JP2010073998A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device capable of efficiently cooling the internal space of a case forming the internal space which is almost sealed. <P>SOLUTION: The electronic device includes a case 20 which forms an internal space that is almost sealed, a heating component 11 stored in the internal space, a heatsink 30 provided outside the case 20, a heat pipe 31 which thermally connects the heating component 11 to the heatsink 30, and a heat pipe 32 which thermally connects the case 20 to the heatsink 30. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic apparatus having a structure for cooling a heat generating component housed in a sealed casing.

  In recent years, in the field of computers, CPUs and chipsets have become more sophisticated and multifunctional. Generally, CPUs mounted on computers tend to increase the amount of heat generated during operation of the CPU itself as the operation clock speeds up and the integration becomes higher. An increase in the amount of heat generated directly affects the failure and life of the mounted electronic components, so how to effectively cool down is important for improving the reliability of electronic devices.

  For this reason, various techniques for cooling electronic devices have been proposed. For example, Patent Document 1 discloses a main body fan that cools the entire computer and a CPU fan that intensively cools a CPU that is a heating element. There is disclosed a configuration in which is provided in a housing. Further, when a cooling fan is used in this way, it is common to provide a ventilation hole in the housing in order to exhaust outside so that heat does not accumulate in the housing.

JP 2006-331286 A

  However, depending on the location where the computer is installed, it may be difficult to provide the vent in the housing. For example, in a computer that is used in a place where a lot of dust or smoke is generated, air flows into the vent when the cooling fan operates, so foreign matter tends to accumulate in the vent, and the vent must be maintained without sufficient maintenance. There is a problem that is blocked and stops functioning. In addition, when a fanless configuration without a cooling fan is provided, there is a problem that the amount of heat inside the housing cannot be sufficiently released to the outside.

  The present invention has been made in view of the above, and an object of the present invention is to provide an electronic device that can cool an internal space more efficiently in a housing that forms a substantially sealed internal space. To do.

  In order to solve the above-described problems and achieve the object, the present invention is provided in a housing that forms a substantially sealed internal space, a heat-generating component housed in the internal space, and an exterior of the housing. A first heat pipe that thermally connects the heat-generating component and the radiator, and a second heat pipe that thermally connects the housing and the radiator. Features.

  According to the present invention, the amount of heat generated in the internal space of the casing is transferred to the radiator through the first heat pipe and the second heat pipe, so that the radiator can dissipate heat to the outside of the casing. For this reason, the substantially sealed internal space can be cooled more efficiently.

  Embodiments of an electronic apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. In addition, this invention is not limited by each embodiment described below.

[First Embodiment]
FIG. 1 is a cross-sectional view schematically showing the configuration of the electronic apparatus according to the first embodiment. As shown in FIG. 1, the electronic device 100 according to the first embodiment includes a substrate 12 on which a heat generating component 11 to be cooled is mounted, and a housing 20 that houses the substrate 12 in a substantially sealed internal space. A heat sink 30 provided on the outer wall of the housing 20, a heat pipe 31 that thermally connects the heat sink 30 and the heat generating component 11, and a heat pipe 32 that thermally connects the heat sink 30 and the housing 20. It has.

  The heat generating component 11 is an electronic component serving as a heat source such as a CPU or a chip set, and is thermally connected to the heat pipe 31. Here, the electronic component used as the heat generating component 11 is not particularly limited, but among the electronic components constituting the electronic device 100, the heat generating component 11 is preferably a component having a relatively large heat generation amount. The method of connecting the heat pipe 31 to the heat generating component 11 is not particularly limited. For example, a recess is provided in the heat generating component 11 and the heat pipe is fitted therein, or heat conductivity such as heat conductive grease. It is possible to use a form of connection through a medium having a high height.

  The substrate 12 is an electronic circuit substrate such as a mother board on which the heat generating component 11 is mounted, and is fixed to the bottom of the housing 20 by a spacer 13 made of metal, PCB (Poly Chlorinated Biphenyl), or the like.

