JP2011108997A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of mounting thereon a wide variety of high density server modules and capable of cooling a high output electric power source module in a miniaturized and high density electric power source module for the server, a server apparatus capable of dealing with an increased power consumption of a semiconductor element in a high performance server module and a blade server for which the shape is restricted. <P>SOLUTION: The electric power source module is configured such that an electronic substrate mounted with a transformer, a regulator, a capacitor and the like, and a cooling fan are contained in a metal plate case of an electric power source module, and air is blown by the fan module, wherein a heat conducting member such as a heat pipe is connected to each of the transformer and the regulator of the electric power source module, one end of the heat conducting member is connected to the metal plate case of the electric power source module, a heat radiating fin of the fan module is connected to a metal plate case of fan module, and the metal plate case to which the heat conducting member of the electric power source module is connected and the metal plate case to which the heat radiating fin of the fan module is connected are connected via a heat conducting sheet. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic device apparatus equipped with a power supply module that performs optimum cooling for miniaturization and higher density of the power supply module.

  Since electronic devices such as blade servers generate heat due to an increase in power consumption of semiconductor elements such as CPUs as the amount of information and processing speed increase, semiconductor devices mounted on power supply modules that convert to predetermined electricity Thermal effects have become a problem.

  Semiconductor elements constituting the power supply module coexist with high heat generation and relatively high heat resistant temperature, and low heat generation but low heat resistant temperature. The latter semiconductor element having a low heat-resistant temperature is greatly affected by the heat generated by the highly heat-generating semiconductor element from the blade server, so that the original performance of the power supply cannot be exhibited and the power supply itself may be damaged.

  Therefore, a power supply module including a semiconductor element having a low heat-resistant temperature includes a cooling device such as a cooling fan and a heat radiating fin for cooling various semiconductor elements and managing them in an optimum temperature range.

  From a dimensional relationship between the outer shape of the cooling fan and the device frame (larger outer shape of the cooling fan), for example, Japanese Patent Application Laid-Open No. 2005-033088 (Patent Document 1) is an example of a power supply device equipped with a heat sink with a cooling fan. .

  Japanese Patent Laid-Open No. 2001-015968 (Patent Document 2) is an example of an electronic device cooling structure in which a cooling fan and a heat sink are connected to a power source.

  Furthermore, there exists Unexamined-Japanese-Patent No. 11-098772 (patent document 3) as an example of the structure which can pressurize a heat sink to the heat generating body of a power supply.

Japanese Patent Laying-Open No. 2005-033088 JP 2001-015968 A JP 11-098772 A

  A server device represented by a blade server is such that each module such as a CPU, I / O, and power supply constituting the server can be detachably exchanged and mounted in a server case according to the needs of an information processing user. It has a configuration.

  That is, for example, when a user installs a server module equipped with a CPU with increased power consumption, a power supply module corresponding to the CPU is required for increasing power consumption.

  Since this power supply module generates heat when it loses conversion from alternating current to direct current, it is necessary to provide a cooling device with high cooling performance. However, since the size of each module is determined, the size cannot be easily changed. Therefore, a high-performance cooling device is required because the power module cannot change its size.

  As a cooling device for a power supply module, a structure in which heat is dissipated in the power supply module using a combination of a cooling fan and a heat sink has been studied.

  The cooling device for a semiconductor element of a power supply module described in Patent Document 1 described above includes a heat dissipating fin in which a plurality of fins are arranged in parallel on a base, and a cover having openings through which the plurality of fins are respectively inserted. The tip of the fin is located outside the cover and the root of the fin is located inside the cover, so that both natural air cooling and forced air cooling can be taken in efficiently.

  However, in Patent Document 1, it is limited to the case where the power supply module generates heat uniformly, and the influence on the cooling performance due to the difference in heat generation amount and heat-resistant allowable temperature of each semiconductor element mounted in the power supply module. However, no consideration is given to this issue.

  In the technique described in Patent Document 2, a heat conductive substrate with a heat transfer medium interposed between upper and lower surfaces of a heat sink with a cooling fan is attached. The heat sink is radiated by a cooling fan that blows air in a direction parallel to the surface of the thermally conductive substrate. Thereby, the ventilation distance of a heat sink can be shortened, ventilation resistance can be reduced, and a heat sink and a cooling fan can be made small.

