1310895 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤指一種種應用於電子元件之散熱裝 • 置。 【先前技術】 電子元件（如中央處理器）運行時產生大量熱，而使其本身及系 統溫度升高，繼而導致其運行性能下降。為確保電子元件正常運行: 通常在電子元件上安裝散熱器，排出其所產生的熱量。 一種傳統之散熱器包括一與電子元件接觸之底板、設於底板上之 複數散熱片以及安裝於散熱片頂部之一風扇。電子元件運行產生之熱 量被底板吸收後’再通過散熱片散發到周圍環境中以冷卻電子元件^ 風扇運行產生氣流吹向散熱片以加速熱量之散失。為提升散熱性能， 通常藉由增加散熱片尺寸來增加散熱器之表面積。然而，增加散熱片 之尺寸將會使散熱器體積增大從而佔用系統更多的空間資源。… 此外，傳統散熱器中由於其頂部距離電子元件較遠，電子元件產 生之熱量經底板不能快速由散熱器之底部傳向頂部，致使散熱器頂部 利用率低，影響散熱器之整體散熱性能。 【發明内容】 有鑒於此，有必要提供一種具較佳性能之散熱裝置。 一種散熱裝置，包括一吸熱板，一導熱體置於吸熱板上，該導熱 體包括一與吸熱板接觸之下基板，一與下基板平行且相隔設置之上基 板，一傳熱板連接下基板與上基板，該上基板朝向下基板垂直設有 複數第一散熱鰭片，複數第二散熱鰭片垂直設於上基板頂部。 與現有技術相比，該散熱裝置之導熱體設有連接上基板與下基板 之傳熱板，使熱量快速傳遞至導熱體頂部，該導熱體頂部分別設置有 朝下與朝上設置之第一及第二散熱鰭片，使傳遞至導熱體頂部之熱量 陕速傳向第一及第二散熱鰭片從而將熱量散發，散熱裝置之總體散熱 性能得以提升。 6 1310895 【實施方式】 4參閱第一圖及第二圖，揭露本發明散熱裝置之較佳實施例。該 散熱f置用以對中央處理器（圖未示）等發熱電子元件進行散熱其 包括—散熱H 1G及-安裝於健^ 1G —側之風扇2{)。鎌熱器1〇 t括—與電子元件接觸之吸熱板12，一置於吸熱板12上導熱體30， 複數平行之第-散觸片36由導舰3G延伸而出，複數第二散熱縫 片％置於導熱體3〇頂部，三u形熱管4〇連接吸熱板12、導熱體 30及第二散熱鰭片38。1310895 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for use in an electronic component. [Prior Art] When an electronic component (such as a central processing unit) operates, a large amount of heat is generated, and the temperature of itself and the system rises, which in turn causes the running performance to deteriorate. To ensure proper operation of the electronic components: A heat sink is usually installed on the electronic components to dissipate the heat generated by them. A conventional heat sink includes a bottom plate in contact with an electronic component, a plurality of heat sinks disposed on the bottom plate, and a fan mounted on the top of the heat sink. The heat generated by the operation of the electronic components is absorbed by the bottom plate and then dissipated through the heat sink to the surrounding environment to cool the electronic components. The fan operates to generate airflow to the heat sink to accelerate the dissipation of heat. To improve heat dissipation, the surface area of the heat sink is usually increased by increasing the heat sink size. However, increasing the size of the heat sink will increase the size of the heat sink and take up more space resources in the system. ... In addition, in the conventional heat sink, since the top of the heat sink is far from the electronic component, the heat generated by the electronic component cannot be quickly transmitted from the bottom of the heat sink to the top through the bottom plate, so that the top utilization of the heat sink is low, which affects the overall heat dissipation performance of the heat sink. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having better performance. A heat dissipating device comprises a heat absorbing plate, a heat conducting body is disposed on the heat absorbing plate, the heat conducting body comprises a substrate in contact with the heat absorbing plate, a substrate is parallel to the lower substrate and the upper substrate is disposed, and a heat transfer plate is connected to the lower substrate And the upper substrate, the upper substrate is perpendicular to the lower substrate, and the plurality of first heat dissipation fins are vertically disposed on the top of the upper substrate. Compared