1309760 九、發明說明： * 【發明所屬之技術領域】 裝置本發明涉及—錄熱裝置，尤健—種驗電子元件散熱之散熱 【先前技術】 ^電子元件（如中央處理器）運行時產生大量熱量，而使其本身及 系統溫度升高，繼而導致其運行性能下降。為確保電子元件能正常運 行，通常在電子元件上安裝散熱裝置，排出其所產生之熱量。 <第一圖所示為一種習知散熱裝置，該散熱裝置包括一散熱器1()、 • 設於散熱器10頂部之一散熱片組2〇，及將散熱器10與散埶片έ且20轨連 接之一U型熱管30。散熱器10包括-基座12及設於該基座;;^复^ r散熱韓片16，基座12上設有容置熱管之溝槽14。散熱片組2〇係由複數 ， 相互平行之散熱片22依次堆疊組成，其上設有一對通孔24。熱管3〇包 、括一，發段％及從蒸發段32兩端彎折延伸而出之一對冷凝段34。熱管 3〇之黑發段32容置於基座12上之溝槽14内’其冷凝段34分別穿設於散 熱片組20上之通孔24内。該散熱裝置在使用時，基座12與電子元件如 中央處理器等接觸，並吸收其產生之熱量。基座12吸收之熱量一部分 ，遞給其上之散熱鰭片16並散發到周圍環境中，另一部分熱量通過熱 管30傳遞到散熱片組20後散發到周圍環境中。熱管3〇具有極好之熱^專 導性’可將其蒸發段32吸收之熱量快速傳遞到其冷凝段34。惟，只有 熱官30之二冷凝段34與散熱片組20接觸’熱管30與散熱片22間之熱傳 導面積較小，熱管30不能將吸收之熱量均勻而快速地傳遞到整個散熱 片組20 ’導致未能充分利用散熱片組2〇進行散熱。 為提升該習知散熱裝置之散熱性能，可通過增加熱管之數量以增 加熱管與散熱片組間之接觸面積。惟，增加熱管數量將導致該習知散 熱裝置之成本增加。該習知散熱裝置之性能與成本比率較低。 【發明内容】 有鑒於此，有必要提供一種改進之散熱裝置。 本發明散熱裝置包括與電子元件接觸之一導熱板及位於該導熱 板上方、由複數散熱片組成之一散熱片組，該導熱板一侧設有凹槽； 該散熱裝置還包括-彎折設置之歸，該鮮包括容置於導熱板上之 1309760 凹槽内之-第-傳熱段、從第—傳熱段兩端彎折而出並向遠離導熱板 方向延巧之二第二傳熱段，及從一第二傳熱段彎折而出並向導熱板延 伸之-第三傳熱段，熱管之第二、第三賴段分別肖散熱片組熱連接。 相較於現有技術，所述散熱裝置利用彎折設置之熱管來增加熱管 與散熱>ί組間之接觸面積，可充分棚散刻散熱，從而提升散熱裝 置之散熱效果；而一支彎折設置之熱管之成本與一支!^型熱管相近， 故本發明散熱裝置具有較高之性能與成本比率。 … 【實施方式】 请參閱第二圖至第四圖，本發明散熱裝置包括一矩形導熱板 100、設於導熱板100上之一散熱器200、一散熱片組300及一熱傳導 元件如二支彎折設置之熱管400，該熱管400將導熱板100、^熱器 200及散熱片組300熱連接。導熱板觸及散熱器2〇〇係由導熱性能 良好之材料，如金屬銅或鋁等製成。 ’ 導熱板100包括一底部11〇及與底部11〇相對之頂部12〇。其中，底 部110與電子元件如設在電路板6〇〇上之中央處理器5〇〇等接觸。一對 相互平行之凹槽122沿導熱板1〇〇之對角線設於導熱板1〇〇之頂部12〇。 散熱器200包括與導熱板1〇〇頂部120相接之基座2〇2及設於該 基座202上之複數鰭片204。該散熱器200還包括設於基座202中部 之一對相互平行之通槽206及分別設於通槽206兩侧之兩對通子匕 208。該通槽206與導熱板1〇〇上之凹槽122分別對應，熱管4〇〇之 一部分穿過通槽206後可容置在導熱板1〇〇上之凹槽122内。 請再參閱第五圖，每一熱管400包括第一傳熱段410及設於第一 傳熱段410兩端之二u型傳熱段420。該二U型傳熱段420包括從第 一傳熱段410兩端垂直彎折而出並向遠離導熱板1〇〇方向延伸之一對 第二傳熱段422 ’及分別從第二傳熱段422端部彎折並向導熱板1〇〇 延伸而形成、且平行於第二傳熱段422之二第三傳熱段424。第三傳 熱段424之自由端分別穿設並固定於基座202上之通孔208内。熱管 400之第一傳熱段41〇穿過基座2〇2上之通槽206後固定於導熱板1〇〇 上之凹槽122内、並從導熱板1〇〇吸收熱量，以作為其蒸發段；熱管 400之第二、第三傳熱段422、424與散熱片組300接觸，用於將蒸發 段吸收之熱量傳遞給散熱片組300，以作為其冷凝段。 散熱片組300套設於熱管400之冷凝段即第二、第三傳熱段422、 1309760 424上，且位於散熱器2〇〇頂部。散熱片組3〇〇係由 散熱片依次疊置組成。請參閱第四至第五圖，每一散 ί :片體310，及設於第一片體31〇相對兩側，並5 別與一熱s 400之冷凝段接觸之二第二片體32〇。在第_ 二第二片體320相臨之邊緣處分別設有複數半圓形之缺口 312。 -片體310與二第二片體32〇組合成—散熱片時，第—: 310、320上之半圓型缺口 312對應組合而在第一、第二片體 相接處形成複數圓形通孔（圖未標）熱管4〇〇之第二、 過^熱片上'^圓形通孔，並過焊接等方法將散^固、i 片^ β ^第―、第二傳熱段422、424上。按照此種方法，散孰 片依二人豐加從而組成散熱片組300。 … 本發明散«置在使贿，導驗1GG射央處理器5⑻ 吸收中央處理器500產生之熱量。導熱板細吸收^ ^ 給散熱器200之基座202 ’再通過其上之則2〇4將-二刀= :分熱量通過熱管棚快速傳遞到散熱片組，進而均=佈 熱片上並散發到周圍環境中。 ^ 由於每一熱管4〇〇包括第二、第三值埶in_ 段，熱管400與散熱片間之接觸面積與二支u型熱管相同、， 及收之熱量快速均勻地分佈到整個散熱片組3⑽，充ϋ二 本與一支u 管之成本相近，t匕支u型歸^長熱成 降低，本，本發明散熱裝置具有較高之性能與成本比率。 地，施例巾’本發明散熱裝置採用兩支熱管，可以理解 也熱官400之數量可以根據設計需要而選取不同之數量，如一 =i敎請再參第六圖，當僅使用—支熱管獅時，每 設邊;處分別 之第一、第二傳熱#又422、424穿過散埶只卜夕圄拟、3^ 過接二=將3片f定在熱管400之第二、第三傳ϋ 422、’ 熱管40心之:=3::時及〒-散熱片包括設於相鄰 A更夕第 >；體細，及分別設於二最外端第一片 7 1309760 體310兩側之二第二片體320。其他元件與上述實施例中相同。此 導熱板100與基座202之間、導熱板100與熱管4〇〇之間、熱其4〇 與基座202之間及熱管400與散熱片之間可通過焊接等方法固、定。 在上述實施例中，散熱器200設於導熱板1〇〇與散熱片組3⑽ 間以增大散熱面積，根據實際需要，亦可將該散熱器省去 熱片組300直接設於導熱板1〇〇上，亦能達成本發明之目的。 綜上所述’本發明確已符合發明專利之要件，遂依法提 二上所述者僅為本㈣之難實補，自列__彳本ί 耸Ιιί利減。舉凡熟悉本案技藝之人士援依本發明之精神所作ί 等效修飾或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第一圖係習知散熱裝置之立體分解圖。 第f圖係本發明散熱裝置-實施例之立體組裂圖。。 第二圖係第二圖中散熱裝置之部分分解圖。 第四圖係第二圖中之立體分解圖。 ^五圖係第二圖中熱管與-散熱片之部分組裝圖。 第六圖係本發明散織置另—實施例中之熱管與散熱片組裝圖 【主要元件符號說明】 導熱板 100 頂部 120 散熱器 200 鰭片 204 通孔 208 第一片體 310 第二片體 320 第一傳熱段 410 第一傳熱段 422 中央處理器 500 底部 11〇 凹槽 122 H 202 206 散熱片組 3〇〇 缺口 312 熱管 400 U型傳熱段 420 第三傳熱段 424 電銘^反 6001309760 IX. Description of the invention: * [Technical field to which the invention pertains] The present invention relates to a heat-collecting device, and a heat-reducing heat dissipation of an electronic component. [Prior Art] ^ Electronic components (such as a central processing unit) generate a large amount of time during operation The heat, which causes itself and the temperature of the system to rise, in turn causes its performance to deteriorate. To ensure proper operation of the electronic