TW200301855A - Cooling device of personal computer - Google Patents
Cooling device of personal computer Download PDFInfo
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- TW200301855A TW200301855A TW091137154A TW91137154A TW200301855A TW 200301855 A TW200301855 A TW 200301855A TW 091137154 A TW091137154 A TW 091137154A TW 91137154 A TW91137154 A TW 91137154A TW 200301855 A TW200301855 A TW 200301855A
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- heat
- personal computer
- cooling device
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- 238000001816 cooling Methods 0.000 title claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 210000003625 skull Anatomy 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
200301855 五、發明說明(1) 卻裝置,用於將配設 冷卻。 :發明所屬之技術領域】 本發明係有關於一種個人電艄泠 於個人電腦内部之C P U等發熱零件力以 【先前技術】 (A ) 背景技術 1 ; , 參動作鍾脈衝之高速 搭載於目前個人電腦之CPU,随^初一般而言,cpu 化和積體化’性能乃飛躍地提升。< 疋 愈高性能化,在動作時的發熱量犹愈^高 化cpu的 在製造個人電腦時/如果採用上;"生之熱加以散熱之 話,就必須設置將CPU寺發熱零件所超級電腦等產生 機構’亦即’必須要講求散熱對策二 方式來散熱,但 大量熱的處理器的散熱對策,係採用=,成本會變很高,200301855 V. Description of the invention (1) Cooling device for cooling the equipment. : The technical field to which the invention belongs] The present invention relates to a kind of personal electric heating device such as a CPU and other heating parts inside the personal computer [Previous Technology] (A) Background Technology 1; The CPU of the computer has generally improved dramatically with cpu and integrated performance. < The higher the performance, the more heat will be generated during the operation ^ When the high CPU is used in the manufacture of personal computers / if it is used; " The heat generated by the heat will be dissipated, you must set the CPU temple heating parts Supercomputers and other generating organizations must use the second method to dissipate heat, but the heat dissipation measures of a large number of thermal processors are =, and the cost will be very high.
是,如果將此方式應用到泛用電C 而且,裝置會大级化,不能符合現:將由散熱器和強制空 在此,一般採用的冷卻方式’:而成之構件,密著於 冷風扇(也稱作「冷卻器」)所缈合 散出。將上述 CPU等發熱零件’使自發熱零件所參生> 於曰本特開平 冷卻機構加以改良之嘗試,有例如開不、 10-308482號公報 C P U冷卻構造 使具有高熱傳導性 的熱傳導性。 主動散熱器和CPU表 使用上述「CPU冷卻構造」的話 而且具有所需撓曲量之金屬製冷卻導板,被挾持於主動散 熱器=CPU表面之間,藉此能夠將AHS固定用彈箬構件的 變形量力σ以吸收,而且’月夠發揮充八 ’、 可是,上述先前技術係藉由提言分Yes, if this method is applied to universal electricity C, and the device will be large-scale, it cannot meet the current situation: the cooling method generally used by a radiator and forced air is here: a component made of a cooling fan (Also known as "cooler"). Attempts have been made to improve the cooling mechanism of the above-mentioned heat-generating components such as the CPU ' s self-heating components. For example, Kaibu, Japanese Patent Publication No. 10-308482 C P U cooling structure provides high thermal conductivity. If the active heat sink and CPU meter use the above-mentioned "CPU cooling structure", a metal cooling guide with the required amount of deflection is held between the active heat sink = the surface of the CPU, thereby enabling the AHS fixing spring member to be fixed. The deformation amount of force σ is absorbed, and 'the month is enough to play enough'. However, the above-mentioned prior art