  However, in Patent Document 2, there is a possibility that the influence on a semiconductor element having a low heat-resistant temperature may become a problem due to the occurrence of an increase in air temperature due to a highly heat-generating semiconductor element in the power supply module.

  Furthermore, the cooling structure of the power supply module described in Patent Document 3 is provided with a ventilation hole that communicates the cooling fan side and the heat generating component contact surface side in a portion facing the heat generating component of the heat sink body. As a result, the flow of the cooling air from the cooling fan is changed, and the heat generating components can be directly cooled by the cooling air, so that the assembly of the power supply device is easy and the cooling performance can be improved.

  However, in Patent Document 3, there is a possibility that cooling air is distributed to a semiconductor element having a low heat-resistant allowable temperature in the power source and a semiconductor element having a high calorific value, an increase in the air temperature, and the like. No consideration is given.

  The objective of this invention is providing the electronic device apparatus which can cool efficiently the semiconductor element of the power supply module mounted in a blade server.

  The purpose is to provide a fan module in which a cooling fan and a heat radiating member are housed in a housing, a server module in which electronic components are mounted, a server module in which heat radiating fins are housed in the housing, a substrate on which semiconductor elements are mounted, and a cooling fan. And a power supply module housed in the electronic device, wherein the heat of the electronic component is cooled by a cooling fan and a heat dissipation member of the fan module, and the heat connected to the semiconductor element of the power supply module A conducting member and one end of the heat conducting member are thermally connected to the housing of the power supply module, and a heat dissipation member of the fan module is thermally connected to the housing of the fan module, and the housing of the power supply module And the housing of the fan module is achieved by being thermally connected via a heat transfer sheet.

  Moreover, the said objective is achieved by the said heat conductive member being a heat pipe.

  Further, the above object is that the heat radiating member in the fan module is composed of a radiator of a water cooling device using a liquid as a cooling medium, and a heat receiving jacket connected to the radiator is thermally connected to the casing of the fan module. Is achieved.

  Further, the above object is that the heat dissipating member in the fan module is composed of a heat receiving jacket of a water cooling device using a liquid as a cooling medium, and a radiator connected to the heat receiving jacket is heated to a door that opens and closes the back of the server device. This is achieved by connecting them together.

  Further, the above object is achieved by forming a part of the casing constituting the fan module by the base of the heat dissipation fin of the fan module.

  Further, the above object is achieved by the heat conducting member of the power supply module forming part of the casing constituting the power supply module.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device apparatus which can respond to the increase in the power consumption of the semiconductor element in a high performance server module can be provided.

It is a perspective view explaining the structure of a general server apparatus. It is the outline | summary block diagram seen from the front and back of a general server apparatus. It is the figure which looked at the figure seen from the front of FIG. 2 by AA and BB. It is the figure seen from the upper surface and side surface of each module part provided with one Example of this invention. It is sectional drawing which shows the structure of the blade server provided with the other Example of this invention. It is sectional drawing which shows the structure of the blade server provided with the other Example of this invention. It is a disassembled schematic perspective view which shows the structure of the cooling device in this invention.

  Before describing an embodiment of the present invention with reference to the drawings, a schematic configuration of a blade server will be described with reference to FIGS.

  FIG. 1 is a perspective view of a general blade server.

  FIG. 2 is a diagram showing the front and back of a general blade server.

  FIG. 3 is a cross-sectional view taken along line AA and a cross-sectional view taken along line BB in FIG.

  In FIG. 1, reference numeral 1 denotes a server apparatus body. The server device body 1 is provided with a blade server 2 together with other devices not shown. As will be described in detail later, a plurality of server modules 3 are detachably mounted on the blade server 2 as shown by arrows (front-rear direction) in FIG.

  1 to 3 show an example in which six server modules 3 are inserted on the front side of the blade server 2.

