JP2007052573A - Server device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow backward and forward insertion/extraction of a plurality of I/F module boards to improve maintenance; and to uniformly cool the plurality of I/F module boards. <P>SOLUTION: In this server device, an I/F unit main board is horizontally joined to a main platter board, and a relaying platter board for mounting the module board is provided. A large-diameter axial-flow fan is disposed above the I/F unit main board, and the relaying platter board is disposed on the downstream side of an air flow to the axial-flow fan such that the relaying platter board blocks a part of flowing air. One portion of the air of the axial-flow fan is discharged rearward from the front of the device through the upper side of an I/F unit, and the other portion strikes the relaying platter board, passes an opening formed in the I/F unit board, and passes a lower side duct provided below the module boards. The air flowing from the lower side duct is made to flow upward from below between the module boards, and the air is discharged to the outside of the device from an upper side duct provided above the module boards. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a server device, and in particular, a device having a plurality of module boards provided on the downstream side of the wind flowing from a cooling fan installed in the apparatus, the board being inserted and removed in the same direction as the blowing direction of wind. The present invention relates to a server device suitable for use.

  First, the structure of a server device according to the prior art and the cooling method thereof will be described with reference to FIG.

  Since the server apparatus is generally mounted in a rack cabinet and used, considering the maintainability of each unit, the main platter board 1 is installed at the center of the apparatus so that each unit can be inserted and removed from the front and rear of the apparatus. The method of connecting and connecting each unit before and after that has become mainstream. Further, a CPU (abbreviation of central processing unit) unit 2 which is an arithmetic processing unit having no external interface is arranged on the front side, and an I / F (abbreviation of interface) unit 3 having an external interface is arranged on the rear side.

  In the I / F unit 3, a plurality of I / F module substrates 11 corresponding to the respective functions are vertically mounted.

  From the above-described mounting form, the axial fan 8 that cools the entire server device needs to be disposed at a position that does not hinder insertion / extraction of each unit, and is an upper part of the I / F unit main board 10, and includes a plurality of I / Fs. It is arranged on the upstream side of the flowing wind with respect to the module substrate 11. Also, large-diameter axial fans with a large air volume and high static pressure are used to support high-density mounting and high heat generation of the device.

  In addition, since the axial fan sucks and discharges wind through the wings, there is no wind from the central motor, so there are many variations in the air volume directly under the axial fan, especially for large-diameter axial fans. The motor part has a large diameter and a high degree of variation. For this reason, since the air volume varies with respect to each of the I / F module substrates 11 mounted in a plurality, the cooling of the I / F module substrate 11 may be insufficient depending on the arrangement. Therefore, it is necessary to secure a sufficient space between the fan and the module to alleviate the variation in the air volume. However, this has a drawback that the depth dimension of the apparatus becomes long.

  On the other hand, regarding cooling of electronic equipment, there is a method of providing a slit-like opening for each module to make the air volume uniform by making a jet. The cooling method of the electronic arithmetic processing device using such a jet duct is disclosed in the following Patent Document 1, for example.

JP-A-6-90092

  In the general server device shown in FIG. 6, the plurality of I / F module substrates 11 are directly connected to the I / F unit main substrate 10 with connectors so as not to obstruct the air flow path of the axial fan 8. Implemented vertically. For this reason, the I / F module substrate 11 is inserted and removed in the vertical direction, and it is necessary to remove the device upper cover 7 at the time of maintenance and replacement. Since the apparatus is also mounted on the upper part of the apparatus, an operation such as drawing out the server apparatus is required, and there is a problem that workability is poor.

  Further, even in Patent Document 1, the problem that the insertion / extraction method of the I / F module substrate 11 is in the vertical direction and the workability is deteriorated still remains unsolved.

  The present invention has been made to solve the above-described problems, and its object is to enable a plurality of I / F module substrates downstream of the axial fan to be inserted and removed in the front-rear direction in the cooling structure of the server device, thereby improving maintainability. In addition, there is a structure in which a plurality of I / F module substrates can be cooled uniformly.

  The server device according to the present invention is a server device in which a plurality of types of units are joined from the front and the back of the device via a vertical main platter substrate, and the main substrate of the I / F unit is connected to the main platter in the I / F unit. The structure is such that a plurality of module boards can be mounted on the relay platter board by horizontally joining the board, providing a relay platter board vertically on the main board. Then, the large-diameter axial fan is arranged on the main board of the I / F unit so as to flow air from the front to the back of the apparatus, and the relay platter board is arranged with respect to the large-diameter axial fan. It is arranged on the downstream side of the wind flow so as to block a part of the wind flowing by the axial fan.

  With such a structure, an opening is formed in the main board of the I / F unit to allow the wind from the large-diameter axial fan to flow to the back side of the board, and the wind from the opening of the main board of the I / F unit is placed in front of the device. A lower duct is provided on the lower side of the module board, and an upper duct is provided on the upper side of the module board for discharging the air that has cooled the module module from the front to the rear of the apparatus and discharging it to the outside. .