with the prior art, the heat conducting body of the heat dissipating device is provided with a heat transfer plate connecting the upper substrate and the lower substrate, so that heat is quickly transmitted to the top of the heat conductor, and the top of the heat conducting body is respectively provided with a downward facing and upward facing And the second heat dissipation fins enable the heat transferred to the top of the heat conductor to be transmitted to the first and second heat dissipation fins to dissipate the heat, and the overall heat dissipation performance of the heat dissipation device is improved. 6 1310895 [Embodiment] 4 Referring to the first and second figures, a preferred embodiment of the heat sink of the present invention is disclosed. The heat dissipation f is used to dissipate heat-generating electronic components such as a central processing unit (not shown), including - heat dissipation H 1G and - fan 2 {) mounted on the side of the health 1G. The heat exchanger 1 includes a heat absorbing plate 12 in contact with the electronic component, a heat conducting body 30 disposed on the heat absorbing plate 12, and a plurality of parallel first-scattering pieces 36 extending from the guiding ship 3G, and a plurality of second heat dissipating slits The sheet % is placed on top of the heat conductor 3, and the three u-shaped heat pipes 4 are connected to the heat absorbing plate 12, the heat conductor 30, and the second heat sink fins 38.
*月參閱第二圖，該吸熱板12呈矩形平板狀，具有一與電子元件 細之底面120及-頂面m，該頂面m形成有三溝槽124，該吸 熱板12四角水平向外延伸有四耳部126，可供套設有彈簧6〇之螺釘 元件50穿過以將散熱器1〇固定於一電路板(圖未示)上。 該導熱體30呈“工”字形’其包括一與吸熱板12接觸之下絲 32 ’ 一與下基板32平行且分隔設置之上基板糾，一垂直連接下基板 32與上基板34之傳熱板33，上述第一散熱鰭片36自上基板34之 下表面朝向下基板32垂直延伸而出，其間形成複數第—氣流通道。 該導熱體3〇之上基板34、下基板％、傳熱板33及設於上基板34 之第一散熱鰭片36是通過鋁擠加工方式一體成型，該等第一散熱鰭 片36之自由端距下基板32有一間隙，該上基 _ 36方向之長度較下基板32長，該上基板34之^=有^ 對溝槽342 ’該下基板32之底面對應吸熱板12頂部122之溝槽124 形成有三賴(圖未示）。其憎熱板33垂直連鮮基板32與上基板 34中部從而使上述第一散熱鰭片36分列於該傳熱板％兩側。第二 散熱鰭片38垂直結合於導熱體3〇上基板34之頂面，該等第二散熱 鰭片38平行於第-散熱鰭片36，其間形成複數第二氣流通道。該等 第一散熱鰭片38底面對應上基板34頂面之溝槽342形成有一對溝槽 382，一貫穿孔380形成於第二散熱鰭片38溝槽342之上方。 該熱管40包括一對第一熱管42及一第二熱管糾，該第一及第 二熱管42 ’ 44分別包括一蒸發段420，，一平行於蒸發段·， 440之冷凝段422，442及一連接段423，443連接蒸發段42〇，44〇 1310895 與冷凝段422，442。其中，第一及第二熱管42，44之蒗發段42〇， 440收容於吸熱板12之溝槽124與導熱體3〇下基板％之溝槽共同 形成的通道中，從而使吸熱板12與導熱體3〇底面熱連接；第一熱 管42之冷凝段422收容於導熱體30上基板34之溝槽342與第二^ 熱籍片38之溝槽382共同形成的通道中；第二熱管之冷凝段^42 穿過第二散熱鰭片38之貫穿孔380。 該風扇20安裝於散熱器10 —側，該風扇2〇之軸線方向與第一 及第二散熱鰭片36，38形成之氣流通道方向—致，使其產生^氣流 吹向第一及第二散熱鰭片36，38之氣流通道中以提升第一及第二散 熱鰭片36，38之散熱效率。 該散熱裝置應用於發熱電子元件時，吸熱板12之底面12〇接觸 電子元件吸收熱量；吸熱板12吸收之熱量傳遞至其上第一及第二熱 管42，44之蒸發段420，440 ;蒸發段420，44〇吸收之一部分Z量 傳遞至與其接觸之導熱體30的下基板32上，然後通過與下基板32 相連之傳熱板33將下基板32上之熱量迅速傳遞至導埶體的基 板34上，再由上基板34傳遞至第—及第二散熱鰭片導3M8上 量散發，第一熱官42之蒸發段420吸收的另一部分熱量通過其連接 段423及冷凝段422直接傳至導熱體30頂面與第二散熱鰭片38之底 面，導熱體30頂面之熱s迅速傳遞至第一散熱鰭片36，如此熱量 通過弟一及第二散熱鰭片36，38向外散發；第二熱管44之蒸發段 440吸收的另一部分熱量通過其連接段443及冷凝段糾2直接傳至第 二散熱鰭片38而向外散發。 本發明散Μ置獅呈“工”狀德擠型導熱體3Q及與熱管4〇 相結合，使發熱電子元件產生之熱量迅速傳遞至散熱器1〇之頂部， 加速熱量的傳遞，從而更快速更有效並且更及時的把熱量帶走，提高 整個散熱裝置之散熱性能。 【圖式簡單說明】 第一圖係本發明散熱器較佳實施例之立體圖。 第二圖係第一圖之正視圖。 8 1310895 第三圖係第一圖之立體分解圖。 