  A front door 2a is attached to the front side of the blade server 2 so as to be opened and closed as indicated by an arrow. Although not shown, the front door 2a has an opening over the entire surface so that cooling air can be taken in. 2b is a back door. The rear door 2b rotates as indicated by an arrow in the same manner as the front door 2a, and an opening is formed over the entire surface so that cooling air can be taken in although not shown.

  In FIG. 2, when the server body 1 is viewed from the front, a plurality of server modules 3 are inserted into the blade server 2 in the width direction. The server module 3 is managed and controlled by the management module 7. A fan module 4 and a power supply module 5 are placed on the back side.

  In FIG. 3, the fan module 4 is positioned on the back side of the server module 3 as shown in the AA cross section. Further, as shown in the BB cross section, the power supply module 5 is positioned on the back side of the management module 7. The blade server 2 is equipped with an I / O module 6 for communicating data, and these electronic components also generate heat and are cooled by a fan (not shown).

  As described above, the general server module 3 is cooled by the dedicated fan module 4, but cooling of the semiconductor elements mounted inside the power supply module 5 has not been considered.

  Therefore, the inventors of the present invention have considered using the metal casing constituting the fan module 4 and the casing constituting the power supply module 5 as a kind of heat conducting member. That is, the cooling of the power supply module is considered by sharing the heat conducting member (heat radiating member) by thermally connecting the housing of the fan module 4 and the housing of the power supply module.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  4 is a partial cross-sectional view of the blade server as seen from above and a view from the side, and FIG. 1 (1) is a view of the fan module as seen from above. FIG. 1B is a view of the power supply module portion as viewed from above. FIG. 1 (3) is a side view.

  In FIG. 4, the blade server 2 has the server module 3, the fan module 4, and the power supply module 5 mounted thereon as described above. The power supply module 5 houses a transformer 51 and a regulator 52 that have high heat generation and a relatively high heat-resistant allowable temperature. Furthermore, a power supply board 54 and a cooling fan 55 on which a capacitor 53 that has low heat generation but has a low heat-resistant allowable temperature, a filter coil 57 that rectifies current, and the like are mounted. These are covered with a casing sheet metal 56 or the like.

  The server module 3 is mounted with a mother board 34 on which a CPU 31, a memory 32, a chip set 33 made of semiconductor elements, and the like are mounted. Moreover, the radiation fin 35 for cooling heat_generation | fever of CPU31 is installed. The radiating fins 35 may be a boiling type cooling device that utilizes a phase change of the refrigerant. These are covered with a housing sheet metal 36 or the like. Reference numeral 58 denotes a heat conducting member such as a heat pipe.

  In the fan module 4, a relatively large cooling fan 41 and heat radiating fins 42 serving as heat radiating members are covered with a casing metal plate 43 or the like. The heat dissipating fins 42 thermally cool the transformer 51 and the regulator 52 having a relatively high heat-resistant allowable temperature due to the high heat generation of the server module 3 and the power supply module 5 to the housing sheet metal 43. It was described to be placed next to each other. However, as shown in FIGS. 1 and 2, each of the plurality of server modules 3 and each power supply module may be opposed to each other and mounted as a large fan module. The cooling fan 41 mounted on the electronic device is generally a propeller fan.

  When a plurality of propeller fans are mounted in parallel, it is necessary to cancel the swirling flow from the upstream fan and rectify. Therefore, the radiating fin 42 has a role for canceling the swirling flow and rectifying. The shape may be sufficient.

  In the power supply module 5, the heat of the capacitor 53 that has low heat generation but has a low heat-resistant allowable temperature and the filter coil 57 that rectifies the current is released outside the blade server 2 by cooling air from the cooling fan 55 of the power supply module 5. It is like that. On the other hand, the heat of the transformer 51 and the regulator 52 having a high heat generation and a relatively high heat-resistant allowable temperature is transmitted to the housing sheet metal 56 of the power supply module 5 via a heat conducting member 58 such as a heat pipe.