2145-5405-PF(Nl).ptd 五、發明說明(2) __ 面之間的密著纟,才能夠提高 經無法對應今曰之高性能化發熱零件二此?術性手段已 假設將大型主動散熱器和大型 *熱置。 能夠解決上述問題,但是,其會彳丨:加以組合,似乎就 ("在朝向更小型輕量化之下問題。 旲將;人邱駐罢丄, 月】的個人電腦中,如 果將/”p衣置大型化,會使剩餘的电γ 型輕量化的技術課題背向而驰,所以::間受小’這和小 ⑴即使將冷卻裝置大型化,二法Λ用此方法。 : 以,自與風扇-體化之散熱器所放出之 腦二如設ΐ於電源部之風扇,將個人電 果將上、朮二戶,也難Γ獲付充分的冷卻效果’而且,如 ,as羽大型化的話,其驅動噪音和風切噪音都會變 大’所以也無法採用此方法。 在此,跳脫先前之冷卻機構,而提案一種採用孰管的 冷卻機構。 (B )先前技術 採用上述熱管之裝置,有例如開示於曰本特開 2 0 0 0 - 2 2 8 5 9 4號公報之「攜帶型電子設備之冷卻控制方法 及冷卻裝置」、開示於日本特開2 〇 〇 〇 Γ 2 5 0 6 6 0號公報之 「電腦的冷卻裝置」、開示於日本特開2 0 0 0 - 2 7 7 9 6 3號公 報之「個人電腦的冷卻裝置」及開示於日本特開平 1 1 - 6 7 9 9 7號公報之「電腦的冷卻裝置」等。 首先,在開示於日本特開2 〇 〇 〇 - 2 2 8 5 9 4號公報之「攜2145-5405-PF (Nl) .ptd V. Description of the invention (2) __ The close contact between the surfaces can improve the performance. Can it not correspond to today's high-performance heating parts? It has been assumed that a large active radiator and a large * heater are placed in the technical means. It can solve the above problems, but it will be combined: it seems to be a problem (" in the direction of smaller size and lighter weight. 旲 将; 人 邱 resident strike, month] if you will / " The larger the size of the p-set, the more technical problems of lightening the remaining electric γ-type will be run in the opposite direction. Therefore: "Sometimes small" This and Xiaoyan use this method even if the cooling device is enlarged. It is difficult to obtain a sufficient cooling effect if the brain two released from the fan-body radiator is installed in the power supply unit, and it will be difficult to obtain a sufficient cooling effect. If the feather becomes larger, its driving noise and wind-cut noise will become larger, so this method cannot be adopted. Here, a cooling mechanism using a stern tube is proposed instead of the previous cooling mechanism. (B) The aforementioned technology uses the above-mentioned heat pipe For example, the "cooling control method and cooling device for portable electronic equipment" disclosed in Japanese Patent Laid-Open No. 2000- 2 2 8 5 9 4 is disclosed in Japanese Patent Laid-Open No. 2000-0 2 `` Computer Cooling Equipment '' "" Cooling device for personal computer "disclosed in Japanese Patent Laid-Open No. 2 0 0-2 7 7 9 6 3 and" Cooling device of computer disclosed in Japanese Laid-Open Patent No. 1 1-6 7 9 9 7 "Etc. First of all, in the" Publication "published in Japanese Patent Application Laid-Open No. 2000- 2 2 8 594
2145-5405-PF(Nl).ptd 第 6 頁 200301855 五、發明說明(3) ▼型電子没備之冷卻控制方法及冷卻裝置」中,開示有一 種筆記型電腦,前述筆記型電腦具備:金屬塊,連接於熱 管一端(受熱部):盒裝CPU,中介有熱擴散板或放熱板… 而一體固定於前述金屬塊;以及風扇,固定有熱管另一端 (放熱部),而且裝設於個人電腦側面内部。前述筆記型 電腦係將盒裝CPU所產生之熱透過熱管傳遞到散熱鰭片, 再以送風風扇將風吹送到散熱鰭片,使熱吹散到外部。 ^ 開示於日本特開2 0 0 〇 - 2 5 0 6 6 0號公報之「電腦的冷卻 ^置」’係將中央運算處理裝置等發熱零件的熱,藉由熱 官傳熱到設置於電動風扇下游的散熱器,再以電動風扇產 生風,將散熱器所發出之熱排出電腦外部。 么=示於日本特開2〇〇〇 —2779 63號公報之「個人電腦的 ;m」DTT’係、至少2支熱管-端部係以能夠傳熱遞的方 r方ΐίΐ」同時,第2熱管另-端部係以能夠傳熱遞 太邮=骷,於叙鏈機構,前述鉸鏈機構係設置在個人電腦 能夠傳熱遞近,而第1熱管另-端部係以 鉸鏈機構而設置政熱器’前述散熱器係遠離前述 其值策u # 於個人電腦内部,CPU所產生之埶透過埶 n 2 '、、、°。再由散熱器將熱發散到電腦外部。 置」,係將設、、3平1卜6 79 97號公,報之「電腦的冷卻裴 連結,同時,;框啦·内部之複數個發熱零件,以熱管相 熱器,由^熱变=官一端部連接到鄰接電動風扇設置的散 藉由電動風扇將埶^ ^熱’透過熱管傳熱到散熱器’再 了熱排出電腦外部。