200908859 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤指一種應用於電子元件 散熱之散熱裝置。 【先前技術】 隨著中央處理器（CPU)等電子元件功率之不斷提高， 散熱問題越來越受到人們之重視，在電腦中更是如此。為 在有限之空間裏高效地帶走系統產生之熱量，目前業界主 要採用由散熱鰭片、熱管及散熱風扇組合之方式進行散 熱。散熱風扇主要係產生氣流，熱管主要係遠距離之傳遞 熱量，散熱鰭片之任務則為將熱管帶來之熱量通過散熱風 扇驅動所產生之氣流傳遞到外界環境中去。由此可見，在 一定之體積空間内，能否及時疏導電子元件所產生之熱量 將取決於是否有高效之散熱鰭片。 傳統之散熱鰭片都為互相平行設置，各散熱鰭片間之 流道間距相等，由於流道與散熱風扇之出風方向平行，氣 流在流道内之流動比較規則，不易產生紊流，氣流不能與 散熱鰭片充分接觸並帶走熱量，因此兩者之間之熱交換效 率較低，進而影響到散熱裝置之散熱效率。 【發明内容】 有鑒於此，有必要提供一種具有較高散熱效率之散熱 裝置。 一種散熱裝置，包括一集熱塊、一熱管以及複數散熱 鰭片，所述熱管包括一蒸發段及一冷凝段，所述蒸發段與 7 200908859 所述集熱塊連接，相鄰散熱鰭片間形成供氣流通過之流 道，所述流道之一端為入風口，另一端為出風口，所述流 道之至少其中一段之寬度由入風口向出風口方向逐漸縮 小，所述熱管之冷凝段對應連接至散熱鰭片於流道之寬度 最小之位置處。 與現有技術相比，上述散熱裝置通過使流道之寬度發 生變化來達到使氣流能與每一散熱鰭片充分接觸，提高氣 流與散熱鰭片間之熱交換效率，且相鄰散熱鰭片間之流道 之寬度逐漸變小能提高氣流之行進速度，同時又由於熱管 將吸收之熱量集中傳遞至該流道寬度最小之位置處，即將 熱量傳遞至散熱鰭片中熱交換效率最高之位置處，並配合 該位置處較高之氣流流速，使氣流能迅速帶走熱量，提高 散熱裝置之散熱效率。 【實施方式】 下面參照附圖，結合實施例作進一步說明。 圖1和圖2分別為該散熱裝置第一實施例之組合與分 解示意圖。該散熱裝置包括一底座10、一集熱塊20、一熱 管30、一散熱器40及一散熱風扇50。 底座10大致為長條形狀，其右端之寬度略有變化，即 先逐漸減小，而後再逐漸增大至與左端之寬度相等，底座 10之中央開設有一長條形開槽12。 集熱塊20為方塊狀，由銅等高導熱性材料製成，集熱 塊20頂面貼覆一發熱電子元件22，如CPU等。 熱管30為扁平長條狀，其大小與底座10之開槽12之 8 200908859 大小大致一樣。熱管30包括分別形成於其兩端之蒸發段 301、冷凝段302以及設于蒸發段301、冷凝段302之間之 絕熱段303。 請同時參考圖3，散熱器40包括一外殼400以及設於 外殼400内之散熱鰭片組。該實施例中，外殼400與散熱 鰭片組為一體成型，顯然，也可分別形成外殼400與散熱 鰭片組，然後通過鎖固或者焊接等方式將二者組合為一 體。外殼400呈盒狀’其左右兩側開口，上下以及前後側 面均呈封閉狀，其中外殼400之上下侧面為平面’而其前 後兩側面均形成内凹之弧面’從而外殼400整體形成一個 左右兩端較大’而從左右兩端向中間部分呈漸縮狀之類似 “X”之形狀，即外殼400之寬度從左向右先逐漸減小’至 中央位置寬度最小，而後由中央位置向右再逐漸增大。散 熱鰭片組包括一平面片狀之第一散熱鰭片401及複數弧面 狀第二散熱鰭片402。各散熱鰭片均延伸設置於外殼400 之左右兩開口之間，任意相鄰兩散熱鰭片間均形成供氣流 通過之流道405,所述流道405與外殼400之左右開口相連 通。其中第一散熱鰭片401置於外殼400之中間位置，第 二散熱鰭片402對稱置於第一散熱鰭片401之兩側。而置 於第一散熱鰭片401每一側之各第二散熱鰭片402之曲率 均不相同，自第一散熱鰭片401向外侧呈逐漸增加’從而 流道405之寬度沿散熱器40之左右方向中央最小，而由散 熱器40中央向左右兩侧均呈逐漸增加。 組裝時，熱管3〇置於底座10之開槽12内’將集熱塊 9 200908859 20置於底座10之左端並使熱管30之蒸發段301與集熱塊 20之底面熱連接。散熱器40置於底座1〇之右端，並使散 熱器40之中間部分與熱管30之冷凝段302熱連接。散熱 器40與熱管30呈平行設置，即散熱器40内之流道405之 延伸方向與熱管30平行。散熱風扇50置於底座1〇之中間 部分也即對應熱管30之絕熱段303位置，從而散熱器40 之外殼400之左側開口形成一入風口 406，而散熱器40之 外殼400之右側開口形成一出風口 407，以供散熱風扇50 提供之強制氣流從入風口 406處進入散熱器40内，在流經 散熱器40之流道405之後從出風口 407流出。 該散熱裝置工作時，集熱塊20吸收發熱電子元件22 散發出之熱量後，經熱管30將熱量傳遞至散熱器40進行 散熱，同時散熱風扇50提供強制氣流吹拂散熱器40達到 加強散熱之效果。由於第二散熱鰭片402呈弧面狀設置， 部分氣流能直接衝擊第二散熱鰭片402,與現有之呈直片狀 平行設置之散熱鰭片相比’氣流進入流道405後可更充分 地接觸每一散熱鰭片’從而可提高氣流與各散熱·續片間之 熱交換效率，更有效地將熱量散發至外界環境中。另外， 由於流道405之寬度逐漸變化’因而氣流之速度在散熱器 40内會不斷地變化，更容易形成紊流，而破壞氣流於各散 熱鰭片之表面處所形成之邊界層’更有利於散熱錯片與氣 流之間之熱交換，氣流能帶走更多之熱量。此外散熱器40 内之流道405之寬度從入風口 406向中間段408逐漸縮小’ 因而氣流進入入風口 406後會加速行進，並至流道405之 10 200908859 中間段408部分時速度達到最大，同時，熱管30之冷凝段 302又沿散熱器40之中間部分安裝並延伸至流道405寬度 最小之中間段408，熱管30吸收之熱量將可以集中傳遞至 該中間段408,並配合于該中間段408處產生之較高氣流流 速，使氣流能迅速帶走熱量，而流道405之後段之寬度逐 漸增大，便於進行熱交換後之氣流流出，提高散熱裝置之 散熱效率。 如圖4所示為該散熱裝置之第二實施例之組合示意 圖。該散熱裝置包括一底座10a、一集熱塊20a、一熱管30a 及一散熱器40a。其中各個元件之結構形狀與第一實施例中 之相應元件皆相同’因此不再贅述。其與第一實施例之不 同之處在於散熱器40a與其他元件之位置關係不同。同樣 散熱器40a置於底座l〇a之右端，但散熱器40a與熱管30a 呈垂直設置。散熱器40a内之流道405a之延伸方向與熱管 30a垂直，從而使熱管30a之冷凝段對應設置於散熱器4〇a 之中間漸縮部分’也即對應散熱器40a内之流道405a寬度 最小之中間段408a。此時散熱風扇（圖未示）置於入風口 406a處並提供強制氣流吹拂散熱器4〇a，強制氣流從出風 口 407a流出。流道405a之中間段408a寬度最小，氣流流 經流道405a之中間段408a時流速最大，因而散熱器4〇a 於該中間漸縮部分之熱交換效率最高，該實施例中將熱管 30a之冷凝段與散熱器4〇a之該漸縮部分垂直熱連接，有利 於將熱管30a傳遞來之熱量更快更集中地傳遞到散熱器4〇a 上並散發到外界環境中，從而提高散熱裝置之散熱效率。 11 200908859 如圖5所示為該散熱裝置之第三實施例之組合示意 圖。該散熱裝置包括一底座l〇b、〆集熱塊2〇b、一熱管（未 示出）、一散熱器40b及一散熱風扇50b。該實施例中除散 熱器40b與底座l〇b之結構有所改變之外，其他各個元件 之結構形狀及各元件之間之連接組裝關係與第一實施例中 之相應元件皆相同。請同時參考圖6’散熱器40b包括一外 殼400b以及設於外殼400b内之散熱鰭片組。