JP2010033103A - Electronic equipment and printed circuit board - Google Patents

Electronic equipment and printed circuit board Download PDF

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Publication number
JP2010033103A
JP2010033103A JP2008191396A JP2008191396A JP2010033103A JP 2010033103 A JP2010033103 A JP 2010033103A JP 2008191396 A JP2008191396 A JP 2008191396A JP 2008191396 A JP2008191396 A JP 2008191396A JP 2010033103 A JP2010033103 A JP 2010033103A
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heat
circuit board
insertion hole
heat receiving
heat transfer
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Nobuto Fujiwara
伸人 藤原
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Toshiba Corp
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Toshiba Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment and a printed circuit board for transferring heat generated from a plurality of heating components to a radiation member by one heat transfer member. <P>SOLUTION: The electronic equipment includes: the radiation member for radiating heat; a heat transfer member installed so as to be extended from the radiation member for transferring heat to the radiation member; a circuit board on which a plurality of radiation members for generating heat are mounted; and a plurality of heat receiving members placed between the respective heating members with heat connecting members interposed, and equipped with insertion holes through which the heat transfer member is inserted. The heat receiving member is packed with thermally conductive grease in gaps formed between the internal wall faces of the insertion holes and the heat transfer members. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、発熱部品を搭載した電子機器およびプリント回路基板に関するものである。   The present invention relates to an electronic device on which a heat generating component is mounted and a printed circuit board.

ノート型のパーソナルコンピュータなどのポータブルコンピュータのような電子機器は、CPU(Central Processing Unit)のような発熱部品を実装した回路基板を搭載している。このような回路基板に実装された発熱部品を冷却する構造の一例として、RHE(Remote Heat Exchanger)がある。RHEは、発熱部品が発した熱をヒートパイプで放熱フィンに伝熱し、冷却ファンにより放熱フィンを冷却することにより放熱フィンに伝熱された熱を放熱させるものである。RHEによれば、発熱部品の実装位置に合わせてヒートパイプを引き回すことにより、放熱フィンおよび冷却ファンから離れた位置に発熱部品が実装されていても、当該発熱部品が発した熱を放熱フィンに伝熱することができる(特許文献1参照)。   An electronic device such as a portable computer such as a notebook personal computer has a circuit board on which a heat generating component such as a CPU (Central Processing Unit) is mounted. As an example of a structure for cooling the heat generating component mounted on such a circuit board, there is RHE (Remote Heat Exchanger). The RHE transfers heat generated by the heat generating component to the heat radiating fin with a heat pipe, and radiates the heat transferred to the heat radiating fin by cooling the heat radiating fin with a cooling fan. According to RHE, the heat pipe is routed in accordance with the mounting position of the heat generating component, so that even if the heat generating component is mounted at a position away from the heat radiating fin and the cooling fan, the heat generated by the heat generating component is transferred to the heat radiating fin. Heat can be transferred (see Patent Document 1).

しかし、特許文献1に記載された電子機器は、発熱部品を回路基板の両面に実装することにより発熱部品の高度な実装を実現しているものの、発熱部品毎にヒートパイプおよび放熱フィンを設ける必要があり、電子機器の小型化・薄型化を図ることができない。   However, although the electronic device described in Patent Document 1 realizes high-level mounting of the heat generating component by mounting the heat generating component on both sides of the circuit board, it is necessary to provide a heat pipe and a heat radiating fin for each heat generating component. Therefore, it is impossible to reduce the size and thickness of electronic devices.

そこで、回路基板に実装される各発熱部品との間にグリスやシート等の熱接続部材を介在させて載置された複数の受熱部材を、放熱フィンと複数の受熱部材との間を亘って設けられるヒートパイプなどの伝熱部材とともに回路基板に固定することにより、複数の発熱部品から発せられた熱を1本のヒートパイプにより放熱フィンに移動させる技術が考えられる。   Therefore, a plurality of heat receiving members placed between each heat generating component mounted on the circuit board with a heat connecting member such as grease or a sheet interposed between the heat radiating fins and the plurality of heat receiving members. A technique may be considered in which heat generated from a plurality of heat generating components is moved to a heat radiating fin by a single heat pipe by being fixed to a circuit board together with a heat transfer member such as a heat pipe provided.

特開2007−310716号公報JP 2007-310716 A

しかしながら、回路基板に実装される複数の発熱部品は、発熱部品毎に回路基板の鉛直方向への高さが異なるため、剛性の高い伝熱部材に外力が加わった際に、その力が各受熱部材に均等に伝わらず、少なくともいずれか一つの受熱部材が発熱部品に対して傾いてしまう。すると、発熱部品と受熱部材との間に介在する熱接続部材が当該発熱部品と受熱部材との間から漏れてしまうため、発熱部品からの熱を受熱部材に伝えることができなくなる、という問題がある。また、発熱部品に対する受熱部材の傾きは、発熱部品と受熱部材の接触や破損を招く恐れもある。   However, since the heat generating components mounted on the circuit board have different heights in the vertical direction of the circuit board for each heat generating component, when an external force is applied to a highly rigid heat transfer member, the heat is received by each heat receiving component. At least one of the heat receiving members is inclined with respect to the heat generating component without being evenly transmitted to the members. Then, since the heat connection member interposed between the heat generating component and the heat receiving member leaks from between the heat generating component and the heat receiving member, there is a problem that heat from the heat generating component cannot be transmitted to the heat receiving member. is there. In addition, the inclination of the heat receiving member with respect to the heat generating component may cause contact or damage between the heat generating component and the heat receiving member.

本発明は、上記に鑑みてなされたものであって、複数の発熱部品から発せられた熱を1つの伝熱部材により放熱部材に伝熱することができる電子機器およびプリント回路基板を提供することを目的とする。   The present invention has been made in view of the above, and provides an electronic device and a printed circuit board capable of transferring heat generated from a plurality of heat generating components to a heat radiating member by one heat transfer member. With the goal.

