JP2009266123A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment such as a personal computer which can reduce a space in a casing without degrading heat dissipation efficiency. <P>SOLUTION: The computer 1 is electronic equipment including: a printed circuit board with a first heating component and a second heating component mounted thereon; a cooling fan provided with an exhaust air hole and two facing air intake holes; a radiating fin disposed facing the exhaust air hole; a first heat transfer member which thermally connects the first heating component and the heat dissipating fan; and a second heat transfer member which covers at least one of the air intake holes and is thermally connected to the second heating component. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device such as a personal computer.

  BACKGROUND Electronic devices such as personal computers are provided with a printed circuit board in which electronic components are mounted on a printed wiring board (also referred to as a printed board) having a wiring pattern formed on a resin substrate. Electronic components that generate relatively large heat (hereinafter also referred to as “heat generating components”) such as CPU, capacitors, control ICs, and power supply components are mounted on the printed circuit board. A cooling fan is provided.

Conventionally, for example, Patent Document 1 discloses a computer having a structure for cooling two heat-generating components using a single cooling fan. Patent Document 2 includes a structure including two heat generating parts fixed to a printed circuit board and one cooling fan, and two heat radiating members for radiating the heat of each heat generating part. A computer is disclosed.
JP 2004-164492 A JP 2007-310716 A

  2. Description of the Related Art Conventionally, in electronic devices, there is a need to reduce the size of a housing in which a printed circuit board is stored, and accordingly, the space in the housing is also required to be reduced.

  However, in the prior art, it has been difficult to reduce the space in the housing without reducing the heat dissipation efficiency. For example, in the technique described in Patent Document 1, a cooling fan is disposed on a heat generating component, and air that has taken heat from the heat generating component is sent from the cooling fan to the fins to dissipate heat (transfers heat using air as a medium). Therefore, a space in the height direction is required in the housing, and the heat dissipation efficiency is not good.

  Further, in the technique described in Patent Document 2, since the two heat dissipating members are provided inside the housing, it is difficult to reduce the space in the housing.

  Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic device such as a personal computer that can reduce the space in the housing without reducing the heat radiation efficiency.

In order to solve the above-described problem, an electronic device according to the present invention includes a printed wiring board on which a first heat generating component and a second heat generating component are mounted, an exhaust hole, and two opposing intake holes. A cooling fan, a heat dissipating fin disposed opposite to the exhaust hole, a first heat generating component, a first heat transfer member thermally connected between the heat dissipating fin, and an air intake hole. And an electronic device having a second heat transfer member that covers at least a portion of the heat transfer member and is thermally connected to the second heat-generating component.
The present invention also includes a printed wiring board on which the first heat-generating component and the second heat-generating component are mounted, an exhaust hole portion, and two opposing intake hole portions. A cooling fan, at least a part of which is a heat radiating plate, a heat radiating fin disposed opposite to the exhaust hole, a first heat generating component, and a first heat transmission that is thermally connected between the heat radiating fins. Provided is an electronic device having a heat member, a second heat generating component, and a second heat transfer member that thermally connects an air intake hole serving as a heat sink.

  As described above in detail, according to the present invention, it is possible to obtain an electronic device such as a personal computer that can reduce the space in the housing without reducing the heat radiation efficiency.

  Hereinafter, embodiments of the present invention will be described. In addition, the same code | symbol is used for the same element and the overlapping description is abbreviate | omitted.

  A personal computer as an electronic apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  Here, FIG. 1 is a perspective view showing a part of a personal computer (hereinafter referred to as “computer”) as an electronic apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the inside of the computer. . 3 is a plan view showing a heat dissipation structure portion of the printed circuit board housed in the computer 1, FIG. 4 is a front view, FIG. 5 is a left side view, and FIG. 6 is a right side view. As shown in FIG. 1, the computer 1 includes a main body 2 and a display unit 3.

  The main body 2 has a main body base 4 and a main body cover 5. The main body cover 5 is combined with the main body base 4 from above. When the main body base 4 and the main body cover 5 cooperate with each other, the main body 2 constitutes a casing 6 formed in a box shape.

  The housing 6 has an upper wall 6a, a peripheral wall 6b, and a lower wall 6c. The upper wall 6 a supports the keyboard 7. The peripheral wall 6b has a front peripheral wall 6ba, a rear peripheral wall 6bb, a left peripheral wall 6bc, and a right peripheral wall 6bd.