2145-5405-PF (Nl) .ptd Page 6 200301855 V. Description of the Invention (3) ▼ Cooling Control Method and Cooling Device for Type Electronic Not Prepared ", a notebook computer is shown. The aforementioned notebook computer has: metal Block, connected to one end of the heat pipe (heat-receiving part): boxed CPU, interposed with a heat diffusion plate or heat-radiating plate ... and integrally fixed to the aforementioned metal block; and a fan, fixing the other end of the heat pipe (heat-releasing part), and installed on the individual Inside of computer side. The aforementioned notebook computer transfers the heat generated by the boxed CPU to the heat dissipation fins through a heat pipe, and then blows the wind to the heat dissipation fins with a blower fan to dissipate the heat to the outside. ^ The "Cooling of the computer" disclosed in Japanese Patent Application Laid-Open No. 2000-2500-5660 is used to transfer heat from heat-generating components such as a central processing unit to an electric device through heat transfer. The radiator downstream of the fan, and the electric fan generates wind to discharge the heat from the radiator to the outside of the computer. What = "Personal computer; m" DTT 'system shown in Japanese Patent Laid-Open No. 2000-2779 63, at least two heat pipe-end systems are capable of transferring heat. 2 The other end of the heat pipe is designed to be able to transfer heat to the postal machine = skull. In the chain mechanism, the aforementioned hinge mechanism is installed in the personal computer to transfer heat, and the other end of the first heat pipe is arranged to use the hinge mechanism. The above-mentioned radiator is far away from the aforementioned value policy. Inside the personal computer, the heat generated by the CPU passes through 埶 n 2 ',,, °. The heat is then dissipated by the radiator to the outside of the computer. "Setting" refers to the installation of 3, 1 flat, 6b, 79b, 97b, 97b, and "The computer's cooling and cooling connection, at the same time; frame, multiple internal heating parts, using a heat pipe phase heater, changed from ^ heat change = One end of the official is connected to the diffuser set adjacent to the electric fan. The electric fan will dissipate the heat 'through the heat pipe to the heat sink', and then the heat will be discharged to the outside of the computer.
2145-54〇5-PF(Nl).ptd 第7頁 200301855 五、發明說明(4) 【發明内容】 【發明所欲解決的課題】 可疋’這些先前技術所例舉之冷卻機構,熱管之放熱 部全部都是連接到配設於個人電腦框體内部之風扇。 如此一來’上述冷卻機構會使熱蓄積於個人電腦内 部,而影響到其他零件,由此觀之,其不能說是良好設 計。 換言之’風扇本身在框體内會發熱,而且熱風會在框 體内移動’所以’不能說不會使個人電腦内部溫度上升, 因而有可能會影響到其他零件。 本發明之目的係提供一種個人電腦冷卻裝置,將自 CPU等發熱零件所發出之熱,效率良好地排放到個人電腦 外部,而能夠防止熱蓄積在個人電腦内部。 【用於解決課題的手段】 為了解決上述課題,本發明之個人電腦冷卻裝置,採 用如下技術性手段。 發熱部及放熱部係以熱管連結,前述發熱部具有c Ρ ϋ 等發熱零件而被裝設於個人電腦框體内部,與個人電腦框 體成一體,刖述放熱部係與前述發熱部呈絕熱狀態。(申 請專利範圍第1項) 前述放熱部包括:筒部,與前述個人電腦權體為絕熱 而隔斷,而且開設有開口部;以及散熱器,設置於前述, 部内,而且固著於前述熱管之放熱部。(申請專利範圍第 2項)2145-54〇5-PF (Nl) .ptd Page 7 200301855 V. Description of the Invention (4) [Summary of the Invention] [Questions to be Solved by the Invention] The cooling mechanisms exemplified by the prior art, heat pipes, etc. The radiators are all connected to fans installed inside the personal computer case. In this way, the above-mentioned cooling mechanism causes heat to be accumulated inside the personal computer and affects other parts. Therefore, it cannot be said that it is a good design. In other words, 'the fan itself generates heat inside the casing and the hot air moves inside the casing', so it cannot be said that it will not increase the internal temperature of the personal computer and may affect other parts. An object of the present invention is to provide a personal computer cooling device that efficiently discharges heat generated from a heat-generating component such as a CPU to the outside