上述した課題を解決し、目的を達成するために、本発明は、熱を放熱する放熱部材と、前記放熱部材から延出して設けられ前記放熱部材に熱を伝熱する伝熱部材と、熱を発する複数の発熱部品が実装された回路基板と、前記各発熱部品との間に熱接続部材を介在させて載置され、前記伝熱部材を挿入する挿入孔を有した複数の受熱部材と、を備え、前記受熱部材は、前記挿入孔の内壁面と前記伝熱部材との間に形成された間隙に熱伝導性グリスが充填されていることを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention includes a heat dissipating member that dissipates heat, a heat transfer member that extends from the heat dissipating member and transfers heat to the heat dissipating member, A circuit board on which a plurality of heat generating components that emit light are mounted, and a plurality of heat receiving members that are placed with a heat connection member interposed between each of the heat generating components and have insertion holes for inserting the heat transfer members, The heat receiving member is characterized in that a heat conductive grease is filled in a gap formed between an inner wall surface of the insertion hole and the heat transfer member.

また、本発明は、熱を放熱する放熱部材と、前記放熱部材から延出して設けられ前記放熱部材に熱を伝熱する伝熱部材と、熱を発する複数の発熱部品と、前記各発熱部品との間に熱接続部材を介在させて載置され、前記伝熱部材を挿入する挿入孔を有した複数の受熱部材と、を備え、前記受熱部材は、前記挿入孔の内壁面と前記伝熱部材との間に形成された間隙に熱伝導性グリスが充填されていることを特徴とする。   The present invention also provides a heat radiating member that radiates heat, a heat transfer member that extends from the heat radiating member and transfers heat to the heat radiating member, a plurality of heat generating components that generate heat, and each of the heat generating components. And a plurality of heat receiving members having insertion holes into which the heat transfer members are inserted, wherein the heat reception members are connected to the inner wall surfaces of the insertion holes and the heat transfer members. A heat conductive grease is filled in a gap formed between the heat member and the heat member.

本発明によれば、複数の発熱部品から発せられた熱を1つの伝熱部材により放熱部材に伝熱することができる、という効果を奏する。   According to the present invention, there is an effect that heat generated from a plurality of heat generating components can be transferred to the heat radiating member by one heat transfer member.

以下に添付図面を参照して、この発明にかかる電子機器およびプリント回路基板の最良な実施の形態を詳細に説明する。本発明の電子機器およびプリント回路基板をポータブルコンピュータに適用した例を示す。但しポータブルコンピュータに限られず、複数の発熱部品が実装されたプリント回路基板を備えるデジタルカメラ、ビデオカメラ、パーソナルデジタルアシスタントなど種々の電子機器にも本発明を適用することができる。   Exemplary embodiments of an electronic apparatus and a printed circuit board according to the present invention will be explained below in detail with reference to the accompanying drawings. The example which applied the electronic device and printed circuit board of this invention to the portable computer is shown. However, the present invention is not limited to a portable computer, and the present invention can be applied to various electronic devices such as a digital camera, a video camera, and a personal digital assistant provided with a printed circuit board on which a plurality of heat generating components are mounted.

(第1実施の形態)
まず、図1を用いて本実施の形態にかかるポータブルコンピュータの概略構成について説明する。図1は、本実施の形態にかかるポータブルコンピュータの斜視図である。
(First embodiment)
First, the schematic configuration of the portable computer according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view of a portable computer according to the present embodiment.

本実施の形態にかかるポータブルコンピュータ1は、本体2と、表示ユニット3と、を備えている。   A portable computer 1 according to the present embodiment includes a main body 2 and a display unit 3.

本体2は、本体ベース4と本体カバー5とを備えている。本体カバー5は、本体ベース4に上方から組み合わされる。本体ベース4と本体カバー5とが互いに協働することにより、本体2は箱状に形成された筐体6を備える。   The main body 2 includes a main body base 4 and a main body cover 5. The main body cover 5 is combined with the main body base 4 from above. When the main body base 4 and the main body cover 5 cooperate with each other, the main body 2 includes a housing 6 formed in a box shape.

筐体6は、上壁6a、周壁6b、および下壁6cを有する。上壁6aは、キーボード7を支持している。周壁6bは、前周壁6ba、後周壁6bb、左周壁6bc、および右周壁6bdを有する。   The housing 6 has an upper wall 6a, a peripheral wall 6b, and a lower wall 6c. The upper wall 6 a supports the keyboard 7. The peripheral wall 6b has a front peripheral wall 6ba, a rear peripheral wall 6bb, a left peripheral wall 6bc, and a right peripheral wall 6bd.

表示ユニット3は、ディスプレイハウジング8と、このディスプレイハウジング8に収容された液晶表示パネル9とを備える。液晶表示パネル9は、表示画面9aを有する。表示画面9aは、ディスプレイハウジング8の前面の開口部8aを通じてディスプレイハウジング8の外部に露出されている。   The display unit 3 includes a display housing 8 and a liquid crystal display panel 9 accommodated in the display housing 8. The liquid crystal display panel 9 has a display screen 9a. The display screen 9 a is exposed to the outside of the display housing 8 through the opening 8 a on the front surface of the display housing 8.

表示ユニット3は、筐体6の後端部にヒンジ装置を介して支持されている。これにより、表示ユニット3は、上壁6aを上方から覆うように倒される閉じ位置と、上壁6aを露出させるように起立する開き位置と、の間で回動可能である。   The display unit 3 is supported by a rear end portion of the housing 6 via a hinge device. Thereby, the display unit 3 is rotatable between a closed position where the display unit 3 is tilted so as to cover the upper wall 6a from above and an open position where the display unit 3 stands so as to expose the upper wall 6a.