  The housing | casing 20 is comprised by the heat absorption layer 21 which consists of members with high thermal conductivity, such as copper, steel, and aluminum. Here, the “member having high thermal conductivity” is a member having a value equal to or higher than a predetermined thermal conductivity. For example, the thermal conductivity is 100 W / (m · K) or higher, or 200 W / (m -It is preferable to set it as the member more than K). The material of the heat absorption layer 21 is not limited to metal, and may be a resin having excellent thermal conductivity, but is required to have rigidity and corrosion resistance that can withstand the use environment.

  The housing 20 is provided with an insertion hole that allows the internal space of the housing 20 to communicate with the outside. The heat generating component 11 and the heat sink 30 are thermally connected by a heat pipe 31 through the insertion hole. It is configured as follows. Here, it is assumed that the gap between the heat pipe 31 and the insertion hole is filled with a heat-conductive filling material such as solder, so that the substantially sealed state of the housing 20 is maintained. Thereby, the heat absorption layer 21 can be thermally connected to the heat pipe 31. As the filling material for the insertion hole, like the heat absorption layer 21, a material having high thermal conductivity is preferable. Further, the connection method between the housing 20 (heat absorption layer 21) and the heat pipe 32 is not particularly limited. For example, the heat absorption layer 21 is provided with a recess and the heat pipe is fitted therein. In addition, it is possible to use a configuration in which connection is made through a medium having high thermal conductivity such as thermal conductive grease.

  The heat sink 30 is formed of a member having high thermal conductivity such as copper, steel, or aluminum, and is fixed to the outer wall portion of the housing 20 by a holder (not shown). The heat sink 30 is provided with a large number of fins (fins) on the opposite side of the surface facing the housing 20, and the amount of heat transferred through the heat pipes 31, 32 is transferred to the housing by the heat transfer action of the fins. 20 Dissipates heat to the outside atmosphere. The connection method between the heat sink 30 and the heat pipes 31 and 32 is not particularly limited. For example, a recess is provided in the heat sink 30 and the heat pipe is fitted therein, or heat such as heat conduction grease is used. A mode of connection through a highly conductive medium can be used.

  The heat pipes 31 and 32 are obtained by enclosing a volatile liquid (working fluid) in a pipe made of a material having high thermal conductivity such as copper, and move heat by circulation of the working fluid. Here, the heat pipe 31 is arranged to thermally connect the heat generating component 11 and the heat sink 30 through an insertion hole provided in the housing 20. The heat pipe 32 is arranged to thermally connect the heat sink 30 and the housing 20 (heat absorption layer 21). As the hydraulic fluid, alternative chlorofluorocarbon, water, methanol, ammonia, or the like can be used.

  According to the cooling mechanism of the electronic device 100 described above, the heat generated by the heat generating component 11 moves to the heat pipe 31 by thermally connecting the heat generating component 11 and the heat pipe 31. Further, since the heat pipe 31 is thermally connected to the heat sink 30, the amount of heat from the heat generating component 11 is moved to the heat sink 30 and is radiated to the atmosphere outside the housing 20 by the heat sink 30. Thereby, the amount of heat generated by the heat generating component 11 can be efficiently radiated to the outside of the housing 20.

  On the other hand, the amount of heat radiated to the internal space of the housing 20 is absorbed by the heat absorption layer 21 and radiated to the atmosphere outside the housing 20. The amount of heat absorbed by the heat absorption layer 21 is transferred to the heat sink 30 through the heat pipe 32, and is radiated to the atmosphere outside the housing 20 by the heat sink 30. Thereby, the amount of heat radiated to the internal space can be efficiently radiated to the outside of the housing 20.

  As described above, according to the cooling mechanism of the electronic device 100 according to the first embodiment, the amount of heat generated in the internal space of the housing 20 is transferred to the heat sink 30 through the heat pipes 31 and 32, thereby Since heat can be radiated to the outside of the housing 20 by 30, the substantially sealed internal space can be cooled more efficiently.

  In addition, in this embodiment, the housing | casing 20 and the heat sink 30 were made into a different body, However, Not only this but the housing | casing 20 and the heat sink 30 are good also as a form comprised integrally. Further, a heat dissipating plate having a large number of perforations may be provided in place of the heat sink 30.

