1309148 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱裝置，尤係涉及一種對發熱電子元件散熱 . 之散熱裝置。 【先前技術】 隨著電子産業之快速發展，電子元件的高速、高頻以及集成化使 其發熱量劇增，因此散熱已成爲業者所重點考慮的問題。 在散熱領域中，現有技術通常係採用一種散熱模組對發熱電子元 件進行散熱，該散熱模組包括板體，設於該板體上部的風扇與複數散 熱鰭片組，以及設於該板體下部的複數熱管，其中，該熱管一端貼設 於發熱電子元件上部，另一端與該散熱鰭片組連接，該散熱模組藉由 _ 熱管將發熱電子元件産生之熱量傳遞到散熱鰭片組上並利用風扇運轉 産生之氣流將散熱鰭片組處的熱量散發到周圍空氣中，以達到對發熱 電子元件散熱之目的。 該散熱模組先將散熱鰭片組、風扇、熱管與板體結合，再將板體 固定於機殼上，從而導致散熱模組零件過多，結合程序複雜，從而增 加了産品重量與成本，需加以改進。 【發明内容】 有鑒於此，有必要提供一種可降低産品重量與成本之散熱裝置。 該散熱裝置包括熱管，散熱鰭片組，用於對該散熱鰭片組散熱的 風扇，以及一具有良好導熱性的機殼，該熱管具有與發熱電子元件熱 接觸的蒸發端，以及與該機殼及散熱鰭片組相結合的兩冷凝端。 該散熱裝置與傳統的散熱模組相比，無需先將散熱元件固定於板 體上，不僅可節省板體等其他元件之用量，且結合程序簡單，從而可 降低産品重量與成本，還可增加散熱面積，提高散航效果。 【實施方式】 下面參照附圖結合實施例對本發明作進一步說明β 請參照圖1及圖2，本發明散熱裝置1〇包括一具有良好導熱性的 鎂鋁合金機殼100,與位於機殼1〇〇内的發熱電子元件16〇接觸^具有 良好導熱性的均熱板110，兩根熱管120、130，固定於該機殼1〇〇 ^的 散熱鰭片組140以及用於對該散熱鰭片組140散熱的風扇15〇。 該熱管120、130爲扁平狀，其分別具有蒸發端121、131盥冷凝 6 1309148 二二固定於缺100上，該均熱板110上設有 j 111 ’該熱管12〇、13〇的蒸發端121、131分別收容於該槽m的 兩端，該熱官130之冷凝端132與散熱鰭片組剔結合 之冷凝端m固定在概綱上，直接與該機殼娜結合。…1309148 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from a heat-generating electronic component. [Prior Art] With the rapid development of the electronics industry, the high-speed, high-frequency and integration of electronic components has caused a sudden increase in heat generation. Therefore, heat dissipation has become a key issue for the industry. In the field of heat dissipation, the prior art generally uses a heat dissipation module to dissipate heat from a heat-generating electronic component. The heat dissipation module includes a board body, a fan disposed at an upper portion of the board body, and a plurality of heat-dissipating fin sets, and the board body is disposed on the board body. a lower heat pipe, wherein one end of the heat pipe is attached to the upper part of the heat-generating electronic component, and the other end is connected to the heat-dissipating fin set, and the heat-dissipating module transfers heat generated by the heat-generating electronic component to the heat-dissipating fin set by the heat pipe The air generated by the fan operation is used to dissipate heat from the heat dissipation fin group to the surrounding air to achieve heat dissipation of the heat-generating electronic components. The heat dissipation module first combines the heat dissipation fin group, the fan, the heat pipe and the plate body, and then fixes the plate body to the casing, thereby causing too many components of the heat dissipation module, and the combination procedure is complicated, thereby increasing the weight and cost of the product. Improve it. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink that can reduce the weight and cost of the product. The heat dissipating device comprises a heat pipe, a heat dissipating fin set, a fan for dissipating heat from the heat dissipating fin set, and a casing having good thermal conductivity, the heat pipe having an evaporation end in thermal contact with the heat generating electronic component, and the machine Two condensing ends combined with a shell and a finned fin set. Compared with the conventional heat dissipation module, the heat dissipation