また、筐体6は、空気を吐き出す冷却ファン11と、冷却ファン11から吐き出された空気を利用して熱を放熱する放熱部材13と、放熱部材13から延出して設けられ当該放熱部材13に熱を伝熱するヒートパイプ12、および熱を発する複数の発熱部品が実装された回路基板10を収容している。なお、発熱部品は、例えば、CPU、グラフィックスチップ、各種チップセット等、ポータブルコンピュータ1の各種の制御処理を実行する電子部品である。なお、発熱部品は、上述した例に限定されるものではなく、制御処理の実行にともなって発する熱を放熱する必要がある各種の電子部品が該当するものとする。これらの発熱部品は、冷却ファン11に比べて例えばポータブルコンピュータ1の前周壁6ba側、すなわちユーザ側にあたる周壁の近くに配置される。また、回路基板10には、図示しないが、その他の回路部品が複数実装されている。   The housing 6 is provided with a cooling fan 11 that exhales air, a heat dissipating member 13 that dissipates heat using air exhaled from the cooling fan 11, and a heat dissipating member 13 that extends from the heat dissipating member 13. A heat pipe 12 for transferring heat and a circuit board 10 on which a plurality of heat generating components for generating heat are mounted are accommodated. The heat generating component is an electronic component that executes various control processes of the portable computer 1 such as a CPU, a graphics chip, and various chip sets. Note that the heat generating component is not limited to the above-described example, and various electronic components that need to dissipate heat generated in accordance with the execution of the control process are applicable. Compared with the cooling fan 11, these heat generating components are arranged, for example, near the front peripheral wall 6ba of the portable computer 1, that is, near the peripheral wall corresponding to the user side. Although not shown, a plurality of other circuit components are mounted on the circuit board 10.

ここで、図2および図3を用いて、筐体6に実装される部品およびその配置について詳細に説明する。図2は、本実施の形態にかかるポータブルコンピュータの筐体内を示す斜視図である。図3は、回路基板に実装される部品を横から見た横視図である。   Here, the components mounted on the housing 6 and the arrangement thereof will be described in detail with reference to FIGS. 2 and 3. FIG. 2 is a perspective view showing the inside of the casing of the portable computer according to the present embodiment. FIG. 3 is a side view of components mounted on the circuit board as seen from the side.

冷却ファン11は、筐体6内の左周壁6bcの近傍に配置される。冷却ファン11に対応する筐体6の左周壁6bcには、例えば複数の排気孔22が設けられている。排気孔22は、筐体6の外部に開口している。冷却ファン11は、空気を吸い込む吸気口11aと、吸い込んだ空気を吐出する排気口11bとを有する。吸気口11aは、冷却ファン11の例えば上面と下面にそれぞれ開口している。排気口11bは、冷却ファン11の側面に開口し、左周壁6bcの排気口11bに対向している。冷却ファン11は、排気孔22に向けて空気を吐き出す。   The cooling fan 11 is disposed in the vicinity of the left peripheral wall 6bc in the housing 6. For example, a plurality of exhaust holes 22 are provided in the left peripheral wall 6bc of the housing 6 corresponding to the cooling fan 11. The exhaust hole 22 opens to the outside of the housing 6. The cooling fan 11 has an intake port 11a for sucking air and an exhaust port 11b for discharging the sucked air. The intake port 11a is opened on, for example, the upper surface and the lower surface of the cooling fan 11, respectively. The exhaust port 11b opens to the side surface of the cooling fan 11 and faces the exhaust port 11b of the left peripheral wall 6bc. The cooling fan 11 discharges air toward the exhaust hole 22.

放熱部材13は、筐体6内に収容された各種の電子部品(発熱部品)から発せられた熱を放熱するものであり、回路基板10を外れた筐体6の左周壁6bcの近傍に配置される。本実施の形態では、放熱部材13は、冷却ファン11の排気口11bと左周壁6bcの排気孔22との間に配置される。放熱部材13は、冷却ファン11の空気の吐出方向を横断する向きに沿って、互いに平行に延びている。   The heat dissipating member 13 dissipates heat generated from various electronic components (heat generating components) housed in the housing 6 and is disposed in the vicinity of the left peripheral wall 6bc of the housing 6 from which the circuit board 10 is removed. Is done. In the present embodiment, the heat radiation member 13 is disposed between the exhaust port 11b of the cooling fan 11 and the exhaust hole 22 of the left peripheral wall 6bc. The heat radiating members 13 extend in parallel to each other along the direction crossing the air discharge direction of the cooling fan 11.

放熱部材13は、複数のフィン要素13aが集合して形成されている。フィン要素13aは、例えば矩形状に形成された板状部材である。フィン要素13aは、熱伝導率の高い例えばアルミニウムのような金属で形成されている。複数のフィン要素13aは、互いの間に間隔を空けるとともに、その板面が冷却ファン11からの空気の流れに沿うように配置されている。   The heat dissipating member 13 is formed by assembling a plurality of fin elements 13a. The fin element 13a is a plate-like member formed in a rectangular shape, for example. The fin element 13a is made of a metal having a high thermal conductivity such as aluminum. The plurality of fin elements 13 a are arranged so as to be spaced apart from each other and their plate surfaces are along the flow of air from the cooling fan 11.

ヒートパイプ12は、放熱部材13から延出して設けられ当該放熱部材13に熱を伝熱する伝熱部材である。ヒートパイプ12は、例えば、内部に作動液を有し、気化熱と毛細血管現象を利用して両端部の間で熱を移動させるものである。なお、本実施の形態では、伝熱部材としてヒートパイプ12を用いたが、これに限定するものではなく、伝熱性の高い他の部材であってもよい。また、本実施の形態では、F1−F1線に沿う断面が矩形のヒートパイプ12を用いたが、これに限定するものではない。例えば、F1−F1線に沿う断面が円状のヒートパイプ12を用いてもよい。   The heat pipe 12 is a heat transfer member that extends from the heat dissipation member 13 and transfers heat to the heat dissipation member 13. The heat pipe 12 has, for example, a working fluid therein, and moves heat between both end portions using heat of vaporization and capillary action. In addition, in this Embodiment, although the heat pipe 12 was used as a heat-transfer member, it is not limited to this, Other members with high heat conductivity may be sufficient. Moreover, in this Embodiment, although the cross section along F1-F1 line used the rectangular heat pipe 12, it is not limited to this. For example, the heat pipe 12 having a circular cross section along the line F1-F1 may be used.