[Second Embodiment]
Next, an electronic apparatus according to the second embodiment will be described with reference to FIG. In addition, about the structure which has the same function as the electronic device 100 which concerns on 1st Embodiment mentioned above, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  FIG. 2 is a cross-sectional view schematically showing the configuration of the electronic apparatus according to the second embodiment. As shown in FIG. 2, the electronic device 200 according to the second embodiment includes a board 12 on which the heat generating component 11 to be cooled is mounted, and a housing 40 that houses the board 12 in a substantially sealed internal space. A heat sink 30 provided on the outer wall of the housing 40, a heat pipe 31 that thermally connects the heat sink 30 and the heat generating component 11, and a heat pipe 32 that thermally connects the heat sink 30 and the housing 40. It has.

  The housing 40 has a two-layer structure including a heat absorption layer 21 that serves as an inner wall portion of the housing 40 and a heat reflection layer 22 that serves as an outer wall portion of the housing 40.

  The heat reflecting layer 22 is formed of a member having a property of reflecting radiant heat, such as mirror-finished aluminum, and is provided so as to reflect radiant heat from the outside of the housing 40. Here, the heat reflection layer 22 is preferably formed of a material having thermal conductivity that can easily absorb the amount of heat from the inside of the housing 40 (heat absorption layer 21). The material of the heat reflecting layer 22 is not limited to metal, and may be a mirror coating, a white gloss coating, or a reflecting sheet that is applied or pasted to the outer wall of the heat absorbing layer 21.

  The housing 40 is provided with an insertion hole that communicates the internal space of the housing 40 with the outside, and the heat pipe 31 thermally connects the heat generating component 11 and the heat sink 30 through the insertion hole. It is arranged. Here, it is assumed that the gap between the heat pipe 31 and the insertion hole is compensated by a member having thermal conductivity such as solder, so that the substantially sealed state of the housing 40 is maintained. Thereby, the housing 40 (the heat absorption layer 21 and the heat reflection layer 22) can be thermally connected to the heat pipe 31. As the filling material for the insertion hole, like the heat absorption layer 21 and the heat reflection layer 22, a material having high thermal conductivity is preferable, so that the heat amount accumulated in the housing 40 is transferred to the heat pipe 31. It can be moved efficiently.

  Further, the heat pipe 32 is arranged to thermally connect the heat absorption layer 21 and the heat sink 30 through an insertion hole provided in the heat reflection layer 22. It is assumed that the gap between the heat pipe 32 and the insertion hole provided in the heat reflecting layer 22 is filled with a heat conductive filling material as in the heat pipe 31.

  According to the cooling mechanism of the electronic device 200 described above, the heat generated by the heat generating component 11 moves to the heat pipe 31 by thermally connecting the heat generating component 11 and the heat pipe 31. Further, since the heat pipe 31 is thermally connected to the heat sink 30, the amount of heat from the heat generating component 11 is moved to the heat sink 30 and is radiated to the atmosphere outside the housing 40 by the heat sink 30. Thereby, the amount of heat generated by the heat generating component 11 can be efficiently radiated to the outside of the housing 40.

  On the other hand, the amount of heat radiated to the internal space of the housing 40 is absorbed by the heat absorbing layer 21 and is radiated to the atmosphere outside the housing 40 through the heat reflecting layer 22. The amount of heat absorbed by the heat absorption layer 21 is transferred to the heat sink 30 through the heat pipe 32, and is radiated to the atmosphere outside the housing 40 by the heat sink 30. Thereby, the amount of heat radiated to the internal space can be efficiently radiated to the outside of the housing 40.

  Further, the heat reflection layer 22 that forms the outer wall of the housing 40 reflects the radiant heat from the outside of the housing 40, so that the influence of the temperature on the inside of the housing 40 can be suppressed. Thereby, since the inflow of the heat quantity from the outside of the housing 40 to the internal space can be suppressed, the temperature rise inside the housing 40 due to the external environment can be suppressed.

  As described above, according to the cooling mechanism of the electronic device 200 according to the second embodiment, the amount of heat generated in the internal space of the housing 40 is transferred to the heat sink 30 through the heat pipes 31 and 32, so that the heat sink Since heat can be radiated to the outside of the housing 40 by 30, the substantially sealed internal space can be cooled more efficiently.