of a personal computer, and can prevent heat from being accumulated inside the personal computer. [Means for solving the problems] In order to solve the above problems, the personal computer cooling device of the present invention employs the following technical means. The heat generating part and the heat releasing part are connected by a heat pipe. The heat generating part has c P ϋ and other heat-generating components and is installed inside the personal computer case to be integrated with the personal computer case. The heat releasing part is thermally insulated from the heat generating part. status. (No. 1 in the scope of patent application) The aforementioned heat radiation unit includes a cylinder portion which is insulated from the personal computer's right body and is provided with an opening portion; and a heat sink is provided in the aforementioned portion and fixed to the heat pipe. Exothermic department. (Item 2 of the scope of patent application)
2145-5405-PF(Nl).ptd 第8頁 200301855 五、發明說明(5) 月ί(述熱官在前述放熱部和 抑 熱構件包覆。(申嗜專利μ η」过放熱益之間王部以絕 、τ明寻利乾圍第3項) 前述發熱部且備私:巷古a 、2145-5405-PF (Nl) .ptd Page 8200301855 V. Description of the Invention (5) Yue (the heat officer covers the aforementioned heat releasing part and the heat suppressing member. (Shen Hsien Patent μ η) between the exothermic benefits The king's ministry must be unique, and τ Ming seeks to benefit the Qianwei. (3) The aforementioned heating department is also private: Xianggu a,
Bi , ^ m ,, , σ載有則述發熱零件之吸熱板,同Bi, ^ m ,,, σ contain the heat-absorbing plates of the heat-generating parts described above.
时’刖述吸熱板固著右箭 — 丨J 圍第4項) 有引述熱官之受熱部。(申請專利範 風戶引ΐ =之構成係在前述散熱器上組合有強制空a 風扇。(申請專利範圍第5項) 7 Φ :述筒部係設置於前述個人電腦框體側面,同時 述W之外形,係、前述筒部與前述個人電腦框 硯形狀略呈四方體。(申請專利範圍第6項) 外 【實施方式】 接著,芩照圖面來說明本發明之個人電腦冷一 實施型態。 、置 在本實施型態中之個人電腦冷卻裝置,係具備 1、放熱部2及熱管3。 …σ 發熱部1係由C P U等發熱零件U及吸熱板丨2所構成,被 裝設於個人電腦框體Α内之電子迴路基板β上,中間挾著吸 熱板1 2而連結有發熱零件11,前述發熱零件丨丨係以電氣式 及機械式的方式連接到前述電子迴路基板]B。 〃工 放熱部2係具備筒部21、散熱器22及強制空冷風扇 23 。 ’ 7 + 筒部2 1被設置於個人電腦框體a側面,以使與個人電 腦框體A結合後之外觀略呈四方體,而且,筒部與發熱 部1係呈絕熱狀態。在筒體2 1側面開設有與外部連通之開Shi ’said the heat sink is fixed with a right arrow — 丨 J around item 4) There is a heat receiving section that quotes the heat officer. (The composition of the patent application Fan Fenghuo ΐ = The structure is a combination of a forced air a fan on the aforementioned radiator. (Item 5 of the scope of patent application) 7 Φ: The cylinder is set on the side of the aforementioned personal computer frame, and also described The shape of W is a rectangular parallelepiped, and the shape of the tube and the frame of the personal computer are slightly rectangular. (Item 6 of the scope of patent application) [Embodiment] Next, the implementation of the personal computer cooling according to the present invention will be described with reference to the drawings. Type. The personal computer cooling device installed in this embodiment is equipped with 1, the heat radiation part 2, and the heat pipe 3. σ The heating part 1 is composed of a heating part U such as a CPU and a heat absorption plate 2 and is installed. The electronic circuit substrate β provided in the personal computer casing A is connected with a heat-generating component 11 with a heat-absorbing plate 12 interposed therebetween, and the heat-generating component 丨 丨 is electrically and mechanically connected to the