本実施の形態では、ヒートパイプ12は、発熱部品31,33の位置に沿って筐体6の左周壁6bcに向って回路基板10上を延びている。回路基板10を外れるまで筐体6の左周壁6bcに向って延びたヒートパイプ12は、放熱部材13の方を向いて折れ曲がっている。そして、ヒートパイプ12の先端部は、冷却ファン11の排気口11bに沿って延びるとともに、複数のフィン要素13aを串刺しにしている。換言すれば、中央に開口を有する複数のフィン要素13aが、それぞれヒートパイプ12に嵌合されることで放熱部材13が形成されている。   In the present embodiment, the heat pipe 12 extends on the circuit board 10 toward the left peripheral wall 6bc of the housing 6 along the positions of the heat generating components 31 and 33. The heat pipe 12 extending toward the left peripheral wall 6bc of the housing 6 until the circuit board 10 is removed is bent toward the heat radiating member 13. And the front-end | tip part of the heat pipe 12 extends along the exhaust port 11b of the cooling fan 11, and is skewering the several fin element 13a. In other words, the heat radiating member 13 is formed by fitting a plurality of fin elements 13 a having an opening in the center to the heat pipe 12.

回路基板10は、複数の発熱部品31,33を実装している。本実施の形態では、発熱部品31は、回路基板10に実装される回路部品の中で最も発熱量が高い部品であり、例えば、CPUである。また、発熱部品33は、発熱部品31よりも発熱量が低い部品であり、例えば、グラフィックチップ、各種チップセット等である。なお、本実施の形態では、2つの発熱部品を実装する回路基板10について説明するが、2以上の発熱部品を実装することも可能である。   The circuit board 10 has a plurality of heat generating components 31 and 33 mounted thereon. In the present embodiment, the heat generating component 31 is a component having the highest heat generation amount among the circuit components mounted on the circuit board 10, and is, for example, a CPU. Further, the heat generating component 33 is a component that generates less heat than the heat generating component 31, and is, for example, a graphic chip or various chip sets. In the present embodiment, the circuit board 10 on which two heat generating components are mounted will be described. However, two or more heat generating components can be mounted.

受熱部材20,23は、高い熱伝導率を有する金属で形成されたものであって、発熱部品31,33との間にグリスや薄くて熱伝導性の高い伝熱シート等の熱接続部材32,34を介在させて発熱部品31,33に載置され、ヒートパイプ12を挿入する挿入孔を有したものである。   The heat receiving members 20 and 23 are made of a metal having a high thermal conductivity, and between the heat generating components 31 and 33, a heat connecting member 32 such as grease or a thin heat transfer sheet having a high thermal conductivity. , 34 are placed on the heat generating parts 31 and 33 and have an insertion hole into which the heat pipe 12 is inserted.

また、受熱部材20は、回路基板10に固定されているものとする。本実施の形態では、受熱部材20は、固定具21を用いて、回路基板10に固定されている。固定具21は、受熱部材20を支持するカバー部21aと、カバー部21aから回路基板10を向いて延びるとともに回路基板10にねじ止めされる脚部21bと、を有する。受熱部材20は、回路基板10と固定具21との間に挟み込まれることで、その位置が固定される。これにより、受熱部材20と回路基板10との間のギャップが空かなくなり、発熱部品31から発せられた熱をより効率的に受熱部材20に伝熱することができる。また、受熱部材23を回路基板10に固定していないのは、受熱部材20と受熱部材23とが回路基板10上での高さが異なる場合、双方とも固定するとストレスがかかってしまうからである。したがって、受熱部材20と受熱部材23とが回路基板10上において高さが略同じである場合には、双方とも固定してもよい。   The heat receiving member 20 is fixed to the circuit board 10. In the present embodiment, the heat receiving member 20 is fixed to the circuit board 10 using a fixing tool 21. The fixture 21 includes a cover portion 21a that supports the heat receiving member 20, and leg portions 21b that extend from the cover portion 21a toward the circuit board 10 and are screwed to the circuit board 10. The position of the heat receiving member 20 is fixed by being sandwiched between the circuit board 10 and the fixture 21. Thereby, the gap between the heat receiving member 20 and the circuit board 10 is not vacant, and the heat generated from the heat generating component 31 can be transferred to the heat receiving member 20 more efficiently. The reason why the heat receiving member 23 is not fixed to the circuit board 10 is that when the heat receiving member 20 and the heat receiving member 23 have different heights on the circuit board 10, stress is applied if both are fixed. . Therefore, when the heat receiving member 20 and the heat receiving member 23 have substantially the same height on the circuit board 10, both may be fixed.

ここで、図4および図5を用いて、受熱部材20,23の詳細な構成について説明する。図4は、図2に示された受熱部材のF2−F2線に沿う断面図である。図5は、図2に示された受熱部材のF1−F1線に沿う断面図である。   Here, the detailed structure of the heat receiving members 20 and 23 is demonstrated using FIG. 4 and FIG. 4 is a cross-sectional view taken along line F2-F2 of the heat receiving member shown in FIG. FIG. 5 is a cross-sectional view taken along line F1-F1 of the heat receiving member shown in FIG.

