蓋板30。 [0007] 請同時參閱圖2，上述散熱器10由導熱性能良好之金屬如 銅、鋁等一體製成，其底面與電子元件之頂面相對應貼 合。該散熱器10包括基板12及形成於基板12上之複數散 熱鰭片14。該等散熱鰭片14相互間隔設置，每相鄰二散 熱鰭片14之間形成一氣流通道（未標示）。該散熱鰭片 14分佈於該基板12上靠近周緣處，該等散熱鰭片14於該 基板12上圍設出一容置部16，以供該離心風扇20容置其 内。該等散熱鰭片14相對於該容置部16呈放射狀排列。 [0008] 上述離心風扇20包括豎直設置於該散熱器10之基板12上 之軸承22、套置於軸承22上之磁極24、安裝環26及葉輪 28。該葉輪28收容於散熱器10之容置部16内並與散熱器 10之散熱鰭片14之氣流通道相正對，以使該葉輪28產生 之強制氣流直接穿過散熱鰭片14。 [0009] 上述蓋板30為一平板體，由導熱性能良好之金屬如銅、 鋁等製成。該蓋板30在週邊尺寸上與該散熱器10對應一 099146014 表單編號A0101 第4頁/共10頁 0992079156-0 201227244 ❹ [0010] Q [0011] 致。該蓋板30之底面與散熱器1G之散熱⑻14之頂面相 貼合，從而將離心風扇2〇封置於散熱器10之容置部16内 。在使用中，該蓋板3〇可以通過焊接、卡扣或者直接用 ，熱膠黏接料絲合於散熱器10之14上。該 板30之中央開叹有貝通孔’該貫通孔犯對應位於離 ^風扇20之葉輪28之正上方。該蓋板3〇上還開設有複數 通氣孔34。該等通氣孔34相互均勻、間隔設置，對應位 於葉輪28之上方，作為離心風扇2〇工作時之進氣口。該 等通氣孔34相對於蓋板3〇之貫通孔32呈放射狀排列。可 以理解地，該通氣孔34之孔徑、形狀、數目可以根據散 熱裝置之實際使用情況及使用效果做出合理調整。 本發明之散熱裝置工作時，該離心風扇20收容於該散熱 器10之散熱鰭片14所圍置之容置部16内，該蓋板蓋置 於散熱鰭片14及離心風扇20上，該蓋板3〇上開設有複數 通氣孔3 4作為離心風扇2 0之進氣口，利用氣流通過多個 通氣孔34時會產生寬頻噪音，可以有效地降低離心風扇 20工作時產生之氣動嗦音，進而降低該散熱裝置工作時 產生之整體噪音。 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1是本發明一實施例之散熱裝置之立體組合圖。 099146014 表單編號A0101 第5頁/共10頁 0992079156-0 [0012] 201227244 [0013] 圖2是圖1中之散熱裝置之立體分解圖。 【主要元件符號說明】 [0014] 散熱器：10 [0015] 基板：12 [0016] 散熱鰭片：14 [0017] 容置部：16 [0018] 離心風扇：2 0 [0019] 轴承：22 [0020] 磁極：24 [0021] 安裝環：26 [0022] 葉輪：28 [0023] 蓋板：30 [0024] 貫通孔：32 [0025] 通氣孔：34 099146014 表單編號A0101 第6頁/共10頁 0992079156-0201227244 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipating device', and more particularly to a heat dissipating device including a fan. [Previous technology #ϊ] [0002] With the rapid development of the electronics industry, the application of electronic components is becoming more and more extensive. The electronic components mounted on the circuit board, such as the central processing unit, generate a large amount of heat during operation. If the heat cannot be dissipated in time, the internal temperature of the electronic components will become higher and higher, which seriously affects the stability of the operation of the electronic components. Nowadays, the heat dissipation problem has become an important factor affecting the running performance of computers, and it has become a bottleneck for the practical application of high-speed processors. Therefore, a heat dissipating device is usually provided on the surface of the electronic component to lower the operating temperature of the electronic component. A conventional heat sink includes a substrate attached to an electronic component and a fin set connected to the substrate. Sometimes, in order to improve the heat dissipation efficiency of the heat sink, the heat sink is further provided with a fan to provide a forced air flow to the fin group. However, the Q fan generates aerodynamic noise when it is working, which causes problems for the user. SUMMARY OF THE INVENTION A rigid heat sink for dissipating heat from electronic components mounted on a circuit board includes a heat sink attached to the electronic component, a fan disposed on the heat sink, and a cover disposed on the heat sink a cover plate on the fan, the cover plate is provided with a plurality of vent holes, and the vent holes are located above the fan to serve as an air inlet for the fan to operate. In the fresh heat device, the cover is placed on the radiator and the fan, and the cover is opened, and a plurality of vent holes are used as the air inlet of the centrifugal fan, and the vent holes 099146014 form number Α0101 300/妓A total of 10 pages 0992079156-0 201227244 Located above the fan, the heat sink uses the airflow through a plurality of vents to generate broadband noise, which can effectively reduce the aerodynamic noise generated when the fan works, thereby reducing the heat generated by the heat sink. Overall noise. [0006] Referring to FIG. 1 , a heat dissipating device of the present invention is used for dissipating heat from an electronic component (not shown) mounted on a circuit board (not shown), and includes a heat sink 10 disposed on the device. The