201239594 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤指一種散熱效率較高之散 熱裝置。 【先前技術】 [0002] 現今電腦之運行速度越來越快，由於電腦之運行速度主 要取決於中央處理器，因此中央處理器之運行速度亦越 來越快，但是對於中央處理器這一類之積體電路電子元 件來說，運行速度越快，其單位時間產生之熱量就越多 ^ ，若不及時排出，就會引起其溫度升高，導致其運行不 穩定。業界均於中央處理器表面安裝一散熱裝置輔助其 散熱，隨著新之處理器不斷推出，其所配用之散熱裝置 亦於不斷改良。 [0003] 請參閱圖1，其為一種常用之散熱裝置包括一散熱器80和 一風扇90，所述散熱器80包括一底座81和複數平行設置 於底座81上部之散熱鰭片83，該等散熱鰭片83均為豎直 q 之板體，兩兩相鄰之散熱鰭片83之間形成一風道85，散 熱器80之底座81可與一電路板70之一發熱元件71接觸而 將發熱元件產生之熱量傳導到散熱鰭片83上，風扇90可 安裝於散熱鰭片83 —側而驅動冷空氣流過散熱器80之風 道85，從而帶走散熱鰭片83上之熱量，但是上述散熱裝 置之散熱效率較低。 【發明内容】 [0004] 鑒於以上内容，有必要提供一種用以提高散熱效率之散 熱裝置。 100109797 表單編號A0101 第3頁/共12頁 1002016573-0 201239594 _5]-種散Μ置，包括—散熱器，所述散熱器包括複數第 一散熱鰭片，所述散熱裝置還包括複數第二散熱鰭片， 每一第二散熱鰭片裝設於每兩相鄰之第一散熱鰭片之間 ，且包括複數第一散熱片及連接兩相鄰第一散熱片之第 二散熱片。 [_與習知技術相比，於上述散熱裝置中，所述第—散熱片 及第二散熱片增加了所述散熱器之散熱面積，從而提高 了所述散熱裝置之散熱效率。 【實施方式】 剛請-併參閱圖2至圖4，於本發明之一較佳實施方式中， -散熱裝置包括-散熱器1G和—可安裝於所述散熱器1〇 —側之風扇30。 剛所述散熱HID包括—底座u，所述底座u上設有複數第 -散熱鰭片13，所述底座1〗之下表面可與—電路板5〇上 之發熱元件60 (如中央處理器)相接觸。所述第一散熱 鰭片13相互平行，且大致垂直所述底座丨丨。每兩相鄰之 第一散熱鰭片13之間裝設一寒二散熱鰭片15。每一第二 散熱籍片15包括複數第一散熱片15〇及第二散熱片⑸。 所述第散熱片150與所述底座11相接觸。於一實施方 式中，所述第二散熱片151與所述第一散熱鰭片13相接觸 所述第散熱片150相互平行，且大致垂直所述第一散 熱--曰片13。所述第二散熱片151相互平行，且大致垂直所 述第—散熱片150。所述第二散熱片151間隔連接兩相鄰 第一散熱片150之兩端。每兩相鄰之第一散熱片15〇與連 接所述第-散熱片150-端之第二散熱片151之間形成一 100109797 表單編號A0101 1002016573-0 201239594 [0009] Ο [0010] 〇 [0011] [0012] [0013] [0014] 風道156 ’所述風道156之延伸方向大致平行所述第—散 熱鰭片13。所述風道156與所述第一散熱鰭片13相接觸。 所逑風扇30安裝於所述散熱器1〇上並與位於所述風道156 之—側’所述散熱裝置安裝到所述發熱元件6〇上，所述 底座11之下表面與所述發熱元件相接觸。所逑發熱元 件60產生之熱量經由底座Π傳送到第一散熱鰭片13及第 散熱ϋ片15上。所述風扇3〇驅動冷空氣流過所述第_ 散熱鰭片15之間之風道156，由於所述風道156岣勻排列 ’所述冷空氣均勻地流過所述風道156，從而帶走所述第 —散熱鰭片13及第二散熱鰭片15上之熱量。所述第—散 熱片150及第二散熱片151增大了所述散熱器1〇之散熱面 積’大大提高了所述發熱元件60之散熱效率。 综上所述，本發明確已符合發明專利要求’爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ’舉凡熟悉本發明技藝之人古:，表依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申讀專利範園内 〇 Ή .· 【圖式簡單說明】 圖1是習知之散熱裝置之立體分解圖。 圖2是本發明電子裝置之一較佳實施方式中之一立體分解 圖。 圖3是圖2之局部放大圖。 圖4是圖2之一立體組裝圖。 【主要元件符號說明】 100109797 表單編號Α0101 第5頁/共12頁 1〇〇2〇16573-0 201239594 [0015] 散熱 器：10 、80 [0016] 底座 ：11 ' 81 [0017] 第一 散熱鰭 片：13 [0018] 第二 散熱鰭片：15 [0019] 第一 散熱片 ：150 [0020] 第二 散熱片 ：151 [0021] 風道 ：156 '85 [0022] 風扇 :30、 90 [0023] 電路板：50 '70 [0024] 發熱元件： 60 ' 71 [0025] 散熱 缝片· 83 100109797 表單編號 A0101 第 6 頁/共]2 頁 1002016573-0201239594 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a high heat dissipating efficiency. [Prior Art] [0002] Today's computers are running faster and faster. Since the operating speed of computers depends mainly on the central processing unit, the central processing unit runs faster and faster, but for the central processing unit. In the case of integrated circuit electronic components, the faster the running speed, the more heat it generates per unit time. If it is not discharged in time, it will cause its temperature to rise, resulting in unstable operation. The industry has installed a heat sink on the surface of the central processor to assist in heat dissipation. As new processors continue to be introduced, the heat sinks they use are constantly being improved. [0003] Referring to FIG. 1 , a conventional heat sink includes a heat sink 80 and a fan 90. The heat sink 80 includes a base 81 and a plurality of heat dissipation fins 83 disposed in parallel with the upper portion of the base 81. The heat dissipating fins 83 are all vertical q plates, and a duct 85 is formed between the adjacent fins 83. The base 81 of the heat sink 80 can be in contact with a heating element 71 of a circuit board 70. The heat generated by the heating element is conducted to the heat dissipation fins 83. The fan 90 can be mounted on the side of the heat dissipation fins 83 to drive the cold air to flow through the air passages 85 of the heat sink 80, thereby taking away the heat on the heat dissipation fins 83, but The heat dissipation device has low heat dissipation efficiency. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink for improving heat dissipation efficiency. 