  The display unit 3 includes a display housing 8 and a liquid crystal display panel 9 incorporated in the display housing 8. The liquid crystal display panel 9 has a display screen 9a. The display screen 9 a is exposed to the outside of the display housing 8 through the opening 8 a on the front surface of the display housing 8.

  The display unit 3 is supported at the rear end of the housing 6 via a hinge mechanism (not shown) so as to expose the closed position where the upper wall 6a is tilted so as to cover the upper wall 6a and the upper wall 6a. It is possible to rotate between the open position where it stands up.

  As shown in FIG. 2, the housing 6 accommodates the printed wiring board 11, the cooling fan 12, the first and second heat pipes 13 and 25, the heat radiation fins 15, and the heat radiation plate 30. .

  The printed wiring board 11 has a first surface 11a and a second surface 11b. In the present embodiment, the first surface 11a is a surface (also referred to as an upper surface) on the front side, that is, the keyboard 7 side. The first surface 11a faces the upper wall 6a. The second surface 11b faces the lower wall 6c on the back surface of the first surface 11a (see FIG. 4).

  The printed wiring board 11 has a heat generating component 21 and a heat generating component 22 mounted on the first surface 11a. Although a plurality of other circuit components are mounted on the printed wiring board 11, illustration is omitted. The heat generating components 21 and 22 are electronic components that generate a large amount of heat among circuit components mounted on the printed wiring board 11 and require active heat dissipation.

  For example, the heat generating component 21 is a CPU and the heat generating component 22 is a graphics chip that generates less heat than the CPU, but other components may be used. Although the heat generating components 21 and 22 correspond to various electronic components for which heat dissipation is desired, in the present embodiment, it is assumed that the heat generation amount of the heat generating component 21 is larger than the heat generation amount of the heat generating component 22.

  As shown in FIGS. 3 to 6, the heat generating component 21 is made of a member having good heat transfer efficiency such as copper, and a rectangular heat receiving plate 14 having a larger size than the heat generating component 21 is a heat connecting member. 32 (heat dissipation sheet, grease, etc.) are connected. Further, one end of a heat pipe 13 as a heat transfer tube made of a member having good heat transfer efficiency such as copper is attached to the heat receiving plate 14.

  The heat generating component 22 is made of a member having good heat transfer efficiency, such as copper, and is connected to a rectangular heat receiving plate 24 having a size larger than that of the heat generating component 22 via a heat connecting member 32. Further, one end portion of a heat pipe 25 as a heat transfer tube made of a member having good heat transfer efficiency such as copper is attached to the heat receiving plate 24.

  The heat pipe 13 has one end connected to the heat receiving plate 14 and the other end connected to the heat radiating fins 15. The heat pipe 25 has one end connected to the heat receiving plate 24 and the other end connected to the heat radiating plate 30.

  The heat receiving plates 14 and 24 are fixed to the printed wiring board 11 using fixtures 26 and 27, respectively. Fixtures 26 and 27 are trifurcated cover portions 26a and 27a that support the heat receiving plates 14 and 24, and legs that extend from the cover portions 26a and 27a to the printed wiring board 11 side and are screwed to the printed wiring board 11, respectively. Part 26b, 27b. The positions of the heat receiving plates 14 and 24 are fixed by being sandwiched between the printed wiring board 11 and the fixtures 26 and 27.

  The heat pipe 13 extends from one end portion attached to the heat generating component 21 along the first surface 11 a of the printed wiring board 11 toward the left peripheral wall 6 bc of the housing 6. The heat generating component 21 is located closer to the front peripheral wall 6ba of the housing 6 than the cooling fan 12.

  Then, the heat pipe 13 extends until it is detached from the printed wiring board 11 and then bends toward the heat radiating fin 15, and its tip extends along the exhaust surface 17 c of the cooling fan 12 to skew each fin element. I have to. That is, the heat dissipation fins 15 are formed by fitting a plurality of fin elements having openings in the center to the heat pipes 13 respectively.

  The heat pipe 13 is provided between the heat generating component 21 and the heat radiation fin 15. One end of the heat pipe 13 is thermally connected to the heat generating component 21. The heat pipe 13 has a working fluid inside, and moves heat using heat of vaporization and capillary action. The heat pipe 13 transmits heat generated by the heat generating component 21 to the heat radiating fins 15.