centrifugal fan 20 on the radiator 10 is used to supply a forced air flow to the radiator 10 and a cover plate 30 that is placed on the radiator 10 and the centrifugal fan 20. Referring to FIG. 2 at the same time, the heat sink 10 is made of a metal having good thermal conductivity such as copper or aluminum, and its bottom surface is matched with the top surface of the electronic component. The heat sink 10 includes a substrate 12 and a plurality of heat radiating fins 14 formed on the substrate 12. The heat dissipation fins 14 are spaced apart from each other, and an air flow passage (not shown) is formed between each adjacent two heat dissipation fins 14. The heat dissipating fins 14 are disposed on the substrate 12 near the periphery. The heat dissipating fins 14 define a receiving portion 16 on the substrate 12 for the centrifugal fan 20 to be accommodated therein. The heat dissipation fins 14 are radially arranged with respect to the accommodating portion 16 . The centrifugal fan 20 includes a bearing 22 vertically disposed on the substrate 12 of the heat sink 10, a magnetic pole 24 sleeved on the bearing 22, a mounting ring 26, and an impeller 28. The impeller 28 is received in the receiving portion 16 of the heat sink 10 and faces the air flow passage of the heat sink fin 14 of the heat sink 10 such that the forced air flow generated by the impeller 28 passes directly through the heat radiating fins 14. [0009] The cover plate 30 is a flat plate made of a metal having good thermal conductivity such as copper, aluminum or the like. The cover plate 30 corresponds to the heat sink 10 in a peripheral dimension. 099146014 Form No. A0101 Page 4 / Total 10 Pages 0992079156-0 201227244 ❹ [0010] Q [0011] The bottom surface of the cover plate 30 is fitted to the top surface of the heat sink (8) 14 of the heat sink 1G, so that the centrifugal fan 2 is sealed in the receiving portion 16 of the heat sink 10. In use, the cover 3 can be welded, snapped or used directly, and the thermal adhesive is bonded to the heat sink 10-14. The center of the plate 30 is sighed with a beton hole. The through hole is located directly above the impeller 28 of the fan 20. A plurality of vent holes 34 are also formed in the cover plate 3. The vent holes 34 are evenly and spaced apart from each other, corresponding to the upper portion of the impeller 28, and serve as an intake port for the centrifugal fan 2 〇 during operation. The vent holes 34 are radially arranged with respect to the through holes 32 of the cover plate 3. It can be understood that the aperture, shape and number of the vent holes 34 can be reasonably adjusted according to the actual use of the heat sink and the effect of use. When the heat dissipating device of the present invention is in operation, the centrifugal fan 20 is received in the accommodating portion 16 surrounded by the heat dissipating fins 14 of the heat sink 10, and the cover is placed on the heat dissipating fins 14 and the centrifugal fan 20, A plurality of vent holes 34 are formed in the cover plate 3 as air inlets of the centrifugal fan 20, and wide-frequency noise is generated when the airflow passes through the plurality of vent holes 34, which can effectively reduce the pneumatic noise generated when the centrifugal fan 20 is working. , thereby reducing the overall noise generated when the heat sink is in operation. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat sink according to an embodiment of the present invention. 099146014 Form No. A0101 Page 5 of 10 0992079156-0 [0012] FIG. 2 is an exploded perspective view of the heat sink of FIG. 1. [Main component symbol description] [0014] Heat sink: 10 [0015] Substrate: 12 [0016] Heat sink fin: 14 [0017] Holder: 16 [0018] Centrifugal fan: 2 0 [0019] Bearing: 22 [ 0020] Magnetic pole: 24 [0021] Mounting ring: 26 [0022] Impeller: 28 [0023] Cover: 30 [0024] Through hole: 32 [0025] Vent: 34 099146014 Form number A0101 Page 6 of 10 0992079156-0