該外殼400b 自左向右呈漸縮狀，即於左側入風口 406b處寬度最大，而 於右侧出風口 407b處寬度最小。同樣’散熱鰭片組設置於 外殼400b内，散熱鰭片組各散熱鰭片401b、402b之間形 成流道405b，流道405b之寬度自左向右逐漸減小。底座 10b之右端之寬度對應散熱器40b之外殼400b之寬度也逐 漸縮小。該實施例中之散熱鰭片組與第一實施例中之散熱 鰭片組相比，僅形成前半部分之漸縮段，而省卻後半部分 之漸擴段，在儘量滿足散熱面積之前提下，能減小散熱器 40b之體積，更適應於曰益小型化之電子裝置，同時還可減 少製造材料’能節省製造成本。且各散熱鰭片間之流道4 〇 5 b 之寬度從入風口 406b向出風口 407b逐漸縮小，使氣流流 經流道405b時一直處於加速之狀態，更有利於氣流與各散 熱鰭片之間之熱交換，提高散熱裝置之散熱效率。 如圖7所示為該散熱裝置之第四實施例之組合示意 圖。該散熱裝置包括一底座l〇c、—集熱塊2〇c、一熱管30c 及一散熱器40c。其中各個元件之結構形狀與第三實施例中 之相應組件皆相同，因此不再贅述。其與第三實施例之不 12 200908859 同之處在於散熱器40c與其他元件之位置關係不同。同樣 散熱益40c置於底座i〇c之右端，但散熱器撕與熱管他 呈垂直設置。散熱器40c内之流道咖之延伸方向與熱管 30c垂直，從而使熱管30c之冷凝段對應設置於散熱器4〇c 之右端漸縮部分’也即對應散熱器4〇c内之流道4〇5c寬度 最小之出風口 407c處。此時散熱風扇（圖未示）置於入風 口 406c處並提供強制氣流吹拂散熱器4〇c，強制氣流從出 風口 407c流出。流道405c之右端出風口 4〇7c處寬度最小， 氣流流經流道405c之出風口 407c處時流速最大，因而散 熱器40c於寬度最小之出風口 407c部分之熱交換效率最 高，該實施例中將熱管30c之冷凝段與散熱器4〇c之寬度 最小之出風口 407c部分熱連接’有利於將熱管3〇c傳遞來 之熱量更快地傳遞到散熱器40c上並散發到外界環境中。 上述各散熱裝置通過使流道之寬度發生變化來達到使 氣流能與每一散熱韓片充刀接觸，提南氣流與散熱鰭片間 之熱交換效率’且相鄰散熱鰭片間之流道之寬度逐漸變小 能提高氣流之行進速度，同時又由於熱管將吸收之熱量集 中傳遞至該流道寬度最小之位置處’即將熱量傳遞至散熱 鰭片中熱交換效率最高之位置處，並配合該位置處較高之 氣流流速，使氣流能迅速帶走熱量，提高散熱裝置之散熱 效率。 綜上所述，本發明符合發明專利之要件，爰伕法提出 專利申請。惟以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 13 200908859 或變化，皆應涵蓋於以下之申請專利範圍内。 ' 【圖式簡單說明】 - 圖1為本發明散熱裝置第一實施例之組合示意圖。 圖2為圖1之分解示意圖。 圖3為圖2中之散熱器之俯視圖。 圖4為本發明散熱裝置第二實施例之組合示意圖。 圖5為本發明散熱裝置第三實施例之組合示意圖。 圖6為圖5中之散熱器之俯視圖。 '圖7為本發明散熱裝置第四實施例之組合示意圖。 【主要元件符號說明】 底座 10、10a、10b、10c 開槽 12 集熱塊 20、20a、20b、20c 發熱電子元件 22 熱管 30 、 30a 、 30c 蒸發段 301 冷凝段 302 絕熱段 303 散熱器 40 、 40a 、 40b 、 40c 外殼 400、 400b 第一散熱鰭片 401、401b 第二散熱鰭片 402、402b 流道 405、405a、405b、405c 入風口 406 、 406a 、 406b 、 406c 出風口 407 、 407a 、 407b 、 407c 中間段 408 、 408a 散熱風扇 50 ' 50b 14200908859 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of electronic components. [Prior Art] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has been receiving more and more attention, especially in computers. In order to efficiently remove the heat generated by the system in a limited space, the industry currently uses a combination of heat sink fins, heat pipes and cooling fans to dissipate heat. The cooling fan mainly generates airflow. The heat pipe mainly transmits heat from a long distance. The task of the heat dissipation fins is to transfer the heat generated by the heat pipe to the external environment through the airflow generated by the heat dissipation fan drive. It can be seen that in a certain volume of space, whether the heat generated by the conductive sub-components in time will depend on whether there are efficient fins. The conventional heat sink fins are arranged parallel to each other, and the flow path spacing between the heat radiating fins is equal. Since the flow path is parallel to the air outlet direction of the heat radiating fan, the flow of the air flow in the flow channel is relatively regular, and turbulence is not easily generated, and the air flow cannot be It is in full contact with the heat sink fins and carries away heat, so the heat exchange efficiency between the two is low, which in turn affects the heat dissipation efficiency of the heat sink. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device having a high heat dissipation efficiency. A heat dissipating device includes a heat collecting block, a heat pipe and a plurality of heat dissipating fins, wherein the heat pipe comprises an evaporation section and a condensation section, and the evaporation section is connected with the heat collecting block of 7200908859, and between the adjacent heat radiating fins Forming a flow passage through which the airflow passes, one end of the flow passage is an air inlet, and the other end is an air outlet, and a width of at least one of the flow passages is gradually reduced from an air inlet to an air outlet, and the heat pipe is condensed. Correspondingly connected to the heat sink fin at the position where the width of the flow channel is the smallest. Compared with the prior art, the heat dissipating device can make the airflow can fully contact each heat dissipating fin by changing the width of the flow channel, thereby improving the heat exchange efficiency between the airflow and the heat dissipating fin, and between the adjacent heat dissipating fins. The decreasing width of the flow channel can increase the traveling speed of the airflow, and at the same time, the heat absorbed by the heat pipe is concentrated to the position where the width of the flow channel is the smallest, that is, the heat is transferred to the heat-dissipating fin at the position with the highest heat exchange efficiency. And with the higher airflow velocity at the location, the airflow can quickly remove heat and improve the heat dissipation efficiency of the heat sink. [Embodiment] Hereinafter, the embodiments will be further described with reference to the accompanying drawings. 1 and 2 are schematic diagrams showing the combination and decomposition of the first embodiment of the heat sink device. The heat dissipating device comprises a base 10, a heat collecting block 20, a heat pipe 30, a heat sink 40 and a heat dissipating fan 50. The base 10 has a substantially elongated shape, and the width of the right end thereof is slightly changed, that is, gradually decreased, and then gradually increased to be equal to the width of the left end, and an elongated slot 12 is formed in the center of the base 10. The heat collecting block 20 has a square shape and is made of a highly thermally conductive material such as copper. The top surface of the heat collecting block 20 is attached with a heat generating electronic component 22 such as a CPU. The heat pipe 30 has a flat strip shape which is approximately the same size as the slot 12 of the base 10 200908859. The heat pipe 30 includes an evaporation section 301 formed at both ends thereof, a condensation section 302, and an adiabatic section 303 provided between the evaporation section 301 and the condensation section 302. Referring to FIG. 3 at the same time, the heat sink 40 includes a housing 400 and a heat dissipation fin set disposed in the housing 400. In this embodiment, the outer casing 400 and the heat dissipating fin set are integrally formed. Obviously, the outer casing 400 and the heat dissipating fin set may be separately formed, and then the two may be combined into one body by locking or welding. The outer casing 400 is in the shape of a box, and the left and right sides thereof are open, and the upper and lower sides and the front and rear sides are closed. The upper side of the outer casing 