electronic circuit substrate] B. The masonry heat radiating section 2 is provided with a tube section 21, a radiator 22, and a forced air cooling fan 23. '7 + The tube section 21 is provided on the side of the personal computer casing a so as to be combined with the personal computer casing A The appearance is slightly rectangular, and , The heat generating portion 1 and the tubular portion form an adiabatic system state defines the opening in communication with the outside of the side surface of the cylindrical body 21
2145-5405-PF(Nl).ptd 第9頁 200301855 五、發明說明(6) 口部2a。又,在與開口部2a相對之側面,開設有狭縫狀之 通氣孔(未圖示)。 散熱器22係呈設置有散熱.1耆片221之盒狀。 結構 部° 強制空冷風扇23,係藉由電力使風扇旋轉之眾所週知 ’其與散熱器2 2組合成 肢’而被配設於汽部2 1内 熱管3進行著眾所週知的熱循環,能鈞古^ , 此列阿效率地進耔 熱傳導。而且’熱管3 —端(受熱部)被插 订 板12,同時,熱管3另一端(放熱部)祜奸 、…、 器2 2,而且,熱管3在前述兩者之間,将、、儿# 、畋…、 體A内壁面配設。並且,為了熱管3在放熱部2 $电%框 之間,全部以絕熱管(絕熱構件)3丨包覆,、和散熱器2 2 射到個人電腦内部,熱也不會傳導到個=^以使熱不會放 又,熱管3如圖面所示,雖然併設2支電飚框體A。 於此,可以併設任意數量之埶管],,、,& ’隹是並不侷限 果。 Μ得充分的冷卻效 接著,說明如上述構成之個人電 首先,自發熱零件1 1產生之熱係 ~ Ρ衣置的動作。 受熱部之順序而傳導,熱藉由絕熱^吸熱板1 2及熱管3 腦内部,而傳遞到個人電腦框體/、外\ 不會玫熱到個人電 遞到熱管3放熱部的熱,被傳導到^ °卩的熱管3放熱部。傳 2 2 1,再藉由強制空冷風扇2 3之風政熱器2 2的放熱鰭片 而熱則由開口部2 a被排出。 使玫熱魚蓄片2 2 1被空冷, 在熱管3内部,藉由埶營 而進行一2145-5405-PF (Nl) .ptd Page 9 200301855 V. Description of the invention (6) Mouth 2a. Moreover, slit-shaped vent holes (not shown) are formed on the side opposite to the opening 2a. The heat sink 22 is in the shape of a box provided with a heat sink 1. Structural section ° Forced air-cooling fan 23 is a well-known 'it is combined with radiator 2 2 to form a limb' by rotating the fan by electric power, and is arranged in steam section 2 1 and internal heat pipe 3 performs a well-known thermal cycle. ^ This column efficiently conducts heat conduction. Moreover, the 'heat pipe 3' (heat-receiving portion) is interposed by the inserting plate 12, and at the same time, the other end of the heat pipe 3 (heat-radiating portion) is raped, ..., and the heat pipe 3 is between the two, # 、 畋… 、 The inner wall surface of the body A is arranged. In addition, for the heat pipe 3 to be enclosed between the heat dissipation unit 2 and the electric power% frame, they are all covered with a heat insulation pipe (insulation member) 3 丨, and the heat sink 2 2 is injected into the personal computer, and the heat is not transmitted to the individual = ^ In order to prevent the heat from being released, the heat pipe 3 is shown in the figure, although two electric frame units A are provided in parallel. Here, it is possible to set any number of arbitrators] ,,, & ′ is not limited. M to obtain a sufficient cooling effect Next, the personal electric device having the above-mentioned configuration will be described. First, the operation of the heat system ~ P garment generated from the self-heating component 11 is described. The heat is transmitted in the order of the heat receiving part. The heat is transferred to the personal computer frame // outside through the adiabatic heat absorption plate 12 and the heat pipe 3, and the heat from the personal electric transfer to the heat pipe 3 heat releasing part is not transmitted. The heat pipe 3 is radiated to ^ ° 卩. Pass 2 2 1 and then the heat is discharged through the opening 2 a through the heat radiating fins of the wind heater 22 of the forced air cooling fan 2 3. The rose hot fish storage piece 2 2 1 was air-cooled, and inside the heat pipe 3, a