100109797 Form No. A0101 Page 3 of 12 1002016573-0 201239594 _5] - Dispersion device, including - heat sink, the heat sink includes a plurality of first heat sink fins, and the heat sink further includes a plurality of second heat sinks Each of the second heat dissipation fins is disposed between each of the two adjacent first heat dissipation fins, and includes a plurality of first heat dissipation fins and a second heat dissipation fin connecting the two adjacent first heat dissipation fins. In the above heat dissipating device, the first heat sink and the second heat sink increase the heat dissipation area of the heat sink, thereby improving the heat dissipation efficiency of the heat sink. [Embodiment] Just-see also FIG. 2 to FIG. 4, in a preferred embodiment of the present invention, a heat sink includes a heat sink 1G and a fan 30 mountable on the side of the heat sink 1 . The heat-dissipating HID includes a base u, and the base u is provided with a plurality of first heat-dissipating fins 13, and the lower surface of the base 1 can be combined with the heat-generating component 60 of the circuit board 5 (such as a central processing unit) ) contact. The first heat dissipation fins 13 are parallel to each other and substantially perpendicular to the base. A cold fin 14 is disposed between each of the two adjacent first fins 13. Each of the second heat radiating fins 15 includes a plurality of first fins 15 and a second fin (5). The first fin 150 is in contact with the base 11 . In one embodiment, the second heat dissipation fins 151 are in contact with the first heat dissipation fins 13 and the first heat dissipation fins 150 are parallel to each other and substantially perpendicular to the first heat dissipation fins 13 . The second fins 151 are parallel to each other and substantially perpendicular to the first fins 150. The second fins 151 are spaced apart from each other at two ends of the adjacent first fins 150. A two-way first heat sink 15A and a second heat sink 151 connected to the first heat sink 150-end form a 100109797 Form No. A0101 1002016573-0 201239594 [0009] Ο [0010] 〇 [0011 [0014] [0014] The duct 156' extends in a direction substantially parallel to the first heat sink fins 13. The air duct 156 is in contact with the first heat dissipation fin 13 . The fan 30 is mounted on the heat sink 1 and mounted on the heat generating component 6 on the side of the air duct 156. The lower surface of the base 11 and the heat is generated. The components are in contact. The heat generated by the heating element 60 is transferred to the first heat dissipation fin 13 and the first heat dissipation fin 15 via the base. The fan 3 〇 drives cold air to flow through the air passage 156 between the first fins 15 , and the air duct 156 is evenly arranged to flow uniformly through the air duct 156 . The heat on the first heat dissipation fin 13 and the second heat dissipation fin 15 is taken away. The first heat dissipating fins 150 and the second fins 151 increase the heat dissipating surface of the heat sink 1 to greatly improve the heat dissipating efficiency of the heat generating component 60. In summary, the present invention has indeed met the requirements of the invention patent 爰 提出 patent application. However, the above description is only a preferred embodiment of the present invention. Those skilled in the art will recognize that equivalent modifications or variations made in accordance with the spirit of the present invention should be included in the following patent application. In the garden 〇Ή.· [Simple description of the drawings] Fig. 1 is an exploded perspective view of a conventional heat sink. Fig. 2 is an exploded perspective view showing a preferred embodiment of the electronic device of the present invention. Figure 3 is a partial enlarged view of Figure 2. Figure 4 is an assembled, isometric view of Figure 2; [Main component symbol description] 100109797 Form number Α0101 Page 5/Total 12 page 1〇〇2〇16573-0 201239594 [0015] Heat sink: 10, 80 [0016] Base: 11 ' 81 [0017] First heat sink fin Sheet: 13 [0018] Second heat sink fin: 15 [0019] First heat sink: 150 [0020] Second heat sink: 151 [0021] Air duct: 156 '85 [0022] Fan: 30, 90 [0023 ] Board: 50 '70 [0024] Heating element: 60 ' 71 [0025] Heat sinking clip · 83 100109797 Form number A0101 Page 6 of 2 Page 1002016573-0