受熱部材20,23は、図4および図5に示すように、ヒートパイプ12を挿入する孔であって、孔の内壁面41aとヒートパイプ12との間に間隙が形成される挿入孔41を有している。そして、挿入孔41の内壁面41aとヒートパイプ12との間に形成された間隙には、熱伝導性グリス40が充填されている。本実施の形態では、受熱部材20,23には、F1−F1線に沿う挿入孔41の矩形の断面が、F1−F1線に沿うヒートパイプ12の矩形の断面を取り囲むように、挿入孔41が設けられている。より具体的には、ヒートパイプ12に外力が加えられた際に、ヒートパイプ12が動く範囲より大きい断面を有する挿入孔41をヒートパイプ12の延在方向に向って設けるものとする。そして、挿入孔41aの内壁面41aとヒートパイプ12との間に形成された間隙には、隙間なく熱伝導性グリスが充填される。これにより、受熱部材20,23と、ヒートパイプ12と、が熱的に接続される。なお、本実施の形態では、受熱部材20,23は、F1−F1線に沿う断面が矩形の挿入孔41を有しているが、これに限定するものではない。例えば、F1−F1線に沿う挿入孔41の断面が、F1−F1線に沿うヒートパイプ12の断面より大きいものであれば、その形状は円状等であってもよい。   As shown in FIGS. 4 and 5, the heat receiving members 20 and 23 are holes into which the heat pipe 12 is inserted, and the insertion holes 41 in which a gap is formed between the inner wall surface 41 a of the hole and the heat pipe 12. Have. The gap formed between the inner wall surface 41 a of the insertion hole 41 and the heat pipe 12 is filled with thermally conductive grease 40. In the present embodiment, the heat receiving members 20 and 23 have the insertion hole 41 such that the rectangular cross section of the insertion hole 41 along the F1-F1 line surrounds the rectangular cross section of the heat pipe 12 along the F1-F1 line. Is provided. More specifically, when an external force is applied to the heat pipe 12, the insertion hole 41 having a larger cross section than the range in which the heat pipe 12 moves is provided in the extending direction of the heat pipe 12. The gap formed between the inner wall surface 41a of the insertion hole 41a and the heat pipe 12 is filled with the heat conductive grease without any gap. Thereby, the heat receiving members 20 and 23 and the heat pipe 12 are thermally connected. In the present embodiment, the heat receiving members 20 and 23 have the insertion holes 41 whose section along the line F1-F1 is rectangular, but the present invention is not limited to this. For example, if the cross section of the insertion hole 41 along the F1-F1 line is larger than the cross section of the heat pipe 12 along the F1-F1 line, the shape may be circular.

このように、本実施の形態にかかるポータブルコンピュータ1によれば、放熱部材13と、放熱部材13から延出して設けられ当該放熱部材13に熱を伝熱するヒートパイプ12と、制御処理の実行にともなって熱を発する複数の発熱部品31,33が実装された回路基板10と、各発熱部品31,33との間に熱接続部材32,34を介在させて載置され、ヒートパイプ12を挿入する挿入孔41を有した複数の受熱部材20,23と、を備え、受熱部材20,23は、挿入孔41の内壁面41aとヒートパイプ12との間に形成された間隙に熱伝導性グリス40が充填されていることにより、剛性の高いヒートパイプ12に外力が加わった際に、その力が各受熱部材20,23に均等に伝わらず、少なくともいずれか一つの受熱部材が発熱部品に対して傾くことによる発熱部品31,33と、受熱部材20,23と、の間に介在する熱接続部材32,33の漏れを防止できるので、発熱部品31,33から発せられた熱を1本のヒートパイプ12により放熱部材13に伝熱することができる。   Thus, according to the portable computer 1 according to the present embodiment, the heat radiating member 13, the heat pipe 12 that extends from the heat radiating member 13 and transfers heat to the heat radiating member 13, and the execution of the control process The circuit board 10 on which the plurality of heat generating components 31 and 33 that generate heat are mounted and the heat generating components 31 and 33 are placed with the heat connection members 32 and 34 interposed therebetween, and the heat pipe 12 is mounted. A plurality of heat receiving members 20 and 23 having insertion holes 41 to be inserted, and the heat receiving members 20 and 23 are thermally conductive in a gap formed between the inner wall surface 41a of the insertion hole 41 and the heat pipe 12. Since the grease 40 is filled, when an external force is applied to the heat pipe 12 having high rigidity, the force is not evenly transmitted to the heat receiving members 20 and 23, and at least one of the heat receiving members is generated. Since the leakage of the heat connecting members 32 and 33 interposed between the heat generating components 31 and 33 and the heat receiving members 20 and 23 due to the inclination with respect to the components can be prevented, the heat generated from the heat generating components 31 and 33 is generated. Heat can be transferred to the heat radiating member 13 by one heat pipe 12.

(第2実施の形態)
本実施の形態にかかるポータブルコンピュータは、受熱部材の挿入孔の挿入口および出口において当該挿入孔の内壁面と伝熱部材との間に形成された間隙を埋める封止部材を備えることにより、受熱部材の挿入孔の内壁面と伝熱部材との間に形成された間隙に充填された熱伝導性グリスが漏れることを防止することができる。なお、ポータブルコンピュータの構成については、第1実施の形態とほぼ同様であるため、第1実施の形態と異なる部分の処理のみを説明する。
(Second Embodiment)
The portable computer according to the present embodiment includes a sealing member that fills a gap formed between the inner wall surface of the insertion hole and the heat transfer member at the insertion port and the outlet of the insertion hole of the heat reception member. It is possible to prevent leakage of the heat conductive grease filled in the gap formed between the inner wall surface of the member insertion hole and the heat transfer member. Since the configuration of the portable computer is almost the same as that of the first embodiment, only the processing of parts different from the first embodiment will be described.

図6は、図2に示された受熱部材のF2−F2線に沿う断面図である。図7は、図2に示された受熱部材が備える挿入孔の挿入口(または出口)におけるF1−F1線に沿う断面図である。受熱部材20,23は、図6および図7に示すように、挿入孔41の挿入口61および出口62において当該挿入孔41の内壁面41aとヒートパイプ12との間に形成された間隙を埋める封止部材60を備えている。ここで、封止部材60は、ゴム部材やOリング等、挿入孔41の内壁面41aとヒートパイプ12との間に形成された間隙に充填された熱伝導性グリスの漏れを防止するものである。   6 is a cross-sectional view taken along line F2-F2 of the heat receiving member shown in FIG. FIG. 7 is a cross-sectional view taken along line F1-F1 in the insertion port (or outlet) of the insertion hole provided in the heat receiving member shown in FIG. As shown in FIGS. 6 and 7, the heat receiving members 20 and 23 fill a gap formed between the inner wall surface 41 a of the insertion hole 41 and the heat pipe 12 at the insertion port 61 and the outlet 62 of the insertion hole 41. A sealing member 60 is provided. Here, the sealing member 60 prevents leakage of thermally conductive grease filled in a gap formed between the inner wall surface 41a of the insertion hole 41 and the heat pipe 12, such as a rubber member or an O-ring. is there.