400 is a flat surface, and the front and rear sides thereof are formed with a concave curved surface, so that the outer casing 400 integrally forms a left and right. The shape of the "X" which is larger at both ends and which is tapered from the left and right ends to the middle portion, that is, the width of the outer casing 400 is gradually decreased from left to right, and the width of the central position is the smallest, and then the central position is The right is gradually increasing. The heat dissipating fin set includes a planar fin-shaped first heat dissipating fin 401 and a plurality of arcuate second heat dissipating fins 402. Each of the heat dissipating fins is disposed between the left and right openings of the outer casing 400. A flow passage 405 is formed between any two adjacent fins for airflow, and the flow passage 405 is connected to the left and right openings of the outer casing 400. The first heat dissipation fins 401 are disposed in the middle of the outer casing 400, and the second heat dissipation fins 402 are symmetrically disposed on opposite sides of the first heat dissipation fins 401. The curvatures of the second heat dissipation fins 402 on each side of the first heat dissipation fins 401 are different, and gradually increase from the first heat dissipation fins 401 to the outer side, so that the width of the flow channel 405 is along the heat sink 40. The center in the left-right direction is the smallest, and the center of the radiator 40 gradually increases toward the left and right sides. When assembled, the heat pipe 3 is placed in the slot 12 of the base 10. The heat collecting block 9 200908859 20 is placed at the left end of the base 10 and the evaporation section 301 of the heat pipe 30 is thermally connected to the bottom surface of the heat collecting block 20. The heat sink 40 is placed at the right end of the base 1 and the intermediate portion of the heat sink 40 is thermally coupled to the condensation section 302 of the heat pipe 30. The heat sink 40 is disposed in parallel with the heat pipe 30, i.e., the flow path 405 in the heat sink 40 extends in a direction parallel to the heat pipe 30. The heat dissipating fan 50 is disposed at a middle portion of the base 1 , that is, corresponding to the heat insulating portion 303 of the heat pipe 30 , so that the left side opening of the outer casing 400 of the heat sink 40 forms an air inlet 406 , and the right side opening of the outer casing 400 of the heat sink 40 forms a The air outlet 407 is provided for the forced airflow provided by the cooling fan 50 to enter the radiator 40 from the air inlet 406, and flows out of the air outlet 407 after flowing through the flow passage 405 of the radiator 40. When the heat dissipating device is in operation, the heat collecting block 20 absorbs the heat radiated from the heat-generating electronic component 22, and then transfers heat to the heat sink 40 through the heat pipe 30 for heat dissipation, and the cooling fan 50 provides a forced airflow to blow the heat sink 40 to enhance the heat dissipation effect. . Since the second heat dissipation fins 402 are arranged in a curved shape, a part of the air flow can directly impact the second heat dissipation