  As a result, a part of the air flowing from the axial fan passes through the upper side of the I / F unit and is discharged from the front to the back of the apparatus, and the other part of the air flowing from the large-diameter axial fan is relayed. The platter board passes through the opening provided in the main board of the I / F unit, passes through the lower duct of the module board, and the wind flowing from the lower duct flows from the bottom to the top between the module boards. It is discharged from the duct to the outside of the device.

  According to the present invention, in the cooling structure of the server device, a plurality of I / F module substrates downstream of the axial fan can also be inserted and removed in the front-rear direction to improve maintainability, and the plurality of I / F module substrates are evenly distributed. It is possible to make the structure coolable.

  Embodiments according to the present invention will be described below with reference to FIGS.

  A first embodiment according to the present invention will be described below with reference to FIGS.

  As an outline of mounting of the server apparatus, a main platter board 1 that connects each unit is vertically mounted in the center of the apparatus, and a CPU unit 2 that is a plurality of arithmetic processing units is provided on the front side of the main platter board 1 and a rear side. Are connected to an I / F unit 3 connected to an external device by a cable, a control unit 4 for controlling each unit of the server device, a power supply unit 5 for supplying power, and the like. A fan unit 6 for cooling the entire server apparatus is mounted on the top of the main platter board 1 and on the top of the I / F unit 3, sucks air through the CPU unit 2, and passes through the I / F unit 3. Exhausted.

  The I / F unit 3 has a plurality of I / F module boards 11 provided with connectors for directly connecting to an external device or the like, and a function of controlling those I / F module boards 11, and a main platter board 1, an I / F unit main board 10 connected to 1, and a relay platter board 12 for relaying the connection between the plurality of I / F module boards 11 and the I / F unit main board 10. Is formed.

  The I / F unit main board 10 is connected to the main platter board 1 horizontally, and the relay platter board 12 is connected to the I / F unit main board 10 vertically. Further, the I / F module substrate 11 is connected to the relay platter substrate 12 in the vertical direction. The I / F module substrate 11 is held by a module case 13. Further, an I / F connector 22 is mounted on the I / F module substrate 11 so that the server device and an external device can be connected.

  In this mounting, the I / F unit 3 can be inserted into and removed from the rear of the server device, and the I / F module substrate 11 can be inserted into and removed from the rear of the device while the I / F unit 3 is mounted.

  An axial fan 8 is mounted on the fan unit 6, and the relay platter board 12 is mounted at a height that closes about half of the flow path of the axial fan 8, but between the axial fan 8 and the relay platter board 12. Is arranged with a certain amount of space. Further, a space is also secured between the upper part of the I / F unit main board 10 and the fan unit 6 for mounting.

  The I / F unit main board 10 is mounted on the unit case metal plate 9 while ensuring a space behind the board. Cooling air from the axial fan 8 is connected to the I / F unit main board 10 with the I / F unit main board 10. A main board opening 14 is provided so as to go around the space with the unit case sheet metal 9.

  Below the I / F module substrate 11 is a lower duct 18 formed by a duct sheet metal 23, and above the upper duct 19 is formed by a duct sheet metal 24. The upper duct 19 has a structure for discharging cooling air to the rear surface of the I / F unit 3.

  The duct sheet metal 23 is provided with an intake opening 16 a for blowing air from the main board opening 14 of the I / F unit main board 10, and the duct sheet metal 24 is similarly provided with an exhaust opening 17.

  With the mounting described above, most of the cooling air of the axial fan 8 is exhausted directly to the outside of the apparatus, and a part of the cooling air hits the relay platter board 12 through the main board opening 14 and the I / F unit main board 10. After going around to the back side, it is ejected from the intake opening 16a of the lower duct 18, cools the I / F module substrate 11, passes through the exhaust opening 17 of the upper duct 19, and is further discharged to the outside of the apparatus.

  The wind of the axial fan 8 passes through the flow path that wraps around the back side of the I / F unit main board 10, so that the wind pressure in the flow path is made uniform, and a uniform air volume is applied to each I / F module board 11. Is discharged from the lower duct 18 and used for cooling each I / F module substrate 11.

  Further, an exhaust hole 20 is provided above the upper duct 19 on the rear surface side of the I / F unit 3 so that the cooling air of the axial fan 8 is directly discharged outside the apparatus. A part of the wind of the large-diameter axial fan 8 hits the relay platter board and passes through the opening 14 of the IF unit main board 10 → the lower duct 18 → between the I / F module board 11 → the upper duct 19. / F Used to cool the module substrate 11. The other wind part sent from the large-diameter axial fan 8 is directly exhausted through the exhaust hole 20 to suppress a decrease in the cooling performance of the entire apparatus due to an increase in fan pressure loss. is there.