device does not need to fix the heat dissipation component on the board body first, which not only saves the amount of other components such as the board body, but also combines the simple program, thereby reducing the weight and cost of the product, and can also increase The heat dissipation area improves the scatter effect. [Embodiment] The present invention will be further described with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the heat dissipating device 1 of the present invention includes a magnesium-aluminum alloy casing 100 having good thermal conductivity, and is located in the casing 1. The heat-generating electronic component 16 in the crucible contacts the heat-receiving plate 110 having good thermal conductivity, the two heat pipes 120 and 130, the heat-dissipating fin group 140 fixed to the casing 1 and the heat-dissipating fin The fan 140 of the chip set 140 dissipates heat. The heat pipes 120 and 130 are flat, and each has an evaporation end 121, 131, a condensation 6 1309148, and a second fixing on the missing 100. The heat equalizing plate 110 is provided with an evaporation end of the heat pipe 12〇, 13〇. 121 and 131 are respectively accommodated at both ends of the slot m, and the condensation end m of the heat-collecting 130 and the condensation end of the heat-dissipating fin 132 are fixed on the outline and directly combined with the casing. ...
清參照圖3，該熱管120之冷凝端122可藉由一固定彈片123與螺 丁 124鎖附^該機殼100上。該固定彈片123具有一门型的收容部a， 以及沿該收容部127兩侧延伸並與機殼觸相貼合的兩固定部126，該 固定部I26與機殼1〇〇接觸，並藉由螺釘以進行.固定，該執管⑽ 之冷凝端122固定於該固定彈片123之收容部127内，並於該熱管12〇 與機殼100結合處塗抹一層熱傳導介質必，以使兩者結合得 密’具有良好的熱傳導效果。 請再參照圖1及圖2，風扇15〇直接固定於機殼綱上，該風扇 150包括殼體151、裝設於該殼體151上的定子（圖未示）及可相對該 定子轉動的轉子152。該風扇15〇在殼體151上設置有進風口 153，並 在设體151側壁設置與該進風α 153垂直之出風口 154，散熱韓片組 W0位於風扇150之出風口 154處並直接固定於機殼1〇〇上。該風扇 ⑽運轉時’將其周圍之冷空氣由進風口 153吸入殼體151内，經加壓 後由出風σ 154處排出’吹向散熱則組⑽，形成冷卻該散熱韓片組 140之氣流。 該散熱裝置10藉由熱管12〇、ΐ3〇吸收設於均熱板11〇上之發熱電 子元，160 ^生的熱量並傳遞到機殼1〇〇與散熱鰭片14〇上，使二部 分熱置直接藉由機殼100散發，另一部分藉由散熱鰭片組14〇散發到 周圍的空氣中。該散熱裝置10將風扇15〇、散熱鰭片組14〇、熱管12〇 直接與導熱性良好的機殼1〇〇結合以對發熱電子元件16〇散熱，與傳 統的散熱模組相比，無需先將散熱元件固定於板體上，不僅可節省板 體等其他元件_ 1： ’且結合程序鮮，從而可降低産品重量與成本， 還可增加散熱面積，提高散熱效果。 本發明中，該熱管爲兩根，分別具有一蒸發端與一冷凝端；該熱 管120之冷凝知122藉由一固定彈片123與螺釘124鎖附於該機殼100 上’實際應用中，熱管可爲-根或更多，如三根、四根等，當熱管爲 一根時，其中間爲蒸發端，兩端爲冷凝端，其中一冷凝端固定於機殼 100上，另一冷凝端與散熱鰭片組14〇相結合；該熱管12〇之冷凝端 1309148 122也可直接焊合於機殼100上。 【圖式簡單說明】 圖1係本發明散熱裝置的立體組裝圖； - 圖2係本發明散熱裝置的立體分解圖； 圖3係圖1中熱管與機殼結合剖面的局部放大圖。 ' 【主要元件符號說明】 散熱裝置 10 機殼 100 均熱板 110 槽 111 熱管 120 、 130 蒸發端 121 、 131 冷凝端 122、132 固定彈片 123 螺釘 124 熱傳導介質 125 固定部 126 收容部 127 散熱鰭片組 140 風扇 150 殼體 151 轉子 152 進風口 153 出風口 154 發熱電子元件 160 8Referring to FIG. 3, the condensation end 122 of the heat pipe 120 can be attached to the casing 100 by a fixing elastic piece 123 and a screw 124. The fixing elastic piece 123 has a door type receiving portion a, and two fixing portions 126 extending along the two sides of the receiving portion 127 and engaging with the casing. The fixing portion I26 is in contact with the casing 1 and borrows The condensing end 122 of the tube (10) is fixed in the accommodating portion 127 of the fixing elastic piece 123, and a heat conducting medium is applied to the joint of