  The heat pipe 25 is provided between the second heat generating component 22 and the heat radiating plate 30. One end of the heat pipe 25 is thermally connected to the heat generating component 22, and transfers heat generated by the second heat generating component 22 to the heat radiating plate 30. The heat pipes 13 and 25 are used in a state where, for example, a φ6 heat pipe is crushed in the vertical direction to a thickness of about 3 mm in order to increase the installation area for the heat receiving plates 14 and 24, for example.

  As shown in FIG. 2, the cooling fan 12 is disposed in the vicinity of the left peripheral wall 6 bc in the housing 6. The printed wiring board 11 has a cutout portion 11 c cut out so as to avoid the cooling fan 12 at the peripheral end portion, and the cooling fan 12 is accommodated in the housing 6 by being arranged in the cutout portion 11 c.

  The cooling fan 12 has a fan stored in a thin box-shaped storage case 17, and the fan rotates along a rotation shaft (not shown) provided in the thickness direction of the storage case 17. ing. The storage case 17 has two opposing intake surfaces 17 a and 17 b provided with intake holes 17 d and 17 e in the center, and an exhaust surface 17 c provided with exhaust holes, and the exhaust surface 17 c is a side surface of the storage case 17. It is supposed to be located in. The cooling fan 12 takes in air from the intake surfaces 17a and 17b and exhausts it from the exhaust surface 17c.

  The position of the cooling fan 12 is fixed so that the intake surfaces 17a and 17b are along the first and second surfaces 11a and 11b of the printed wiring board 11, respectively, and the exhaust surface 17c is facing the radiation fins 15. . Thus, the radiation fins 15 are arranged so as to face the exhaust surface 17c of the cooling fan 12.

  A plurality of exhaust holes 28 are provided in the left peripheral wall 6bc of the housing 6 corresponding to the cooling fan 12. The exhaust hole 28 opens to the outside of the housing 6.

  The heat radiating fins 15 are disposed in the vicinity of the left peripheral wall 6bc of the housing 6 from which the printed wiring board 11 is removed. Specifically, as shown in FIG. 2, the radiation fins 15 are disposed between the exhaust surface 17 c of the cooling fan 12 and the exhaust hole 28 of the left peripheral wall 6 bc. The heat radiating fins 15 extend in parallel to each other along the direction crossing the air discharge direction of the cooling fan 12. The heat radiating fins 15 are arranged side by side along the air flow direction, and are configured as an aggregate of a plurality of fin elements. Each fin element is a plate-like member formed in a rectangular shape and is made of a metal having a high thermal conductivity such as aluminum. Each fin element is arranged so that a space is provided between the fin elements and the plate surface thereof is along the flow direction of air from the cooling fan 12.

  The heat radiating plate 30 is made of a metal having good heat transfer efficiency such as copper, and has a rectangular heat diffusing plate 30a larger than the intake surface 17a of the cooling fan 12, and the heat diffusing plate 30a to the heat diffusing plate. It extends in a direction intersecting with 30a, and has an L-shaped fixing portion 30b as viewed from the side. The heat radiating plate 30 has the heat diffusing plate 30a covering the entire intake surface 17a including the intake hole portion 17d, and a predetermined gap is secured between the heat radiating plate 30a and the intake surface 17a. 1 is fixed to the surface 11a.

  Next, the effect | action regarding the heat transfer of the computer 1 which has the above structure is demonstrated with reference to FIGS. When the computer 1 is used, the first and second heat generating components 21 and 22 generate heat. Then, as shown in FIGS. 7 and 8, the heat h <b> 1 generated in the heat generating component 21 is transmitted to the heat receiving plate 14, and then is transmitted to the heat radiating fin 15 through the heat pipe 13.

  Further, as shown in FIGS. 9 and 10, the heat h <b> 2 generated in the second heat generating component 22 is transmitted to the heat receiving plate 24, and then is transmitted to the heat radiating plate 30 through the heat pipe 25. In this case, the heat radiating plate 30 is made of a metal having good heat transfer efficiency, such as copper, and the heat diffusing plate 30a has a two-dimensional expansion, so that the heat h2 generated in the second heat generating component 22 is radiated. The heat spreads through the heat diffusion plate 30a of the plate 30 and is performed.