  The heat conducting member 58 may serve as a part of the casing metal plate 56 of the power supply module 5. Further, the heat transfer sheet 8 provided between the power supply module 5 and the fan module 4 allows the heat of the power module 5 to generate heat and the heat of the transformer 51 and the regulator 52 that have a relatively high heat-resistant allowable temperature. 43, transmitted to the radiation fins 42, and discharged to the outside of the blade server 2 by a relatively large cooling fan 41. A base portion 421 (details will be described later) of the heat radiating fin 42 may constitute a part of the housing sheet metal 43 of the fan module 4.

  FIG. 5 is a side sectional view for explaining a blade server provided with another embodiment.

  In FIG. 5, in this embodiment, a water-cooled radiator 45 driven by a pump 44 is provided in place of the radiating fins 42 which are radiating members in the fan module 4 described in the first embodiment.

  The heat of the transformer 51 and the regulator 52 having high heat generation and relatively high heat-resistant allowable temperature of the power supply module 5 is transmitted to the housing sheet metal 43 of the fan module 4. The heat transmitted to the housing sheet metal 43 is transmitted to the water-cooled radiator 45 that is not thermally connected, and is released to the outside of the blade server 2. As in the case of the first embodiment, the heat receiving jacket portion 451 of the water-cooled radiator 45 may constitute a part of the housing sheet metal 43 of the fan module 4. This water-cooled radiator 45 is a general water-cooling device in which a heat receiving jacket 451, a water tank (not shown), and a pump 44 are connected by a flexible hose.

  FIG. 6 is a side sectional view for explaining a blade server provided with another embodiment.

  In FIG. 6, the present embodiment replaces the heat radiation fins 42 that are heat radiation members in the fan module 4 described in the first embodiment and the water-cooled radiator 45 described in the second embodiment with the heat receiving jacket portion 451 of the second embodiment. A different heat receiving jacket 46 is attached to the housing sheet metal 43 of the fan module 4.

  From this heat receiving jacket 46, piping is extended to the back door 2b of the server apparatus 1, and the water-cooled radiator 91 attached to the back door 2b is connected. This water-cooled radiator 91 is piped to the rear door 2b in order to ensure as large a heat radiation area as possible. However, when the water-cooled radiator 91 is enlarged, it goes without saying that a heat receiving jacket having performance corresponding to the size is required.

  The heat collected in the heat receiving jacket 46 by the liquid circulated by a pump (not shown) is transmitted from the water cooling pipe 92 to the water cooling radiator 91 and released to the outside of the server device 1. The heat receiving jacket 46 may constitute a part of the housing sheet metal 43 of the fan module 4.

  Here, a cooling device mounted on the power supply module of the present invention will be described with reference to FIG.

  FIG. 7 is an exploded perspective view of a power supply module cooling apparatus provided with an embodiment of the present invention (a cooling fan is omitted).

  In FIG. 7, a power source board 54 is mounted with a transformer 51 having a high heat generation and a relatively high heat-resistant allowable temperature, a regulator 52, and a capacitor 53 having a low heat generation but a low heat-resistant allowable temperature. Further, the heat conducting members of flat heat pipes 511 and 521 are attached to the transformer 51 and the regulator 52, respectively. One end (not shown) of the flat heat pipes 511 and 521 is thermally connected to the casing metal plate 56 of the power supply module via grease, a heat transfer sheet, or the like.

  A heat transfer sheet 8 is provided between the housing sheet metal 56 of the power supply module and the housing sheet metal 43 of the fan module, and a spring or the like (not shown) attached to the module to reduce the contact thermal resistance of the heat transfer sheet 8. )). In addition, heat radiating fins 42 are attached to the housing sheet metal 43 of the fan module via grease, a heat transfer sheet, or the like. The base 421 of the heat radiating fin 42 may also serve as a part of the housing sheet metal 43 of the fan module. Further, the heat radiating fins 43 may be the water-cooled radiator 91 shown in FIG. 5, the high performance heat receiving jacket 46 shown in FIG.

  Here, the temperature of the transformer 51 and the regulator 52 having high heat generation and relatively high heat-resistant allowable temperature will be described.

  As described with reference to FIG. 4, the cooling air volume in the fan module is higher than that of the power supply module in order to cool the heat generated from the server modules such as the CPU and the memory. The inflow air temperature of the radiating fin 43 is the server module outlet air temperature, and since the air volume here is large, the air temperature is relatively lower than the air temperature in the power supply module.