fins 402, and the airflow can be more fully integrated into the flow path 405 than the existing heat dissipation fins disposed in parallel with the straight sheets. The ground contact with each of the heat dissipating fins can improve the heat exchange efficiency between the airflow and each heat dissipation and sequel, and more effectively dissipate heat to the external environment. In addition, since the width of the flow path 405 gradually changes, the velocity of the airflow continuously changes in the heat sink 40, and turbulence is more likely to be formed, and the boundary layer formed by destroying the airflow at the surface of each heat radiating fin is more advantageous. The heat exchange between the heat sink and the airflow can bring more heat away. In addition, the width of the flow passage 405 in the radiator 40 gradually decreases from the air inlet 406 to the intermediate portion 408. Therefore, the airflow enters the air inlet 406 and accelerates, and reaches the maximum speed when the flow passage 405 is 10, 200908859, the middle portion 408. At the same time, the condensation section 302 of the heat pipe 30 is mounted along the middle portion of the heat sink 40 and extends to the intermediate section 408 having the smallest width of the flow passage 405. The heat absorbed by the heat pipe 30 can be concentratedly transmitted to the intermediate section 408 and fit in the middle. The higher airflow rate generated at the section 408 enables the airflow to quickly remove heat, and the width of the subsequent section of the runner 405 is gradually increased to facilitate the flow of the air after the heat exchange, thereby improving the heat dissipation efficiency of the heat sink. Fig. 4 is a schematic diagram showing the combination of the second embodiment of the heat sink. The heat dissipating device comprises a base 10a, a heat collecting block 20a, a heat pipe 30a and a heat sink 40a. The structural shapes of the respective elements are the same as those of the corresponding elements in the first embodiment, and therefore will not be described again. This is different from the first embodiment in that the positional relationship of the heat sink 40a with other elements is different. Similarly, the heat sink 40a is placed at the right end of the base 10a, but the heat sink 40a is disposed perpendicular to the heat pipe 30a. The extending direction of the flow path 405a in the heat sink 40a is perpendicular to the heat pipe 30a, so that the condensation section of the heat pipe 30a is disposed correspondingly to the intermediate tapered portion of the heat sink 4a, that is, the width of the flow path 405a corresponding to the heat sink 40a is the smallest. The middle section 408a. At this time, a cooling fan (not shown) is placed at the air inlet 406a and a forced air flow is blown to the radiator 4〇a to force the airflow to flow out of the air outlet 407a. The middle portion 408a of the flow passage 405a has the smallest width, and the flow velocity of the flow passage 405a is the largest when the airflow flows through the intermediate portion 408a of the flow passage 405a, so that the heat exchange efficiency of the heat sink 4〇a at the intermediate tapered portion is the highest, and the heat pipe 30a is used in this embodiment. The condensation section is vertically thermally connected to the tapered portion of the heat sink 4A, which facilitates faster and more concentrated transfer of heat transferred from the heat pipe 30a to the heat sink 4〇a and is radiated to the external environment, thereby improving the heat dissipation device. Heat dissipation efficiency. 