【主要元件符號說明】 散熱器 10 吸熱板 12 底面 120 頂面 122 溝槽 124、342、382 耳部 126 風扇 20 散熱體 30 下基板 32 傳熱板 33 上基板 34 第一散熱鰭片 36 第二散熱鰭片 38 貫穿孔 380 熱管 40 第一熱管 42 蒸發段 420、440 冷凝段 422 > 442 連接段 423、443 螺釘元件 50 彈簧 60 ❿ 9* Referring to the second figure, the heat absorbing plate 12 has a rectangular flat shape and has a bottom surface 120 and a top surface m which are thinner than the electronic component. The top surface m is formed with three grooves 124. The heat absorbing plate 12 extends horizontally outward. There are four ear portions 126 through which the screw members 50, which are sleeved with springs, are passed to fix the heat sinks 1 to a circuit board (not shown). The heat conductor 30 has a "work" shape, which includes a wire 32' in contact with the heat absorbing plate 12, a substrate parallel to the lower substrate 32, and a substrate correction, and a heat transfer between the lower substrate 32 and the upper substrate 34. The first heat dissipation fins 36 extend vertically from the lower surface of the upper substrate 34 toward the lower substrate 32, and a plurality of first air flow passages are formed therebetween. The heat conducting body 3 〇 the upper substrate 34 , the lower substrate % , the heat transfer plate 33 , and the first heat dissipation fins 36 disposed on the upper substrate 34 are integrally formed by aluminum extrusion processing, and the first heat dissipation fins 36 are free. The bottom substrate 32 has a gap, the length of the upper base _36 is longer than the lower substrate 32, and the upper substrate 34 has a pair of grooves 342'. The bottom surface of the lower substrate 32 corresponds to the groove of the top 122 of the heat absorbing plate 12. The groove 124 is formed with a triple (not shown). The hot plate 33 vertically connects the fresh substrate 32 and the middle portion of the upper substrate 34 such that the first heat dissipation fins 36 are arranged on both sides of the heat transfer plate %. The second heat dissipating fins 38 are vertically coupled to the top surface of the upper substrate 34 of the heat conductor 3. The second heat dissipating fins 38 are parallel to the first heat dissipating fins 36, and a plurality of second air flow passages are formed therebetween. The grooves 342 of the bottom surface of the first heat dissipation fins 38 corresponding to the top surface of the upper substrate 34 are formed with a pair of grooves 382, and the permanent holes 380 are formed above the grooves 342 of the second heat dissipation fins 38. The heat pipe 40 includes a pair of first heat pipes 42 and a second heat pipe, and the first and second heat pipes 42' 44 respectively include an evaporation section 420, a condensation section 422, 442 parallel to the evaporation section, 440, and A connecting section 423, 443 connects the evaporation section 42A, 44〇1310895 and the condensation section 422, 442. The bursting sections 42A and 440 of the first and second heat pipes 42 and 44 are received in the channel formed by the groove 124 of the heat absorbing plate 12 and the groove of the lower heat sink body 3, so that the heat absorbing plate 12 is formed. The heat pipe 3 is thermally connected to the bottom surface of the heat conductor 3; the condensation portion 422 of the first heat pipe 42 is received in the channel formed by the groove 342 of the substrate 34 on the heat conductor 30 