components, heat sinks are usually placed on the electronic components to dissipate the heat generated by them. <The first figure shows a conventional heat sink comprising a heat sink 1(), a heat sink set 2〇 disposed on the top of the heat sink 10, and a heat sink 10 and a heat sink 10 And one of the U-shaped heat pipes 30 is connected by 20 rails. The heat sink 10 includes a base 12 and is disposed on the base. The heat sink 16 is disposed on the base 12, and the base 12 is provided with a groove 14 for accommodating the heat pipe. The heat sink group 2 is composed of a plurality of heat sinks 22 which are parallel to each other, and a pair of through holes 24 are formed thereon. The heat pipe 3 includes, includes, sends a segment % and bends from the two ends of the evaporation section 32 to form a pair of condensation sections 34. The black tube section 32 of the heat pipe 3 is accommodated in the groove 14 on the susceptor 12, and its condensing section 34 is respectively bored in the through hole 24 in the heat sink group 20. When the heat sink is in use, the susceptor 12 comes into contact with an electronic component such as a central processing unit or the like and absorbs the heat generated therefrom. A portion of the heat absorbed by the susceptor 12 is transferred to the heat dissipating fins 16 and radiated to the surrounding environment, and another portion of the heat is transferred to the heat sink group 20 through the heat pipe 30 and then dissipated into the surrounding environment. The heat pipe 3 has excellent heat conductivity to rapidly transfer the heat absorbed by its evaporation section 32 to its condensation section 34. However, only the heat officer 30 bis condensation section 34 is in contact with the heat sink group 20. The heat conduction area between the heat pipe 30 and the heat sink 22 is small, and the heat pipe 30 cannot uniformly and quickly transfer the absorbed heat to the entire heat sink group 20'. As a result, the heat sink group 2 is not fully utilized for heat dissipation. In order to improve the heat dissipation performance of the conventional heat sink, the contact area between the heat pipe and the heat sink group can be increased by increasing the number of heat pipes. However, increasing the number of heat pipes will result in an increase in the cost of the conventional heat sink. The performance and cost ratio of the conventional heat sink is low. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an improved heat sink. The heat dissipating device of the present invention comprises a heat conducting plate in contact with the electronic component and a heat sink group formed by the plurality of heat radiating plates, wherein the heat conducting plate is provided with a groove on one side thereof; the heat dissipating device further comprises a bending setting The fresh-in-the-heat transfer section, which is placed in the groove of the 1309760 on the heat conducting plate, is bent from both ends of the first heat transfer section and extends in the direction away from the heat conducting plate. The heat segment, and the third heat transfer section which is bent from a second heat transfer section and extends to the hot plate, the second and third heats of the heat pipe are respectively thermally connected. Compared with the prior art, the heat dissipating device uses a heat pipe that is bent to increase the contact area between the heat pipe and the heat dissipating group, and can fully scatter the heat dissipation, thereby improving the heat dissipation effect of the heat dissipating device; The cost of the set heat pipe is similar to that of a ^^ type heat pipe, so the heat sink of the present invention has a high performance to cost