the heat pipe 12 〇 and the casing 100 to combine the two. Demi has a good heat transfer effect. Referring to FIG. 1 and FIG. 2, the fan 15A is directly fixed to the casing. The fan 150 includes a casing 151, a stator (not shown) mounted on the casing 151, and a rotatable relative to the stator. Rotor 152. The fan 15 is provided with an air inlet 153 on the housing 151, and an air outlet 154 perpendicular to the air inlet α 153 is disposed on the side wall of the housing 151. The heat dissipation Korean group W0 is located at the air outlet 154 of the fan 150 and directly fixed. On the case 1 〇〇. When the fan (10) is in operation, 'the cold air around it is sucked into the casing 151 from the air inlet 153, and after being pressurized, the air is discharged from the air outlet σ 154, and the heat radiating group (10) is blown to form the cooling heat sink group 140. airflow. The heat dissipating device 10 absorbs the heat generating element disposed on the heat equalizing plate 11 by the heat pipe 12〇, ΐ3〇, and transfers the heat generated to the casing 1〇〇 and the heat radiating fin 14〇 to make the two parts The heat is directly dissipated by the casing 100, and the other part is radiated to the surrounding air by the fin group 14 . The heat dissipating device 10 combines the fan 15〇, the heat dissipation fin group 14〇, and the heat pipe 12〇 directly with the heat-conducting casing 1〇〇 to dissipate heat from the heat-generating electronic component 16 , compared with the conventional heat dissipation module. Firstly, the heat dissipating component is fixed on the board body, which not only saves other components such as the board body _ 1: ' and the combination procedure is fresh, thereby reducing the weight and cost of the product, and also increasing the heat dissipation area and improving the heat dissipation effect. In the present invention, the heat pipes are two, each having an evaporation end and a condensation end; the condensation of the heat pipe 120 is locked to the casing 100 by a fixing elastic piece 123 and a screw 124. It can be - root or more, such as three, four, etc. When the heat pipe is one, the middle is the evaporation end, the two ends are the condensation end, one of the condensation ends is fixed on the casing 100, and the other condensation end is The heat dissipating fin group 14 结合 is combined; the condensing end 1309148 122 of the heat pipe 12 也 can also be directly soldered to the casing 100. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a heat dissipating device of the present invention; FIG. 2 is an exploded perspective view of a heat dissipating device of the present invention; FIG. 3 is a partial enlarged view of a heat pipe and a casing joint cross section of FIG. ' [Main component symbol description] Heat sink 10 Enclosure 100 Heat spreader 110 Slot 111 Heat pipe 120, 130 Evaporation end 121, 131 Condensation end 122, 132 Fixing spring 123 Screw 124 Heat transfer medium 125 Fixing part 126 Housing part 127 Heat sink fin Group 140 Fan 150 Housing 151 Rotor 152 Air inlet 153 Air outlet 154 Heated electronic components 160 8