[Third Embodiment]
Next, an electronic apparatus according to the third embodiment will be described with reference to FIG. In addition, about the structure which has the same function as the electronic devices 100 and 200 which concern on the 1st and 2nd embodiment mentioned above, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  FIG. 3 is a cross-sectional view schematically showing an electronic apparatus according to the third embodiment. As shown in FIG. 2, an electronic device 300 according to the third embodiment includes a substrate 12 on which a heat generating component 11 to be cooled is mounted, and a housing 50 that houses the substrate 12 in a substantially sealed internal space. A heat sink 30 provided on the outer wall of the housing 50, a heat pipe 31 that thermally connects the heat sink 30 and the heat generating component 11, and a heat pipe 32 that thermally connects the heat sink 30 and the housing 50. It has.

  The housing 50 includes a heat absorption layer 21 that serves as an inner wall portion of the housing 50, a heat radiation layer 23 that serves as an outer wall portion of the housing 50, and a heat reflection formed between the heat absorption layer 21 and the heat radiation layer 23. A three-layer structure with the layer 22 is used.

  Similarly to the heat absorption layer 21, the heat dissipation layer 23 is formed from a member having high thermal conductivity such as copper, steel, or aluminum, and the amount of heat reflected or radiated from the heat reflection layer 22 is transferred to the atmosphere outside the housing 50. It is provided to dissipate heat. The material of the heat dissipation layer 23 is not limited to metal, but may be a resin having excellent thermal conductivity, but is required to have rigidity and corrosion resistance that can withstand the use environment.

  The housing 50 is provided with an insertion hole that allows the internal space of the housing 50 to communicate with the outside, and the heat pipe 31 thermally connects the heat generating component 11 and the heat sink 30 through the insertion hole. It is arranged. Here, it is assumed that the gap between the heat pipe 31 and the insertion hole is filled with a heat-conductive filling material such as solder, so that the substantially sealed state of the housing 50 is maintained. In addition, as a filling material, what has higher thermal conductivity is preferable, and thereby, the amount of heat accumulated in the housing 50 can be efficiently transferred to the heat pipe 31.

  The heat pipe 32 is arranged so as to thermally connect the heat absorption layer 21 and the heat sink 30 through insertion holes provided in the heat reflection layer 22 and the heat dissipation layer 23. Here, it is assumed that the gap between the heat pipe 32 and the insertion hole is filled with a heat-conductive filling material in the same manner as the heat pipe 31.

  According to the cooling structure of the electronic device 300 described above, the heat quantity of the heat generating component 11 moves to the heat pipe 31 by thermally connecting the heat generating component 11 and the heat pipe 31. Further, since the heat pipe 31 is thermally connected to the heat sink 30, the amount of heat transferred from the heat generating component 11 to the heat pipe 31 is radiated by the heat sink 30 on the outer surface of the housing 50. Thereby, the heat generated by the heat generating component 11 can be efficiently radiated to the outside of the housing 50.

  On the other hand, the amount of heat radiated to the internal space of the housing 50 is absorbed by the heat absorption layer 21 constituting the housing 50 and is radiated to the atmosphere outside the housing 50 through the heat reflecting layer 22 and the heat radiating layer 23. The amount of heat transferred to the heat absorption layer 21, the heat reflection layer 22, and the heat dissipation layer 23 is transferred to the heat sink 30 through the heat pipe 31 and the heat pipe 32, and is radiated to the outside of the housing 50 by the heat sink 30. Thereby, the amount of heat radiated to the internal space of the housing 50 can be efficiently radiated to the outside of the housing 50.

  Further, radiant heat from the outside of the housing 50 is reflected through the heat dissipation layer 23 by the heat reflecting layer 22 that forms the outer wall of the housing 50, and the amount of heat transferred to the heat dissipation layer 23 is radiated to the outside of the housing 50. Thereby, since the inflow of the heat quantity from the outside to the inside of the housing 50 can be suppressed, the temperature rise inside the housing 50 due to the external environment can be suppressed.

  In addition, in this embodiment, since the heat radiation layer 23 is provided, the amount of heat accumulated in the housing 50 can be radiated to the outside more efficiently. Therefore, the cooling effect is more improved than in the second embodiment. Can be increased.