Claims (1)

201227244 七、申請專利範圍： 1 . 一種散熱裝置，用於對裝設於電路板上之電子元件進行散 熱，包括與電子元件相貼設之散熱器、設置於散熱器上之 風扇及蓋置於散熱器與風扇上之蓋板，其改良在於：該蓋 板上開設有複數通氣孔，通氣孔位於該風扇之上方，以作 為該風扇工作時之進氣口。 2 .如申請專利範圍第1項所述之散熱裝置，其中該散熱器包 括基板及形成於基板上之複數散熱鰭片。 3. 如申請專利範圍第2項所述之散熱裝置，其中散熱鰭片分 〇 ^ 佈於該基板上靠近周緣處，散熱鰭片於基板上圍設出一容 置部，以供該風扇容置其内。 4. 如申請專利範圍第3項所述之散熱裝置，其中散熱鰭片相 對於容置部呈放射狀排列。 5 .如申請專利範圍第2項所述之散熱裝置，其中散熱鰭片相 互間隔設置，每相鄰二散熱鰭片之間形成一氣流通道。 6.如申請專利範圍第5項所述之散熱裝置，其中該風扇為離 心風扇，包括豎直設置於基板上之軸承、套置於軸承上之 〇 磁極及葉輪，該葉輪與散熱鰭片之氣流通道相正對，以使 葉輪產生之強制氣流直接穿過散熱鰭片之氣流通道。 7 .如申請專利範圍第1項所述之散熱裝置，其中通氣孔相互 均勻、間隔設置。 8 .如申請專利範圍第1項所述之散熱裝置，其中通氣孔相對 於蓋板之中央呈放射狀排列。 9.如申請專利範圍第1項所述之散熱裝置，其中該蓋板之中 央還開設有貫通孔，該貫通孔對應位於風扇之正上方。 099146014 表單編號A0101 第7頁/共10頁 0992079156-0 201227244 ίο . 如申請專利範圍第1項所述之散熱裝置，其中該蓋板通過 焊接、卡扣或者直接用散熱膠黏接之方式結合於散熱器上 099146014 表單編號A0101 第8頁/共10頁 0992079156-0201227244 VII. Patent application scope: 1. A heat dissipating device for dissipating heat from electronic components mounted on a circuit board, including a heat sink attached to the electronic component, a fan and a cover disposed on the heat sink The cover plate on the heat sink and the fan is improved in that the cover plate is provided with a plurality of vent holes, and the vent holes are located above the fan to serve as an air inlet for the fan to operate. 2. The heat sink of claim 1, wherein the heat sink comprises a substrate and a plurality of heat sink fins formed on the substrate. 3. The heat dissipating device of claim 2, wherein the heat dissipating fins are disposed on the substrate near the periphery, and the heat dissipating fins surround the substrate with a receiving portion for the fan capacity Set it inside. 4. The heat sink of claim 3, wherein the heat sink fins are radially arranged relative to the receiving portion. 5. The heat dissipating device of claim 2, wherein the heat dissipating fins are spaced apart from each other, and an air flow passage is formed between each adjacent two fins. 6. The heat dissipating device according to claim 5, wherein the fan is a centrifugal fan, comprising a bearing vertically disposed on the substrate, a neodymium magnetic pole and an impeller disposed on the bearing, the impeller and the heat dissipating fin The airflow channels are opposite each other such that the forced airflow generated by the impeller passes directly through the airflow passages of the fins. 7. The heat sink according to claim 1, wherein the vent holes are evenly and spaced apart from each other. 8. The heat sink according to claim 1, wherein the vent holes are radially arranged with respect to the center of the cover. 9. The heat dissipating device of claim 1, wherein the center of the cover is further provided with a through hole corresponding to the fan directly above. Forms No. A0101, page 7 of 10, 0992079156-0, 201227244 ίο. The heat sink of claim 1, wherein the cover is bonded by welding, snapping or directly by means of heat-dissipating glue. Radiator on 099146014 Form No. A0101 Page 8 / Total 10 Page 0992079156-0
TW099146014A 2010-12-27 2010-12-27 Heat dissipation device TW201227244A (en)

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US12/981,438 US20120160462A1 (en) 2010-12-27 2010-12-29 Heat dissipation device

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CN1848035A (en) * 2005-04-14 2006-10-18 富准精密工业(深圳)有限公司 Locking module
CN101338766B (en) * 2007-07-04 2011-11-30 富准精密工业(深圳)有限公司 Centrifugal fan and heat sink module adopting same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107816455A (en) * 2016-09-14 2018-03-20 宏碁股份有限公司 Blower module and the electronic installation using this blower module
CN107816455B (en) * 2016-09-14 2020-01-21 宏碁股份有限公司 Fan module and electronic device using same
CN112833698A (en) * 2019-11-25 2021-05-25 大众汽车股份公司 Cooling assembly for electronic components of a motor vehicle

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