  When the cooling fan 12 is driven, air is introduced into the storage case 17 from the intake holes 17d and 17e of the two intake surfaces 17a and 17b, and the air is discharged from the exhaust surface 17c, and the radiating fins. It is forcibly sprayed toward 15. At this time, heat exchange is performed between the heat radiating fins 15 and the air discharged from the cooling fan 12, so that the heat h <b> 1 moved from the heat generating component 21 to the heat radiating fins 15 is transmitted to the air a <b> 1 discharged from the cooling fan 12. The air a1 is exhausted to the outside of the housing 6 through the exhaust hole 28, whereby exhaust heat g1 is performed. Thereby, cooling of the heat-emitting component 21 is promoted.

  On the other hand, since the heat radiating plate 30 is disposed in the vicinity so as to cover the air intake surface 17a, when the air a2 is introduced into the storage case 17 from the air intake hole portion 17d of the air intake surface 17a, it contacts the heat radiating plate 30. To do. Then, since the heat h2 generated in the second heat generating component 22 spreads in the heat diffusion plate 30a, efficient heat exchange in a wide range is performed between the air a2 and the heat diffusion plate 30a. Therefore, the heat transferred from the heat generating component 22 to the heat radiating plate 30 is efficiently transmitted to the air a2. The air a2 is discharged from the exhaust surface 17c together with the air a1. Thereby, the exhaust heat g2 about the heat h2 generated by the heat generating component 22 is performed.

  As described above, the computer 1 can release the heat of the two heat generating components 21 and 22 to the outside of the housing 6 by the single cooling fan 12. Therefore, the space in the housing is used effectively.

  Further, in the computer 1, the heat generated by the two heat generating components 21 and 22 is transmitted to the heat radiation fins 15 and the heat radiation plate 30 through the heat receiving plates 14 and 24 and the heat pipes 13 and 25, and heat is transmitted through the air. Since it is minimized, efficient heat dissipation can be performed. In addition, since there is only one radiating fin and it is not provided side by side, there is no extra space along the first and second surfaces 11a and 11b of the printed wiring board 11, and the space is effective. It's being used. Moreover, since the cooling fan 12 is not mounted on the first and second heat generating components 21 and 22, no extra space is taken along the vertical direction (thickness direction) of the printed wiring board 11. The space is being used effectively.

  Thus, the computer 1 can reduce the space in the housing without reducing the heat dissipation efficiency.

  Further, since the second heat generating component 22, the heat receiving plate 24, the heat pipe 25 and the heat radiating plate 30 are arranged along the exhaust direction in the cooling fan 12, the distance traveled by the heat generated by the second heat generating component 22. Is short and can efficiently dissipate heat.

  Furthermore, since the heat pipes 13 and 25 are avoided from being adjacent to each other along one surface of the printed wiring board 11, the degree of freedom in routing the heat pipe is increased, and a plurality of the heat pipes 13 and 25 are provided in the housing 6 with limited space. The heat pipes 13 and 25 can be routed.

  Furthermore, since the cooling fan 12 is disposed in the notch 11c of the printed wiring board 11, the mounting height of the entire module disposed in the housing 6 can be suppressed. That is, the casing 6 can be made thinner than when the cooling fan 12 is placed on the printed wiring board 11.

(Modification)
FIG. 11 is a side view corresponding to FIG. 4 illustrating a case where a member having a different structure is used as the second heat transfer member that transfers heat of the heat generating component 22. In the above description, the member having the heat receiving plate 24, the heat pipe 25, and the heat radiating plate 30 and connected to the heat generating component 22 is the second heat transfer member. As shown in FIG. 11, the second heat transfer member has a heat radiating plate 31 similar to the heat diffusing plate 30 disposed on the intake surface 17a, and is formed by bending a single metal plate. It is also possible to use the heat transfer member 33 in which the heat receiving plate 24 is integrated.

  Further, as shown in FIG. 12, instead of using the cooling fan 12, a cooling fan 40 is used in which the intake surface 40a of the storage case is formed of a metal having good heat transfer efficiency such as copper and can be used as a heat radiating plate. The heat pipe 25 may be connected to the intake surface 40a.