11 200908859 A schematic diagram of the combination of the third embodiment of the heat sink is shown in FIG. The heat dissipating device comprises a base lb, a heat collecting block 2〇b, a heat pipe (not shown), a heat sink 40b and a heat dissipating fan 50b. In this embodiment, the structure of the other elements and the connection and assembly relationship between the elements are the same as those of the first embodiment except that the structure of the heat sink 40b and the base 10b are changed. Referring to Figure 6 at the same time, the heat sink 40b includes a housing 400b and a heat sink fin set disposed in the housing 400b. The outer casing 400b is tapered from left to right, i.e., has the largest width at the left air inlet 406b and the smallest width at the right air outlet 407b. Similarly, the heat dissipation fin group is disposed in the outer casing 400b, and the flow passage 405b is formed between the heat dissipation fins 401b and 402b, and the width of the flow passage 405b gradually decreases from left to right. The width of the right end of the base 10b corresponds to the width of the outer casing 400b of the heat sink 40b. Compared with the heat dissipation fin group in the first embodiment, the heat dissipation fin group in the embodiment only forms the tapered portion of the front half portion, and the tapered portion of the second half portion is omitted, and is lifted before the heat dissipation area is satisfied as much as possible. The size of the heat sink 40b can be reduced, and the electronic device can be more suitable for miniaturization, and the manufacturing material can be reduced to save manufacturing costs. The width of the flow channel 4 〇 5 b between the heat dissipation fins is gradually reduced from the air inlet 406b to the air outlet 407b, so that the airflow is always accelerated when flowing through the flow channel 405b, which is more favorable for the airflow and the heat dissipation fins. The heat exchange between the two increases the heat dissipation efficiency of the heat sink. Fig. 7 is a schematic diagram showing the combination of the fourth embodiment of the heat sink. The heat dissipating device comprises a base lc, a heat collecting block 2〇c, a heat pipe 30c and a heat sink 40c. The structural shapes of the respective elements are the same as those of the corresponding components in the third embodiment, and therefore will not be described again. It is the same as the third embodiment of 200908859 in that the positional relationship of the heat sink 40c with other elements is different. Similarly, the heat dissipation 40c is placed at the right end of the base i〇c, but the heat sink is torn perpendicularly to the heat pipe. The extending direction of the runner in the heat sink 40c is perpendicular to the heat pipe 30c, so that the condensation section of the heat pipe 30c is correspondingly disposed on the right end tapered portion of the heat sink 4〇c, that is, the flow path 4 corresponding to the heat sink 4〇c. 