図8は、図6および図7に示す受熱部材の製造方法の一例を示す説明図である。本実施の形態は、図8に示すように、挿入孔41にヒートパイプ12を挿入しかつ挿入孔41の内壁面41aとヒートパイプ12との間に形成された間隙に熱伝導性グリスを充填した後、挿入孔41の挿入口51および出口62に形成されたOリングの形に合わせて掘られた溝に、それぞれ封止部材60(例えば、Oリング)を嵌合することにより受熱部材20,23を製造する。   FIG. 8 is an explanatory view showing an example of a manufacturing method of the heat receiving member shown in FIGS. 6 and 7. In this embodiment, as shown in FIG. 8, the heat pipe 12 is inserted into the insertion hole 41 and the gap formed between the inner wall surface 41 a of the insertion hole 41 and the heat pipe 12 is filled with heat conductive grease. After that, the heat receiving member 20 is fitted by fitting the sealing member 60 (for example, O-ring) into the grooves dug in accordance with the shape of the O-ring formed in the insertion port 51 and the outlet 62 of the insertion hole 41, respectively. , 23 is manufactured.

このように、本実施の形態にかかるポータブルコンピュータ1によれば、受熱部材20,23内に充填されている熱伝導性グリス40を封止部材60により受熱部材20,23内に封入することにより、ヒートパイプ12が挿入孔41内で動くことにより熱伝導性グリス40が受熱部材20,23から漏れることを防止することができるので、受熱部材20,23が発熱部品31,33から受熱した熱をヒートパイプ12に伝えることができる。   As described above, according to the portable computer 1 according to the present embodiment, the heat conductive grease 40 filled in the heat receiving members 20 and 23 is sealed in the heat receiving members 20 and 23 by the sealing member 60. Since the heat conductive grease 40 can be prevented from leaking from the heat receiving members 20 and 23 when the heat pipe 12 moves in the insertion hole 41, the heat received by the heat receiving members 20 and 23 from the heat generating components 31 and 33. Can be transmitted to the heat pipe 12.

(第3実施の形態)
本実施の形態にかかるポータブルコンピュータは、受熱部材が挿入孔を挟んで上部部材と下部部材に分かれており、挿入孔の挿入口および出口に加えて、当該上部部材と下部部材との間も封止することにより、第2実施の形態にかかるポータブルコンピュータと同様の効果を得るものである。なお、ポータブルコンピュータの構成については、第2実施の形態とほぼ同様であるため、第2実施の形態と異なる部分の処理のみを説明する。
(Third embodiment)
In the portable computer according to the present embodiment, the heat receiving member is divided into an upper member and a lower member with the insertion hole interposed therebetween, and in addition to the insertion port and outlet of the insertion hole, the space between the upper member and the lower member is sealed. By stopping, the same effect as the portable computer according to the second embodiment is obtained. Since the configuration of the portable computer is almost the same as that of the second embodiment, only the processing of the parts different from the second embodiment will be described.

図9は、図2に示された受熱部材のF2−F2線に沿う断面図である。図10は、図2に示された受熱部材が備える挿入孔の挿入口(または出口)におけるF1−F1線に沿う断面図である。図11は、上部部材を取り付ける前の受熱部材の上面図である。受熱部材20,23は、図9〜11に示すように、挿入孔41を挟んで上部部材91と下部部材92とに分かれて構成される。そして、受熱部材20,23は、挿入孔41の挿入口61および出口62において挿入口61の内壁面41aとヒートパイプ12との間に形成された間隙、および上部部材91と下部部材92との間を埋めるゴム部材90を備えている。ここで、ゴム部材90は、第2実施の形態で用いた受熱部材20,23の挿入孔41の挿入口61および出口62に取り付けられる2つの封止部材60と、挿入孔41内の上部部材91と下部部材92との合わせ目からの熱伝導性グリス40の漏れを防止するためのゴム部材90と、を一体として形成したものである。   FIG. 9 is a cross-sectional view taken along line F2-F2 of the heat receiving member shown in FIG. 10 is a cross-sectional view taken along line F1-F1 at the insertion port (or outlet) of the insertion hole provided in the heat receiving member shown in FIG. FIG. 11 is a top view of the heat receiving member before the upper member is attached. As shown in FIGS. 9 to 11, the heat receiving members 20 and 23 are divided into an upper member 91 and a lower member 92 with the insertion hole 41 interposed therebetween. The heat receiving members 20 and 23 are formed by the gap formed between the inner wall surface 41a of the insertion port 61 and the heat pipe 12 at the insertion port 61 and the outlet 62 of the insertion hole 41, and between the upper member 91 and the lower member 92. A rubber member 90 is provided to fill the gap. Here, the rubber member 90 includes two sealing members 60 attached to the insertion port 61 and the outlet 62 of the insertion hole 41 of the heat receiving members 20 and 23 used in the second embodiment, and an upper member in the insertion hole 41. The rubber member 90 for preventing leakage of the heat conductive grease 40 from the joint of the lower member 92 and the lower member 92 is integrally formed.