2145-5405-PF(Nl).ptd 第10頁 …、g 3兩蠕產生溫度差, 2UUJ01855 五、發明說明(7) ί力環’將傳導到吸熱板12之熱’持續而效率良好 產生ίΐ:來,在個人電腦框體A外部,係將自發熱構件 個人空冷之構造’戶斤以,風扇之排氣不會蓄積於 升外也r吏溫度上升’除了能夠防止裝置整體溫度上 卜也此夠使發熱零件u本身效率良好地被冷卻。 會產生隧:為散熱器22 (熱源)係、配設於筒部21内,所以 夠僅將iif果,#由前述隨道效果及強制空冷風扇,能 出。11欠政熱器22發出熱的空氣’效率良好地加以排 發揮卻y:散熱器22配設於筒部21内’筒部21能 使低速旋轉的作用。因此,強制空冷風扇23即 冷卻氣流。田μ此Λ。效率良好地形成用於冷卻散熱器22的 噪音。μ 此,能夠降低強制空冷風扇23轉速,而減少 埶突件,伯f本κ %型態中,其構成雖然係僅對應1個發 ‘音對庫福釤Γ,本發明之構成並不侷限於此,其係可以任 f應複數個發熱零件。 o f e在本K ^型態中,雖然在筒部側面開設有開口部 置Η : : ’ ί個人電腦為立式時’也,可以在筒部上表面設 f a ί。在這種狀況下,溫暖的空氣朝向開口部上升, :::自開設於與開口部相對面(成為筒部底面)的通氣 而產生平順的自然對流,因此獲得煙囪效果,所 1 ’在CPU等零件之發熱量少時,可以不使用強制空冷風2145-5405-PF (Nl) .ptd page 10 ..., g 3 two worms produce a temperature difference, 2UUJ01855 V. Description of the invention (7) The force ring 'will conduct heat to the heat absorbing plate 12' continuously and efficiently. : Come, outside the personal computer casing A, the structure of the self-heating of the self-heating components is personally cooled, the fan exhaust does not accumulate in the rise, and the temperature rises, in addition to preventing the overall temperature of the device. This is sufficient for the heat generating component u itself to be efficiently cooled. A tunnel will be generated: it is a radiator 22 (heat source) and is arranged in the tube portion 21, so it is enough to use only the iif results, which can be output by the aforementioned effect and forced air cooling fan. 11 The hot air ′ emitted from the heat exchanger 22 is efficiently exhausted. However, the radiator 22 is disposed in the tube portion 21, and the tube portion 21 can rotate at a low speed. Therefore, the forced air cooling fan 23 cools the airflow. Tian μ this Λ. The noise for cooling the heat sink 22 is efficiently formed. μ In this way, the speed of the forced air cooling fan 23 can be reduced, and the projections can be reduced. Although the structure of the κ% type is only corresponding to one utterance, the structure of the present invention is not limited. Here, it can be used for several heating parts. o f e In this K ^ form, although an opening is provided on the side of the tube portion. Η:: ‘When the personal computer is in a vertical position’, f a ί may be provided on the upper surface of the tube portion. In this situation, the warm air rises toward the opening, ::: Since the ventilation opened on the opposite side of the opening (becomes the bottom of the tube), smooth natural convection is generated, so the chimney effect is obtained, so 1 'in the CPU When the heat generation of the parts is small, forced air cooling can not be used
2145-5405-PF(Nl).ptd2145-5405-PF (Nl) .ptd
第11頁 200301855 五、發明說明(8) 扇。又,因為係無風扇構造,所以,就沒有強制空冷風扇 所產生的噪音。 【發明效果】 藉由上述構成,本發明具有以下效果: (1 )藉由使用熱管,在CPU等發熱零件上方,僅需預 留設置吸熱板的空間。因此,就無須裝設習知之大型散熱 器,能夠達到減少發熱零件週邊裝設零件所佔之空間。 (2 )以熱管作熱傳遞,而且在裝置外部使用與風扇 一體化之散熱器來進行冷卻,所以,在裝置外部能夠實施 確實的空冷。在裝置内部,使風扇接觸發熱零件而進行冷 卻的方法(目前之主流方法)中,冷卻後之排氣係積蓄於 裝置内部,而引起裝置内部溫度上升,但是,使用本發明 的話,除了能夠避免裝置内部溫度上升,同時,能夠獲得 發熱零件本身之冷卻效果。 〇 (3 )藉由將放熱部配設於筒部内,能夠確保安全 性,同時,也能夠藉此獲得煙1¾效果,即使風扇為低轉速 也能夠效率良好地將熱排出到外部。更有甚者,當僅藉由 煙囪效果就能夠獲得冷卻效果時,僅藉由散熱器就能夠進 行冷卻,因此能夠減少零件數量及提高靜音性。