and the groove 382 of the second heat substrate 38; the second heat pipe The condensation section ^42 passes through the through hole 380 of the second heat dissipation fin 38. The fan 20 is mounted on the side of the heat sink 10, and the axial direction of the fan 2 is aligned with the direction of the airflow passage formed by the first and second heat dissipation fins 36, 38, so that the airflow is blown toward the first and second The airflow passages of the heat dissipation fins 36, 38 enhance the heat dissipation efficiency of the first and second heat dissipation fins 36, 38. When the heat dissipating device is applied to the heat-generating electronic component, the bottom surface 12 of the heat absorbing plate 12 contacts the electronic component to absorb heat; the heat absorbed by the heat absorbing plate 12 is transferred to the evaporation sections 420, 440 of the first and second heat pipes 42, 44; The portion 420, 44 〇 absorbs a portion of the Z amount transferred to the lower substrate 32 of the thermal conductor 30 in contact therewith, and then transfers the heat on the lower substrate 32 to the guide body through the heat transfer plate 33 connected to the lower substrate 32. The substrate 34 is further distributed by the upper substrate 34 to the first and second heat dissipation fin guides 3M8, and another portion of the heat absorbed by the evaporation section 420 of the first heat register 42 is directly transmitted through the connection section 423 and the condensation section 422. To the top surface of the heat conductor 30 and the bottom surface of the second heat dissipation fin 38, the heat s of the top surface of the heat conductor 30 is quickly transmitted to the first heat dissipation fins 36, so that the heat passes through the first and second heat dissipation fins 36, 38 outward. Dissipating; another portion of the heat absorbed by the evaporation section 440 of the second heat pipe 44 is directly transmitted to the second heat dissipation fins 38 through the connection section 443 and the condensation section 2 to be radiated outward. The schist-through lion of the present invention is combined with the heat pipe 3Q of the "work" shape and combined with the heat pipe 4〇, so that the heat generated by the heat-generating electronic component is quickly transmitted to the top of the radiator 1 to accelerate the heat transfer, thereby being faster. More efficient and timely removal of heat to improve the heat dissipation of the entire heat sink. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a preferred embodiment of the heat sink of the present invention. The second figure is a front view of the first figure. 8 1310895 The third figure is an exploded view of the first figure. [Main component symbol description] Heat sink 10 Heat absorbing plate 12 Bottom surface 120 Top surface 122 Grooves 124, 342, 382 Ear 126 Fan 20 Heat sink 30 Lower substrate 32 Heat transfer plate 33 Upper substrate 34 First heat sink fin 36 Second Heat sink fin 38 through hole 380 heat pipe 40 first heat pipe 42 evaporation section 420, 440 condensation section 422 > 442 connection section 423, 443 screw element 50 spring 60 ❿ 9