  Further, as shown in FIG. 13, in addition to the heat generating components 21 and 22, the third heat generating component 42 is provided, and the third heat generating component 42 is mounted on the second surface 11 b, as shown in FIG. 13. As shown in FIG. FIG. 13 shows a case where a heat radiating plate 41 similar to the heat diffusing plate 30 disposed in the vicinity of the intake surface 17b is provided as a third heat transfer member for transferring the heat of the third heat generating component 42. FIG. Is a case where a cooling fan 45 in which the two opposite intake surfaces 45a and 45b can be used as a heat radiating plate is used as the third heat transfer member. In both cases of FIGS. 13 and 14, the third heat generating component 42 is fixed by a fixing tool 48 similar to the fixing tool 26.

  In the above embodiment, a notebook computer is described as an example of the electronic device, but the present invention can also be applied to an electronic device other than the notebook computer.

  The above description is the description of the embodiment of the present invention, and does not limit the apparatus and method of the present invention, and various modifications can be easily implemented. In addition, an apparatus or method configured by appropriately combining components, functions, features, or method steps in each embodiment is also included in the present invention.

It is the perspective view which showed a part inside of the computer concerning embodiment of this invention. It is the perspective view which illustrated the inside of a computer. It is a top view which shows the thermal radiation structure part of the printed circuit board accommodated in the computer. It is also a front view. Similarly, it is a left side view. Similarly, it is a right side view. It is the top view which showed typically a mode when radiating the heat | fever from a 1st heat-emitting component. It is also a front view. It is the top view which showed typically a mode when radiating the heat | fever from a 2nd heat-emitting component. It is also a front view. It is a side view corresponding to Drawing 4 showing the case where a member of another structure is used for the 2nd heat transfer member which transmits the heat of the 2nd exothermic part. Similarly, it is a front view corresponding to Drawing 4 showing the case where the 2nd heat transfer member of another structure is used. It is a front view in case it has a heat sink arrange | positioned in the vicinity of an intake-hole part as a 3rd heat-transfer member for transmitting the heat | fever of a 3rd heat-emitting component. Similarly, it is a front view in the case of having a cooling fan in which two opposing intake holes can be used as a heat sink as a third heat transfer member.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Computer, 6 ... Housing, 11 ... Printed wiring board, 12 ... Cooling fan, 15 ... Radiation fin, 21, 22, 42 ... Heat generating component, 17 ... Storage case, 17a, 17b ... Intake surface, 17c ... Exhaust surface, 14, 24 ... heat receiving plate, 13, 25 ... heat pipe, 30 ... heat radiating plate.

Claims (7)

A printed wiring board on which the first heat generating component and the second heat generating component are mounted;
A cooling fan having an exhaust hole and two opposing intake holes;
Radiating fins arranged to face the exhaust hole, and
A first heat transfer member thermally connected between the first heat-generating component and the radiation fin;
An electronic apparatus comprising: a second heat transfer member that covers at least a part of the air intake hole and is thermally connected to the second heat-generating component.   The second heat transfer member includes a heat receiving plate connected to the second heat generating component, a heat radiating plate covering at least a part of the air intake hole, and a heat transfer tube connecting the heat receiving plate and the heat radiating plate. The electronic apparatus according to claim 1, further comprising:   The heat radiating plate has a heat diffusing plate having a size larger than one of the two intake holes in the cooling fan, and a fixing portion formed extending from the heat diffusing plate in the intersecting direction. The fixing portion is fixed to the printed wiring board, and the heat diffusion plate is disposed so as to secure a gap between one of the two intake holes. The electronic device according to claim 2.   4. The electronic apparatus according to claim 3, wherein the second heat generating component, the heat transfer tube, and the heat diffusion plate are arranged in a straight line along the exhaust direction of the cooling fan. The printed wiring board has a notch in a part of the peripheral end,
The electronic device according to claim 4, wherein the cooling fan is disposed in the notch.   6. The electronic apparatus according to claim 5, wherein the heat generation amount of the first heat generation component is larger than the heat generation amount of the second heat generation component. A printed wiring board on which the first heat generating component and the second heat generating component are mounted;
A cooling fan comprising an exhaust hole and two opposing intake holes, wherein at least a part of the intake hole is a heat sink;
Radiating fins arranged to face the exhaust hole, and
A first heat transfer member thermally connected between the first heat-generating component and the radiation fin;
An electronic apparatus comprising: the second heat generating component and a second heat transfer member that thermally connects the intake hole serving as the heat radiating plate.

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