〇5c is the smallest outlet 407c. At this time, a cooling fan (not shown) is placed at the air inlet 406c and a forced airflow is provided to blow the radiator 4〇c, and the forced airflow flows out from the air outlet 407c. The flow passage 405c has the smallest width at the right end air outlet 4〇7c, and the flow velocity is maximized when the airflow flows through the air outlet 407c of the flow passage 405c, so that the heat exchange efficiency of the heat sink 40c at the portion of the air outlet 407c having the smallest width is the highest. The condensation section of the heat pipe 30c is partially thermally connected to the air outlet 407c having the smallest width of the radiator 4〇c, which facilitates the transfer of heat transferred from the heat pipe 3〇c to the radiator 40c and is distributed to the external environment. . Each of the above heat dissipating devices can change the width of the flow channel to make the airflow contact with each of the heat sinking Korean blades, and the heat exchange efficiency between the south airflow and the heat radiating fins and the flow path between the adjacent heat radiating fins. The gradual decrease in width can increase the speed of the airflow, and at the same time, the heat absorbed by the heat pipe is concentrated to the position where the width of the flow channel is the smallest. The heat is transferred to the heat-dissipating fin at the position where the heat exchange efficiency is the highest, and the heat is matched. The higher airflow velocity at this location allows the airflow to quickly remove heat and improve the heat dissipation efficiency of the heat sink. In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed. The above is only the preferred embodiment of the present invention, and those skilled in the art will be able to devise the equivalent modifications of the present invention within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the combination of a first embodiment of a heat sink according to the present invention. Figure 2 is an exploded perspective view of Figure 1. 3 is a top plan view of the heat sink of FIG. 2. 4 is a schematic view showing the combination of the second embodiment of the heat sink of the present invention. FIG. 5 is a schematic diagram of the combination of the third embodiment of the heat dissipation device of the present invention. Figure 6 is a plan view of the heat sink of Figure 5. Figure 7 is a schematic view showing the combination of the fourth embodiment of the heat sink of the present invention. [Main component symbol description] Base 10, 10a, 10b, 10c Slot 12 Heat collecting block 20, 20a, 20b, 20c Heating electronic component 22 Heat pipe 30, 30a, 30c Evaporation section 301 Condensing section 302 Adiabatic section 303 Radiator 40, 40a, 40b, 40c outer casing 400, 400b first heat radiating fins 401, 401b second heat radiating fins 402, 402b flow passages 405, 405a, 405b, 405c air inlets 406, 406a, 406b, 406c air outlets 407, 407a, 407b 407c intermediate section 408, 408a cooling fan 50 ' 50b 14