ratio. [Embodiment] Referring to the second to fourth figures, the heat dissipating device of the present invention comprises a rectangular heat conducting plate 100, a heat sink 200 disposed on the heat conducting plate 100, a heat sink assembly 300, and a heat conducting component such as two The heat pipe 400 is bent, and the heat pipe 400 thermally connects the heat conducting plate 100, the heat exchanger 200, and the heat sink group 300. The heat-conducting plate touches the heat sink 2, which is made of a material having good thermal conductivity, such as metal copper or aluminum. The heat conducting plate 100 includes a bottom portion 11 顶部 and a top portion 12 〇 opposite the bottom portion 11 。. The bottom portion 110 is in contact with an electronic component such as a central processing unit 5A provided on the circuit board 6A. A pair of mutually parallel grooves 122 are provided on the top of the heat conducting plate 1〇〇 along the diagonal of the heat conducting plate 1〇〇. The heat sink 200 includes a base 2 2 connected to the top 120 of the heat conducting plate 1 and a plurality of fins 204 disposed on the base 202. The heat sink 200 further includes a pair of mutually parallel through slots 206 disposed in the middle of the base 202 and two pairs of passers 208 disposed on opposite sides of the through slot 206. The through groove 206 corresponds to the groove 122 on the heat conducting plate 1 respectively, and a part of the heat pipe 4 穿过 passes through the through groove 206 and can be received in the groove 122 on the heat conducting plate 1 . Referring to the fifth figure, each heat pipe 400 includes a first heat transfer section 410 and two u-type heat transfer sections 420 disposed at opposite ends of the first heat transfer section 410. The two U-shaped heat transfer sections 420 include a pair of second heat transfer sections 422 ′ that are bent perpendicularly from both ends of the first heat transfer section 410 and extend away from the heat conducting plate 1 及 and respectively from the second heat transfer The end of section 422 is bent and extends along the hot plate 1 、 and is parallel to the second heat transfer section 424 of the second heat transfer section 422. The free ends of the third heat transfer section 424 are respectively pierced and fixed in the through holes 208 on the base 202. The first heat transfer section 41 of the heat pipe 400 passes through the through groove 206 on the base 2〇2, is fixed in the groove 122 on the heat conducting plate 1〇〇, and absorbs heat from the heat conducting plate 1〇〇 as its The evaporation section; the second and third heat transfer sections 422, 424 of the heat pipe 400 are in contact with the heat sink set 300 for transferring the heat absorbed by the evaporation section to the heat sink set 300 as its condensation section. The heat sink assembly 300 is sleeved on the condensation sections of the heat pipe 400, that is, the second and third heat transfer sections 422, 1309760 424, and is located at the top of the heat sink 2〇〇. The heat sink group 3 is composed of heat sinks stacked one on another. Please refer to the fourth to fifth figures, each of the sheets 310, and the second sheets 32 disposed on opposite sides of the first sheet 31 and 5 in contact with the condensation section of a heat s 400. Hey. A plurality of semicircular notches 312 are respectively provided at the edges of the second and second second bodies 320. When the body 310 and the second body 32 are combined into a heat sink, the semicircular notches 312 on the first: 310, 320 are combined to form a plurality of circular passes at the intersection of the first and second bodies. The hole (not shown) is the second of the heat pipe 4〇〇, and the ^^ circular through hole on the hot plate, and the method of welding, etc., will be loosened, i piece ^ β ^ first, second heat transfer section 422, On 424. According to this method, the dilated film is formed by two people to form the heat sink group 300. The invention is placed in a bribe, and the 1GG radiation processor 5(8) absorbs the heat generated by the central processing unit 500. The heat-conducting plate is finely absorbed ^ ^ to the base 202 of the heat sink 200' and then passed through it 2〇4--two-knife=: the heat is quickly transferred to the heat sink group through the heat pipe shed, and then both are distributed on the heat plate and distributed Into the surrounding environment. ^ Since each heat pipe 4〇〇 includes the second and third values 埶in_ segment, the contact area between the heat pipe 400 and the heat sink is the same as that of the two u-shaped heat pipes, and the heat is quickly and evenly distributed to the entire heat sink group. 3(10), the cost of filling two books is similar to that of a u pipe, and the heat dissipation device of the present invention has a higher performance-to-cost ratio. Ground, the application of the towel 'the heat sink of the present invention uses two heat pipes, it can be understood that the number of hot officials 400 can be selected according to the design needs, such as a = i 敎 please refer to the sixth figure, when only use - heat pipe When the lion is set, each side is set; the first and second heat transfer are separately 422, 424 pass through the scatter, only the 圄 圄 圄, 3 ^ 接 2 = 3 pieces of f are set in the second heat pipe 400, The third pass 422, 'the heat pipe 40 heart: = 3:: when and 〒 - the heat sink includes the adjacent A, the other side of the eve; body size, and respectively set at the two outermost first piece 7 1309760 Two second sheets 320 on both sides of the body 310. The other elements are the same as in the above embodiment. The heat conducting plate 100 and the susceptor 202, between the heat conducting plate 100 and the heat pipe 4, between the heat and the susceptor 202, and between the heat pipe 400 and the heat sink can be fixed by welding or the like. In the above embodiment, the heat sink 200 is disposed between the heat conducting plate 1A and the heat sink group 3 (10) to increase the heat dissipation area. According to actual needs, the heat sink group 300 can be directly disposed on the heat conducting plate 1 according to actual needs. In summary, the object of the invention can also be achieved. In summary, the present invention has indeed met the requirements of the invention patent, and the one mentioned in the above is only the hardship of the present (4), and the self-category __ 彳 ί ί Ι Ι Ι 。 。. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. [Simple description of the drawings] The first figure is an exploded perspective view of a conventional heat sink. Figure f is a three-dimensional group crack diagram of the heat sink device of the present invention. . The second figure is a partially exploded view of the heat sink in the second figure. The fourth figure is an exploded perspective view in the second figure. ^Five diagram is a partial assembly diagram of the heat pipe and the heat sink in the second figure. Figure 6 is a diagram of the assembly of the heat pipe and the heat sink in the embodiment of the present invention. [Main component symbol description] Thermal plate 100 Top 120 Heat sink 200 Fin 204 Through hole 208 First sheet 310 Second sheet 320 First heat transfer section 410 First heat transfer section 422 Central processor 500 Bottom 11〇 Groove 122 H 202 206 Heat sink set 3〇〇 Notch 312 Heat pipe 400 U-type heat transfer section 420 Third heat transfer section 424 Electric ^反600