  When the cross section of FIG. 2 is seen from the BB cross section, it is as shown in FIG.

  The I / F unit main board 10 has two openings 14, and the duct sheet metal 23 is uniformly provided with openings 16 a for sending air to each I / F module.

  According to this mounting form, the I / F module substrate 11 can be inserted and removed in the front-rear direction, thereby improving maintainability and ensuring uniform cooling performance.

  That is, by providing a relay platter board perpendicularly to the I / F unit main board and allowing a plurality of I / F module boards to be inserted into and removed from the I / F unit main board, maintenance work can be performed directly from the rear of the apparatus, improving workability. .

  In addition, it is not necessary to remove the upper cover of the apparatus or to pull out the server apparatus, and there is no danger of disconnection of the cable during operation or dropping of the components inside.

  Further, since the fan wind is turned to the back side of the I / F unit main board and then blown to the I / F module board, the wind pressure is made uniform in the flow path, and the amount of air blown from each I / F module board is reduced. It can be made uniform, and the cooling of the apparatus can be made uniform.

  Hereinafter, a second embodiment according to the present invention will be described with reference to FIG.

  This is a configuration in which the I / F unit main board 10 has a length extending to the bottom of the I / F module board 11 and an intake opening 16b is provided in the I / F unit main board. In this embodiment, the duct sheet metal 23 of the lower duct 1 is omitted. This is a modification of the BB cross section of the first embodiment.

  Thereby, the duct metal plate 23 can be omitted, and the mounting of the cooling structure of the server device can be realized at low cost.

  The third embodiment according to the present invention will be described below with reference to FIG.

  This embodiment shows another form of the module case 13. This is because the lower width of the module case 13 is widened so as to block the intake openings 16a and 16b, and the intake opening 16 is provided in accordance with the position of the heating element 21 on the I / F module substrate 11, and cooling is required. It has a structure that allows wind to flow at a pinpoint in various places.

  As a result, even if the type of the I / F module substrate 11 is changed and the position of the heating element is changed, the position of the intake opening 16 of the module case 13 is changed, so that cooling according to each substrate is possible.

It is a see-through | perspective perspective view of the mounting state of the server apparatus which concerns on 1st embodiment of this invention. It is AA sectional drawing of FIG. 1 which shows the flow path of cooling air. It is BB sectional drawing of FIG. 2 which concerns on 1st embodiment of this invention. It is sectional drawing of the I / F unit which concerns on 2nd embodiment of this invention. It is a perspective view of the I / F module case which concerns on 3rd embodiment of this invention. It is sectional drawing which shows the mounting state of the server which concerns on a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Main platter board | substrate 2 ... CPU unit 3 ... I / F unit 4 ... Control unit 5 ... Power supply unit 6 ... Fan unit 7 ... Apparatus upper cover 8 ... Axial fan 9 ... Unit case sheet metal 10 ... I / F unit main board DESCRIPTION OF SYMBOLS 11 ... I / F module board 12 ... Relay platter board 13 ... Module case 14 ... I / F unit main board opening 16a, 16b ... Intake opening 17 ... Exhaust opening 18 ... Lower duct 19 ... Upper duct 20 ... Exhaust hole 21 ... Heating element 22 ... I / F connector 23 ... Duct sheet metal (lower side)
24 ... Duct sheet metal (upper side)

Claims (3)

In a server device that joins a plurality of types of units from the front and rear of the device via a vertically placed main platter board,
A main board of one type of unit in the plurality of types of units is horizontally joined to the main platter board, a relay platter board is provided vertically on the main board, and a plurality of module boards are rearwardly mounted on the relay platter board. So that it can be inserted and removed from
The fan is arranged on the main board of the unit so as to flow wind from the front to the back of the apparatus,
The relay platter substrate is arranged downstream of the air flow with respect to the fan so as to block a part of the air flowing through the fan,
In the main board of the unit, an opening for flowing the air flowing from the fan to the back side of the board is opened,
A lower duct is provided on the lower side of the module board to flow the wind from the opening of the main board of the unit from the front to the back of the unit, and the air that has cooled the module board is flowed from the front to the back of the apparatus. An upper duct to be discharged to the upper side of the module substrate,
A part of the air flowing from the fan passes through the upper side of the unit and is discharged from the front to the back of the apparatus. The main board of the unit has a length that extends below the module board,
In addition to the first opening for flowing the wind from the fan of the main board of the unit to the back side of the main board of the unit, the second opening for flowing the wind between the lower duct and the module board The server apparatus according to claim 1, further comprising: The opening through which the air flows from the lower duct to the module substrate and the opening from which the air flows from the module substrate to the upper duct are the same opening for each module substrate,
An opening for flowing air from the lower duct to the module board and an opening for flowing air from the module board to the upper duct at a position matched to the heating element on the module board of the module case holding the module board The server apparatus according to claim 1, further comprising a small opening.

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