  As described above, according to the electronic apparatus 300 according to the third embodiment, in the fan-less housing 50 in which the housing 50 is substantially hermetically sealed, the heat amount inside the housing 50 is changed to the heat pipes 31 and 32. The heat sink 30 moves to the heat sink 30, and the heat sink 30 can efficiently dissipate heat to the outside of the housing 50, so that the inside of the housing 50 can be cooled more efficiently.

  As mentioned above, although each embodiment concerning the present invention was described, the present invention is not limited to these, and various change, substitution, addition, etc. are possible in the range which does not deviate from the main point of the present invention. In addition, any or all of the first to third embodiments described above can be used in combination.

  For example, in the above-described embodiment, the shape of the electronic device (100, 200, 300) is a box shape, but is not limited thereto, and may be a cylindrical shape. The shape of the heat pipes 31 and 32 is not particularly limited, and may be a round pipe shape or a flat plate shape.

  The range to which the electronic devices (100, 200, 300) according to the above embodiments are applied is not particularly limited, and may be applied to an information processing apparatus such as a PC (Personal Computer) or a POS terminal. However, the present invention may be applied to general-purpose electrical products such as video equipment and audio equipment.

  Here, FIG. 4 is a perspective view schematically showing an example in which the above-described electronic device (100, 200, 300) is applied to a POS terminal. The display unit 400 is a display device such as an LCD that displays an image signal input from a CPU (not shown), and is installed in an inclined state on the upper surface on the front side of the casing of the electronic device.

  In addition, a heat sink 30 is provided on the upper surface of the electronic device and on the back side of the display unit 400, and the amount of heat inside the electronic device (housing) is radiated to the outside by the cooling mechanism described above.

  As described above, by applying the electronic circuit according to the present embodiment to the POS terminal, the POS terminal can be sufficiently cooled without providing a cooling fan or a ventilation hole in the housing, so that there is a lot of dust and smoke. Even when the POS terminal is used at the place where the error occurs, stable operation can be realized.

  In addition, since the electronic devices 100, 200, and 300 have a fanless configuration, it is possible to reduce the noise of the POS terminal itself, and it is not necessary to secure a ventilation path to the vent hole. An advertising board or the like can be installed on the back side of the POS terminal. In addition, this makes it possible to shield the heat sink 30 with an advertising board so as not to be seen from the customer side, so that the aesthetics of the POS terminal can be improved.

It is sectional drawing which showed typically the structure of the electronic device which concerns on 1st Embodiment. It is sectional drawing which showed typically the structure of the electronic device which concerns on 2nd Embodiment. It is sectional drawing which showed typically the structure of the electronic device which concerns on 3rd Embodiment. It is the perspective view which showed typically the example which applied the electronic device which concerns on this invention to the POS terminal.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Heat-generating component 12 Board | substrate 13 Spacer 20 Case 21 Heat absorption layer 22 Heat reflection layer 23 Heat dissipation layer 30 Heat sink 31 Heat pipe 32 Heat pipe 40 Case 50 Case 100 Electronic device 200 Electronic device 300 Electronic device 400 Display part

Claims (6)

A housing forming a substantially sealed internal space;
A heat generating component housed in the internal space;
A radiator provided outside the housing;
A first heat pipe that thermally connects the heat generating component and the radiator;
A second heat pipe that thermally connects the housing and the radiator;
An electronic device characterized by comprising: The housing has a first insertion hole for inserting the first heat pipe,
2. The electronic device according to claim 1, wherein the first heat pipe is arranged to thermally connect the heat generating component and the radiator through the first insertion hole.   The electronic apparatus according to claim 1, wherein the radiator is a heat sink provided on an outer wall of the housing. A display device provided on the upper surface of the front side of the housing;
The electronic apparatus according to claim 1, wherein the radiator is provided on an upper surface of the housing and on a rear side of the display device.   The housing is composed of a first heat conducting member made of a highly heat conductive material and a heat reflecting member that is formed on the outer surface of the first heat conducting member and reflects radiant heat from outside the housing. The electronic apparatus according to any one of claims 1 to 4, wherein The heat reflecting member has a second insertion hole for inserting the second heat pipe,
The electronic device according to claim 5, wherein the second heat pipe is arranged to thermally connect the first heat conducting member and the radiator through the second insertion hole.

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