Page 11 200301855 V. Description of Invention (8) Fan. In addition, because it has a fanless structure, there is no noise generated by a forced air cooling fan. [Effects of the Invention] With the above configuration, the present invention has the following effects: (1) By using a heat pipe, it is only necessary to reserve a space for installing a heat absorption plate above a heat-generating component such as a CPU. Therefore, it is not necessary to install a conventional large-sized heat sink, and the space occupied by installing parts around the heating parts can be reduced. (2) The heat pipe is used for heat transfer, and a radiator integrated with a fan is used to cool the outside of the device, so that it can be reliably air-cooled outside the device. In a method in which a fan is cooled by contacting a heating component inside the device (currently the mainstream method), the exhaust gas after cooling is accumulated inside the device, causing the internal temperature of the device to rise. However, in addition to using the present invention, it can avoid The internal temperature of the device rises, and at the same time, the cooling effect of the heating element itself can be obtained. 〇 (3) By disposing the heat radiation part in the tube part, safety can be ensured, and at the same time, the smoke effect can be obtained. Even if the fan is at a low speed, the heat can be efficiently discharged to the outside. What's more, when the cooling effect can be obtained only by the chimney effect, the cooling can be performed only by the radiator, so the number of parts can be reduced and the quietness can be improved.
2145-5405-PF(Nl).ptd 第12頁 2003018552145-5405-PF (Nl) .ptd Page 12 200301855
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JP2002003927A JP2003209385A (en) | 2002-01-10 | 2002-01-10 | Personal computer cooling equipment |
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TW200301855A true TW200301855A (en) | 2003-07-16 |
TWI241474B TWI241474B (en) | 2005-10-11 |
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TW091137154A TWI241474B (en) | 2002-01-10 | 2002-12-24 | Cooling device of personal computer |
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KR (1) | KR20030061315A (en) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI399165B (en) * | 2004-06-08 | 2013-06-11 | Nvidia Corp | System for efficiently cooling a processor |
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Publication number | Priority date | Publication date | Assignee | Title |
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EP1531384A3 (en) * | 2003-11-14 | 2006-12-06 | LG Electronics Inc. | Cooling apparatus for portable computer |
KR100783613B1 (en) * | 2006-03-07 | 2007-12-07 | 잘만테크 주식회사 | Power supply unit |
JP4685692B2 (en) * | 2006-04-14 | 2011-05-18 | 株式会社日立製作所 | Electronics |
US20080043425A1 (en) * | 2006-08-17 | 2008-02-21 | Justin Richard Hebert | Methods and systems for cooling a computing device |
JP6135363B2 (en) * | 2012-12-21 | 2017-05-31 | 東芝ホームテクノ株式会社 | heat pipe |
-
2002
- 2002-01-10 JP JP2002003927A patent/JP2003209385A/en active Pending
- 2002-12-24 TW TW091137154A patent/TWI241474B/en not_active IP Right Cessation
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2003
- 2003-01-09 KR KR10-2003-0001247A patent/KR20030061315A/en not_active Application Discontinuation
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI399165B (en) * | 2004-06-08 | 2013-06-11 | Nvidia Corp | System for efficiently cooling a processor |
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