図12は、図9〜11に示す受熱部材の製造方法の一例を示す説明図である。本実施の形態では、図12に示すように、まず、下部部材92の溝1201,1202に、ゴム部材90を嵌合する。次に、下部部材92に取り付けたゴム部材90を上部部材91の溝1203,1204に嵌合し、さらに挿入孔41内の上部部材91と下部部材92との合わせ目に位置するゴム部材90を上部部材91および下部部材92により挟み込む。次いで、ヒートパイプ12を挿入するゴム部材90の穴から熱伝導性グリス40を受熱部材20,23内に充填させた後、挿入孔41の挿入口61側のゴム部材90の穴からヒートパイプ12を挿入することにより、受熱部材20,23を製造する。   FIG. 12 is an explanatory view showing an example of a method for manufacturing the heat receiving member shown in FIGS. In the present embodiment, as shown in FIG. 12, first, the rubber member 90 is fitted into the grooves 1201 and 1202 of the lower member 92. Next, the rubber member 90 attached to the lower member 92 is fitted into the grooves 1203 and 1204 of the upper member 91, and the rubber member 90 located at the joint between the upper member 91 and the lower member 92 in the insertion hole 41 is further inserted. It is sandwiched between the upper member 91 and the lower member 92. Next, after the thermal conductive grease 40 is filled into the heat receiving members 20 and 23 from the hole of the rubber member 90 into which the heat pipe 12 is inserted, the heat pipe 12 is inserted from the hole of the rubber member 90 on the insertion port 61 side of the insertion hole 41. The heat receiving members 20 and 23 are manufactured by inserting.

このように、本実施の形態にかかるポータブルコンピュータ1によれば、受熱部材20,23が、挿入孔41を挟んで上部部材91と下部部材92とに分かれており、挿入孔41の挿入口61および出口62において挿入孔41の内壁面41aとヒートパイプ12との間に形成された間隙、および上部部材91と下部部材92との間を埋めるゴム部材90を備えることにより、第2実施の形態にかかるポータブルコンピュータ1と同様の効果を得ることができる。   As described above, according to the portable computer 1 according to the present embodiment, the heat receiving members 20 and 23 are divided into the upper member 91 and the lower member 92 with the insertion hole 41 interposed therebetween. And a rubber member 90 that fills a gap formed between the inner wall surface 41a of the insertion hole 41 and the heat pipe 12 at the outlet 62 and between the upper member 91 and the lower member 92, thereby providing the second embodiment. The same effects as those of the portable computer 1 can be obtained.

第1実施の形態にかかるポータブルコンピュータの斜視図である。1 is a perspective view of a portable computer according to a first embodiment. 第1実施の形態にかかるポータブルコンピュータの筐体内を示す斜視図である。It is a perspective view which shows the inside of the housing | casing of the portable computer concerning 1st Embodiment. 回路基板に実装される部品を横から見た横視図である。It is the side view which looked at the components mounted in a circuit board from the side. 図2に示された受熱部材のF2−F2線に沿う断面図である。It is sectional drawing which follows the F2-F2 line of the heat receiving member shown by FIG. 図2に示された受熱部材のF1−F1線に沿う断面図である。It is sectional drawing which follows the F1-F1 line | wire of the heat receiving member shown by FIG. 図2に示された受熱部材のF2−F2線に沿う断面図である。It is sectional drawing which follows the F2-F2 line of the heat receiving member shown by FIG. 図2に示された受熱部材が備える挿入孔の挿入口(または出口)におけるF1−F1線に沿う断面図である。It is sectional drawing which follows the F1-F1 line | wire in the insertion port (or exit) of the insertion hole with which the heat receiving member shown by FIG. 2 is provided. 図6および図7に示す受熱部材の製造方法の一例を示す説明図である。It is explanatory drawing which shows an example of the manufacturing method of the heat receiving member shown to FIG. 6 and FIG. 図2に示された受熱部材のF2−F2線に沿う断面図である。It is sectional drawing which follows the F2-F2 line of the heat receiving member shown by FIG. 図2に示された受熱部材が備える挿入孔の挿入口(または出口)におけるF1−F1線に沿う断面図である。It is sectional drawing which follows the F1-F1 line | wire in the insertion port (or exit) of the insertion hole with which the heat receiving member shown by FIG. 2 is provided. 上部部材を取り付ける前の受熱部材の上面図である。It is a top view of the heat receiving member before attaching an upper member. 図9〜11に示す受熱部材の製造方法の一例を示す説明図である。It is explanatory drawing which shows an example of the manufacturing method of the heat receiving member shown to FIGS.

符号の説明Explanation of symbols

1 ポータブルコンピュータ
2 本体
3 表示ユニット
4 本体ベース
5 本体カバー
6 筐体
6a 上壁
6b 周壁
6c 下壁
6ba 前周壁
6bb 後周壁
6bc 左周壁
6bd 右周壁
7 キーボード
8 ディスプレイハウジング
8a 開口部
9 液晶表示パネル
9a 表示画面
10 回路基板
11 冷却ファン
11a 吸気口
11b 排気口
12 ヒートパイプ
13 放熱部材
13a フィン要素
20,23 受熱部材
21 固定具
21a カバー部
21b 脚部
22 排気孔
31,33 発熱部品
32,34 熱接続部材
40 熱伝導性グリス
41 挿入孔
41a 内壁面
60 封止部材
61 挿入口
62 出口
90 ゴム部材
91 上部部材
92 下部部材
1201〜1204 溝
DESCRIPTION OF SYMBOLS 1 Portable computer 2 Main body 3 Display unit 4 Main body base 5 Main body cover 6 Case 6a Upper wall 6b Peripheral wall 6c Lower wall 6ba Front peripheral wall 6bb Rear peripheral wall 6bc Left peripheral wall 6bd Right peripheral wall 7 Keyboard 8 Display housing 8a Opening part 9 Liquid crystal display panel 9a Display screen 10 Circuit board 11 Cooling fan 11a Intake port 11b Exhaust port 12 Heat pipe 13 Heat radiation member 13a Fin element 20, 23 Heat receiving member 21 Fixing tool 21a Cover portion 21b Leg portion 22 Exhaust hole 31, 33 Heat generating component 32, 34 Thermal connection Member 40 Thermally conductive grease 41 Insertion hole 41a Inner wall surface 60 Sealing member 61 Insertion port 62 Exit 90 Rubber member 91 Upper member 92 Lower member 1201-1204 Groove

Claims (8)