  From the above, the heat of the transformer 51 and the regulator 52 having high heat generation and relatively high heat-resistant allowable temperature is transmitted to the heat radiation fins 42 in the fan module, and the transformer 51 and the regulator 52 can be cooled well. Furthermore, since the heat of the transformer 51 and the regulator 52 having high heat generation and relatively high heat-resistant allowable temperature is transmitted to the heat dissipation fins 42 of the fan module and is not released from the power supply module, the temperature rise of the air in the power supply module can be reduced.

  Conventionally, a large radiating fin is mounted on the transformer 51 and the regulator 52, which have high heat generation and a relatively high heat-resistant allowable temperature, for heat radiation, and the capacitor 53 becomes a shadow of the large radiating fin, and there is insufficient cooling air or air temperature. There was a rising problem.

  However, according to the present invention, the influence of the heat fog (convection, radiation) from the transformer 51 and the regulator 52, which is the main factor of the temperature rise of the capacitor 53 with low heat generation but low allowable heat resistance, is eliminated. For this reason, the capacitor | condenser 53 can be cooled favorably and the cooling fan of a power supply module can be reduced in size. Furthermore, the degree of freedom of the power module mounting layout can be increased, and high-density mounting and high output can be achieved.

  With the above-described configuration, the present invention can provide a small-sized and high-density server power supply module, and can provide a server apparatus that can cope with an increase in power consumption of a semiconductor element in a high-performance server module.

  Even in a blade server whose shape is limited, it is possible to provide an electronic device that can cool a high-output power supply module and can mount various high-density server modules.

  DESCRIPTION OF SYMBOLS 1 ... Server apparatus main body, 2 ... Blade server, 2a ... Front door, 2b ... Rear door, 3 ... Server module, 4 ... Fan module, 5 ... Power supply module, 6 ... I / 0 module, 7 ... management module, 31 ... CPU, 32 ... memory, 33 ... chipset, 34 ... motherboard, 35 ... radiation fins, 36. ············································································································································································ -Transformer, 52 ... Regulator, 53 ... Capacitor, 55 ... Cooling fan, 56 ... Housing sheet metal, 57 ... Filter coil, 58 ... Heat conduction member, 91 ... Water-cooled radiator , 42 ... base portion, 451 ... heat-receiving jacket portion, 511, 521 ... flat heat pipe.

Claims (6)

A fan module that houses a cooling fan and a heat dissipation member in a housing, a server module that houses a board on which electronic components are mounted and a heat dissipation fin, and a power supply that houses a board on which semiconductor elements are mounted and a cooling fan in the housing A server device including a module, wherein the electronic device device cools the heat of the electronic component by a cooling fan and a heat dissipation member of the fan module;
A heat conduction member connected to the semiconductor element of the power supply module and one end of the heat conduction member are thermally connected to the housing of the power supply module, and a heat dissipation member of the fan module is thermally connected to the housing of the fan module. Connected to the
The electronic device apparatus, wherein the casing of the power supply module and the casing of the fan module are thermally connected via a heat transfer sheet. The electronic device apparatus according to claim 1,
The electronic device apparatus, wherein the heat conducting member is a heat pipe. The electronic device apparatus according to claim 1,
The heat dissipating member in the fan module is constituted by a radiator of a water cooling device using a liquid as a cooling medium, and a heat receiving jacket connected to the radiator is thermally connected to a housing of the fan module. Electronic equipment device. The electronic device apparatus according to claim 1,
The heat radiating member in the fan module is composed of a heat receiving jacket of a water cooling device using a liquid as a cooling medium, and a radiator connected to the heat receiving jacket is thermally connected to a door that opens and closes the back of the server device. An electronic apparatus device characterized by the above. The electronic device apparatus according to claim 1,
The electronic device apparatus, wherein a base of the heat dissipating fin of the fan module forms a part of a casing constituting the fan module. The electronic device apparatus according to claim 1,
The electronic device apparatus, wherein the heat conducting member of the power supply module forms a part of a casing constituting the power supply module.

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