熱を放熱する放熱部材と、
前記放熱部材から延出して設けられ前記放熱部材に熱を伝熱する伝熱部材と、
熱を発する複数の発熱部品が実装された回路基板と、
前記各発熱部品との間に熱接続部材を介在させて載置され、前記伝熱部材を挿入する挿入孔を有した複数の受熱部材と、を備え、
前記受熱部材は、前記挿入孔の内壁面と前記伝熱部材との間に形成された間隙に熱伝導性グリスが充填されていることを特徴とする電子機器。
A heat dissipating member that dissipates heat;
A heat transfer member that extends from the heat dissipation member and transfers heat to the heat dissipation member;
A circuit board on which a plurality of heat generating components that generate heat are mounted;
A plurality of heat receiving members mounted with a heat connection member interposed between each of the heat generating components and having an insertion hole for inserting the heat transfer member;
The electronic device, wherein the heat receiving member is filled with a heat conductive grease in a gap formed between an inner wall surface of the insertion hole and the heat transfer member.
前記受熱部材は、さらに、前記挿入孔の挿入口および出口において前記挿入孔の内壁面と前記伝熱部材との間に形成された間隙を埋める封止部材を備えたことを特徴とする請求項1に記載の電子機器。   The heat receiving member further includes a sealing member that fills a gap formed between an inner wall surface of the insertion hole and the heat transfer member at an insertion port and an outlet of the insertion hole. 1. The electronic device according to 1. 前記封止部材は、ゴム部材であることを特徴とする請求項2に記載の電子機器。   The electronic device according to claim 2, wherein the sealing member is a rubber member. 前記封止部材は、オーリングであることを特徴とする請求項2に記載の電子機器。   The electronic device according to claim 2, wherein the sealing member is an O-ring. 前記受熱部材は、さらに、前記挿入孔を挟んで上部部材と下部部材とに分かれており、前記挿入孔の挿入口および出口において前記挿入口の内壁面と前記伝熱部材との間に形成された間隙、および前記上部部材と前記下部部材との間を埋めるゴム部材を備えたことを特徴とする請求項1に記載の電子機器。   The heat receiving member is further divided into an upper member and a lower member across the insertion hole, and is formed between the inner wall surface of the insertion port and the heat transfer member at the insertion port and the outlet of the insertion hole. The electronic apparatus according to claim 1, further comprising a rubber member that fills a gap between the upper member and the lower member. 前記複数の受熱部材のうち1つの受熱部材は、前記回路基板に固定されていることを特徴とする請求項1に記載の電子機器。   The electronic apparatus according to claim 1, wherein one heat receiving member of the plurality of heat receiving members is fixed to the circuit board. 前記回路基板に固定された前記受熱部材が載置された前記発熱部品の発熱量が、他の受熱部材が載置された前記発熱部品の発熱量より大きいことを特徴とする請求項6に記載の電子機器。   The heat generation amount of the heat generating component on which the heat receiving member fixed to the circuit board is placed is larger than the heat generation amount of the heat generating component on which another heat receiving member is mounted. Electronic equipment. 熱を放熱する放熱部材と、
前記放熱部材から延出して設けられ前記放熱部材に熱を伝熱する伝熱部材と、
熱を発する複数の発熱部品と、
前記各発熱部品との間に熱接続部材を介在させて載置され、前記伝熱部材を挿入する挿入孔を有した複数の受熱部材と、を備え、
前記受熱部材は、前記挿入孔の内壁面と前記伝熱部材との間に形成された間隙に熱伝導性グリスが充填されていることを特徴とするプリント回路基板。
A heat dissipating member that dissipates heat;
A heat transfer member that extends from the heat dissipation member and transfers heat to the heat dissipation member;
A plurality of heat generating components that generate heat;
A plurality of heat receiving members mounted with a heat connection member interposed between each of the heat generating components and having an insertion hole for inserting the heat transfer member;
The printed circuit board, wherein the heat receiving member is filled with a heat conductive grease in a gap formed between an inner wall surface of the insertion hole and the heat transfer member.
JP2008191396A 2008-07-24 2008-07-24 Electronic equipment and printed circuit board Pending JP2010033103A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
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US7986520B2 (en) * 2009-06-22 2011-07-26 Kabushiki Kaisha Toshiba Electronic device
JP2012004976A (en) * 2010-06-18 2012-01-05 Toshiba Corp Electronic apparatus
JP2012016064A (en) * 2011-10-07 2012-01-19 Toshiba Corp Television receiver and electronic equipment
US8218312B2 (en) 2010-04-09 2012-07-10 Kabushiki Kaisha Toshiba Electronic apparatus
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WO2017208461A1 (en) * 2016-06-03 2017-12-07 株式会社日立製作所 Boiling cooling device and electronic device having same mounted thereon

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7986520B2 (en) * 2009-06-22 2011-07-26 Kabushiki Kaisha Toshiba Electronic device
US8218312B2 (en) 2010-04-09 2012-07-10 Kabushiki Kaisha Toshiba Electronic apparatus
US8982557B2 (en) 2010-04-09 2015-03-17 Kabushiki Kaisha Toshiba Electronic apparatus
JP2012004976A (en) * 2010-06-18 2012-01-05 Toshiba Corp Electronic apparatus
US8274614B2 (en) 2010-06-18 2012-09-25 Kabushiki Kaisha Toshiba Television apparatus and electronic device
US8675142B2 (en) 2010-06-18 2014-03-18 Kabushiki Kaisha Toshiba Television apparatus and electronic device
JP2012016064A (en) * 2011-10-07 2012-01-19 Toshiba Corp Television receiver and electronic equipment
JPWO2013150772A1 (en) * 2012-04-02 2015-12-17 富士電機株式会社 Power converter
CN105898117A (en) * 2015-02-18 2016-08-24 佳能株式会社 Electronic apparatus capable of efficient and uniform heat dissipation
CN105898117B (en) * 2015-02-18 2020-01-14 佳能株式会社 Electronic equipment capable of efficiently and uniformly radiating heat
WO2017208461A1 (en) * 2016-06-03 2017-12-07 株式会社日立製作所 Boiling cooling device and electronic device having same mounted thereon

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